NXP BFU725F User guide

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UM10483
BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
Rev. 1 — 16 September 2011 User manual
Document information
Info Content
Keywords LNA, 2.4 GHz to 6.0 GHz, BFU725F/N1, WiFi, 802.11, WiMax, 802.16
Abstract This document describes how to use the BFU725F/N1 2.4 GHz to 6.0 GHz
LNA demonstration board.
UM10483 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
User manual Rev. 1 — 16 September 2011 2 of 16
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
NXP Semiconductors
UM10483
BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
Revision history
Rev Date Description
v 1.0 20110916 first issue
UM10483 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
User manual Rev. 1 — 16 September 2011 3 of 16
NXP Semiconductors
UM10483
BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
1. Introduction
The BFU725F/N1 is a wideband silicon germanium amplifier transistor for high speed,
low-noise applications. The transistor is designed to be used for LNA applications up to
15 GHz such as GPS, satellite radio, cordless phone, wireless LAN and satellite LNB. The
BFU725F/N1 is packaged in a SOT343F that has 2 emitter pins to reduce emitter
inductance (for maximum gain).
The BFU725F/N1 is ideal for applications where cost is a concern. It also gives the
designer flexibility in his design work, for bias current, frequency of operation,
noise-figure, gain and P1dB.
The 2.4 GHz to 6.0 GHz LNA demonstration (demo) board is designed to evaluate the
performance of the BFU725F/N1 applied as a LNA in the 2.4 GHz to 6 GHz range. In this
document, the application diagram, board layout, bill of materials, and some typical results
are given.
Figure 1
shows the demonstration board.
2. General description
The BFU725F/N1 is the first discrete HBT produced using NXP Semiconductor’s SiGeC
QuBIC4x BiCMOS process. SiGe:C is a silicon germanium process with the addition of
carbon in the base layer of the NPN-transistor. The presence of carbon in the base layer
suppresses the diffusion of boron during wafer processing allowing steeper and narrower
Fig 1. BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
aaa-000220
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User manual Rev. 1 — 16 September 2011 4 of 16
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BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
SiGe HBT base and a heavier doped base. This results in lower base resistance, hence
lower noise and higher cut-off frequency (higher gain). Table 1
shows a summary of the
transistor performance in terms of noise and gain.
3. Application board
The BFU725F/N1 2.4 GHz to 6 GHz demonstration board simplifies the evaluation of the
BFU725F/N1 wideband transistor, for this frequency range. The demonstration board
enables testing of the device performance and requires no additional support circuitry.
The board is fully assembled with the BFU725F/N1, including input- and output-matching,
to optimize the performance. For input matching, a compromise must be made between
optimum noise/maximum gain/RL/usable bandwidth of the application and customer
requirements. The board is mounted with signal input and output SMA connectors for
connection to RF test equipment.
3.1 Schematic
Figure 2 shows the demonstration board schematic.
Figure 3
shows the required end-users application board schematic optimized for BOM
count compared to the demonstration board schematic which is optimized for tuning
flexibility.
Table 1. BFU725F/N1
V
CE
=2V, I
C
=5mA, T
amb
=25
C
Frequency (GHz) Noise figure (dB) Associated gain (dB)
1.5 0.42 24
2.4 0.47 20
5.8 0.7 13.5
12 1.1 10
Table 2. Pinning information BFU725/N1
Pin Description Simplified outline Symbol
1emitter
2base
3emitter
4 collector
12
34
mbb159
4
1, 3
2
Table 3. Design targets
Symbol Parameter Value Unit
NF noise figure <1.3 dB
G
p
power gain >14 dB
s
11
2
input return loss >10 dB
s
22
2
output return loss >10 dB
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User manual Rev. 1 — 16 September 2011 5 of 16
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UM10483
BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
(1) Output series resistance (R
OS
) is set for V
O
= 1.2 V; reference voltage = 0.7 V.
Fig 2. Demo board schematic
aaa-000221
R4
237 Ω
R11
10 Ω
R3
49.9 kΩ
RF_IN
X1
C15
V
CC
RF_OUT
X2
18 pF
C17
10 nF
C18
3.9 pF
C16
L1
6.8 nH
L2
82 nH
R8
619 Ω
R12
0 Ω
R9
0 Ω
U1
BFU725FN1
R10
619 Ω
3.9 pF
(1) R
OS
is set for V
O
= 1.2 V; reference voltage = 0.7 V.
Fig 3. Circuit diagram of the end-user application circuit (minimized BOM) demo board schematic
aaa-000222
R4
237 Ω
R10
1240 Ω
R11
10 Ω
R3
49.9 kΩ
RF_IN
X1
C15
V
CC
RF_OUT
X2
18 pF
C17
10 nF
C18
3.9 pF
C16
L1
6.8 nH
L2
82 nH
U1
BFU725FN1
3.9 pF
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User manual Rev. 1 — 16 September 2011 6 of 16
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UM10483
BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
3.2 PCB layout
Figure 4 shows the board layout.
The PCB layout is an essential part of an RF circuit design. The demonstration of the
BFU725F/N1 can serve as a guideline for laying out a board using the BFU725F/N1. Use
controlled impedance lines for all high frequency inputs and outputs. Bypass V
CC
with
decoupling capacitors, preferably located as close as possible to the device. For long bias
lines it may be necessary to add decoupling capacitors to the line away from the device.
Correctly grounding the emitters is also essential for the performance. Connect the
emitters either directly to the ground plane or through vias, or do both.
Fig 4. Printed-circuit board of the BFU725F/N1 2.4 GHz to 6 GHz demo board
aaa-000223
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UM10483
BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
The demonstration board is constructed from Rogers 4003C using the stack shown in
Figure 5
.
3.3 Bill of materials
Fig 5. PCB material stack
aaa-000250
35.56 μm
304.8 μm Ro4003C
655.2 μm FR4 only for
mechanical rigidity of PCB
35.56 μm
35.56 μm
Table 4. Demonstration board BOM
Reference Value Package Manufacturer / part number Comment
C15 18 pF 0402 Murata GRM1555C1H180JZ01 decoupling
C16 3.9 pF 0402 Murata GRM1555C1H3R9CZ01 DC blocking, input matching
C17 10 nF 0402 Murata GRM155R71C104KA88 decoupling
C18 3.9 pF 0402 Murata GRM1555C1H3R9CZ01 DC blocking, output matching
L1 6.8 nH 0402 Murata LQG15HN6N8J02 input matching
L2 82 nH 0402 CoilCraft 06CS82N output matching, DC bias
R3 49.9 k 0402 various bias setting temperature stability
R4 237 0402 various bias setting temperature stability
R9 0 0402 various emitter degenerating resistor, used to set gain
R11 10 0402 various stability
R12 0 0402 various not required
U1 BFU725F/N1 SOT343 NXP Semiconductors transistor
X1, X2 SMA RF
connector
Johnson, end-launch SMA
142-0701-841
RF input, RF output
X3 DC header Molex, PCB-header, 1 row, 3 way bias connector
UM10483 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
User manual Rev. 1 — 16 September 2011 8 of 16
NXP Semiconductors
UM10483
BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
4. Required equipment
The following equipment is required to perform measurements on the demonstration
board:
DC power supply up to 30 mA at 3.3 V
An RF signal generator capable of generating an RF signal over the operating
frequency range of 2.4 GHz to 6.0 GHz (preferably up to 12 GHz)
An RF spectrum analyzer that covers at least the operating frequency range of
2.4 GHz to 6.0 GHz plus a few harmonics, (up to 18 GHz should be sufficient).
Optionally, a version with the capability of measuring noise figure would be convenient
Current meter to measure the supply current (optional)
A network analyzer for measuring gain, return loss, reverse isolation, stability and
P1dB
Noise figure analyzer
4.1 Connections and setup
The BFU725F/N1 2.4 GHz to 6.0 GHz demonstration board is fully assembled and tested.
Please follow the steps below for a step-by-step guide to operate the demonstration board
and testing the device functions.
1. Connect the DC power supply, set to 3.3 V, to the V
CC
and GND terminals.
2. Connect the RF signal generator and the spectrum analyzer; to the RF input and the
RF output of the demonstration board respectively. Do not turn on the RF output of the
signal generator yet, set it to 30 dBm output power at 2.4 GHz, and set the spectrum
analyzer on 2.4 GHz center frequency and a reference level of 10 dBm.
3. Turn on the DC power supply and it should read approximately 11 mA.
4. Enable the RF output of the generator; the spectrum analyzer displays a tone of
2.4 GHz at around –10 dBm.
5. Instead of using a signal generator and spectrum analyzer one can also use a
network analyzer in order to measure gain, return loss, stability and P1dB.
6. For noise figure evaluation, either a noise-figure analyzer or a spectrum analyzer with
noise option can be used. The use of a 5 dB noise source, such as the Agilent 346B is
recommended. When measuring the noise figure of the demonstration board, avoid
connecting adaptors and cables between the noise source and the demonstration
board, or de-embedded.
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User manual Rev. 1 — 16 September 2011 9 of 16
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UM10483
BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
5. Typical results
5.1 2.4 GHz data (de-embedded)
5.2 5.9 GHz data (de-embedded)
Table 5. BFU725F/N1 demonstration board at 2.4 GHz
Symbol Parameter Value Unit
NF noise figure 0.8 dB
G
p
power gain >19 dB
s
11
2
Input return loss <11 dB
s
22
2
output return loss <12 dB
s
12
2
isolation >21 dB
P
L(1dB)
output power at 1 dB
gain compression
>0.8 dBm
P
i(1dB)
input power at 1 dB
gain compression
>17.3 dBm
I
C
collector current >10.5 mA
Table 6. BFU725F/N1 demonstration board at 5.9 GHz
Symbol Parameter Value Unit
NF noise figure 1.37 dB
G
p
power gain >11.6 dB
s
11
2
Input return loss <9.0 dB
s
22
2
output return loss <12.0 dB
s
12
2
isolation >21.0 dB
P
L(1dB)
output power at 1 dB
gain compression
>0.7 dBm
P
i(1dB)
input power at 1 dB
gain compression
>10.2 dBm
I
C
collector current >10.5 mA
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User manual Rev. 1 — 16 September 2011 10 of 16
NXP Semiconductors
UM10483
BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
Fig 6. S parameters
aaa-000224
-40
-30
-20
-10
0
10
20
30
40
0
1
Pwr -30 dBm Ch1 Start 200 MHz Stop 10 GHz
Trc1
Trc2
Trc3
Trc4
S11
S21
S12
S22
dB Mag
dB Mag
dB Mag
dB Mag
10 dB /
10 dB /
10 dB /
10 dB /
Ref 0 dB
Ref 0 dB
Ref 0 dB
Ref 0 dB
Cal PCao
Cal PCao
Cal PCao
Cal PCao
S11
M 1
M 2
M 1
M 2
M 1
M 2
M 1
M 2
11/23/2010, 1:54 PM
M 1
M 2
M 1
M 2
M 1
M 2
M 1
M 2
2.400000
5.900000
2.400000
5.900000
2.400000
5.900000
2.400000
5.900000
GHz
GHz
GHz
GHz
GHz
GHz
GHz
GHz
-11.980
-10.164
18.912
11.694
-26.414
-20.753
-13.080
-12.271
dB
dB
dB
dB
dB
dB
dB
dB
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UM10483
BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
Fig 7. 1 dB compression point (input and output)
aaa-000225
2
Freq
Freq
Freq
2.4 GHz
4.1 GHz
5.9 GHz
Ch2
Ch3
Ch4
Start
Start
Start
-40 dBm
-40 dBm
-40 dBm
Stop
Stop
Stop
0 dBm
0 dBm
0 dBm
Trc2
Trc3
Trc4
dB Mag
dB Mag
dB Mag
1 dB /
1 dB /
1 dB /
Ref 15 dB
Ref 15 dB
Ref 15 dB
Ch2
Ch3
Ch4
Ca? PCal Off
Ca? PCal Off
Ca? PCal Off
Trac Stat:
Cmp In:
Cmp Out:
Trac Stat:
Cmp In:
Cmp Out:
•Trac Stat:
Cmp In:
Cmp Out:
Trc2 S21
-17.3
0.8
Trc3 S21
-12.2
1.3
Trc4 S21
-10.2
0.7
dBm
dBm
dBm
dBm
dBm
dBm
M 1
M 2
M 3
-35.98
-35.98
-35.98
dBm
dBm
dBm
19.144
14.513
11.699
dB
dB
dB
M 1
Cmp
M 2
Cmp
M 3
Cmp
4/19/2011, 2:58 AM
S21
S21
S21
S21
15
11
12
13
14
16
17
18
19
15
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BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
Fig 8. Demonstration board noise figure 2.4 GHz (not de-embedded to de-embedded
subtract 0.1 dB)
Measurement Complete
Direct NOISE & GAIN CALIBRATED
RBW: 1 MHz RF Atten. 0 dB 2nd Stage Corr. On
Average: 10 Auto Ref Level On Image Rejection ...
Current Value
RF: 6 GHz ENR 15 dB NF. 1.77 dB
LO: ... Loss In 6 dB Noise Temp. 145.88 K
IF: ... Loss Out 0.3 dB Gain 11.75 dB
Noise Figure Marker[Noise] 0.991 dB Gain
Ref -62.7 dBm SWT 100 ms 2.4 GHz
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2.000 GHz 6.000 GHz400.000 MHz/div
4
6
8
10
12
14
16
18
20
SGL
PA
(RF)
1
Date: 19.APR.2011 17:11:34
aaa-000226
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BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
Fig 9. Demonstration board noise figure 5.9 GHz (not de-embedded to de-embedded
subtract 0.3 dB)
aaa-000227
Measurement Complete
Direct NOISE & GAIN CALIBRATED
RBW: 1 MHz RF Atten. 0 dB 2nd Stage Corr. On
Average: 10 Auto Ref Level On Image Rejection ...
Current Value
RF: 6 GHz ENR 15 dB NF. 1.77 dB
LO: ... Loss In 6 dB Noise Temp. 145.88 K
IF: ... Loss Out 0.3 dB Gain 11.75 dB
Noise Figure Marker[Noise] 1.672 dB Gain
Ref -62.7 dBm SWT 100 ms 5.9 GHz
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2.000 GHz 6.000 GHz400.000 MHz/div
4
6
8
10
12
14
16
18
20
SGL
PA
(RF)
1
Date: 19.APR.2011 17:11:56
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BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
6. Abbreviations
Fig 10. Stability factor
aaa-000228
0
1
Pwr -30 dBm Ch1 Start 100 MHz Stop 10 GHz
Trc4 K Lin Mag1 U / Ref 0 U Cal int
M 1
M 3
2.400000
5.900000
GHz
GHz
1.2160
1.3498
U
U
M 1
M 3
4/19/2011, 3:55 AM
K
0
3
4
5
6
7
8
1
2
Table 7. Abbreviations
Acronym Description
BOM Bill Of Materials
DCR Direct Current Resistance
GPS Global Positioning System
HBT Heterojunction Bipolar Transistor
LFM Linear Feet per Minute
LNA Low-Noise Amplifier
RL Return Loss
SMA SubMiniature version A
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BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
7. Legal information
7.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
7.2 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express, implied
or statutory, including but not limited to the implied warranties of
non-infringement, merchantability and fitness for a particular purpose. The
entire risk as to the quality, or arising out of the use or performance, of this
product remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be liable
to customer for any special, indirect, consequential, punitive or incidental
damages (including without limitation damages for loss of business, business
interruption, loss of use, loss of data or information, and the like) arising out
the use of or inability to use the product, whether or not based on tort
(including negligence), strict liability, breach of contract, breach of warranty or
any other theory, even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by customer
for the product or five dollars (US$5.00). The foregoing limitations, exclusions
and disclaimers shall apply to the maximum extent permitted by applicable
law, even if any remedy fails of its essential purpose.
7.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
NXP Semiconductors
UM10483
BFU725F/N1 2.4 GHz to 6.0 GHz LNA demonstration board
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddre[email protected]
Date of release: 16 September 2011
Document identifier: UM10483
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
8. Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 General description. . . . . . . . . . . . . . . . . . . . . . 3
3 Application board . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 Schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.3 Bill of materials. . . . . . . . . . . . . . . . . . . . . . . . . 7
4 Required equipment . . . . . . . . . . . . . . . . . . . . . 8
4.1 Connections and setup. . . . . . . . . . . . . . . . . . . 8
5 Typical results . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1 2.4 GHz data (de-embedded). . . . . . . . . . . . . . 9
5.2 5.9 GHz data (de-embedded). . . . . . . . . . . . . . 9
6 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14
7 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
7.1 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.2 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.3 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
/