Lenovo ThinkSystem HR630X User Manual And Hardware Maintenance Manual

Category
Server barebones
Type
User Manual And Hardware Maintenance Manual

This manual is also suitable for

ThinkSystem
HR650X User Guide and Hardware Maintenance Manual V1.0
Please read this manual before using the product
2
Content
Disclaimer ........................................................................................................................................................7
Trademarks and Copyrights ..............................................................................................................................8
Safety Information ............................................................................................................................................9
Chapter 1 Introduction ................................................................................................................................... 13
1.1 PRODUCT OVERVIEW ............................................................................................................................ 13
1.2 FEATURES ............................................................................................................................................. 13
1.2.1 HIGH RELIABILITY ........................................................................................................................... 13
1.2.2 HIGHLY AVAILABILITY ..................................................................................................................... 13
1.2.3 HIGH EXPANDABILITY ..................................................................................................................... 13
1.2.4 HIGH MANAGEABILITY ................................................................................................................... 13
1.3 FEATURES AND SPECIFICATIONS ........................................................................................................... 14
Chapter 2 Structural Characteristics ................................................................................................................ 16
2.1 STRUCTURAL CHARACTERISTICS ............................................................................................................ 16
2.1.1 FRONT VIEW OF THE SERVER .......................................................................................................... 16
2.1.2 REAR VIEW OF THE SERVER ............................................................................................................ 17
2.1.3 FRONT CONTROL PANEL ................................................................................................................. 17
2.1.4 MB ASSEMBLY MAIN COMPONENTS .............................................................................................. 19
2.2 INSTALLING, REMOVING AND REPLACING HARDWARE ......................................................................... 19
2.2.1 EXPLODED DRAWING ..................................................................................................................... 20
2.2.2 REMOVING AND REINSTALLING THE RACK HANDLE ........................................................................ 21
2.2.3 REMOVING AND REINSTALLING THE SERVER COVER ...................................................................... 21
2.2.4 REMOVING AND REINSTALLING THE COOLING SHROUD ................................................................. 21
2.2.5 REMOVING AND REINSTALLING THE BACK PLANE........................................................................... 22
2.2.6 REMOVING AND REINSTALLING THE SUPERCAP ON THE COOLING SHROUD ................................... 22
2.2.7 REMOVING OR INSTALLING A MEMORY MODULE .......................................................................... 23
2.2.8 REPLACING THE RISER 1, 2 .............................................................................................................. 24
2.2.9 REMOVING OR INSTALLING A PCIE CARD ........................................................................................ 25
2.2.10 REMOVING OR INSTALLING THE REAR HDD MODULE ................................................................... 27
2.2.11 INSTALLING OR REPLACING A CPU, HEAT SINK AND CPU DUMMY ................................................ 27
2.2.12 INSTALLING OR REPLACING A OCP CARD ...................................................................................... 28
3
2.2.13 INSTALLING OR REPLACING THE DUMMY TRAY FOR A HOT-SWAP DRIVE ...................................... 29
2.2.14 INSTALLING OR REPLACING A HOT-SWAP DRIVE ........................................................................... 31
2.2.15 INSTALLING OR REPLACING A HOT-SWAP POWER SUPPLY ............................................................ 32
2.2.16 INSTALLING OR REPLACING A SYSTEM FAN ................................................................................... 32
2.2.17 INSTALLING OR REPLACING A SYSTEM FAN CAGE ......................................................................... 33
2.2.18 INSTALLING THE M.2 STORAGE MODULE ...................................................................................... 33
2.2.19 REMOVING THE MAIN BOARD ...................................................................................................... 35
2.2.20 INSTALLING THE RAIL KIT .............................................................................................................. 36
Chapter 3. BIOS Setup .................................................................................................................................... 37
3.1 BIOS Setup Description ......................................................................................................................... 37
3.2 BIOS Setup Main Menu ......................................................................................................................... 37
3.3 Main Menu ........................................................................................................................................... 37
Chapter 4. BMC Setup .................................................................................................................................... 78
4.1 Overview of the Lenovo ThinkSystem Management Module ................................................................ 78
4.2 Configuration of the ThinkSystem Remote Management Module ......................................................... 79
4.3 ThinkSystem Remote Management Module Quick Start ....................................................................... 80
Prestart ................................................................................................................................................... 80
Log-on .................................................................................................................................................... 82
Navigation .............................................................................................................................................. 83
Log-out ................................................................................................................................................... 85
4.4 ThinkSystem Remote Management Module Web Console Options ...................................................... 86
4.4.1 Dashboard...................................................................................................................................... 86
4.4.2 Dashboard Information .................................................................................................................. 86
4.5 Sensor ................................................................................................................................................... 87
4.5.1 Sensor Reading............................................................................................................................... 87
4.6 System Inventory .................................................................................................................................. 88
4.6.1 CPU ................................................................................................................................................ 88
4.6.2 DIMM............................................................................................................................................. 88
4.6.3 HDD ............................................................................................................................................... 89
4.6.4 PSU ................................................................................................................................................ 89
4.6.5 PCIE................................................................................................................................................ 90
4.7 FRU Information ................................................................................................................................... 90
4
4.7.1 Field Replaceable Unit(FRU) Information ........................................................................................ 90
4.8 Logs & Reports ...................................................................................................................................... 91
4.8.1 IPMI Event Log ............................................................................................................................... 91
4.8.2 System Log ..................................................................................................................................... 92
4.8.3 Audit Log ........................................................................................................................................ 92
4.8.4 Video Log ....................................................................................................................................... 93
4.9 Settings ................................................................................................................................................. 93
4.9.1 Date & Time ................................................................................................................................... 94
4.9.2 External User Services .................................................................................................................... 94
4.9.3 KVM Mouse Setting ........................................................................................................................ 95
4.9.4 Log Settings .................................................................................................................................... 95
4.9.5 Manage Licenses ............................................................................................................................ 96
4.9.6 Media Redirection Settings ............................................................................................................ 96
4.9.7 Network settings ............................................................................................................................ 97
4.9.8 PAM Order Settings ........................................................................................................................ 97
4.9.9 Platform Event Filter ...................................................................................................................... 98
4.9.10 RAID Management ....................................................................................................................... 98
4.9.11 Services ........................................................................................................................................ 99
4.9.12 SMTP Settings .............................................................................................................................. 99
4.9.13 SSL Settings ................................................................................................................................ 100
4.9.14 System Firewall .......................................................................................................................... 101
4.9.15 User Management...................................................................................................................... 101
4.9.16 Video Recording ......................................................................................................................... 102
4.9.17 Web Server Instances ................................................................................................................. 102
4.10 Remote Control ................................................................................................................................ 103
4.11 Image Redirection ............................................................................................................................. 103
4.12 Power Control ................................................................................................................................... 104
4.13 Maintenance ..................................................................................................................................... 104
4.13.1 Backup Configuration ................................................................................................................. 105
4.13.2 Firmware Information ................................................................................................................ 105
4.13.3 Firmware Update ....................................................................................................................... 106
4.13.4 Preserve Configuration ............................................................................................................... 107
5
4.13.5 Restore Configuration ................................................................................................................ 108
Chapter 5. Troubleshooting and diagnostics ................................................................................................. 109
5 . 1 PROBLEMS WITH INITIAL START UP ................................................................................................... 109
5 . 2 APPLICATION PROGRAM PROBLEMS ................................................................................................. 109
5. 3 SYSTEM OPERATION PROBLEMS......................................................................................................... 109
5 . 4 RESOLVING OTHER PROBLEMS .......................................................................................................... 110
5.4.1 MONITOR DISPLAY PROBLEMS ..................................................................................................... 110
5.4.2 WAVY LINES ON THE SCREEN ....................................................................................................... 110
5.4.3 CLEARING SYSTEM CONFIGURATION ............................................................................................ 110
5.4.4 REPLACING THE SYSTEM BOARD BATTERY .................................................................................... 110
5.4.5 COMMON PROBLEMS ENCOUNTERED WHILE OPERATING AND USING THE SYSTEM .................... 111
Chapter 6. SAS/SATA/NVME install guide ...................................................................................................... 112
6.1 4*SAS/SATA Bay+8*Anybay Bay .......................................................................................................... 112
6.2 8*SAS/SATA Bay+4*Anybay Bay .......................................................................................................... 112
6.3 12*Anybay Bay ................................................................................................................................... 113
Chapter 7. ErP Lot 9 Comliance Mode ........................................................................................................... 114
7.1 You can enable the ErP Lot 9 compliance mode in the Setup Utility program to reduce the consumption
of electricity ............................................................................................................................................. 114
7.2 Make system load default ................................................................................................................... 116
Appendix - Terms and Abbreviations ............................................................................................................ 117
6
7
Disclaimer
Thank you for purchasing a Lenovo product.
This manual is intended as a guide to the use of Lenovo server products (hereinafter referred to as "Product"). Before installing and using the Product
for the first time, be sure to read all information provided with the product carefully, especially the precautions stated in this manual. This will help you
use the Product more effectively and safely.Please keep this manual for future reference.
The descriptions contained in this manual are not intended as specifications for the Product or of its hardware or software settings.For actual product
specifications and settings, please refer to relevant agreements, packing lists, or any documents describing product specifications and settings.
Alternatively, you may contact the seller for more information.
Lenovo shall not be liable for any damage that may result from the improper installation, use or storage of this Product in proper manner or as
instructed in this manual, or of any damage that may result from the repair or modification of this Product by anyone other than authorized technical
personnel.
The photographs, pictures, diagrams and illustrations provided in this manual are for illustrative and descriptive purposes only, and may differ from
the actual product. Due to continued product improvements, product specifications may change from time to time, and may differ from the contents of
this manual.
References to third party websites are provided for the convenience of our users. The information contained in these websites does not constitute part
of Lenovo's product information and are not part of the services provided by Lenovo. Lenovo shall not be responsible for the accuracy and reliability of
these websites and of the information contained therein. Such websites should only be accessed at the user's own risks.
The contents of this manual shall not be construed to constitute any expressed or implied warranty or guarantee by Lenovo for its products or services,
including (but not limited to) the applicability, safety, saleability, or suitability of the products to the stated purposes. The guarantee and warranty for
this Product and its related services shall be executed according to applicable agreements, or standard product warranty terms and conditions.Lenovo
shall not be liable for any damage arising from the use or inability to use the Product, including, but not limited to, direct or indirect personal damages,
loss of business profits, business interruption, loss of business information, or any other pecuniary loss, to the greatest legal extent possible.
Lenovo accepts no responsibility for the use of the software supplied with this Product on any other devices, or for using software other than that
provided with the Product or which has been verified and recommended by Lenovo on this Product.
Although due care has been taken in compiling and checking the information provided in this manual, we cannot guarantee that the Information is free
from error and omission. As an effort towards improving our service, the contents of this manual, as well as the software and hardware described
herein, are subject to changes without notice.Should you find any inconsistency between the actual Product and the contents of this manual, or should
you wish to find out the latest information or to send us your questions or comments, please call our service hotline or visit the Lenovo service website.
8
Trademarks and Copyrights
Legend, Lenovo, Lenovo
联想
, ThinkServer, and For Those Who Do characters and logos are either registered trademarks or trademarks of the
Lenovo Group in the P.R.C. and/or other countries or regions.
Celeron, Celeron Inside, Centrino, Centrino Inside, Core Inside, Intel, the Intel logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside
Logo, Intel Viiv, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, Viiv inside, vPro Inside, Xeon and Xeon Inside are trademarks of the Intel
Corporation in the United States or other countries.
Microsoft, Windows, Windows XP, and Windows NT are trademarks or registered trademarks of the Microsoft Corporation.
The names of other companies, products or services may be trademarks or service marks of other companies.
The software accompanying this Product are provided based on the terms and conditions of the end-user license agreement, and may only be used
and copied as stipulated in the end-user agreement.
© Copyright Lenovo (Beijing) Co., Ltd. 2016. All rights reserved.
This manual is subject to copyright protection laws and regulations. No person may, in whole or in part, copy, reproduce, delete the contents of,
compile this document into machine-readable format, save it in a searchable system, share it through wired or wireless networks, or translate it into
any other languages in any format, without prior written permission from Lenovo.
Lenovo (Beijing) Co., Ltd.
9
Safety Information
IMPORTANT: Each caution and danger statement in this document is labeled with a number. This number is used to cross reference an English-language caution or
danger statement with translated versions of the caution or danger statement in the Safety Information document.For example, if a caution statement is labeled
“StatementInformationdocumentunder1”, tra “Statement 1.”
Be sure to read all caution and danger statements in this document before you perform the procedures.Be sure to read all additional safety information
that comes with the server and the optional device before you install, remove or replace any device.
Statement 1
DANGER
Electrical current from power, telephone, and communication cables is hazardous. To avoid a shock hazard:
•Do not connect or disconnect any cables or perform installation, maintenance, or reconfiguration of this Product during an electrical storm.
•Connect all power cords to properly wired and grounded electrical outlets.
•Connect all equipment that will be attached to this Product to properly wired outlets.
•When possible, use one hand only to connect or disconnect signal cables.
•Never turn on any equipment when there is evidence of fire, water, or structural damage.
•Disconnect the attached power cords, telecommunications systems, networks, and modems before you open the device covers, unless otherwise
instructed in the installation and configuration procedures.
•Connect and disconnect cables as described in the following table when installing, moving, or opening covers on this Product or the attached devices.
The power button on the front panel does not disconnect the internal system from the AC power supply completely. To prevent electrical shock
and equipment damage, be sure to unplug the power cord from the power outlet before performing any operation described in this manual.
To connect:
To disconnect:
1. Turn everything OFF.
1. Turn everything OFF.
2. First, attach all cables to devices.
2.
First, remove power cords from outlet.
3. Attach signal
cables to connectors.
3.
Remove signal cables from connectors.
4. Attach power cords to outlet.
4.
Remove all cables from devices.
5. Turn device ON.
Do not plug or unplug any connector from the chassis backplane without first disconnecting the power supply.
Statement 2
DANGER
Danger of explosion if battery is incorrectly replaced. When replacing the lithium coin cell battery, use only the same or an
equivalent type that is recommended by the manufacturer. The battery contains lithium and can explode if not properly
used, handled, or disposed of.
Do not:
1. Throw or immerse into water
2. Heat to more than 100 (212)
3. Repair or disassemble
Dispose of the battery as required by local ordinances or regulations.
Statement 3
10
CAUTION:
When laser products (such as CD-ROMs, DVD drives, fiber optic devices, or transmitters) are installed, note the following:
•Do not remove the covers. Removing the covers of laser products may result in exposure to hazardous laser radiation.There are no serviceable parts inside these
devices.
•Controls or adjustments, or performance of procedures other than those specified herein, may result in hazardous radiation exposure.
DANGER
Some laser products contain embedded Class 3A or Class 3B laser diodes. Note the following: Laser radiation when open. Do not stare into the beam, do not view
directly with optical instruments, and avoid direct exposure to the beam.
Statement 4
≥ 18 kg (39.
≥ 32 kg (70.
≥ 55 kg (121
< 32 kg (70.5 lb)
< 55 kg (121.2 lb)
< 100 kg (220.5 lb)
CAUTION: Use safe practices when lifting.
Statement 5
CAUTION: The power control button on the device and the power switch on the power supply do not turn off the electrical current supplied to the device. The device
may have more than one power cord. To remove all electrical current from the device, ensure that all power cords are disconnected from the power source.
Statement 6
CAUTION: If you install a strain-relief bracket option over the end of the power cord that is connected to the device, you must connect the other end of the power cord
to a power source that is easily accessible, in case it needs to be disconnected.
Statement 7
CAUTION: If the device has doors, ensure that you remove or secure the doors before moving or lifting the device to protect against personal injury. The doors will
not support the weight of the device.
Statement 8
11
CAUTION: Never remove the cover on a power supply or any part that has the following label attached.
Hazardous voltage, current, and energy levels are present inside any component that has this label attached. There are no serviceable parts inside these
components. If you suspect a problem with one of these parts, contact a service technician.
Statement 9
CAUTION: Disconnect the hot-swap fan cables before removing the fan from the device to protect against personal injury. Statement 10
CAUTION: The following label indicates a sharp-edge hazard.
Statement 11
CAUTION: The following label indicates a potential heat hazard.
Statement 12
DANGER
Overloading a branch circuit is a potential fire hazard and shock hazard under certain conditions. To avoid these hazards, ensure that your system electrical
requirements do not exceed branch current ratings at the installation site.
Statement 13
CAUTION: Ensure that the rack is secured properly to avoid tipping when the server unit is extended on the rails.
Statement 14
CAUTION: Some accessory or option board outputs exceed Class 2 or limited power source limits. You must install the appropriate interconnecting cabling in
accordance with your local electrical code requirements.
Statement 15
CAUTION: The power-control button on the device may put the device in standby mode instead of turning off the device. In addition, the device may
have multiple connections to DC power. To remove all electrical current from the device, ensure that all connections to DC power are disconnected
at the DC power input terminals.
12
Statement 16
CAUTION: To reduce the risk of electric shock or energy hazards:
•This equipment must be installed by trained service personnel in a restricted-access location, as defined by your local electrical code and the latest
edition of IEC 60950.
•Connect the equipment to a reliably grounded safety extra low voltage (SELV) source. An SELV source is a secondary circuit that is designed so that
normal and single fault conditions do not cause the voltages to exceed a safe level (60 V direct current).
•The branch circuit overcurrent protection must be rated in accordance with local electrical code requirements.
•Use only 1.3 mm
2
or 16 American Wire Gauge (AWG) copper conductors, not exceeding 3 meters in length.
•Torque the wiring-terminal screws to 1.4 newton-meters (12 inch-pounds).
•Provide a readily available approved and rated disconnect device in the field wiring.
Statement 17
CAUTION:
This Product contains a Class 1M laser. Do not view directly with optical instruments.
Statement 18
CAUTION:
Do not place any object on top of rack-mounted products.
Statement 19
CAUTION: Hazardous moving parts. Keep fingers and other body parts aw
Statement 20
The device is equipped with a replaceable battery. Using an incorrect battery may present a risk of explosion.
Caution: Risk of explosion if battery is replaced with an incorrect type. Dispose of used batteries as instructed.
Statement 21
This device is not intended for use in the direct field of view at visual display workplaces. To avoid incommoding reflexions at visual display workplaces
this device must not be placed in the direct field of view.
13
Chapter 1 Introduction
This chapter gives you an overview of the ThinkServer HR650X and briefly describes its features, specifications and functions.
1.1 PRODUCT OVERVIEW
The ThinkServer HR650X is a low-cost, 2U, two-socket server that features the latest Intel Xeon Skylake Server 2S processors and supports up to 24
DDR4 DIMMs. The front panel supports up to 12*3.5-inch SATA/SAS/NVMe HDDs. The back panel supports up to 2*3.5-inch SATA/SAS HDDs The
device is equipped with Platinum (1 + 1) Redundant Power Supply.The HR650X system board is integrated with a BMC chip, which allows web-based
OOB management. The HR650X is easy to use and manage. It is suitable as a storage server, file server, video server, enterprise server and OA
Server.
1.2 FEATURES
1.2.1 HIGH RELIABILITY
1. Supports DDR4 2666/2400/2133/1866 and ECC memory for accurate data transfer between the internal memories and the operating system.
2. Supports RAID controllers, including RAID 0, 1, for advanced data protection.
3. Supports hot-swap SATA, SAS and NVMe SSD hard disk drives to provide users with flexible, secure, reliable, and high-speed storage subsystems.
4. Uses highly-reliable server-dedicated power supply to ensure uninterrupted and stable operation.
1.2.2 HIGHLY AVAILABILITY
1. Supports two Intel Xeon (Skylake Server 2S) processors. The new processor supports up to 28 cores, up to 10.4 GT/s UPI, hence significantly
improving data processing capabilities, and meeting performance standards for servers in multi-threaded, multi-tasking environments.
2. Supports DDR4 2666/2400/2133/1866, LRDIMM/RDIMM
3. Supports 12 Gbps enterprise-class hard drives for superb subsystem I/O performance.
4. Support OCP MEZZ Ethernet for excellent network transmission and processing performance.
1.2.3 HIGH EXPANDABILITY
1. Supports 6 PCIe slots or 3 PCIe + 2x3.5” Rear HDD
2. Supports 24s DIMM memory slots, and up to 3TB (128GB 8Gb 3DS DDR4LRDIMM) RAM (dependent on memory type).
3. Supports OCP MEZZ card. 12×3.5-inch SATA/SAS/NVMe HDDs, The back panel supports up to 2x3.5-inch SATA/SAS HDDs
1.2.4 HIGH MANAGEABILITY
1. Equipped with Front two USB interface (via adapter cable) to cater to needs of different users and maximize the ease of use.
2. Equipped with automatic power saving and noise reduction technologies that adjust the fan speed according to actual operating conditions,
hence promoting environmental protection and energy conservation.
14
1.3 FEATURES AND SPECIFICATIONS
The following information is a summary of the features and specifications of the server.
Server
Technical parameters
performance
Processor
Two
Intel Xeon
Skylake Server 2S
supports
up to 28 cores
Support 2 UPI links @10.4GT/s and future 11.2GT/s UPI
Memory
DDR4 2666/2400
/2133/1866, LRDIMM/RDIMM
Number of slots: 24 DIMMs or 16 DIMMs
System
hard disk
support
Front : Up to 12x 3.5-inch Hot Swap SATA/SAS/NVMe HDDs
Rear : 2x 3.5-inch Hot Swap SATA/SAS HDDs
Display
Integrated graphics chip, 16MB
CD-ROM
Supports USB DVDRW drive
Network One dedicate management chip
Keyboard
Supports USB keyboards
Mouse
Supports USB mouse
Expansion slots
Supports up to 6 PCIe slots
Device
connectors
COM x 1
VGA x 2 (1 front, 1 rear)
USB3.0 x 3 (2 rear, 1 internal)
USB2.0 x 2 (front)
RJ45 x 1 (Management NIC),
System fan
Support hot
-
plug
Equipped with automatic energy saving and noise reduction technologies
Compatible with
Windows Server 2008 SP2 (x86) ), Windows Server 2008 R2 with SP1 (including Hyper
-
V), Windows 8.1,
Windows Server® 2012 (including Hyper-
V), Windows Server 2012 R2, SUSE LINUX Enterprise Server 11 SP3,
SUSE LINUX Enterprise Server 12, SUSE LINUX Enterprise Server 10 SP2, SUSE LINUX Enterprise Server 11
SP3, RedHat RHEL 6.5, CentOS 5.4 32bit, CentOS 6.3 64bit, Citrix XenServer 6.2
operating system
Note: The
supported
operating system
varies depending
on different
system
configurations.If
you have any
questions, please
contact Lenovo.
Supported Altitude* (unpressurized): 0-10000ft (0-3050m)
Altitude
A2: Operating temperature de-rated 1°C per 300m (1000ft) to 3050m (10000ft)
above sea level, No A3/A4 support
Ambient
temperature
(operating)
System support ASHARE A2, and A3, A4 with limitation
No specific humidity definition for A2-A4
Design by project, but if system follow ASHRAE standard, should follow below requirements
Maximum rate of change(/hr) should ≤ 20
Humidity transition rate should ≤10%/hr.
A2: 10 to 35.
Humidity: 8%~80% RH, Non-condensing.
A3: 5 to 40.
Humidity: 8%~85% RH, Non-condensing.
A4: 5 to 45.
Humidity: 8%~90% RH, Non-condensing.
Supported Altitude* (unpressurized): 0-10000ft (0-3050m)
15
A2 - Derate maximum allowable dry-bulb temperature 1°C/300 m above 900 m.
A3 - Derate maximum allowable dry-bulb temperature 1°C/175 m above 900 m.
A4 - Derate maximum allowable dry-bulb temperature 1°C/125 m above 900 m.
Please refer ASHRAE standard
Ambient
temperature
(transport/storage)
Temperature: -40 to 70
Humidity: 8%~90% RH, non-condensing
Relative humidity
(operating)
8%~90%, non
-
condensing
Relative humidity
(transport/storage)
8 to 90%, non-condensing (in original shipping package)
8 to
9
0%, non
-
condensing (without original shipping packaging)
Power supply
voltage
200
-
240V 50Hz
-
60Hz
100
-
127V 50Hz
-
60Hz
Power
750W 1 + 1 hot
-
swap redundant power supply.
550W 1 + 1
hot
-
swap redundant power supply.
Dimensions
86.5
m
m
×
482m
m
×
763.7
mm
(height × width × depth) (with rack handles)
86.5mm
×
434.4mm
×
750
mm
(heigh
t x
width
x
depth) (without rack handles)
16
Chapter 2 Structural Characteristics
This chapter provides detailed descriptions on the appearance and internal structures of the Lenovo HR650X server, and specifies the procedures
for removing and installing related components.
Note: The following procedures should only be performed by qualified operators or service personnel trained in server maintenance. Do not
perform any removal procedure until you have read and understood all warnings and cautions stated in the "Lenovo Server User Guide - Read Me
First" (hereinafter referred to as "Read Me First"). All removals should be performed strictly as instructed.
Note: All pictures in this chapter are for reference only, and may differ from actual product appearance.
2.1 STRUCTURAL CHARACTERISTICS
2.1.1 FRONT VIEW OF THE SERVER
Front view of the server(12×
3.5
-
inch HDD configuration)
1.3.5-inch hot-swap drive (optional)
2
.
Rack handle (left)
3.Front controller module
4
.
Rack handle (right)
5.Front VGA Connector
6.
Drive activity LED (Green)
7.Drive Status LED(Yellow)
17
2.1.2 REAR VIEW OF THE SERVER
Rear views of the server
1. Half high half length PCIe card slot 2. Full high half length PCIe card slot
3. Hot-swap power supply 1
4. Hot-swap power supply 2optional
5. Serial connector 6. VGA connector
7. System ID button with LED
8. USB3.0 connectorx2
9. 3.5-inch HDD 1 10. 3.5-inch HDD 2
11. Network connector (system management) 12.OCP Mezz card
13. Full high full/half length PCIe card
2.1.3 FRONT CONTROL PANEL
18
Front control panel
1.
Power button with power status LED
1.
Steady green light: the server is on
2.
Off: the server is off
3.Blinking green: the server is DC off
2.
System ID
button with ID LED
1.
Steady blue light: the server is identified
2.
Off: the server is not identified.
3 P
ress 5 secs, initiate BMC reset
1.
Steady green light: the network is connected
3.
Network status LED
2.
Blinking green light: the
network is connected and active
3.
Off: the server is disconnected from the network or the server
is off
4
. System health LED
1.
Steady
yellow
light: key component failure
2. Off: the server is off, or the server is on and is working
correctly.
5.
VGA connector
6.
USB2.0 connectorx2
19
2.1.4 MB ASSEMBLY MAIN COMPONENTS
2.2 INSTALLING, REMOVING AND REPLACING HARDWARE
Safety Precautions
Read and follow all safety precautions specified in "Read Me First". If the instructions provided with the server differs from the instructions contained in
this manual, contact a service technician from the supplier to confirm the correct procedures.
Note: The power button does not completely turn off the AC current supplied to the device. To remove all AC current from the device, unplug all
power cords connected to the server from the AC power sockets.
To ensure proper cooling and ventilation, be sure to replace the cover before using the server normally.
As the components of server as extremely sensitive to electrostatic discharge (ESD), the following operations should be performed on
ESD workbenches. Where ESD workbenches are not available, minimize ESD damage by doing the following:
1. Wear an ESD wrist strap, and connect it to a metal part of the server.
2. Touch the metal casing of the server chassis before handling other server components.
3. Ensure that part of your body is in contact with the metal chassis when removing or installing a component; this helps to release static electricity.
4. Avoid unnecessary movement.
5. Always handle a component (especially boards) by its edges or frame.
6. Place the server on a grounded, static-free work surface. Use a conductive foam pad if available. Do not use the package that the component came in.
7. Avoid sliding the unit across the work surface.
Tools required
1. Phillips (cross) screwdriver.
2. Anti-static wrist strap and conductive foam pad (recommended).
3. Pen and paper to record changes in server configuration, and information specific to installed components.
20
2.2.1 EXPLODED DRAWING
1. Server cover
2.
Riser
2
cage
3. Riser
1
cage
4.
M.2 module
5. Rear back plane
6. Supercap
7. OCP
shroud
8.
OCP Mezz card
9.
PSU
10.
Rear 3.5
-
inch HDD module t
11. Chassis
12. MB Assembly
13.
GPU fan duc
t
14.
Cooling shroud
15. 3.5
-
inch HDD tray module
16. HDD dummy
17. System fan cage
18.
Fan module
19.
Back plane
20.
DIMM
21.
CPU
22. CPU
heat sink
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Lenovo ThinkSystem HR630X User Manual And Hardware Maintenance Manual

Category
Server barebones
Type
User Manual And Hardware Maintenance Manual
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