Toshiba RD206-SW User guide

Brand: Toshiba

Model: RD206-SW

Type: User guide

Toshiba RD206-SW is an advanced software guide for IH Cooker that offers precise control and efficient operation of your induction heating system. With comprehensive error processing capabilities, it ensures safe and reliable cooking experiences. The software enables accurate data acquisition from ADC, including IGBT temperature, pot bottom temperature, power supply voltage, and electric current. It features various protection mechanisms such as power supply voltage upper and lower limit error detection, overcurrent protection, and temperature monitoring to prevent potential hazards.

RD206-SWGUIDE-01

2022-01-19

Rev.1

1 / 12

Toshiba Electronic Devices & Storage Corporation

Inverter Circuit for IH Cooker

SW Guide

RD206-SWGUIDE-01

2022-01-19

Rev.1

2 / 12

Toshiba Electronic Devices & Storage Corporation

Contents

1. Introduction ................................................................. 3

2. Software Files .............................................................. 5

3. Software Flowchart ...................................................... 6

4. Data Acquisition from ADC ........................................... 6

5. Error Processing ......................................................... 10

5.1. Power Supply Voltage Upper Limit Error .............................................. 10

5.2. Power Supply Voltage Low Limit Error ................................................. 10

5.3. Overcurrent ........................................................................................ 10

5.4. IGBT Temp Sensor Open Circuit Error .................................................. 10

5.5. IGBT Temperature Sensor Short Circuit Error ...................................... 10

5.6. Pot Bottom Temperature Sensor Open Circuit Error ............................. 10

5.7. Pot Bottom Temperature Sensor Short Circuit Error ............................. 10

5.8. Pot Bottom High Temperature Error .................................................... 11

5.9. IGBT High Temperature Error .............................................................. 11

5.10. No Pot Error ..................................................................................... 11

5.11. IGBT High Temperature Monitoring ................................................... 11

5.12. Detection of Surge Current by Hardware ........................................... 11

5.13. Detection of Overcurrent by Hardware .............................................. 11

5.14. Detection of Overvoltage by Hardware .............................................. 11

RD206-SWGUIDE-01

2022-01-19

Rev.1

3 / 12

Toshiba Electronic Devices & Storage Corporation

1. Introduction

This Guide describes the software (SW) of IH Cooker (hereafter referred to as this reference design)

using GT20N135SRA IGBT designed for Home Appliances. The block diagram and circuit of hardware

(HW) controlled by the SW specified in this guide is shown below.

Fig. 1.1 Block Diagram of IH Cooker

220 V

AC/DC

18 V supply

5 V supply

MCU

HT45F0058

(Holtek)

CN1

CN2

Pot bottom temperature

monitoring thermistor

IH coil

IGBT

temperature

monitoring

thermistor

IGBT drive

circuitry

Voltage

divider

Voltage

divider

Resonant

capacitor

Op.Amp

Voltage

Divider

FAN

control

DC Fan

MCU

CN3

CN4

CN5

CN6

CN102

CN101

Within dashed line:

Main Board

Within dashed line:

Control Board

Touch Sensors

+5 V power supply

I2C-bus Interface

Voltage

Divider

LEDs

7 Segment Display

IGBT

GT20N135SRA

RD206-SWGUIDE-01

2022-01-19

Rev.1

4 / 12

Toshiba Electronic Devices & Storage Corporation

Fig. 1.2 Circuit of Main Board

0.24 μF

630 VAC

AC1

AC2

220 V

5 μF

275 VAC

20m

240 pF

1 μF

150 k

110 k

100 k

82 k

75 k

330 pF

110 k

68 k

1.3 k

2 k

GT20N135SRA

10 k

CRZ18

330 pF

PPG

PA3/TCO/CP0P/AN9

PB3/PPGIN/CP0N/AN0

PB0/OPINN/OPINP

PA1/OPOUT/AN8

PA4/C2VO/AN4/VREF

PA6/CP2N/AN6

PB2/OVPI1/AN1

4.7 μF

450 V

4.7 μF

50 V

470 μF

35 V

2 k

220 μF

35 V

+18VF (To cooling fan)

+18VG

（To IGBT driver）

100 μF

25 V

100 μF

25 V

GND

VDD

PN8044

220 pF

PA7/CP2P/AN5

PB4/C0VO/AN3

PA2/OPROUT/AN2/ICPCK

TBC847

TBC857

TBC847

220

10k

3.3 k

1/5 W

1 μF

68 x2

1/4 W

68 x2

1/4 W

KDZV5.1B

47 k

56 k

0.1 μF

27 nF

9.1 k

4.3 k

14 k

1 μF

3.3 k

470 k

10 k

470 k

20 k

0.1 μF

18V_G

PA0/ICPDA

10 k

ICPCK

ICPDA

VSS

VDD

SDA

SCL

VSS

VDD

TXD

VSS

VDD

PA5/CP1N/AN7

2SC6135

1 k

PB1/PCK/C1VO/C3VO

5.1 k

0.1 μF

ma μ

VDD/AVDD

VSS/AVDD

HT45F0058

1000 pF

1 kV

US1M

EE10

GBJ2010-F

US1M

18V

FANG

US1M

SMAZ5V1

US1M

1 k×2

1/8 W

100 μF

25 V

CN1

CN2

CN3

CN4

CN6

CN5

NTC

100 k/B3964

JP1

12.5 A

250 VAC

10 μF

470 k

5 μF

275 VAC

0.1 μF

275 VAC

300 μH

10 A

390

LDO

L4931CZ50

0.1 μF

100 μH

+5V

NTC

RD206-SWGUIDE-01

2022-01-19

Rev.1

5 / 12

Toshiba Electronic Devices & Storage Corporation

2. Software Files

Following table shows the files of Source code for this reference design.

Table 2.1 List of Source Code Files

File Name

Description

startup1_l.asm

Startup code

ADC.c

Functions of A/D conversion

ADC.h

Header of ADC.c

Beep_Fan_dcf.c

Functions of buzzer and fan control

Beep_Fan_dcf.h

Header of Beep_Fan_dcf.c

CMP_OPA_Calibrate.c

Calibration of op amp and comparators

CMP_OPA_Calibrate.h

Header of CMP_OPA_Calibrate.c

I2C.c

Functions of I2C

I2C.h

Header of I2C.c

Include.h

Header of Interrupt.c

Interrupt.c

Functions of interrupt handler

Interrupt.h

Header of Interrupt.c

main.c

Initialization and main loop

Main.h

Header of main.c

MyType.h

Definition of types and constants

POT_Detect.c

Functions of pot detection

POT_Detect.h

Header of POT_Detect.c

PPG_IGBT_Control.c

Functions of IGBT gate pulse control

PPG_IGBT_Control.h

Header of PPG_IGBT_Control.c

Protection.c

Functions of various protection

Protection.h

Header of Protection.c

Timer.c

Functions of timer control

Timer.h

Header of Timer.c

Uart_Debug.c

Functions of UART debug output

Uart_Debug.h

Header of Uart_Debug.c

UI_Test.c

Functions of control board communication

UI_Test.h

Header of UI_Test.c

PowCalculate.h

Header of PowCalculate.lib

PowCalculate.lib

Power calculation library (binary)

RD206-SWGUIDE-01

2022-01-19

Rev.1

6 / 12

Toshiba Electronic Devices & Storage Corporation

3. Software Flowchart

The flowchart of the software is shown below.

Fig. 3.1 Software Flowchart

4. Data Acquisition from ADC

Following parameters are read using Analog to Digital Converter:

 IGBT temperature

 Pot bottom temperature

 Power supply voltage

 Electric current

main()

Initialize

Interrupt Enable

WDT Clear

RAM Check

A/D Value

Average

A/D Value

Upper and Lower

Limit Check

Process for

every 1 s

Process for

every 500 ms

Process for

every 100 ms

Process for

every 20 ms

Process for

every 1 ms

RD206-SWGUIDE-01

2022-01-19

Rev.1

7 / 12

Toshiba Electronic Devices & Storage Corporation

Method of Reading Data:

10 samples are taken and average of 8 samples are taken after ignoring the maximum and minimum values.

1. Sampling cycle starts every 20 ms in the “Process for every 20 ms” block.

2. For taking a sample, Analog to Digital conversion is performed at every 1 ms interrupt.

3. Systems takes average of samples for all four parameters.

4. System waits for next sampling cycle.

Meaning of ADC Output Values:

1. IGBT temperature

For more description refer to MyType.h

Table. 4.1 IGBT Temperature and ADC Value Relation

IGBT Temp.

A/D Value

Symbol

253

c_NTC_OPENCIRCUIT

199

196

176

171

c_T_IGBT_RECOVER

166

145

135

c_T_IGBT_POWERDROP1

124

131

124

c_T_IGBT_POWERDROP

100

105

c_T_IGBT_OTEMP

110

c_NTC_SHORTCIRCUIT

Fig. 4.1 IGBT Temperature and ADC Value Relation Chart

100

150

200

250

12345678910 11 12 13

- IGBT Temperature

- ADC Value

RD206-SWGUIDE-01

2022-01-19

Rev.1

8 / 12

Toshiba Electronic Devices & Storage Corporation

2. Pot bottom temperature

For more description refer to MyType.h

Table 4.2 Pot Bottom Temperature and ADC Value Relation

PAD Temperature

A/D Value

Symbol

c_NTC_SHORTCIRCUIT

c_T_PAD_RECOVER

100

105

108

110

130

101

148

108

150

116

155

119

160

149

167

181

170

184

175

188

c_T_PAD_OTEMP、c_T_PAD_OTEMP1

235

195

240

208

260

236

280

246

253

c_NTC_OPENCIRCUIT

Fig. 4.2 Pot Bottom Temperature and ADC Value Relation Chart

100

150

200

250

300

12345678910 11 12 13 14 15 16 17 18 19

-PAD Temperature

-ADC value

RD206-SWGUIDE-01

2022-01-19

Rev.1

9 / 12

Toshiba Electronic Devices & Storage Corporation

3. Power supply voltage

For more description refer to MyType.h

Table 4.3 Power Supply Voltage and ADC Value Relation

Power Supply Voltage

A/D Value

Power Supply Voltage

A/D Value

195

126

200

129

205

132

210

135

100

215

139

110

220

142

120

225

145

130

230

148

140

235

152

145

240

155

150

245

158

160

103

250

161

170

110

260

168

180

116

270

174

185

119

275

177

190

123

285

184

Fig. 4.3 Power Supply Voltage and ADC Value Relation Chart

100

150

200

250

300

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31

-PAD Temperature

-ADC value

RD206-SWGUIDE-01

2022-01-19

Rev.1

10 / 12

Toshiba Electronic Devices & Storage Corporation

5. Error Processing

5.1. Power Supply Voltage Upper Limit Error

This error check is carried out using ADC value upper/lower limit check.

If the value indicates 270 V or more, the count is incremented by 1. And when it is confirmed 10 times, it is

judged to be an error.

And if the value indicates less than 270 V, the count is decremented by 1.

When it is judged to be an error, the IGBT is turned off, and the error status is recorded in the notification data

sent to the DISPLAY_BOARD.

If normal status is maintained for 3 seconds, the error status is cleared in the notification data sent to the

DISPLAY_BOARD.

5.2. Power Supply Voltage Low Limit Error

This error check is carried out using ADC value upper/lower limit check.

If the value indicates less than 150 V, the count is incremented by 1. And when it is confirmed 10 times, it is

judged to be an error.

And if the value indicates 150 V or more, the count is decremented by 1.

When it is judged to be an error, IGBT is turned off, and the error status is recorded in the notification data sent

to the DISPLAY_BOARD.

If normal status is maintained for 3 seconds, the error status is cleared in the notification data sent to the

DISPLAY_BOARD.

5.3. Overcurrent

This error check is carried out using ADC value upper/lower limit check.

If the ADC value is 165 or more, the count is incremented by 1. And when it is confirmed 2 times, it is judged to

be an error.

And if the value is below 165, the count is decremented by 1.

When it is judged to be an error, the error status is recorded in the notification data sent to the DISPLAY_BOARD.

If normal status is maintained for 3 seconds, the error status is cleared in the notification data sent to the

DISPLAY_BOARD.

5.4. IGBT Temp Sensor Open Circuit Error

This error check is carried out using ADC value upper/lower limit check in the “processing at every 1 s”.

If the ADC value is 253 or more, it judged to be an error.

When it is judged to be an error, the error status is recorded in the notification data sent to the DISPLAY_BOARD.

It is restored after restart.

5.5. IGBT Temperature Sensor Short Circuit Error

This error check is carried out using ADC value upper/lower limit check in the “processing at every 1 s”.

If the ADC value is 3 or less, it judged to be an error.

When it is judged to be an error, the error status is recorded in the notification data sent to the DISPLAY_BOARD.

It is restored after restart.

5.6. Pot Bottom Temperature Sensor Open Circuit Error

This error check is carried out using ADC value upper/lower limit check in the “processing at every 1 s”.

If the ADC value is 253 or more, it judged to be an error.

When it is judged to be an error, the error status is recorded in the notification data sent to the DISPLAY_BOARD.

It is restored after restart.

5.7. Pot Bottom Temperature Sensor Short Circuit Error

This error check is carried out using ADC value upper/lower limit check in the “processing at every 1 s”.

If the ADC value is 3 or less, it judged to be an error.

When it is judged to be an error, the error status is recorded in the notification data sent to the DISPLAY_BOARD.

It is restored after restart.

RD206-SWGUIDE-01

2022-01-19

Rev.1

11 / 12

Toshiba Electronic Devices & Storage Corporation

5.8. Pot Bottom High Temperature Error

This error check is carried out using ADC value upper/lower limit check.

If the pot bottom temperature is 175 degree or more and the ADC value is below 253, the count is incremented

by 1. And when it is confirmed 5 times, it is judged to be an error.

And if above conditions are not met, the count is decremented by 1.

When it is judged to be an error, the IGBT is turned off, and the error status is recorded in the notification data

sent to the DISPLAY_BOARD.

When pot bottom temperature goes below 60 degree, the error status is cleared in the notification data sent to

the DISPLAY_BOARD.

5.9. IGBT High Temperature Error

This error check is carried out using ADC value upper/lower limit check.

If the IGBT temperature is 105 degree or more and the ADC value is above 3, the count is incremented by 1.

And when it is confirmed 5 times, it is judged to be an error.

And if above conditions are not met, the count is decremented by 1.

When it is judged to be an error, the IGBT is turned off, and the error status is recorded in the notification data

sent to the DISPLAY_BOARD.

When IGBT temperature goes below 65 degree, the error status is cleared in the notification data sent to the

DISPLAY_BOARD.

5.10. No Pot Error

This error check is carried out in the “processing at every 100 ms”.

Detection processing starts due to a decrease in the current flow value.

After one pulse is generated by the PPG, changes at both ends of the coil are counted by the comparator.

If the value is above the threshold value, it is assumed that no pot is set. If cooking is in progress, IGBT is

turned off, and the error status is recorded in the notification data sent to the DISPLAY_BOARD.

If the value is less than the threshold value, it is assumed that there is pot, and if cooking is in progress, IGBT

is turned on, and the error status is cleared in the notification data sent to the DISPLAY_BOARD.

5.11. IGBT High Temperature Monitoring

This error check is carried out in the “processing at every 1 s”.

If IGBT temperature is 88 degree or more, the count is incremented by 1. And when it is confirmed 5 times, it is

judged to be an error.

And if above condition is not met, the count is decremented by 1.

After this error detection, if IGBT temperature goes below 83 degree, the heating is resumed.

5.12. Detection of Surge Current by Hardware

This flag is enabled by CMP2 interrupt, and it is checked in “processing at every 20 ms”.

IGBT is turned off when surge current is detected.

And if it does not recur for 3 s, normal operation is restored.

5.13. Detection of Overcurrent by Hardware

This flag is enabled by CMP3 interrupt, and it is checked in “processing at every 20 ms”.

IGBT is turned off when overcurrent is detected.

And if it does not recur within 1 s for the second time and within 3 seconds for other cases, normal operation is

restored.

5.14. Detection of Overvoltage by Hardware

PPG is reset by OVP interrupt. At this time, the flag is enabled, checked by an interrupt of 10 ms, and the PPG

is reset after 190 ms.

RD206-SWGUIDE-01

2022-01-19

Rev.1

12 / 12

Toshiba Electronic Devices & Storage Corporation

This terms of use is made between Toshiba Electronic Devices and Storage Corporation (“We”) and customers who use

documents and data that are consulted to design electronics applications on which our semiconductor devices are mounted (“this

Reference Design”). Customers shall comply with this terms of use. Please note that it is assumed that customers agree to any

and all this terms of use if customers download this Reference Design. We may, at its sole and exclusive discretion, change, alter,

modify, add, and/or remove any part of this terms of use at any time without any prior notice. We may terminate this terms of use

at any time and for any reason. Upon termination of this terms of use, customers shall destroy this Reference Design. In the event

of any breach thereof by customers, customers shall destroy this Reference Design, and furnish us a written confirmation to prove

such destruction.

1. Restrictions on usage

1. This Reference Design is provided solely as reference data for designing electronics applications. Customers shall not use

this Reference Design for any other purpose, including without limitation, verification of reliability.

2. This Reference Design is for customer's own use and not for sale, lease or other transfer.

3. Customers shall not use this Reference Design for evaluation in high or low temperature, high humidity, or high electromagnetic

environments.

4. This Reference Design shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is

prohibited under any applicable laws or regulations.

2. Limitations

1. We reserve the right to make changes to this Reference Design without notice.

2. This Reference Design should be treated as a reference only. We are not responsible for any incorrect or incomplete data and

information.

3. Semiconductor devices can malfunction or fail. When designing electronics applications by referring to this Reference Design,

customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their

hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of semiconductor

devices could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Customers must

also refer to and comply with the latest versions of all relevant our information, including without limitation, specifications, data

sheets and application notes for semiconductor devices, as well as the precautions and conditions set forth in the "Semiconductor

Reliability Handbook".

4. When designing electronics applications by referring to this Reference Design, customers must evaluate the whole system

adequately. Customers are solely responsible for all aspects of their own product design or applications. WE ASSUME NO

LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

5. No responsibility is assumed by us for any infringement of patents or any other intellectual property rights of third parties that

may result from the use of this Reference Design. No license to any intellectual property right is granted by this terms of use,

whether express or implied, by estoppel or otherwise.

6. THIS REFERENCE DESIGN IS PROVIDED "AS IS". WE (a) ASSUME NO LIABILITY WHATSOEVER, INCLUDING WITHOUT

LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT

LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (b)

DISCLAIM ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO THIS REFERENCE

DESIGN, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE,

ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

3. Export Control

Customers shall not use or otherwise make available this Reference Design for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology

products (mass destruction weapons). This Reference Design may be controlled under the applicable export laws and regulations

including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration

Regulations. Export and re-export of this Reference Design are strictly prohibited except in compliance with all applicable export

laws and regulations.

4. Governing Laws

This terms of use shall be governed and construed by laws of Japan.

Toshiba RD206-SW User guide

Toshiba RD206-SW User guide

Toshiba RD206-SW User guide

Related papers

Other documents