Eurotech CPU-162-23 Owner's manual

CPU-162-23

Xeon D COMe CPU Module

USER MANUAL

First edition – July 2018 – B37028A0-MN002-00_UserMan_En_1

Preface

Thank you for choosing the CPU-162-23. Please read this manual before using the CPU-162-23 so that you may

obtain the greatest benefit from using the device.

This manual presents the specifications, functions, and method of use of the CPU-162-23.

Eurotech has made every effort to carefully inspect each product and has taken great care to package and to

ship the product. In the unlikely event of the product’s failure to operate normally due to problems in shipping or

otherwise, the company will repair or replace the product at its own responsibility.

If you have any questions, contact your local Eurotech Sales Office.

Trademarks

All trademarks both marked and unmarked appearing in this document are the property of their respective owners.

This document does not give permission to the implementation of patents or other rights held by Eurotech or third

parties.

Revision history

Revision

Description

Date

1

First release

24 July 2018

CPU-162-23 USER MANUAL  Table of contents  
 

B37028A0-MN002-00_UserMan_En_1 
Table of contents 
Preface ........................................................................................................................................................................ 2 
Trademarks .................................................................................................................................................................. 2 
Revision history ........................................................................................................................................................... 2 
Table of contents .......................................................................................................................................................... 3 
Important User Information ...................................................................................................................................... 5 
1 Safety Notices and Warnings ................................................................................................................................ 5 
2 Life Support Policy ................................................................................................................................................. 7 
3 Warranty ................................................................................................................................................................ 7 
4 RoHS ..................................................................................................................................................................... 7 
5 Technical Assistance ............................................................................................................................................. 7 
6 Conventions ........................................................................................................................................................... 7 
7 Electromagnetic Compatibility ............................................................................................................................... 7 
Overview .................................................................................................................................................................... 9 
Basic Specifications ............................................................................................................................................... 10 
Block Diagram ......................................................................................................................................................... 12 
Board Outline/Schematic Layout .......................................................................................................................... 13 
Processor ................................................................................................................................................................. 15 
1. Processor ............................................................................................................................................................ 15 
2. Cache Memories ................................................................................................................................................ 15 
Memory ..................................................................................................................................................................... 16 
1. Main Memory ...................................................................................................................................................... 16 
2. Boot ROM ........................................................................................................................................................... 16 
3 EEPROM ............................................................................................................................................................. 16 
COM Express ........................................................................................................................................................... 17 
1. PCI Express (lane0-7) ....................................................................................................................................... 17 
2. PCI Express (lane 8-31) ..................................................................................................................................... 18 
3. LAN (GbE) .......................................................................................................................................................... 18 
4. LAN (10GbE) ...................................................................................................................................................... 19 
5. SATA .................................................................................................................................................................. 19 
6. USB3.0 ............................................................................................................................................................... 19 
7. USB2.0 ............................................................................................................................................................... 19 
8 UART ................................................................................................................................................................... 19 
9 LPC ...................................................................................................................................................................... 19 
10. SPI .................................................................................................................................................................... 19 
11. SMBus (System Management Bus) ................................................................................................................. 19 
12.I
2
C Bus ............................................................................................................................................................... 19 
13. GPIO ................................................................................................................................................................. 20 
13.1  GPI ........................................................................................................................................................... 20 
13.2  GPO ......................................................................................................................................................... 20 
14 External BIOS ROM Support ............................................................................................................................. 20 
15. Reset ................................................................................................................................................................ 20 
16. Battery Low Alarm ............................................................................................................................................ 20 
17. Power Button .................................................................................................................................................... 21 

 Table of contents  CPU-162-23 USER MANUAL 
 

B37028A0-MN002-00_UserMan_En_1 
18. Power Good ...................................................................................................................................................... 21 
19. Speaker ............................................................................................................................................................ 21 
FPGA ........................................................................................................................................................................ 22 
1. GPIO Signals between FPGA and MCU ............................................................................................................ 22 
2. LPC Bus Controller ............................................................................................................................................. 22 
3. Address Map....................................................................................................................................................... 23 
3.1.  I
2
C Controller ............................................................................................................................................. 23 
3.2.  LED Control Register ................................................................................................................................ 24 
3.3.  WDT Control Register ............................................................................................................................... 24 
3.4.  FAN Control Resister ................................................................................................................................ 25 
VOLTAGE MONITORING SOFTWARE SPECIFICATIONS ................................................................................................ 26 
1. Description of Operation ................................................................................................................................... 26 
1.1.  Voltage Monitoring Operation ................................................................................................................. 26 
1.2.  Notifying the Bit Error of FPGA Configuration Memory .......................................................................... 26 
1.3.  10GbEthernet LED Control .................................................................................................................... 26 
2. Address ............................................................................................................................................................. 27 
2.1.  Address List ............................................................................................................................................ 27 
2.2.  Detailed Description of Bit ....................................................................................................................... 28 
Connector and Jumper/LED................................................................................................................................. 35 
1. CPU Module Onboard Component .................................................................................................................. 35 
1.1.  LED1 (General Purpose Status LED) ..................................................................................................... 37 
2. Setting ............................................................................................................................................................... 37 
2.1.  JP2 (CMOS_CLR Setting Pin) ................................................................................................................ 37 
2.2.  SW1(PCI Express/LAN select switch).................................................................................................... 37 
Pin Layout .............................................................................................................................................................. 38 
1. CN1 (COM Express Stacking Connector) ........................................................................................................ 38 
2. CN7 (Multi ISP Connector) ............................................................................................................................... 40 
Address Map .......................................................................................................................................................... 41 
1. IO Space ........................................................................................................................................................... 41 
2. Memory Space ................................................................................................................................................. 42 
3. PCI devices....................................................................................................................................................... 43 
4. SMBus Address Map ........................................................................................................................................ 43 
5. I
2
C Address Map ............................................................................................................................................... 43 
BIOS ........................................................................................................................................................................ 44 
1. Displayed Contents of BIOS Setup Menu ........................................................................................................ 44 
1.1.  BIOS Setup Menu ................................................................................................................................... 45 
1.2.  EDKII Menu ............................................................................................................................................. 46 
1.3.  Boot Manager Menu................................................................................................................................ 78 
1.4.  Boot Maintenance Manager .................................................................................................................... 78 
2. Recording Method For an error Detected During POST .................................................................................. 81 
Heat Sink ................................................................................................................................................................ 83 
1. Passive heat sink (M38001A0) ......................................................................................................................... 83 
2. Active heat sink (M38001B0)............................................................................................................................ 85 
3. Active heat sink eTEMP (M38001C0) .............................................................................................................. 87 
Notes ............................................................................................................................................................................ 89 
 
 

CPU-162-23 USER MANUAL Important User Information

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1. Important User Information

In order to lower the risk of personal injury, electric shock, fire, or equipment damage, users must observe the

following precautions as well as good technical judgment, whenever this product is installed or used.

All reasonable efforts have been made to ensure the accuracy of this document; however, Eurotech assumes

no liability resulting from any error/omission in this document or from the use of the information contained herein.

Eurotech reserves the right to revise this document and to change its contents at any time without obligation to

notify any person of such revision or changes. Reproduction of all or part of this document without Eurotech’s

permission is prohibited.

1.1 Safety Notices and Warnings

The following general safety precautions must be observed during all phases of operation, service, and repair of

this equipment. Failure to comply with these precautions or with specific warnings elsewhere in this manual

violates safety standards of design, manufacture, and intended use of the equipment. Eurotech assumes no

liability for the customer’s failure to comply with these requirements.

The safety precautions listed below represent warnings of certain dangers of which Eurotech is aware. You, as

the user of the product, should follow these warnings and all other safety precautions necessary for the safe

operation of the equipment in your operating environment.

Alerts that can be found throughout this manual

The following alerts are used within this manual and indicate potentially dangerous situations.

Danger, electrical shock hazard:

Information regarding potential electrical shock hazards:

Personal injury or death could occur. Also damage to the system, connected peripheral

devices, or software could occur if the warnings are not carefully followed.

Appropriate safety precautions should always be used, these should meet the

requirements set out for the environment that the equipment will be deployed in.

Warning:

Information regarding potential hazards:

Personal injury or death could occur. Also damage to the system, connected peripheral

devices, or software could occur if the warnings are not carefully followed.

Appropriate safety precautions should always be used, these should meet the

requirements set out for the environment that the equipment will be deployed in.

Information and/or Notes:

These will highlight important features or instructions that should be observed.

Protect the device from vibration and impact

Do not place the product in a location where it can fall or can be subject to vibration or impact because this may

cause device failure.

Do not modify the device

For safety reasons, under no circumstances should you modify the device. Eurotech will not repair products

that have been modified.

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Protect the product from water and chemicals

Contact between the product and water or chemicals can result in product failure, electrocution, or fire.

Protect the product from foreign material

Make sure that foreign material does not get into the product during use, storage, or transport because this can

result in product failure.

Use precautions in handling to ensure that you are not injured

The sharp projections on this product may cause injury. Take care in handling this product in order to avoid

injury.

Do not disassemble the product

In order to maintain guaranteed product performance, do not disassemble this product under any circumstances.

Keep the product away from radios and TVs

Do not use the product near radios, television sets, or other devices generating strong magnetic or electrical

fields. This could result in failure or malfunction.

Keep the product away from flame, humidity, and direct sunlight

Do not use or store the product in any of the following locations, as this could result in product failure:

 Places where there is fire

 Locations high in humidity or exposed to rain

 Locations exposed to direct sunlight

 Dusty or dirty locations

 Locations containing excessive water or chemical vapors

Install the product in well-ventilated locations

Install the product in well-ventilated locations to efficiently disperse heat generated by the product.

Remove the power plug from the receptacle when not using the product

Turn off the main switch and remove the power plug from the receptacle when not using the product or when

there is the risk of lightning strike.

Use the device within rated parameters

Be sure to use the product within the ratings specified in this manual. Failure to do so may result in malfunction.

Use care when cleaning the product

If the product becomes dirty, wipe it with a dry soft cloth. A thinned neutral cleaner may be used if the product is

particularly dirty. Do not use benzene, thinners, or other solvents under any circumstances.

Ground the product in order to prevent electrocution

Be sure to ground the product by connecting it to a 3-pole AC receptacle or by using an AC receptacle having a

grounding terminal.

Dispose of the product properly

Use appropriate methods for handling industrial wastes when disposing of this product.

Wire the product correctly

Failure to wire the product correctly can result in malfunction or fire. Read this manual and wire the product

correctly.

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Use antistatic precautions

This product comprises electronic parts that are highly susceptible to static electricity. Static electricity can

cause the product to malfunction. Take care not to touch any of the terminals, connectors, ICs, or other parts

with the hands.

Do not use a malfunctioning product

Stop using the product if you believe it is malfunctioning. Continuing to use a malfunctioning product can cause

the malfunction to spread to other products and can cause short circuits or fire.

1.2 Life Support Policy

Eurotech products are not authorized for use as critical components in life support devices or systems without

the express written approval of Eurotech.

1.3 Warranty

For warranty terms and conditions users should contact their local Eurotech Sales Office.

Refer to the back covers of this manual for full contact details.

1.4 RoHS

This device, including all its components, subassemblies and the consumable materials that are an integral part

of the product, has been manufactured in compliance with the European directive 2011/65/EU known as the

RoHS directive (Restrictions on the use of certain Hazardous Substances). This directive targets the reduction

of certain hazardous substances previously used in electrical and electronic equipment (EEE).

1.5 Technical Assistance

If you have any technical questions, cannot isolate a problem with your device, or have any enquiry about repair

and returns policies, contact your local Eurotech Technical Support Team.

See the back cover for full contact details.

Transportation

When transporting any module or system, for any reason, it should be packed using anti-static material and

placed in a sturdy box with enough packing material to adequately cushion it.

Warning:

Any product returned to Eurotech that is damaged due to inappropriate packaging will not be covered by the

warranty.

1.6 Conventions

The following table describes the conventions for signal names used in this document.

1.7 Electromagnetic Compatibility

This product is intended for industrial assembly only and is not for commercial use. Therefore, this product is not

an apparatus and so does not need to be subject to the EMC Directive.

Convention

Explanation

GND

Digital ground plane

#

Active low signal

+

Positive signal in differential pair

-

Negative signal in differential pair

NC

No connection

RSVD

Use is reserved to Eurotech

CPU-162-23 USER MANUAL Overview

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2. Overview

CPU-162-23 is a basic module sized COM Express CPU Module, which is equipped with the Intel Xeon

Processor D-1500 family or the Intel Pentium Processor D-1500 family. It is possible to specify when placing an

order about the CPU type and mounting of the memory socket. Details are explained in Chapter 3 Basic

Specifications.

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3. Basic Specifications

Table 1 describes the specification list of this product. Table 2 shows the board product model number.

CPU-162-23 specification list

Item

Details

CPU

(*1)

Model

Pentium

D1519

Xeon

D-1539

Xeon

D-1559

Xeon

D-1587

# of cores

4

8

12

16

TDP

25W

35W

45W

65W

Base frequency

1.5GHz

1.6GHz

1.5GHz

1.7GHz

Max Turbo

Frequency

2.1GHz

2.2GHz

2.1GHz

2.3GHz

L1 cache

32kB for data, 32kB for instruction (per core)

L2 cache

256kB for data and instruction (per core)

L3 cache

1.5MB (per core)

Memory

Main Memory

2133MT/s

DDR4 SO-DIMM socket x3

(*2)

, ECC supported

SODIMM sockets support up to 16 GB each. The maximum

memory capacity as a module is 48 GB.

Boot ROM

SPI-FLASH 16MB

EEPROM

64kb

COM Express

SMBus

1 port

I

2

C

1 port

UART

2 ports

LAN(GbE)

1 port

LAN(10GbE)

2 ports

USB 2.0

4 ports

USB 3.0

4 ports

GPIO

GPI：4 bits / GPO：4 bits (GPI1 can be used as a NMI)

PCI Express Gen3

24 lanes

PCI Express Gen2

8 lanes

LPC

1 port

Serial-ATA 6Gb

2 ports

SPI

1 port

Other

Following features are supported.

Reset

Thermal Protection

Power button

Power Good

Speaker

Power source

Specification

Power supply

VCC_12V±5%

VCC_5V_SBY±5%

VCC_RTC(2.0~3.3V)

*supplied from the COM Express connector

Current consumption

VCC_12V : Typ 5.02 A (with TDP65W Model)

VCC_5V_SBY : Typ 0.34 A

VCC_RTC (Power OFF) : Typ 2.6 uA

(Power ON) : Typ 0.1 uA

Mechanical

Specification

Standard

PICMG COM.0 COM Express Module base Spec R3.0

Pin-out type

Type7

Form factor

125mm x 95mm (Basic module size)

Weight

145g (excluding the SO-DIMM)

*1 Processor is an implementation option.

*2 Factory Option: up to 4x DDR4 ECC SODIMM for up to 64GB. When memory socket 4x is used, it is necessary to use COM

Express riser card or to drill a hole in memory socket area. The memory socket area is shown in Figure 5 of the PCB

outline / schematic layout diagram in Chapter 5.

CPU-162-23 USER MANUAL Overview

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Board product model number

Product model number

Description

CPU-162-23-05

Pentium D 1519, 4Core, 1.5GHz, TDP 25W

CPU-162-23-07

Xeon D-1539, 8Core, 1.6GHz, TDP 35W,

CPU-162-23-08

Xeon D-1559, 12Core, 1.5GHz, TDP 45W,

COM Express riser card

It is a board sandwiched between CPU module and carrier

board.

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4. Block Diagram

Figure 1 illustrates the block diagram of this product.

Figure 1. Block diagram

GbE Controller

Intel: I210-AT

PCIe gen2.0

PCIE 0-3

DDR4 1600-2400

SO-DIMM w/ ECC

up to 16GB

72

DDR4

PCIe (PCH)

PCIe gen2.0

PCIE 4-5

PCIe (PCH)

PCIe gen2.0

PCIE 6

PCIe (PCH)

PCIe gen3.0

PCIE 8-15

PCIe (CPU)

x4

x2

x8

PCIe gen3.0

PCIE 16-31

PCIe (CPU)

x16

10GBASE-KR

10G_KR [0:1]

10GBASE-KR

1000BASE-T

GBE 0

PCIe(PCH)

PCIe gen2.0

NCSI

NC-SI

RT

SER [0:1]

UART

2ports

Buffer

UART

2ports

SATA 3.0

SATA [0:1]

SATA

2ports

USB2.0

USB [0:3]

USB2.0

4ports

USB3.0

USB_SS [0:3]

USB3.0

4ports

SPI

MUX

SPI

SPI Flash

(BIOS)

SPI

GPI [0:3]

GPIO

4bits

GPO [0:3]

GPIO

4bits

x1

EEPROM

SMBus

FPGA

I2C

Management

Signals

Management

Signals

TPM

LPC

4

VCC_5V_SBY

VCC_RTC

12V

VCC_12V

5V

3V

MCU

NOTE:

2400 MT/s is supported by limited SKUs.

2133 MT/s is the maximum data rate for

usual SKUs.

DDR4 1600-2400

SO-DIMM w/ ECC

up to 16GB

COM Express

Connector

Intel Xeon D-1500

(option)PCIE 7

PCIe gen2.0

x1

DDR4 1600-2400

SO-DIMM w/ ECC

up to 16GB

72

DDR4

DDR4 1600-2400

SO-DIMM w/ ECC

up to 16GB

option

SW1

CPU-162-23 USER MANUAL Block Diagram

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5. Board Outline/Schematic Layout

Figure 2, 3 and 4 illustrate the board outline/schematic layout of the product. Figure 5 shows the area where

holes are drilled in the carrier board when using memory socket x4.

Figure 2. Component side layout

Figure 3. Solder side layout (Bottom view)

125

95

87

4

4117

41

CN7

JP2

SW1

LED1

20.5

48.5

U1

76

4

53

26.75

CN4

CN6

CN1

CN2 CN3

Board Outline/Schematic Layout CPU-162-23 USER MANUAL

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Figure 4. Side layout

Figure 5. Memory socket area

42UA

9

78

8

Memory socket

area

125

95

83

CPU-162-23 USER MANUAL Processor

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6. Processor

6.1. Processor

The following processors can be mounted on this product. Processor is an implementation option.

Processor

CPU Model

Number of cores

Core frequency

(base)

Memory

frequency

TDP

D-1519

4

1.5GHz

DDR4-2133

25W

D-1539

8

1.6GHz

DDR4-2133

35W

D-1559

12

1.5GHz

DDR4-2133

45W

D-1587

16

1.7GHz

DDR4-2133

65W

6.2. Cache Memories

The processor contains the following cache memories.

- L1 Cache

32 kB for data, and 32 kB for instruction (for each core)

- L2 Cache

256 kB shared for data and instruction (for each core)

- L3 Cache

1.5MB (for each core)

Memory CPU-162-23 USER MANUAL

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7. Memory

The memories in the CPU module are listed as follows.

7.1. Main Memory

The main memory is a DDR4 SO-DIMM socket. The maximum main memory is 64 GB (max. 16 GB of SO-DIMM

4pcs).

This corresponds to ECC, which can correct a 1 bit error automatically. (non-ECC are also supported.)

When installing the memory module, please install from the component side.

Adbc8043 does not come with a memory module.

(It will not boot if the memory module is mounted only on the solder side.)

7.2. Boot ROM

The BIOS is stored in the SPI-FLASH memory on CPU-162-23. This memory is 16 MB.

CPU-162-23 can also be configured to boot from a BIOS in an SPI-FLASH on the career board.

7.3 EEPROM

An EEPROM is mounted as a storage memory to store an error log of BIOS. The memory is 64 kbit.

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8. COM Express

The CPU module uses the COM Express Type 7 pin-out. This chapter describes each interface.

8.1. PCI Express (lane0-7)

This interface conforms to the standard of Gen2 (maximum transfer rate: 5 GT/s).

It is composed of 8 lanes.

Table 3 and Table 4 show the PCI Express link configuration. Changing this configuration requires to modify

BIOS image at low level. Please ask our sales team.

PCI Express Link configuration

COM Express

pin name

PCI Express

lane #

Configuration1

Configuration2

Configuration3

Configuration4

(Default)

PCIE3

3

X 1

X 2

X 4

PCIE2

2

X 1

PCIE1

1

X 1

X 2

PCIE0

0

X 1

PCI Express Link configuration

COM Express

pin name

PCI Express

lane #

Configuration1

Configuration2

(Default)

Configuration3

Configuration4

PCIE7

(*1)

7

X 1

X 2

X 4

PCIE6

6

X 1

PCIE5

5

X 1

X 2

PCIE4

4

X 1

* 1 When using PCIE 7, it is necessary to turn on SW1.

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8.2. PCI Express (lane 8-31)

This interface conforms to the standard of Gen3 (maximum transfer rate: 8GT/s). (*1)

It is composed of 24 lanes.

Table 6 and Table 7 shows the PCI Express link configuration. The configuration can be changed from the BIOS

configuration screen.

PCI Express Link configuration

COM Express

pin name

PCI Express

lane #

Configuration1

Configuration2

Configuration3

(Default)

PCIE31

15

X 4

X 8

X 16

PCIE30

14

PCIE29

13

PCIE28

12

PCIE27

11

X 4

PCIE26

10

PCIE25

9

PCIE24

8

PCIE23

7

X 4

X 8

PCIE22

6

PCIE21

5

PCIE20

4

PCIE19

3

X 4

PCIE18

2

PCIE17

1

PCIE16

0

PCI Express Link configuration

COM Express

pin name

PCI Express

lane #

Configuration1

Configuration2

(Default)

PCIE15

7

X 4

X 8

PCIE14

6

PCIE13

5

PCIE12

4

PCIE11

3

X 4

PCIE10

2

PCIE9

1

PCIE8

0

8.3. LAN (GbE)

This interface conforms to the standard of 10/100/1000BASE-T.

It is composed of 1 ports.

The Ethernet controller is composed of WG210 of Intel Corporation.

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8.4. LAN (10GbE)

This interface complies with the standards of 10GBASE-KR, 1000BASE-KX, XFI, SFP+, Direct Attach Cable,

10GBASE-LR, 10GBASE-SR, 10GBASE-T, and 1000BASE-T. (*1, 2, 3)

It is a 2-port configuration.

Design examples of this interface are listed in the COM Express Module specifications, so please use it.

(The chapter number is 9.5.1 2016 Silicon 10 GbE Fiber Implementation and 9.5.2 2016 Silicon 10 GbE Copper Implementation.)

* 1 When using with SFP +, Direct Attach Cable, 10GBASE-LR, 10GBASE-SR, 10GBASE-T, and 1000BASE-T

you need to prepare the PHY chip on the carrier board.

* 2 When using direct attach copper cable (DAC) please use passive type. Active type cannot be used.

* 3 When using 10GBASE-T, 1000BASE-T and 1000BASE-KX, SPI-Flash U42 needs to be rewritten. Please

contact sales for details.

8.5. SATA

This interface conforms to the standard of SATA-600 (maximum transfer rate: 6Gb/s), SATA-300 (maximum

transfer rate: 3Gb/s), and SATA-150 (maximum transfer rate: 1.5Gb/s).

It is composed of 2 ports.

8.6. USB3.0

This interface conforms to the standard of USB3.0 (maximum transfer rate: 5Gb/s).

It is composed of 4 ports.

8.7. USB2.0

This interface conforms to the standard of USB2.0 (maximum transfer rate: 480Mb/s).

It is composed of 4 ports.

8.8 UART

This interface is composed of 2 ports.

They support up to 115,200 bps.

Though the signal level of this interface is 5 V according to COMe R2.1, 3.3 V signal version is also available.

Please ask our sales team.

8.9 LPC

This interface conforms to the standard of LPC 1.1.

8.10. SPI

This interface is composed of 1 ports.

The BIOS boot can be performed from ROM connected to this port.

8.11. SMBus (System Management Bus)

This interface is composed of 1 ports.

Each signal of SMBus is pulled up to 3.3 V on the CPU module.

8.12.I

2

C Bus

This interface is composed of 1 ports.

Each signal of I

2

C Bus is pulled up to 3.3 V on the CPU module.

The I

2

C bus controller is built in FPGA and accessed via the LPC bus.

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8.13. GPIO

8.13.1 GPI

The CPU module supports four general purpose input signals (GPI).

Each GPI signal is connected to the GPIO pin of the processor. Table 8 shows the assignment of the GPI signals.

Moreover, GPI1 can be used as an NMI input.

GPI

COM Express pin name

Pin name of CPU

GPI0

GPIO35

GPI1

GPIO2

GPI2

GPIO3

GPI3

GPIO4

8.13.2 GPO

The CPU module supports four general purpose output signals (GPO).

Each GPO signal is connected to the GPIO pin of the processor. Table 9 shows the assignment of the GPO

signals.

GPO

COM Express pin name

Pin name of CPU

GPO0

GPIO42

GPO1

GPIO9

GPO2

GPIO15

GPO3

GPIO7

8.14 External BIOS ROM Support

The CPU module supports the BIOS_DIS# [1-0] signal, and the BIOS boot destination can be selected. The

destination can be selected as shown in Table 10 below by processing the BIOS_DIS#[1-0] signals on a carrier

board.

BIOS source settings by BIOS_DIS#[1-0]

BIOS_DIS#[1-0]

BIOS(CS0) Boot Option

11b

SPI-FLASH on CPU-162-23 (Default)

10b

Reserved

01b

SPI-FLASH on a carrier board

00b

SPI-FLASH on CPU-162-23

8.15. Reset

The CPU module supports a SYS_RESET # signal and a CB_RESET # signal.

The CB_RESET # signal is a reset output signal to a carrier board. This reset signal can be used to reset a

device on the carrier board.

The SYS_RESET # signal is a reset button input signal from the carrier board.

8.16. Battery Low Alarm

The CPU module supports a BATLOW # signal.

The BATLOW # signal is an input signal from the carrier board.

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Eurotech CPU-162-23 Owner's manual

Eurotech CPU-162-23 Owner's manual

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