Dynatron 88885175 Datasheet

Dynatron
Brand
Dynatron
Model
88885175
Category
Computer cooling components
Type
Datasheet
NEW PRODUCT SPEC SHEET
Model Number: K2
• Recommend for Intel® Xeon® Processor E3 Family, Socket LGA1155
2
nd
Generation Core™ i3 / i5 / i7 Desktop Processors, Socket LGA1155
Previous
Generation Core™ i3 / i5 / i7 Desktop Processors, Socket LGA1156
• Active Cooler for Mini-ITX Form Factory and Quiet Solution
Overall Specification:
• Dimension: 82.6 x 81.0 x 27.8mm
• Weight: 380g ± 5g
• Material: Copper Heat Sink with Skiving Fins
• Alloy Frame Blower with PWM function
• Plastic Push-Pin Mounting for avoiding interference with back end components
• GE-Toshiba TIG830SP Thermal Grease Pre-Printed
• Support CPU Power up to 73 Watts
Blower Specification:
• Model Number: DB127515BM-PWMG
• Dimension: Ø75.0 x 15.0 mm
• Bearing: Double-Ball
• Rated Voltage: 12V
• Rated Speed:
o At Duty Cycle 0~20%: 1000±10% RPM
o At Duty Cycle 50%: 2500±10% RPM
o At Duty Cycle 100%: 4000 RPM Max
• Rated Input Power:
o At Duty Cycle 0~20%: 0.60 W
o At Duty Cycle 50%: 1.80 W
o At Duty Cycle 100%: 4.80 W
2
78
75
72.3
69.5
68
70
72
74
76
78
80
0 2000 2500 3000 3800 4000
Blower Speed (RPM)
CPU temperature ( °c )
21
26
31
36
41
Noise Level (dBA)
Tc
Noise
• Rated Airflow:
o At Duty Cycle 0~20%: 6.0 CFM
o At Duty Cycle 50%: 8.3 CFM
o At Duty Cycle 100%: 11.9 CFM
• Rated Static Pressure:
o At Duty Cycle 0~20%: 2.2 mm-H
2
O
o At Duty Cycle 50%: 11.5 mm-H
2
O
o At Duty Cycle 100%: 23.6 mm-H
2
O
• Rated Acoustical Noise:
o At Duty Cycle 0~20%: 21.0 dBA
o At Duty Cycle 50%: 37.8 dBA
o At Duty Cycle 100%: 44.0 dBA
• Lead Wire Pin Out:
o Pin#1-Black(-)
o Pin#2- Yellow(+)
o Pin#3- Green(Tachometer/ Signal Output)
o Pin#4- Blue (PWM)
Active Cooler K2 Cooling Performance VS. Airflow & Noise:
Thermal Target
  • Page 1 1
  • Page 2 2

Dynatron 88885175 Datasheet

Dynatron
Brand
Dynatron
Model
88885175
Category
Computer cooling components
Type
Datasheet
Download PDF
report

Ask a question and I''ll find the answer in the document

Finding information in a document is now easier with AI

Related papers

Other documents