DIGITAL-LOGIC MSB900 User manual

Category
Server/workstation motherboards
Type
User manual

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Detailed Technical USER MANUAL FOR:
3.5”-SBC
MSB900/L
Nordstrasse 11/F
CH- 4542 Luterbach
Tel.: ++41 (0)32 681 58 00
Fax: ++41 (0)32 681 58 01
Homepage:
http://www.digitallogic.com
DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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For internal use only:
File: MSB900_Detailed_V1.0
Path: R:\HANDBUCH\MSB\MSB900\MSB900_Detailed_V1.0.doc
COPYRIGHT
2008 BY DIGITAL-LOGIC AG
This publication is protected by copyright and all rights are reserved. No part of this document may be repro-
duced, transmitted, transcribed or stored in a retrieval system, in any form or by any means, electronic, me-
chanical, optical, manual, or otherwise, without the prior written permission of DIGITAL-LOGIC AG.
The software described herein, together with this document, are furnished under a license agreement and
may be used or copied only in accordance with the terms of that agreement.
About this Manual and How to Use It
This manual is written for the original equipment manufacturer (OEM) who plans to build computer systems
based on the single board MICROSPACE-PC. It is for integrators and programmers of systems based on the
MICROSPACE-Computer family. This manual provides instructions for installing and configuring the board,
and describes the system and setup requirements. This document contains information on hardware re-
quirements, interconnections, and details of how to program the system. Please check the Product CD for
further information and manuals.
REVISION HISTORY:
Document
Version
Date/Initials:
Modification:
Remarks, News, Attention:
V1.0 02.2008 DAR Initial document
Attention!
1. All information in this manual, and the product, are subject to change without prior notice.
2. Read this manual prior to installation of the product.
3. Read the security information carefully prior to installation of the product.
DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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Table of Contents
1. Preface.......................................................................................................................5
1.1. Trademarks ................................................................................................................... 5
1.2. Disclaimer ..................................................................................................................... 5
1.3. Environmental Protection Statement .......................................................................... 5
1.4. Who should use this Product....................................................................................... 5
1.5. Recycling Information .................................................................................................. 6
1.6. Technical Support......................................................................................................... 6
1.7. Limited Two Year Warranty.......................................................................................... 6
1.8. Explanation of Symbols ............................................................................................... 7
1.9. Applicable Documents and Standards........................................................................ 8
1.10. For Your Safety ............................................................................................................. 9
1.11. RoHS Commitment ....................................................................................................... 9
1.11.1. RoHS Compatible Product Design......................................................................................... 10
1.11.2. RoHS Compliant Production Process .................................................................................... 10
1.11.3. WEEE Application .................................................................................................................. 10
1.12. Swiss Quality .............................................................................................................. 11
1.13. The Swiss Association for Quality and Management Systems ............................... 11
2. Overview..................................................................................................................12
2.1. Standard Features of the MSB900/L.......................................................................... 12
2.2. Unique Features.......................................................................................................... 12
2.3. MSB900 Block Diagram.............................................................................................. 13
2.4. MSB900/MSB900L specifications .............................................................................. 14
2.5. Examples of Ordering Codes ..................................................................................... 16
2.6. Related Application Notes.......................................................................................... 16
2.7. Dimensions & Diagrams............................................................................................. 17
2.7.1. MSB900/L .................................................................................................................................. 17
2.7.2. MSB800CON Part Nr 802205.................................................................................................... 21
2.8. MSB900/L Incompatibilities to a standard PC/AT ..................................................... 22
2.9. Related Application Notes.......................................................................................... 22
2.10. High Frequency Radiation (to meet EN55022) .......................................................... 22
2.11. Battery-Lifetime .......................................................................................................... 23
2.11.1. External battery assembling (for the MSB900L): ................................................................... 23
3. Bus Signals .............................................................................................................23
3.1. Addressing PCI Devices............................................................................................. 23
3.1.1. MSB900 and MSB900L ............................................................................................................. 23
4. BIOS History............................................................................................................24
5. Detailed System Description .................................................................................25
5.1. Power Requirements .................................................................................................. 25
5.2. Boot Time .................................................................................................................... 25
5.3. CPU, Boards and RAMs.............................................................................................. 26
5.3.1. CPUs of this MICROSPACE Product ........................................................................................ 26
5.3.2. Numeric Coprocessor ................................................................................................................ 26
5.3.3. DDRAM Memory........................................................................................................................ 26
5.4. Interfaces..................................................................................................................... 26
5.4.1. Keyboard AT compatible and PS/2 Mouse................................................................................ 26
5.4.2. Line Printer Port LPT1 ............................................................................................................... 26
5.4.3. Serial Ports COM1-COM2 ......................................................................................................... 27
5.4.4. Floppy Disk Interface ................................................................................................................. 27
5.5. Controllers................................................................................................................... 27
5.5.1. Interrupt Controllers ................................................................................................................... 27
5.6. Timers and Counters .................................................................................................. 28
5.6.1. Programmable Timers ............................................................................................................... 28
5.6.2. RTC (Real Time Clock).............................................................................................................. 28
DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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5.6.3. Watchdog................................................................................................................................... 28
5.6.4. ROM-BIOS Sockets ................................................................................................................... 28
5.6.5. BIOS CMOS Setup .................................................................................................................... 29
5.7. CMOS RAM Map.......................................................................................................... 29
5.8. EEPROM saved CMOS Setup..................................................................................... 34
5.8.1. EEPROM Memory for Setup...................................................................................................... 35
5.9. Memory & I/O Map....................................................................................................... 35
5.9.1. System Memory Map ................................................................................................................. 35
5.9.2. System I/O map ......................................................................................................................... 36
6. VGA ..........................................................................................................................40
6.1. VGA/LCD Controller of the Geode LX900.................................................................. 40
6.2. Graphic Modes............................................................................................................ 40
7. Video Input ..............................................................................................................41
8. Description of the connectors ...............................................................................41
9. Jumper Locations on the Board ............................................................................53
9.1. The Jumpers on MSB900/L ........................................................................................ 53
9.2. Reload Default BIOS Settings .................................................................................... 53
10. Cable Interfaces ......................................................................................................55
10.1. The Hard Disk Cable 44pin......................................................................................... 55
10.2. The COM1/LPT Serial Interface Cable ....................................................................... 56
10.3. The COM2 Serial Interface Cable ............................................................................... 57
11. Thermal Specifications...........................................................................................58
11.1. Thermal Analysis for Case Integration...................................................................... 58
12. Assembly Views......................................................................................................59
12.1. MSB900/L .................................................................................................................... 59
12.2. Mechanical Dimensions ............................................................................................. 61
13. PXE-Boot and PXE-Setup in the BIOS ..................................................................62
14. PXE-License Order .................................................................................................64
15. Index ........................................................................................................................65
DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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1. PREFACE
The information contained in this manual has been carefully checked and is believed to be accurate; it is
subject to change without notice. Product advances mean that some specifications may have changed.
DIGITAL-LOGIC AG assumes no responsibility for any inaccuracies, or the consequences thereof, that may
appear in this manual. Furthermore, DIGITAL-LOGIC AG does not accept any liability arising from the use or
application of any circuit or product described herein.
1.1. Trademarks
DIGITAL-LOGIC, DIGITAL-LOGIC-Logo, MICROSPACE, and smartModule are registered trademarks
owned worldwide by DIGITAL-LOGIC AG, Luterbach (Switzerland). In addition, this document may include
names, company logos, and registered trademarks which are, therefore, proprietary to their respective own-
ers.
1.2. Disclaimer
DIGITAL-LOGIC AG makes no representations or warranties with respect to the contents of this manual, and
specifically disclaims any implied warranty of merchantability or fitness, for any particular purpose. DIGITAL-
LOGIC AG shall, under no circumstances, be liable for incidental or consequential damages or related ex-
penses resulting from the use of this product, even if it has been notified of the possibility of such damage.
1.3. Environmental Protection Statement
This product has been manufactured to satisfy environmental protection requirements wherever possible.
Many of the components used (structural parts, printed circuit boards, connectors, batteries, etc.) are capa-
ble of being recycled. Final disposal of this product after its service life must be accomplished in accordance
with applicable country, state, or local laws or regulations.
1.4. Who should use this Product
Electrical engineers with know-how in PC-technology.
Because of the complexity and the variability of PC-technology, we cannot guarantee that the product
will work in any particular situation or set-up. Our technical support will try to help you find a solution.
Pay attention to electrostatic discharges; use a CMOS protected workplace.
Power supply must be OFF when working on the board or connecting any cables or devices.
DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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1.5. Recycling Information
All components within this product fulfill the requirements of the RoHS (Restriction of Hazardous Substances
Directive). The product is soldered with a lead free process.
1.6. Technical Support
1. Contact your local DIGITAL-LOGIC Technical Support, in your country.
2. Use the Internet Support Request form at http://support.digitallogic.ch/ embedded products
New Support Request
Support requests are only accepted with detailed information about the product (i.e., BIOS-, Board-
version)!
1.7. Limited Two Year Warranty
DIGITAL-LOGIC AG guarantees the hardware and software products it manufactures and produces to be
free from defects in materials and workmanship for two years following the date of shipment from DIGITAL-
LOGIC AG, Switzerland. This warranty is limited to the original purchaser of the product and is not transfer-
able.
During the two year warranty period, DIGITAL-LOGIC AG will repair or replace, at its discretion, any defec-
tive product or part at no additional charge, provided that the product is returned, shipping prepaid, to
DIGITAL-LOGIC AG. All replaced parts and products become property of DIGITAL-LOGIC AG.
Before returning any product for repair, direct customers of DIGITAL-LOGIC AG, Switzerland are re-
quired to register a RMA (Return Material Authorization) number in the Support Center at
http://support.digitallogic.ch/
All other customers must contact their local distributors for returning defective materials.
This limited warranty does not extend to any product which has been damaged as a result of accident, mis-
use, abuse (such as use of incorrect input voltages, wrong cabling, wrong polarity, improper or insufficient
ventilation, failure to follow the operating instructions that are provided by DIGITAL-LOGIC AG or other con-
tingencies beyond the control of DIGITAL-LOGIC AG), wrong connection, wrong information or as a result of
service or modification by anyone other than DIGITAL-LOGIC AG. Nor if the user has insufficient knowledge
of these technologies or has not consulted the product manuals or the technical support of DIGITAL-LOGIC
AG and therefore the product has been damaged.
Empty batteries (external and onboard), as well as all other battery failures, are not covered by this manufac-
turer’s limited warranty.
Except, as directly set forth above, no other warranties are expressed or implied, including, but not limited to,
any implied warranty of merchantability and fitness for a particular purpose, and DIGITAL-LOGIC AG ex-
pressly disclaims all warranties not stated herein. Under no circumstances will DIGITAL-LOGIC AG be liable
to the purchaser or any user for any damage, including any incidental or consequential damage, expenses,
lost profits, lost savings, or other damages arising out of the use or inability to use the product.
DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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1.8. Explanation of Symbols
CE Conformity
This symbol indicates that the product described in this manual is in compliance with all ap-
plied CE standards.
Caution, Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60V) when touching prod-
ucts or parts of them. Failure to observe the precautions indicated and/or prescribed by the
law may endanger your life/health and/or result in damage to your equipment.
Caution, Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 32V) when touching prod-
ucts or parts of them. Failure to observe the precautions indicated and/or prescribed by the
law may endanger your life/health and/or result in damage to your equipment
Warning, ESD Sensitive Device!
This symbol and title inform that electronic boards and their components are sensitive to
Electro Static Discharge (ESD). In order to ensure product integrity at all times, care must
always be taken while handling and examining this product.
Attention!
This symbol and title emphasize points which, if not fully understood and taken into consid-
eration by the reader, may endanger your health and/or result in damage to your equipment.
Note...
This symbol and title emphasize aspects the user should read through carefully for his, or
her, own advantage.
Warning, Heat Sensitive Device!
This symbol indicates a heat sensitive component.
Safety Instructions
This symbol shows safety instructions for the operator to follow.
This symbol warns of general hazards from mechanical, electrical,
and/or chemical failure. This may endanger your life/health and/or
result in damage to your equipment.
DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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1.9. Applicable Documents and Standards
The following publications are used in conjunction with this manual. When any of the referenced specifica-
tions are superseded by an approved revision, that revision shall apply. All documents may be obtained from
their respective organizations.
Advanced Configuration and Power Interface Specification Revision 2.0c, August 25, 2003 Copyright
© 1996-2003 Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, Phoenix Tech-
nologies Ltd., Toshiba Corporation. All rights reserved. http://www.acpi.info/
ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS) In-
terface Circuits, January 1, 2001. http://www.ansi.org/
ANSI INCITS 361-2002: AT Attachment with Packet Interface - 6 (ATA/ATAPI-6), November 1, 2002.
http://www.ansi.org/
ANSI INCITS 376-2003: American National Standard for Information Technology Serial Attached
SCSI (SAS), October 30, 2003. http://www.ansi.org/
Audio Codec ’97 Revision 2.3 Revision 1.0, April 2002 Copyright © 2002 Intel Corporation. All rights
reserved. http://www.intel.com/labs/media/audio/
Display Data Channel Command Interface (DDC/CI) Standard (formerly DDC2Bi) Version 1, August
14, 1998 Copyright © 1998 Video Electronics Standards Association. All rights reserved.
http://www.vesa.org/summary/sumddcci.htm
ExpressCard Standard Release 1.0, December 2003 Copyright © 2003 PCMCIA. All rights reserved.
http://www.expresscard.org/
IEEE 802.3-2002, IEEE Standard for Information technology, Telecommunications and information ex-
change between systems–Local and metropolitan area networks–Specific requirements Part 3: Car-
rier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer
Specifications. http://www.ieee.org
IEEE 802.3ae (Amendment to IEEE 802.3-2002), Part 3: Carrier Sense Multiple Access with Collision
Detection (CSMA/CD) Access Method and Physical Layer Specifications, Amendment: Media Access
Control (MAC) Parameters, Physical Layers, and Management Parameters for 10 GB/s Operation.
http://www.ieee.org
Intel Low Pin Count (LPC) Interface Specification Revision 1.1, August 2002 Copyright © 2002 Intel
Corporation. All rights reserved. http://developer.intel.com/design/chipsets/industry/lpc.htm
PCI Express Base Specification Revision 1.1, March 28, 2005, Copyright © 2002-2005 PCI Special In-
terest Group. All rights reserved. http://www.pcisig.com/
PCI Express Card Electromechanical Specification Revision 1.1, March 28, 2005, Copyright © 2002-
2005 PCI Special Interest Group. All rights reserved. http://www.pcisig.com/
PCI Local Bus Specification Revision 2.3, March 29, 2002 Copyright © 1992, 1993, 1995, 1998, 2002
PCI Special Interest Group. All rights reserved. http://www.pcisig.com/
PCI-104 Specification, Version V1.0, November 2003. All rights reserved. http://www.pc104.org
PICMG® Policies and Procedures for Specification Development, Revision 2.0, September 14, 2004,
PCI Industrial Computer Manufacturers Group (PICMG®), 401 Edgewater Place, Suite 500, Wake-
field, MA 01880, USA, Tel: 781.224.1100, Fax: 781.224.1239. http://www.picmg.org/
Serial ATA: High Speed Serialized AT Attachment Revision 1.0a January 7, 2003 Copyright © 2000-
2003, APT Technologies, Inc, Dell Computer Corporation, Intel Corporation, Maxtor Corporation, Sea-
gate Technology LLC. All rights reserved. http://www.sata-io.org/
DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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Smart Battery Data Specification Revision 1.1, December 11, 1998. www.sbs-forum.org
System Management Bus (SMBus) Specification Version 2.0, August 3, 2000 Copyright © 1994, 1995,
1998, 2000 Duracell, Inc., Energizer Power Systems, Inc., Fujitsu, Ltd., Intel Corporation, Linear
Technology Inc., Maxim Integrated Products, Mitsubishi Electric Semiconductor Company, Power-
Smart, Inc., Toshiba Battery Co. Ltd., Unitrode Corporation, USAR Systems, Inc. All rights reserved.
http://www.smbus.org/
Universal Serial Bus Specification Revision 2.0, April 27, 2000 Copyright © 2000 Compaq Computer
Corporation, Hewlett-Packard Company, Intel Corporation, Lucent Technologies Inc., Microsoft Corpo-
ration, NEC Corporation, Koninklijke Philips Electronics N.V. All rights reserved. http://www.usb.org/
1.10. For Your Safety
Your new DIGITAL-LOGIC product was developed and tested carefully to provide all features neces-
sary to ensure its compliance with electrical safety requirements. It was also designed for a long,
fault-free life. However, this life expectancy can be drastically reduced by improper treatment during
unpacking and installation. Therefore, in the interest of your own safety and for the correct operation
of your new DIGITAL-LOGIC product, please comply with the following guidelines.
Attention!
All work on this device must only be carried out by sufficiently skilled personnel.
Caution, Electric Shock!
Before installing your new DIGITAL-LOGIC product, always ensure that your mains power is
switched off. This applies also to the installation of piggybacks or peripherals. Serious electri-
cal shock hazards can exist during all installation, repair and maintenance operations with this
product. Therefore, always unplug the power cable and any other cables which provide
external voltage before performing work.
Warning, ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. In order to ensure
product integrity at all times, be careful during all handling and examinations of this product.
1.11. RoHS Commitment
DIGITAL-LOGIC AG is committed to develop and produce environmentally friendly products according to the
Restriction of Hazardous Substances (RoHS) Directive (2002/95/EC) and the Waste Electrical and Electronic
Equipment (WEEE) Directive (2002/96/EC) established by the European Union. The RoHS directive was
adopted in February 2003 by the European Union and came into effect on July 1, 2006. It is not a law but a
directive, which restricts the use of six hazardous materials in the manufacturing of various types of elec-
tronic and electrical equipment. It is closely linked with the Waste Electrical and Electronic Equipment Direc-
tive (WEEE) 2002/96/EC, which has set targets for collection, recycling and recovery of electrical goods and
is part of a legislative initiative to solve the problem of huge amounts of toxic e-waste.
Each European Union member state is adopting its own enforcement and implementation policies using the
directive as a guide. Therefore, there could be as many different versions of the law as there are states in the
EU. Additionally, non-EU countries like China, Japan, or states in the U.S. such as California may have their
own regulations for green products, which are similar, but not identical, to the RoHS directive.
DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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RoHS is often referred to as the "lead-free" directive but it restricts the use of the following substances:
Lead
Mercury
Cadmium
Chromium VI
PBB and PBDE
The maximum allowable concentration of any of the above mentioned substances is 0.1% (except for Cad-
mium, which is limited to 0.01%) by weight of homogeneous material. This means that the limits do not apply
to the weight of the finished product, or even to a component but to any single substance that could (theo-
retically) be separated mechanically.
1.11.1. RoHS Compatible Product Design
All DIGITAL-LOGIC standard products comply with RoHS legislation.
Since July 1, 2006, there has been a strict adherence to the use of RoHS compliant electronic and mechani-
cal components during the design-in phase of all DIGITAL-LOGIC standard products.
1.11.2. RoHS Compliant Production Process
DIGITAL-LOGIC selects external suppliers that are capable of producing RoHS compliant devices. These
capabilities are verified by:
1. A confirmation from the supplier indicating that their production processes and resulting devices are
RoHS compliant.
2. If there is any doubt of the RoHS compliancy, the concentration of the previously mentioned sub-
stances in a produced device will be measured. These measurements are carried out by an accred-
ited laboratory.
1.11.3. WEEE Application
The WEEE directive is closely related to the RoHS directive and applies to the following devices:
Large and small household appliances
IT equipment
Telecommunications equipment (although infrastructure equipment is exempt in some countries)
Consumer equipment
Lighting equipment – including light bulbs
Electronic and electrical tools
Toys, leisure and sports equipment
Automatic dispensers
It does not apply to fixed industrial plants and tools. The compliance is the responsibility of the company that
brings the product to market, as defined in the directive. Components and sub-assemblies are not subject to
product compliance. In other words, since DIGITAL-LOGIC does not deliver ready-made products to end
users the WEEE directive is not applicable for DIGITAL-LOGIC. Users are nevertheless encouraged to prop-
erly recycle all electronic products that have reached the end of their life cycle.
DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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1.12. Swiss Quality
100% Made in Switzerland
DIGITAL-LOGIC is a member of "Swiss-Label"
This product was not manufactured by employees earning
piecework wages
This product was manufactured in humane work conditions
All employees who worked on this product are paid
customary Swiss market wages and are insured
ISO 9000:2001 (quality management system)
1.13. The Swiss Association for Quality and Management Sys-
tems
The Swiss Association for Quality and Management Systems (SQS) provides certification and assessment
services for all types of industries and services. SQS certificates are accepted worldwide thanks to accredita-
tion by the Swiss Accreditation Service (SAS), active membership in the International Certification Network,
IQNet, and co-operation contracts/agreements with accredited partners.
www.sqs.ch
The SQS Certificate ISO 9001:2000 has been issued to DIGITAL-LOGIC AG, the entire company, in the field
of development, manufacturing and sales of embedded computer boards, embedded computer modules and
computer systems. The certification is valid for three years at which time an audit is performed for recertifica-
tion.
DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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2. OVERVIEW
2.1. Standard Features of the MSB900/L
The MICROSPACE 3.5”-SBC is a miniaturized modular device incorporating the major elements of a PC/AT
compatible computer. It includes standard PC/AT compatible elements, such as:
Powerful GEODE LX-900 600MHz
Legacy BIOS ROM
DDR-SODIMM 200pin socket (for DDR-RAM 256-1024MB)
128k second level cache
Timers
DMA
Real-time clock with CMOS-RAM and battery buffer (only on MSB900, not on MSB900L)
LPT1 parallel port
COM1-, COM2- RS2332 serial port
Speaker interface
PS/2-keyboard and mouse interface (shared on one mini DIN connector)
PATA-IDE hard disk interface
VGA video interface
PCI/104 (one slot), limited I/O connector space
4 Channels USB 2.0
Onboard CF socket Type II
2.2. Unique Features
The MICROSPACE 3.5”-SBC includes all standard PC/AT functions plus unique DIGITAL-LOGIC AG en-
hancements, such as:
Two channel LAN Ethernet, INTEL 82551QM (LAN A) and INTEL 82551ER (LAN B)
Boot from LAN (PXE and RPL)
Single 8 - 32Volt supply
Video input (only on MSB900, not available on MSB900L)
Watchdog
EEPROM for setup and configuration
UL approved parts
Optional: interface for operator display (LVDS, COM2, CRT, USB, SMBus)
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2.3. MSB900 Block Diagram
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2.4. MSB900/MSB900L specifications
CPU Specification
CPU GEODE LX900
CPU Core Supply 1.25V very low powered
Mode Real / Protected
Compatibility x86
Word Size 32Bits
Secondary Cache 128kB
Physical Addressing 32 lines
Virtual Addressing 16GB
Clock Rates 600MHz
Socket Standard Soldered BGA
Chipset Specification
Northbridge AMD LX900
Southbridge AMD CS5536
LAN 2x 10/100Mbit Intel 82551QM (LAN A), Intel 82551ER (LAN B)
Audio Stereo In and Stereo Line-Out
Codec AD1985 up to 96kHz sampling rate, 16Bit (Analog Devices)
Firewire IEEE1394 Not on board
Video 16MByte Video-DDRAM
Power Management: Specification
The LX900 supports ACPI and APM Version 1.2
The following ACPI Sleep States are supported:
- S1 (Standby)
- S3 (Suspend to RAM) not available
- S4 (Hibernation)
DMA: Specification
8237A comp. 4 channel 8bit
3 channel 16bit
Interrupts: Specification
8259 comp. 8 + 7 levels
PC compatible
Timers: Specification
8254 comp. 3 programmable counters/timers
Memory: Specification
SODIMM SODIMM200pin DDR PC2700 333MHz 256-1024MByte
Video Specification
Controller GEODE LX900
BUS 32Bit high speed 33MHz PCI bus
Enhanced BIOS VGA / LCD BIOS
Memory 2-16MByte shared RAM
CRT-Monitor VGA, SVGA up to 1920x1440
Video Input MSB900: yes, 1 channel
MSB900L: no
Drivers WIN2000, XP
DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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Mass Storage Specification
FD Floppy disk interface not supported
HD E-IDE interface, AT-type, for max. 2 hard disks, 44pin connector,
for 1.3, 1.8 and 2.5" hard disk with 44 pins IDE
Standard AT Interfaces: Specification
Name FIFO IRQs Addr. Standard Option
Serial COM1
COM2
yes
yes
IRQ4
IRQ3
3F8
2F8
RS232C
RS232C
COM1/2 available on headers onboard.
For DSub-connectors, option MSB800-CON is needed.
SuperIO Chip W83627HF from WINBOND
Parallel LPT1 printer interface mode: SPP (output), EPP (bidir.)
Keyboard AT or PS/2-keyboard
Mouse PS/2
Speaker No speaker
RTC Integrated into the chipset, RTC with CMOS-RAM 256Byte
Backup current
<5 µA
RTC-backup MSB900 Onboard 3.6Volt Lithium 400mAh available
RTC-backup MSB900L External connection, no onboard battery available
BUS Specification
PCI/104 PCI 32Bit Bus, 1 slot
Clock 33MHz defined by the GEODE
USB Specification
USB 2.0
Transfer rate 480MBps, 12.5MBps / 1.5MBps
Channels 4
Peripheral Extension Specification
ISA Not supported
PCI MSB900 With PCI/104 BUS (1 slot), limited I/O space
PCI MSB900L Not available
Power Supply Specification
Working
8-32Volt ± 5% (peak 36Volt)
Power Rise Time Unspecified
Power consumption MSB900/L with HD, MS/KB (PS/2), CRT Monitor
Windows XP Desktop: type 8.5-10W
Standby power consumption MSB900/L:
Windows Standby: 2.5W (without MS/KB wakeup function)
Windows Standby: 4.5W (with PS/2 wakeup function)
Physical Characteristics Specification
Dimensions Length: 146 mm
Depth: 102 mm
Height: 20 mm
Weight 160g
PCB Thickness 1.6mm / 0.0625 inches nominal
PCB Layer Multilayer
DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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Operating Environment Specification
Relative humidity 5-90%, non-condensing
Vibration 5-2000Hz, 0.1G
Shock 1G
Temperature MSB900*:
Operating: Standard version: -2C to +70°C
Extended version: -4C to +85°C
Storage: -55°C to +85°C
* = with passive cooler
MSB900L**:
Operating: Standard version: C to +60°C
Storage: -55°C to +85°C
** = without passive cooler
EMI/EMC (IEC1131-2 refer MIL
461/462)
Specification
ESD Electro Static Discharge IEC 801-2, EN55101-2, VDE 0843/0847 Part 2
Metallic protection needed
Separate ground layer included
15kV single peak
REF Radiated Electromagnetic Field IEC 801-3, VDE 0843 Part 3, IEC770 6.2.9. (not tested)
EFT Electric Fast Transient (Burst) IEC 801-4, EN50082-1, VDE 0843 Part 4
250V - 4kV, 50 ohms, Ts=5ns
Grade 2: 1kV Supply, 500 I/O, 5kHz
SIR Surge Immunity Requirements IEC 801-5, IEEE587, VDE 0843 Part 5
Supply: 2kV, 6 pulse/minute
I/O: 500V, 2 pulse/minute
FD, CRT: none
High-frequency Radiation EN55022
Compatibility Specification
MSB900/L Mechanically compatible to 3.5inch industrial embedded com-
puter boards
All information is subject to change without notice.
2.5. Examples of Ordering Codes
802220 MSB900 with LX900 CPU, 0MB-RAM, Battery, PCI/104 and Video input
802221 MSB900L with LX900 CPU, 0MB RAM, …
802205 MSB800CON COM1, LPT1 Expansion board.
These are only examples; for current ordering codes, please see the current price list.
2.6. Related Application Notes
Application Notes are available at http://www.digitallogic.com
support, or on any DIGITAL-LOGIC
Application CD.
# Description
DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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2.7. Dimensions & Diagrams
2.7.1. MSB900/L
Board / Version Unit: Tolerance: Date / Author
MSB900/L mm (millimeter) + / - 0.1mm 25.10.2006 / BRR
DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
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DIGITAL-LOGIC MSB900 User manual

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