TDK HHM1521 User manual

TDK
Brand
TDK
Model
HHM1521
Type
User manual

This manual is also suitable for

TDK HHM1521 multilayer chip balun is designed for Bluetooth and 2.4 GHz W-LAN applications. It is RoHS compliant and features a compact size with dimensions of 2.0 x 1.25 x 0.65 mm. The balun has an unbalanced impedance of 50 ohms and a balanced impedance of 200 ohms. It operates in the frequency range of 2400 to 2500 MHz with an insertion loss of 1.0 dB max and a return loss of 10 dB min. The balun also has a phase imbalance of 180 ±10 degrees and an amplitude imbalance of 0 ±2.0 dB. It is packaged in a reel of 2000 pieces, making it a convenient option for high-volume applications.

TDK HHM1521 multilayer chip balun is designed for Bluetooth and 2.4 GHz W-LAN applications. It is RoHS compliant and features a compact size with dimensions of 2.0 x 1.25 x 0.65 mm. The balun has an unbalanced impedance of 50 ohms and a balanced impedance of 200 ohms. It operates in the frequency range of 2400 to 2500 MHz with an insertion loss of 1.0 dB max and a return loss of 10 dB min. The balun also has a phase imbalance of 180 ±10 degrees and an amplitude imbalance of 0 ±2.0 dB. It is packaged in a reel of 2000 pieces, making it a convenient option for high-volume applications.

(1/2)
001-03 / 20080106 / e751_hhm1521.fm
• All specifications are subject to change without notice.
Multilayer Chip Baluns
For Bluetooth & 2.4GHz W-LAN
HHM Series HHM1521
SHAPES AND DIMENSIONS
0.95±0.1
1.25±0.15
0.65±0.2 0.3±0.2
0.2±0.2 0.35±0.2
2.0±0.15
654
123
Dimensions in mm
0.25
+0.1
–0.2
1 Unbalanced port
2 GND or DC feed+ RF GND
3 Balanced port
4 Balanced port
5 GND
6 N.C.
Terminal functions
CIRCUIT DIAGRAM
123
564
Unbalanced
input
50
Ω
Balanced
output
200Ω
RECOMMENDED PC BOARD PATTERNS
0.2
0.3
0.3
0.8 0.6
0.7
ø0.3 Through-hole
This width is 50Ω.
Micro-strip line for 0.4mm thick
glass-epoxy substrate.
Dimensions in mm
654
123
0.8
ELECTRICAL CHARACTERISTICS
Unbalanced impedance 50Ω
Balanced impedance 200Ω
Frequency range 2400 to 2500MHz
Unbalanced port return loss 10dB min.
Phase imbalance at balanced port 180±10deg.
Amplitude imbalance at balanced port 0±2.0dB
Insertion loss 1.0dB max.
Temperature range
Operating –40 to +85°C
Storage –40 to +85°C
Packaging style and quantities 2000pieces/reel
Conformity to RoHS Directive
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and
specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
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001-03 / 20080106 / e751_hhm1521.fm
• All specifications are subject to change without notice.
FREQUENCY CHARACTERISTICS
Unbalance 50Ω/Balance 200Ω
RETURN LOSS
–30
2100 2200 2300 2400 2500 2600 2700
–20
–25
–15
–10
–5
0
Return loss
(
dB
)
Frequency
(
MHz
)
1: 2400MHz
–13.08dB
2: 2500MHz
–14.96dB
1
2
INSERTION LOSS
–5.0
–4.0
–4.5
–3.0
–3.5
–2.0
–2.5
–1.0
–1.5
–0.5
0.0
Insertion loss
(
dB
)
Frequency
(
MHz
)
1: 2400MHz
–0.82dB
2: 2500MHz
–0.76dB
2100 2200 2300 2400 2500 2600 2700
1
2
AMPLITUDE BALANCE
2
1
4
3
5
–4
–5
–2
–3
–1
0
Amplitude balance
(
dB
)
Frequency
(
MHz
)
1: 2400MHz
–0.45dB
2: 2500MHz
–0.57dB
2100 2200 2300 2400 2500 2600 2700
1
2
PHASE BALANCE
155
175
185
195
170
165
160
180
190
200
205
Phase balance
(
deg.
)
1: 2400MHz
180.7deg.
2: 2500MHz
181.3deg.
Frequency
(
MHz
)
2100 2200 2300 2400 2500 2600 2700
1
2
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  • Page 2 2

TDK HHM1521 User manual

TDK
Brand
TDK
Model
HHM1521
Type
User manual
This manual is also suitable for

TDK HHM1521 multilayer chip balun is designed for Bluetooth and 2.4 GHz W-LAN applications. It is RoHS compliant and features a compact size with dimensions of 2.0 x 1.25 x 0.65 mm. The balun has an unbalanced impedance of 50 ohms and a balanced impedance of 200 ohms. It operates in the frequency range of 2400 to 2500 MHz with an insertion loss of 1.0 dB max and a return loss of 10 dB min. The balun also has a phase imbalance of 180 ±10 degrees and an amplitude imbalance of 0 ±2.0 dB. It is packaged in a reel of 2000 pieces, making it a convenient option for high-volume applications.

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