ASROCK H110M-HDVP User manual

Type
User manual
Version 1.0
Published March 2016
Copyright©2016 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer
Law. You are entitled to a replacement or refund for a major failure and compensation for
any other reasonably foreseeable loss or damage caused by our goods. You are also entitled
to have the goods repaired or replaced if the goods fail to be of acceptable quality and the
failure does not amount to a major failure. If you require assistance please call ASRock Tel
: +886-2-28965588 ext.123 (Standard International call charges apply)
e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
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English
H110M-HDVP
Motherboard Layout
Intel
H110
DDR4_B1 (64 bit, 288-pin module)
DDR4_A1 (64 bit, 288-pin module)
ATXPWR1
PCIE1
Top:
RJ-45
USB 2.0
T: USB0
B: USB1
HDL ED RESE T
PLE D PWRBT N
PANE L1
1
1
SPK _CI1
COM2
1
1
HD_ AUDIO 1
H110M-HDVP
RoHS
8
6
7
11
14
15
16
USB 3.0
T: USB0
B: USB1
1
3
2
CMOS
Battery
CLR MOS1
1
10
4
USB 3_2_3
1
CPU _FAN1
9
1
TPM S1
5
PCI Express 3.0
Front USB 3.0
Top:
LINE I N
Cent er:
FRON T
Bott om:
MIC IN
CHA _FAN1
PCIE2
PCIE3
ATX1 2V1
SATA3 _2
DVI1
VGA1
12
USB _4_5
1
SATA3 _3
SATA3 _0
SATA3 _1
PS2
Keyboard
PS2
Mouse
HDMI1
PCI1
1
LPT 1
CHA _FAN2
BIOS
ROM
17
18
19
20
13
USB _6_7
1
COM1
2
English
No. Description
1 ATX 12V Power Connector (ATX12V1)
2 CPU Fan Connector (CPU_FAN1)
3 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
4 ATX Power Connector (ATXPWR1)
5 Chassis Fan Connector (CHA_FAN2)
6 SATA3 Connector (SATA3_0)
7 SATA3 Connector (SATA3_1)
8 SATA3 Connector (SATA3_2)
9 SATA3 Connector (SATA3_3)
10 Clear CMOS Jumper (CLRMOS1)
11 System Panel Header (PANEL1)
12 USB 3.0 Header (USB3_2_3)
13 USB 2.0 Header (USB_6_7)
14 USB 2.0 Header (USB_4_5)
15 Chassis Intrusion and Speaker Header (SPK_CI1)
16 Print Port Header (LPT1)
17 TPM Header (TPMS1)
18 COM Port Header (COM2)
19 Chassis Fan Connector (CHA_FAN1)
20 Front Panel Audio Header (HD_AUDIO1)
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English
H110M-HDVP
I/O Panel
No. Description No. Description
1 PS/2 Mouse Port 8 USB 2.0 Ports (USB_01)
2 D-Sub Port 9 USB 3.0 Ports (USB3_01)
3 COM Port 10 USB 2.0 Ports (USB_23)
4 LAN RJ-45 Port* 11 HDMI Port
5 Line In (Light Blue)** 12 DVI-D Port
6 Front Speaker (Lime)** 13 PS/2 Keyboard Port
7 Microphone (Pink)**
* ere are two LEDs on the LAN port. Please refer to the table below for the LAN port LED indications.
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection
ACT/LINK LED
SPEED LED
LAN Port
13 78
12
6
5
1 4
9
2 3
1011
4
English
** To congure 7.1 CH HD Audio, it is required to use an HD front panel audio module and enable the multi-
channel audio feature through the audio driver.
Please set Speaker Conguration to “7.1 Speaker”in the Realtek HD Audio Manager.
Function of the Audio Ports in 7.1-channel Conguration:
Port Function
Light Blue (Rear panel) Rear Speaker Out
Lime (Rear panel) Front Speaker Out
Pink (Rear panel) Central /Subwoofer Speaker Out
Lime (Front panel) Side Speaker Out
5
English
H110M-HDVP
Chapter 1 Introduction
ank you for purchasing ASRock H110M-HDVP motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRocks
commitment to quality and endurance.
1.1 Package Contents
•
ASRock H110M-HDVP Motherboard (Micro ATX Form Factor)
•
ASRock H110M-HDVP Quick Installation Guide
•
ASRock H110M-HDVP Support CD
•
2 x Serial ATA (SATA) Data Cables (Optional)
•
1 x I/O Panel Shield
Because the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version will be available on
ASRock’s website without further notice. If you require technical support related to
this motherboard, please visit our website for specic information about the model
you are using. You may nd the latest VGA cards and CPU support list on ASRock’s
website as well. ASRock website http://www.asrock.com.
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English
1.2 Specications
Platform
•
Micro ATX Form Factor
•
Solid Capacitor design
CPU
•
Supports 6
th
Generation Intel® Core
TM
i7/i5/i3/Pentium®/
Celeron® Processors (Socket 1151)
•
Supports CPU up to 95W
•
Digi Power design
•
4 Power Phase design
•
Supports Intel® Turbo Boost 2.0 Technology
Chipset
•
Intel® H110
Memory
•
Dual Channel DDR4 Memory Technology
•
2 x DDR4 DIMM Slots
•
Supports DDR4 2133 non-ECC, un-buered memory
•
Supports ECC UDIMM memory modules (operate in non-
ECC mode)
•
Max. capacity of system memory: 32GB
•
Supports Intel® Extreme Memory Prole (XMP) 2.0
Expansion
Slot
•
1 x PCI Express 3.0 x16 Slot (PCIE1: x16 mode)*
* Supports NVMe SSD as boot disks
•
2 x PCI Express 2.0 x1 Slots
•
1 x PCI Slot
Graphics
•
Intel® HD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
•
Supports Intel® HD Graphics Built-in Visuals : Intel® Quick
Sync Video with AVC, MVC (S3D) and MPEG-2 Full
HW Encode1, Intel® InTru
TM
3D, Intel® Clear Video HD
Technology, Intel® Insider
TM
, Intel® HD Graphics 510/530
•
Pixel Shader 5.0, DirectX 12
•
Max. shared memory 1024MB
* e size of maximum shared memory may vary from dierent
operating systems.
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English
H110M-HDVP
•
ree graphics output options: D-Sub, DVI-D and HDMI
* Supports up to 2 displays simultaneously
•
Supports HDMI with max. resolution up to 4K x 2K
(4096x2160) @ 24Hz / (3840x2160) @ 30Hz
•
Supports DVI-D with max. resolution up to 1920x1200 @
60Hz
•
Supports D-Sub with max. resolution up to 1920x1200 @
60Hz
•
Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
HBR (High Bit Rate Audio) with HDMI Port (Compliant
HDMI monitor is required)
•
Supports Accelerated Media Codecs: HEVC, VP8, VP9
•
Supports HDCP with DVI-D and HDMI Ports
•
Supports Full HD 1080p Blu-ray (BD) playback with DVI-D
and HDMI Ports
Audio
•
7.1 CH HD Audio (Realtek ALC887 Audio Codec)
* To congure 7.1 CH HD Audio, it is required to use an HD
front panel audio module and enable the multi-channel audio
feature through the audio driver.
•
Supports Surge Protection (ASRock Full Spike Protection)
•
ELNA Audio Caps
LAN
•
PCIE x1 Gigabit LAN 10/100/1000 Mb/s
•
Realtek RTL8111E
•
Supports Wake-On-LAN
•
Supports Lightning/ESD Protection (ASRock Full Spike
Protection)
•
Supports LAN Cable Detection
•
Supports Energy Ecient Ethernet 802.3az
•
Supports PXE
Rear Panel
I/O
•
1 x PS/2 Mouse Port
•
1 x PS/2 Keyboard Port
•
1 x Serial Port: COM1
•
1 x D-Sub Port
•
1 x DVI-D Port
•
1 x HDMI Port
•
4 x USB 2.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))
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English
•
2 x USB 3.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))
•
1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
LED)
•
HD Audio Jacks: Line in / Front Speaker / Microphone
Storage
•
4 x SATA3 6.0 Gb/s Connectors, support NCQ, AHCI and
Hot Plug
Connector
•
1 x Print Port Header
•
1 x COM Port Header
•
1 x TPM Header
•
1 x Chassis Intrusion and Speaker Header
•
1 x CPU Fan Connector (4-pin)
•
2 x Chassis Fan Connectors (4-pin)
* e CPU Fan Connector supports the CPU fan of maximum
1A (12W) fan power.
•
1 x 24 pin ATX Power Connector
•
1 x 4 pin 12V Power Connector
•
1 x Front Panel Audio Connector
•
2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
•
1 x USB 3.0 Header (Supports 2 USB 3.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
* USB3_2_3 is shared with USB_6_7.
BIOS
Feature
•
AMI UEFI Legal BIOS with multilingual GUI support
•
ACPI 5.0 Compliant wake up events
•
SMBIOS 2.7 Support
•
CPU, GT_CPU, DRAM, PCH 1.0V Voltage Multi-adjustment
Hardware
Monitor
•
CPU/Chassis temperature sensing
•
CPU/Chassis Fan Tachometer
•
CPU/Chassis Quiet Fan (Auto adjust chassis fan speed by
CPU temperature)
•
CPU/Chassis Fan multi-speed control
•
CASE OPEN detection
•
Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore
9
English
H110M-HDVP
Please realize that there is a certain risk involved with overclocking, including
adjusting the setting in the BIOS, applying Untied Overclocking Technology, or using
third-party overclocking tools. Overclocking may aect your system’s stability, or
even cause damage to the components and devices of your system. It should be done
at your own risk and expense. We are not responsible for possible damage caused by
overclocking.
* For detailed product information, please visit our website:
http://www.asrock.com
OS
•
Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-
bit
* To install Windows® 7 OS, a modied installation disk with
xHCI drivers packed into the ISO le is required. Please refer to
page 33 for more detailed instructions.
* For the updated Windows® 10 driver, please visit ASRocks
website for details: http://www.asrock.com
Certica-
tions
•
FCC, CE, WHQL
•
ErP/EuP Ready (ErP/EuP ready power supply is required)
10
English
is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
•
Make sure to unplug the power cord before installing or removing the motherboard
components. Failure to do so may cause physical injuries and damages to motherboard
components.
•
In order to avoid damage from static electricity to the motherboard’s components,
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
•
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
in the bag that comes with the components.
•
When placing screws to secure the motherboard to the chassis, please do not over-
tighten the screws! Doing so may damage the motherboard.
Chapter 2 Installation
11
English
H110M-HDVP
2.1 Installing the CPU
1. Before you insert the 1151-Pin CPU into the socket, please check if the PnP cap
is on the socket, if the CPU surface is unclean, or if there are any bent pins in the
socket. Do not force to insert the CPU into the socket if above situation is found.
Otherwise, the CPU will be seriously damaged.
2. Unplug all power cables before installing the CPU.
1
2
A
B
12
English
4
5
3
13
English
H110M-HDVP
Please save and replace the cover if the processor is removed. e cover must be
placed if you wish to return the motherboard for aer service.
14
English
2.2 Installing the CPU Fan and Heatsink
1 2
CPU_
FAN
15
English
H110M-HDVP
2.3 Installing Memory Modules (DIMM)
is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
e DIMM only ts in one correct orientation. It will cause permanent damage to
the motherboard and the DIMM if you force the DIMM into the slot at incorrect
orientation.
1. For dual channel conguration, you always need to install identical (the same
brand, speed, size and chip-type) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Memory Technology with only one memory
module installed.
3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4
slot; otherwise, this motherboard and DIMM may be damaged.
16
English
1
2
3
17
English
H110M-HDVP
2.4 Expansion Slots (PCI and PCI Express Slots)
ere is 1 PCI slot and 3 PCI Express slots on the motherboard.
PCI slot:
e PCI1 slot is used to install expansion cards that have 32-bit PCI interface.
PCIe slots:
PCIE1 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE2 (PCIe 2.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE3 (PCIe 2.0 x1 slot) is used for PCI Express x1 lane width cards.
Before installing an expansion card, please make sure that the power supply is
switched o or the power cord is unplugged. Please read the documentation of the
expansion card and make necessary hardware settings for the card before you start
the installation.
18
English
2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper
is “Open”. e illustration shows a 3-pin jumper whose pin1 and pin2 are “Short
when a jumper cap is placed on these 2 pins.
Clear CMOS Jumper
(CLRMOS1)
(see p.1, No. 10)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short pin2 and pin3 on CLRMOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed.
Clear CMOSDefault
If you clear the CMOS, the case open may be detected. Please adjust the BIOS option
“Clear Status” to clear the record of previous chassis intrusion status.
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ASROCK H110M-HDVP User manual

Type
User manual

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