CPU-162-23
Xeon D COMe CPU Module
USER MANUAL
First edition – July 2018 – B37028A0-MN002-00_UserMan_En_1
© 2018 Eurotech
Preface
Thank you for choosing the CPU-162-23. Please read this manual before using the CPU-162-23 so that you may
obtain the greatest benefit from using the device.
This manual presents the specifications, functions, and method of use of the CPU-162-23.
Eurotech has made every effort to carefully inspect each product and has taken great care to package and to
ship the product. In the unlikely event of the product’s failure to operate normally due to problems in shipping or
otherwise, the company will repair or replace the product at its own responsibility.
If you have any questions, contact your local Eurotech Sales Office.
Trademarks
All trademarks both marked and unmarked appearing in this document are the property of their respective owners.
This document does not give permission to the implementation of patents or other rights held by Eurotech or third
parties.
Revision history
Revision
Description
Date
1
First release
24 July 2018
CPU-162-23 USER MANUAL Table of contents
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Table of contents
Preface ........................................................................................................................................................................ 2
Trademarks .................................................................................................................................................................. 2
Revision history ........................................................................................................................................................... 2
Table of contents .......................................................................................................................................................... 3
1. Important User Information ...................................................................................................................................... 5
1.1 Safety Notices and Warnings ................................................................................................................................ 5
1.2 Life Support Policy ................................................................................................................................................. 7
1.3 Warranty ................................................................................................................................................................ 7
1.4 RoHS ..................................................................................................................................................................... 7
1.5 Technical Assistance ............................................................................................................................................. 7
1.6 Conventions ........................................................................................................................................................... 7
1.7 Electromagnetic Compatibility ............................................................................................................................... 7
2. Overview .................................................................................................................................................................... 9
3. Basic Specifications ............................................................................................................................................... 10
4. Block Diagram ......................................................................................................................................................... 12
5. Board Outline/Schematic Layout .......................................................................................................................... 13
6. Processor ................................................................................................................................................................. 15
6.1. Processor ............................................................................................................................................................ 15
6.2. Cache Memories ................................................................................................................................................ 15
7. Memory ..................................................................................................................................................................... 16
7.1. Main Memory ...................................................................................................................................................... 16
7.2. Boot ROM ........................................................................................................................................................... 16
7.3 EEPROM ............................................................................................................................................................. 16
8. COM Express ........................................................................................................................................................... 17
8.1. PCI Express (lane0-7) ....................................................................................................................................... 17
8.2. PCI Express (lane 8-31) ..................................................................................................................................... 18
8.3. LAN (GbE) .......................................................................................................................................................... 18
8.4. LAN (10GbE) ...................................................................................................................................................... 19
8.5. SATA .................................................................................................................................................................. 19
8.6. USB3.0 ............................................................................................................................................................... 19
8.7. USB2.0 ............................................................................................................................................................... 19
8.8 UART ................................................................................................................................................................... 19
8.9 LPC ...................................................................................................................................................................... 19
8.10. SPI .................................................................................................................................................................... 19
8.11. SMBus (System Management Bus) ................................................................................................................. 19
8.12.I
2
C Bus ............................................................................................................................................................... 19
8.13. GPIO ................................................................................................................................................................. 20
8.13.1 GPI ........................................................................................................................................................... 20
8.13.2 GPO ......................................................................................................................................................... 20
8.14 External BIOS ROM Support ............................................................................................................................. 20
8.15. Reset ................................................................................................................................................................ 20
8.16. Battery Low Alarm ............................................................................................................................................ 20
8.17. Power Button .................................................................................................................................................... 21
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8.18. Power Good ...................................................................................................................................................... 21
8.19. Speaker ............................................................................................................................................................ 21
9. FPGA ........................................................................................................................................................................ 22
9.1. GPIO Signals between FPGA and MCU ............................................................................................................ 22
9.2. LPC Bus Controller ............................................................................................................................................. 22
9.3. Address Map....................................................................................................................................................... 23
9.3.1. I
2
C Controller ............................................................................................................................................. 23
9.3.2. LED Control Register ................................................................................................................................ 24
9.3.3. WDT Control Register ............................................................................................................................... 24
9.3.4. FAN Control Resister ................................................................................................................................ 25
10. VOLTAGE MONITORING SOFTWARE SPECIFICATIONS ................................................................................................ 26
10.1. Description of Operation ................................................................................................................................... 26
10.1.1. Voltage Monitoring Operation ................................................................................................................. 26
10.1.2. Notifying the Bit Error of FPGA Configuration Memory .......................................................................... 26
10.1.3. 10GbEthernet LED Control .................................................................................................................... 26
10.2. Address ............................................................................................................................................................. 27
10.2.1. Address List ............................................................................................................................................ 27
10.2.2. Detailed Description of Bit ....................................................................................................................... 28
11. Connector and Jumper/LED................................................................................................................................. 35
11.1. CPU Module Onboard Component .................................................................................................................. 35
11.1.1. LED1 (General Purpose Status LED) ..................................................................................................... 37
11.2. Setting ............................................................................................................................................................... 37
11.2.1. JP2 (CMOS_CLR Setting Pin) ................................................................................................................ 37
11.2.2. SW1(PCI Express/LAN select switch).................................................................................................... 37
12. Pin Layout .............................................................................................................................................................. 38
12.1. CN1 (COM Express Stacking Connector) ........................................................................................................ 38
12.2. CN7 (Multi ISP Connector) ............................................................................................................................... 40
13. Address Map .......................................................................................................................................................... 41
13.1. IO Space ........................................................................................................................................................... 41
13.2. Memory Space ................................................................................................................................................. 42
13.3. PCI devices....................................................................................................................................................... 43
13.4. SMBus Address Map ........................................................................................................................................ 43
13.5. I
2
C Address Map ............................................................................................................................................... 43
14. BIOS ........................................................................................................................................................................ 44
14.1. Displayed Contents of BIOS Setup Menu ........................................................................................................ 44
14.1.1. BIOS Setup Menu ................................................................................................................................... 45
14.1.2. EDKII Menu ............................................................................................................................................. 46
14.1.3. Boot Manager Menu................................................................................................................................ 78
14.1.4. Boot Maintenance Manager .................................................................................................................... 78
14.2. Recording Method For an error Detected During POST .................................................................................. 81
15. Heat Sink ................................................................................................................................................................ 83
15.1. Passive heat sink (M38001A0) ......................................................................................................................... 83
15.2. Active heat sink (M38001B0)............................................................................................................................ 85
15.3. Active heat sink eTEMP (M38001C0) .............................................................................................................. 87
Notes ............................................................................................................................................................................ 89
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1. Important User Information
In order to lower the risk of personal injury, electric shock, fire, or equipment damage, users must observe the
following precautions as well as good technical judgment, whenever this product is installed or used.
All reasonable efforts have been made to ensure the accuracy of this document; however, Eurotech assumes
no liability resulting from any error/omission in this document or from the use of the information contained herein.
Eurotech reserves the right to revise this document and to change its contents at any time without obligation to
notify any person of such revision or changes. Reproduction of all or part of this document without Eurotech’s
permission is prohibited.
1.1 Safety Notices and Warnings
The following general safety precautions must be observed during all phases of operation, service, and repair of
this equipment. Failure to comply with these precautions or with specific warnings elsewhere in this manual
violates safety standards of design, manufacture, and intended use of the equipment. Eurotech assumes no
liability for the customer’s failure to comply with these requirements.
The safety precautions listed below represent warnings of certain dangers of which Eurotech is aware. You, as
the user of the product, should follow these warnings and all other safety precautions necessary for the safe
operation of the equipment in your operating environment.
Alerts that can be found throughout this manual
The following alerts are used within this manual and indicate potentially dangerous situations.
Danger, electrical shock hazard:
Information regarding potential electrical shock hazards:
Personal injury or death could occur. Also damage to the system, connected peripheral
devices, or software could occur if the warnings are not carefully followed.
Appropriate safety precautions should always be used, these should meet the
requirements set out for the environment that the equipment will be deployed in.
Warning:
Information regarding potential hazards:
Personal injury or death could occur. Also damage to the system, connected peripheral
devices, or software could occur if the warnings are not carefully followed.
Appropriate safety precautions should always be used, these should meet the
requirements set out for the environment that the equipment will be deployed in.
Information and/or Notes:
These will highlight important features or instructions that should be observed.
Protect the device from vibration and impact
Do not place the product in a location where it can fall or can be subject to vibration or impact because this may
cause device failure.
Do not modify the device
For safety reasons, under no circumstances should you modify the device. Eurotech will not repair products
that have been modified.
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Protect the product from water and chemicals
Contact between the product and water or chemicals can result in product failure, electrocution, or fire.
Protect the product from foreign material
Make sure that foreign material does not get into the product during use, storage, or transport because this can
result in product failure.
Use precautions in handling to ensure that you are not injured
The sharp projections on this product may cause injury. Take care in handling this product in order to avoid
injury.
Do not disassemble the product
In order to maintain guaranteed product performance, do not disassemble this product under any circumstances.
Keep the product away from radios and TVs
Do not use the product near radios, television sets, or other devices generating strong magnetic or electrical
fields. This could result in failure or malfunction.
Keep the product away from flame, humidity, and direct sunlight
Do not use or store the product in any of the following locations, as this could result in product failure:
ï‚Ÿ Places where there is fire
ï‚Ÿ Locations high in humidity or exposed to rain
ï‚Ÿ Locations exposed to direct sunlight
ï‚Ÿ Dusty or dirty locations
ï‚Ÿ Locations containing excessive water or chemical vapors
Install the product in well-ventilated locations
Install the product in well-ventilated locations to efficiently disperse heat generated by the product.
Remove the power plug from the receptacle when not using the product
Turn off the main switch and remove the power plug from the receptacle when not using the product or when
there is the risk of lightning strike.
Use the device within rated parameters
Be sure to use the product within the ratings specified in this manual. Failure to do so may result in malfunction.
Use care when cleaning the product
If the product becomes dirty, wipe it with a dry soft cloth. A thinned neutral cleaner may be used if the product is
particularly dirty. Do not use benzene, thinners, or other solvents under any circumstances.
Ground the product in order to prevent electrocution
Be sure to ground the product by connecting it to a 3-pole AC receptacle or by using an AC receptacle having a
grounding terminal.
Dispose of the product properly
Use appropriate methods for handling industrial wastes when disposing of this product.
Wire the product correctly
Failure to wire the product correctly can result in malfunction or fire. Read this manual and wire the product
correctly.
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Use antistatic precautions
This product comprises electronic parts that are highly susceptible to static electricity. Static electricity can
cause the product to malfunction. Take care not to touch any of the terminals, connectors, ICs, or other parts
with the hands.
Do not use a malfunctioning product
Stop using the product if you believe it is malfunctioning. Continuing to use a malfunctioning product can cause
the malfunction to spread to other products and can cause short circuits or fire.
1.2 Life Support Policy
Eurotech products are not authorized for use as critical components in life support devices or systems without
the express written approval of Eurotech.
1.3 Warranty
For warranty terms and conditions users should contact their local Eurotech Sales Office.
Refer to the back covers of this manual for full contact details.
1.4 RoHS
This device, including all its components, subassemblies and the consumable materials that are an integral part
of the product, has been manufactured in compliance with the European directive 2011/65/EU known as the
RoHS directive (Restrictions on the use of certain Hazardous Substances). This directive targets the reduction
of certain hazardous substances previously used in electrical and electronic equipment (EEE).
1.5 Technical Assistance
If you have any technical questions, cannot isolate a problem with your device, or have any enquiry about repair
and returns policies, contact your local Eurotech Technical Support Team.
See the back cover for full contact details.
Transportation
When transporting any module or system, for any reason, it should be packed using anti-static material and
placed in a sturdy box with enough packing material to adequately cushion it.
Warning:
Any product returned to Eurotech that is damaged due to inappropriate packaging will not be covered by the
warranty.
1.6 Conventions
The following table describes the conventions for signal names used in this document.
1.7 Electromagnetic Compatibility
This product is intended for industrial assembly only and is not for commercial use. Therefore, this product is not
an apparatus and so does not need to be subject to the EMC Directive.
Convention
Explanation
GND
Digital ground plane
#
Active low signal
+
Positive signal in differential pair
-
Negative signal in differential pair
NC
No connection
RSVD
Use is reserved to Eurotech
CPU-162-23 USER MANUAL Overview
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2. Overview
CPU-162-23 is a basic module sized COM Express CPU Module, which is equipped with the Intel Xeon
Processor D-1500 family or the Intel Pentium Processor D-1500 family. It is possible to specify when placing an
order about the CPU type and mounting of the memory socket. Details are explained in Chapter 3 Basic
Specifications.
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3. Basic Specifications
Table 1 describes the specification list of this product. Table 2 shows the board product model number.
CPU-162-23 specification list
Item
Details
CPU
(*1)
Model
Pentium
D1519
Xeon
D-1539
Xeon
D-1559
Xeon
D-1587
# of cores
4
8
12
16
TDP
25W
35W
45W
65W
Base frequency
1.5GHz
1.6GHz
1.5GHz
1.7GHz
Max Turbo
Frequency
2.1GHz
2.2GHz
2.1GHz
2.3GHz
L1 cache
32kB for data, 32kB for instruction (per core)
L2 cache
256kB for data and instruction (per core)
L3 cache
1.5MB (per core)
Memory
Main Memory
2133MT/s
DDR4 SO-DIMM socket x3
(*2)
, ECC supported
SODIMM sockets support up to 16 GB each. The maximum
memory capacity as a module is 48 GB.
Boot ROM
SPI-FLASH 16MB
EEPROM
64kb
COM Express
SMBus
1 port
I
2
C
1 port
UART
2 ports
LAN(GbE)
1 port
LAN(10GbE)
2 ports
USB 2.0
4 ports
USB 3.0
4 ports
GPIO
GPI：4 bits / GPO：4 bits (GPI1 can be used as a NMI)
PCI Express Gen3
24 lanes
PCI Express Gen2
8 lanes
LPC
1 port
Serial-ATA 6Gb
2 ports
SPI
1 port
Other
Following features are supported.
Reset
Thermal Protection
Power button
Power Good
Speaker
Power source
Specification
Power supply
VCC_12V±5%
VCC_5V_SBY±5%
VCC_RTC(2.0~3.3V)
*supplied from the COM Express connector
Current consumption
VCC_12V : Typ 5.02 A (with TDP65W Model)
VCC_5V_SBY : Typ 0.34 A
VCC_RTC (Power OFF) : Typ 2.6 uA
(Power ON) : Typ 0.1 uA
Mechanical
Specification
Standard
PICMG COM.0 COM Express Module base Spec R3.0
Pin-out type
Type7
Form factor
125mm x 95mm (Basic module size)
Weight
145g (excluding the SO-DIMM)
*1 Processor is an implementation option.
*2 Factory Option: up to 4x DDR4 ECC SODIMM for up to 64GB. When memory socket 4x is used, it is necessary to use COM
Express riser card or to drill a hole in memory socket area. The memory socket area is shown in Figure 5 of the PCB
outline / schematic layout diagram in Chapter 5.
CPU-162-23 USER MANUAL Overview
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Board product model number
Product model number
Description
CPU-162-23-05
Pentium D 1519, 4Core, 1.5GHz, TDP 25W
CPU-162-23-07
Xeon D-1539, 8Core, 1.6GHz, TDP 35W,
CPU-162-23-08
Xeon D-1559, 12Core, 1.5GHz, TDP 45W,
COM Express riser card
It is a board sandwiched between CPU module and carrier
board.
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4. Block Diagram
Figure 1 illustrates the block diagram of this product.
Figure 1. Block diagram
GbE Controller
Intel: I210-AT
PCIe gen2.0
PCIE 0-3
DDR4 1600-2400
SO-DIMM w/ ECC
up to 16GB
72
DDR4
PCIe (PCH)
PCIe gen2.0
PCIE 4-5
PCIe (PCH)
PCIe gen2.0
PCIE 6
PCIe (PCH)
PCIe gen3.0
PCIE 8-15
PCIe (CPU)
x4
x2
x8
PCIe gen3.0
PCIE 16-31
PCIe (CPU)
x16
10GBASE-KR
10G_KR [0:1]
10GBASE-KR
1000BASE-T
GBE 0
PCIe(PCH)
PCIe gen2.0
NCSI
NC-SI
RT
SER [0:1]
UART
2ports
Buffer
UART
2ports
SATA 3.0
SATA [0:1]
SATA
2ports
2ports
USB2.0
USB [0:3]
USB2.0
4ports
USB3.0
USB_SS [0:3]
USB3.0
4ports
SPI
SPI
SPI
MUX
SPI
SPI Flash
(BIOS)
SPI
GPI [0:3]
GPIO
4bits
GPO [0:3]
GPIO
4bits
x1
x1
EEPROM
SMBus
SMBus
SMBus
FPGA
I2C
I2C
Management
Signals
Management
Signals
TPM
LPC
LPC
LPC
4
VCC_5V_SBY
VCC_RTC
12V
VCC_12V
5V
3V
MCU
NOTE:
2400 MT/s is supported by limited SKUs.
2133 MT/s is the maximum data rate for
usual SKUs.
DDR4 1600-2400
SO-DIMM w/ ECC
up to 16GB
COM Express
Connector
Intel Xeon D-1500
(option)PCIE 7
PCIe gen2.0
x1
DDR4 1600-2400
SO-DIMM w/ ECC
up to 16GB
72
DDR4
DDR4 1600-2400
SO-DIMM w/ ECC
up to 16GB
option
SW1
CPU-162-23 USER MANUAL Block Diagram
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5. Board Outline/Schematic Layout
Figure 2, 3 and 4 illustrate the board outline/schematic layout of the product. Figure 5 shows the area where
holes are drilled in the carrier board when using memory socket x4.
Figure 2. Component side layout
Figure 3. Solder side layout (Bottom view)
125
95
87
4
4117
41
CN7
JP2
SW1
LED1
20.5
48.5
U1
76
4
4
4
4
53
26.75
CN4
CN6
CN1
CN2 CN3
Board Outline/Schematic Layout CPU-162-23 USER MANUAL
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Figure 4. Side layout
Figure 5. Memory socket area
42UA
9
78
8
Memory socket
area
125
95
83
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6. Processor
6.1. Processor
The following processors can be mounted on this product. Processor is an implementation option.
Processor
CPU Model
Number of cores
Core frequency
(base)
Memory
frequency
TDP
D-1519
4
1.5GHz
DDR4-2133
25W
D-1539
8
1.6GHz
DDR4-2133
35W
D-1559
12
1.5GHz
DDR4-2133
45W
D-1587
16
1.7GHz
DDR4-2133
65W
6.2. Cache Memories
The processor contains the following cache memories.
- L1 Cache
32 kB for data, and 32 kB for instruction (for each core)
- L2 Cache
256 kB shared for data and instruction (for each core)
- L3 Cache
1.5MB (for each core)
Memory CPU-162-23 USER MANUAL
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7. Memory
The memories in the CPU module are listed as follows.
7.1. Main Memory
The main memory is a DDR4 SO-DIMM socket. The maximum main memory is 64 GB (max. 16 GB of SO-DIMM
4pcs).
This corresponds to ECC, which can correct a 1 bit error automatically. (non-ECC are also supported.)
When installing the memory module, please install from the component side.
Adbc8043 does not come with a memory module.
(It will not boot if the memory module is mounted only on the solder side.)
7.2. Boot ROM
The BIOS is stored in the SPI-FLASH memory on CPU-162-23. This memory is 16 MB.
CPU-162-23 can also be configured to boot from a BIOS in an SPI-FLASH on the career board.
7.3 EEPROM
An EEPROM is mounted as a storage memory to store an error log of BIOS. The memory is 64 kbit.
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8. COM Express
The CPU module uses the COM Express Type 7 pin-out. This chapter describes each interface.
8.1. PCI Express (lane0-7)
This interface conforms to the standard of Gen2 (maximum transfer rate: 5 GT/s).
It is composed of 8 lanes.
Table 3 and Table 4 show the PCI Express link configuration. Changing this configuration requires to modify
BIOS image at low level. Please ask our sales team.
PCI Express Link configuration
COM Express
pin name
PCI Express
lane #
Configuration1
Configuration2
Configuration3
Configuration4
(Default)
PCIE3
3
X 1
X 1
X 2
X 4
PCIE2
2
X 1
X 1
PCIE1
1
X 1
X 2
X 2
PCIE0
0
X 1
PCI Express Link configuration
COM Express
pin name
PCI Express
lane #
Configuration1
Configuration2
(Default)
Configuration3
Configuration4
PCIE7
(*1)
7
X 1
X 1
X 2
X 4
PCIE6
6
X 1
X 1
PCIE5
5
X 1
X 2
X 2
PCIE4
4
X 1
* 1 When using PCIE 7, it is necessary to turn on SW1.
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8.2. PCI Express (lane 8-31)
This interface conforms to the standard of Gen3 (maximum transfer rate: 8GT/s). (*1)
It is composed of 24 lanes.
Table 6 and Table 7 shows the PCI Express link configuration. The configuration can be changed from the BIOS
configuration screen.
PCI Express Link configuration
COM Express
pin name
PCI Express
lane #
Configuration1
Configuration2
Configuration3
(Default)
PCIE31
15
X 4
X 8
X 16
PCIE30
14
PCIE29
13
PCIE28
12
PCIE27
11
X 4
PCIE26
10
PCIE25
9
PCIE24
8
PCIE23
7
X 4
X 8
PCIE22
6
PCIE21
5
PCIE20
4
PCIE19
3
X 4
PCIE18
2
PCIE17
1
PCIE16
0
PCI Express Link configuration
COM Express
pin name
PCI Express
lane #
Configuration1
Configuration2
(Default)
PCIE15
7
X 4
X 8
PCIE14
6
PCIE13
5
PCIE12
4
PCIE11
3
X 4
PCIE10
2
PCIE9
1
PCIE8
0
8.3. LAN (GbE)
This interface conforms to the standard of 10/100/1000BASE-T.
It is composed of 1 ports.
The Ethernet controller is composed of WG210 of Intel Corporation.
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8.4. LAN (10GbE)
This interface complies with the standards of 10GBASE-KR, 1000BASE-KX, XFI, SFP+, Direct Attach Cable,
10GBASE-LR, 10GBASE-SR, 10GBASE-T, and 1000BASE-T. (*1, 2, 3)
It is a 2-port configuration.
Design examples of this interface are listed in the COM Express Module specifications, so please use it.
(The chapter number is 9.5.1 2016 Silicon 10 GbE Fiber Implementation and 9.5.2 2016 Silicon 10 GbE Copper Implementation.)
* 1 When using with SFP +, Direct Attach Cable, 10GBASE-LR, 10GBASE-SR, 10GBASE-T, and 1000BASE-T
you need to prepare the PHY chip on the carrier board.
* 2 When using direct attach copper cable (DAC) please use passive type. Active type cannot be used.
* 3 When using 10GBASE-T, 1000BASE-T and 1000BASE-KX, SPI-Flash U42 needs to be rewritten. Please
contact sales for details.
8.5. SATA
This interface conforms to the standard of SATA-600 (maximum transfer rate: 6Gb/s), SATA-300 (maximum
transfer rate: 3Gb/s), and SATA-150 (maximum transfer rate: 1.5Gb/s).
It is composed of 2 ports.
8.6. USB3.0
This interface conforms to the standard of USB3.0 (maximum transfer rate: 5Gb/s).
It is composed of 4 ports.
8.7. USB2.0
This interface conforms to the standard of USB2.0 (maximum transfer rate: 480Mb/s).
It is composed of 4 ports.
8.8 UART
This interface is composed of 2 ports.
They support up to 115,200 bps.
Though the signal level of this interface is 5 V according to COMe R2.1, 3.3 V signal version is also available.
Please ask our sales team.
8.9 LPC
This interface conforms to the standard of LPC 1.1.
8.10. SPI
This interface is composed of 1 ports.
The BIOS boot can be performed from ROM connected to this port.
8.11. SMBus (System Management Bus)
This interface is composed of 1 ports.
Each signal of SMBus is pulled up to 3.3 V on the CPU module.
8.12.I
2
C Bus
This interface is composed of 1 ports.
Each signal of I
2
C Bus is pulled up to 3.3 V on the CPU module.
The I
2
C bus controller is built in FPGA and accessed via the LPC bus.
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8.13. GPIO
8.13.1 GPI
The CPU module supports four general purpose input signals (GPI).
Each GPI signal is connected to the GPIO pin of the processor. Table 8 shows the assignment of the GPI signals.
Moreover, GPI1 can be used as an NMI input.
GPI
COM Express pin name
Pin name of CPU
GPI0
GPIO35
GPI1
GPIO2
GPI2
GPIO3
GPI3
GPIO4
8.13.2 GPO
The CPU module supports four general purpose output signals (GPO).
Each GPO signal is connected to the GPIO pin of the processor. Table 9 shows the assignment of the GPO
signals.
GPO
COM Express pin name
Pin name of CPU
GPO0
GPIO42
GPO1
GPIO9
GPO2
GPIO15
GPO3
GPIO7
8.14 External BIOS ROM Support
The CPU module supports the BIOS_DIS# [1-0] signal, and the BIOS boot destination can be selected. The
destination can be selected as shown in Table 10 below by processing the BIOS_DIS#[1-0] signals on a carrier
board.
BIOS source settings by BIOS_DIS#[1-0]
BIOS_DIS#[1-0]
BIOS(CS0) Boot Option
11b
SPI-FLASH on CPU-162-23 (Default)
10b
Reserved
01b
SPI-FLASH on a carrier board
00b
SPI-FLASH on CPU-162-23
8.15. Reset
The CPU module supports a SYS_RESET # signal and a CB_RESET # signal.
The CB_RESET # signal is a reset output signal to a carrier board. This reset signal can be used to reset a
device on the carrier board.
The SYS_RESET # signal is a reset button input signal from the carrier board.
8.16. Battery Low Alarm
The CPU module supports a BATLOW # signal.
The BATLOW # signal is an input signal from the carrier board.
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