Seco SBC-pITX-BT Owner's manual

SBC-A44-pITX

Single Board Computer

with the Intel® Atom E3800 family SOCs

and ECC DDR3L memory

on picoITX form factor

SBC-A44-pITX

2

Unauthorized use, duplication, modification or disclosure of the information to a third-party by any means without prior consent of SECO S.r.l. is prohibited.

Every effort has been made to ensure the accuracy of this manual. However, SECO S.r.l. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.r.l. reserves the right to change precise specifications without prior notice to supply the best product possible.

Some of the information found in the BIOS SETUP Chapter has been extracted from the following copyrighted Insyde Software Corp. documents:

InsydeH2O Setup Utility - User Reference Guide

For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the

dedicated web form available at http://www.seco.com (registration required).

Our team is ready to assist.

Revision

Date

Note

Ref

1.0

4th February 2016

First Official Release.

SB

1.1

25th February 2016

VGA connector removed

SB

1.2

18th November 2016

Typo corrected in par. 2.3.2.

BIOS Section updated.

Changes for rev. C of the PCB:

 μSD only

 minicard slot (CN6) pinout updated

 added GPI/O connector

SB

1.3

18th January 2017

BIOS Section updated

SB

1.4

5th May 2017

BIOS Section updated

SB

1.5

11th September 2017

BIOS Section updated

SB

REVISION HISTORY

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INDEX

INTRODUCTION .......................................................................................................................................................................... 6 Chapter 1.

1.1 Warranty ........................................................................................................................................................................................................................................ 7

1.2 Information and assistance ............................................................................................................................................................................................................. 8

1.3 RMA number request ..................................................................................................................................................................................................................... 8

1.4 Safety ............................................................................................................................................................................................................................................ 9

1.5 Electrostatic discharges ................................................................................................................................................................................................................. 9

1.6 RoHS compliance .......................................................................................................................................................................................................................... 9

1.7 Terminology and definitions .......................................................................................................................................................................................................... 10

1.8 Reference specifications .............................................................................................................................................................................................................. 12

OVERVIEW ............................................................................................................................................................................... 13 Chapter 2.

2.1 Introduction .................................................................................................................................................................................................................................. 14

2.2 Technical specifications ............................................................................................................................................................................................................... 15

2.3 Electrical specifications ................................................................................................................................................................................................................ 16

2.3.1 Power available .................................................................................................................................................................................................................... 16

2.3.2 Power consumption ............................................................................................................................................................................................................. 17

2.3.3 RTC Battery ......................................................................................................................................................................................................................... 18

2.3.4 Power rails naming convention ............................................................................................................................................................................................. 18

2.4 Mechanical specifications............................................................................................................................................................................................................. 19

2.5 Block diagram .............................................................................................................................................................................................................................. 20

CONNECTORS ......................................................................................................................................................................... 21 Chapter 3.

3.1 Introduction .................................................................................................................................................................................................................................. 22

3.2 Connectors overview ................................................................................................................................................................................................................... 23

3.3 Connectors description ................................................................................................................................................................................................................ 24

3.3.1 Ethernet connectors ............................................................................................................................................................................................................. 24

3.3.2 USB ports............................................................................................................................................................................................................................ 25

3.3.3 LVDS + backlight + T/S connector ....................................................................................................................................................................................... 27

3.3.4 HDMI connector................................................................................................................................................................................................................... 29

3.3.5 Audio interface ..................................................................................................................................................................................................................... 30

3.3.6 Buttons / LED header ........................................................................................................................................................................................................... 31

3.3.7 Optional multi-standard serial ports ....................................................................................................................................................................................... 32

3.3.8 μSD slot .............................................................................................................................................................................................................................. 33

3.3.9 S-ATA connectors ............................................................................................................................................................................................................... 34

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3.3.10 miniCard slot ........................................................................................................................................................................................................................ 35

3.3.11 FAN connector .................................................................................................................................................................................................................... 37

3.3.12 SO-DIMM DDR3L ECC Slot ................................................................................................................................................................................................. 37

BIOS SETUP ............................................................................................................................................................................. 38 Chapter 4.

4.1 InsydeH2O setup Utility ................................................................................................................................................................................................................ 39

4.2 Main setup menu ......................................................................................................................................................................................................................... 40

4.2.1 System Time / System Date ................................................................................................................................................................................................. 40

4.3 Advanced menu .......................................................................................................................................................................................................................... 41

4.3.1 Boot configuration submenu ................................................................................................................................................................................................. 42

4.3.2 PCI Express configuration submenu ..................................................................................................................................................................................... 42

4.3.3 USB configuration submenu ................................................................................................................................................................................................. 42

4.3.4 Audio configuration submenu ............................................................................................................................................................................................... 44

4.3.5 LPSS & SCC configuration submenu .................................................................................................................................................................................... 45

4.3.6 Miscellaneous Configuration submenu .................................................................................................................................................................................. 46

4.3.7 Security configuration (TXE) submenu ................................................................................................................................................................................... 46

4.3.8 Video configuration submenu ............................................................................................................................................................................................... 47

4.3.9 Chipset configuration submenu ............................................................................................................................................................................................ 48

4.3.10 SATA configuration submenu ............................................................................................................................................................................................... 50

4.3.11 Console Redirection submenu.............................................................................................................................................................................................. 51

4.3.12 ACPI Table/features submenu .............................................................................................................................................................................................. 52

4.3.13 INT/IRQ configuration submenu ............................................................................................................................................................................................ 52

4.4 Security menu.............................................................................................................................................................................................................................. 53

4.4.1 USB Disk Signature Option submenu ................................................................................................................................................................................... 53

4.5 Power menu ................................................................................................................................................................................................................................ 54

4.5.1 Advanced CPU control submenu ......................................................................................................................................................................................... 55

4.5.2 EC Watchdog Configuration submenu .................................................................................................................................................................................. 56

4.5.3 Thermal Zone configuration submenu ................................................................................................................................................................................... 56

4.6 Boot menu .................................................................................................................................................................................................................................. 57

4.6.1 Fixed Legacy Boot Order Settings Submenu ......................................................................................................................................................................... 58

4.6.2 Legacy submenu ................................................................................................................................................................................................................. 59

4.7 Exit menu .................................................................................................................................................................................................................................... 60

APPENDICES............................................................................................................................................................................ 61 Chapter 5.

5.1 Thermal Design ............................................................................................................................................................................................................................ 62

5.2 Accessories ................................................................................................................................................................................................................................. 63

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5.2.1 Accessories kit CABKITA44 .................................................................................................................................................................................................. 63

5.2.2 USB-to-Serial port converter modules ................................................................................................................................................................................... 64

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Chapter 1.

 Warranty

 Information and assistance

 RMA number request

 Safety

 Electrostatic discharges

 RoHS compliance

 Terminology and definitions

 Reference specifications

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1.1 Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts for 1 year.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.

Items cannot be returned unless previously authorized by the supplier.

The authorization is released after completing the specific form available on the web-site http://www.seco.com/en/prerma (RMA Online). The RMA authorization

number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original packaging, with

no signs of damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and has must accompany the returned item.

If any of the above mentioned requirements for the RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.

Following a technical analysis, the supplier will verify if all the requirements, for which a warranty service applies, are met. If the warranty cannot be applied, the

Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

Warning!

All changes or modifications to the equipment not explicitly approved by SECO S.r.l. could impair the equipment’

s functionalities and could void

the warranty

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1.2 Information and assistance

What do I have to do if the product is faulty?

SECO S.r.l. offers the following services:

 SECO website: visit http://www.seco.com to receive the latest information on the product. In most cases it is possible to find useful information to solve the

problem.

 SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.

 SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct

solution. E-mail: technical.se[email protected]

Fax (+39) 0575 340434

 Repair centre: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

o Returned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.

o Returned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before asking for technical assistance:

 Name and serial number of the product;

 Description of Customer’s peripheral connections;

 Description of Customer’s software (operating system, version, application software, etc.);

 A complete description of the problem;

 The exact words of every kind of error message encountered.

1.3 RMA number request

To request a RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online” and follow the procedure described.

A RMA Number will be sent within 1 working day (only for on-line RMA requests).

SBC-A44-pITX

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Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other

boards.

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid

short circuits due to unwanted contacts with other board components.

If the board has become wet, never connect it to any external power supply unit or battery.

Check carefully that all cables are correctly connected and that they are not damaged.

Whenever handling a SBC-A44-pITX board, ground yourself through an anti-static wrist strap. Placement of the board on an anti-

static surface is also highly recommended.

1.4 Safety

The SBC-A44-pITX board uses only extremely-low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

1.5 Electrostatic discharges

The SBC-A44-pITX board, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all

the devices and/or components on-board.

1.6 RoHS compliance

The SBC-A44-pITX board is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

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1.7 Terminology and definitions

ACPI Advanced Configuration and Power Interface, an open industrial standard for the board’s devices configuration and power management

AHCI Advanced Host Controller Interface, a standard which defines the operation modes of SATA interface

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

BIOS Basic Input / Output System, the Firmware Interface that initializes the board before the OS starts loading

CEC Consumer Electronics Control, an HDMI feature which allows controlling more devices connected together by using only one remote control

CRT Cathode Ray Tube. Initially used to indicate a type of monitor, this acronym has been used over time to indicate the analog video interface used to

drive them.

DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)

DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock

DDR3 DDR, 3rd generation

EHCI Enhanced Host Controller interface, a high-speed controller for USB ports, able to support USB2.0 standard

FFC/FPC Flexible Flat Cable / Flat Panel Cable

GBE Gigabit Ethernet

Gbps Gigabits per second

GND Ground

GPI/O General purpose Input/Output

HD Audio High Definition Audio, most recent standard for hardware codecs developed by Intel® in 2004 for higher audio quality

HDMI High Definition Multimedia Interface, a digital audio and video interface

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

LVDS Low Voltage Differential Signaling, a standard for transferring data at very high speed using inexpensive twisted pair copper cables, usually used

for video applications

Mbps Megabits per second

MMC/eMMC MultiMedia Card / embedded MMC, a type of memory card, having the same interface as the SD card. The eMMC is the embedded version of

the MMC. They are devices that incorporate the flash memories on a single BGA chip.

N.A. Not Applicable

N.C. Not Connected

OpenCL Open Computing Language, a software library based on C99 programming language, conceived explicitly to realise parallel computing using

Graphics Processing Units (GPU)

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OpenGL Open Graphics Library, an Open Source API dedicated to 2D and 3D graphics

OS Operating System

PCI-e Peripheral Component Interface Express

PSU Power Supply Unit

PWM Pulse Width Modulation

PWR Power

PXE Preboot Execution Environment, a way to perform the boot from the network ignoring local data storage devices and/or the installed OS

SATA Serial Advance Technology Attachment, a differential full duplex serial interface for Hard Disks

SD Secure Digital, a memory card type

SDHC Secure Digital Host Controller

SIM Subscriber Identity Module, a card which stores all data of the owner necessary to allow him accessing to mobile communication networks

SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and

other power supply-related devices

SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed of a master and one or more slaves, individually

enabled through a Chip Select line

TBM To be measured

TMDS Transition-Minimized Differential Signaling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces

UEFI Unified Extensible Firmware Interface, a specification defining the interface between the OS and the board’s firmware. It is meant to replace the

original BIOS interface

UIM User Identity Module, an extension of SIM modules.

USB Universal Serial Bus

V_REF Voltage reference Pin

xHCI eXtensible Host Controller Interface, Host controller for USB 3.0 ports, which can also manage USB 2.0 and USB1.1 ports

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1.8 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

ACPI

http://www.acpi.info

AHCI

http://www.intel.com/content/www/us/en/io/serial-ata/ahci.html

DDC

http://www.vesa.org

Gigabit Ethernet

http://standards.ieee.org/about/get/802/802.3.html

HD Audio

http://www.intel.com/content/dam/www/public/us/en/documents/product-specifications/high-definition-audio-specification.pdf

HDMI

http://www.hdmi.org/index.aspx

I2C

http://www.nxp.com/documents/other/UM10204_v5.pdf

Intel® Front Panel I/O connectivity DG

http://www.formfactors.org/developer/specs/A2928604-005.pdf

LVDS

http://www.ti.com/lit/ml/snla187/snla187.pdf

MMC/eMMC

http://www.jedec.org/committees/jc-649

OpenCL

http://www.khronos.org/opencl

OpenGL

http://www.opengl.org

PCI Express

http://www.pcisig.com/specifications/pciexpress

PCI Express mini cards

http://www.pcisig.com/specifications/pciexpress/specifications/specifications/pciexpress/base2/#MCEM2

SATA

https://www.sata-io.org

SD Card Association

https://www.sdcard.org/home

SM Bus

http://www.smbus.org/specs

TMDS

http://www.siliconimage.com/technologies/tmds

UEFI

http://www.uefi.org

USB 2.0 and USB OTG

http://www.usb.org/developers/docs/usb_20_070113.zip

USB 3.0

http://www.usb.org/developers/docs/usb_30_spec_070113.zip

Intel® Atom Bay Trail family

http://ark.intel.com/products/codename/55844/Bay-Trail#@Embedded

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Chapter 2.

 Introduction

 Technical specifications

 Electrical specifications

 Mechanical specifications

 Block diagram

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2.1 Introduction

SBC-A44-pITX is a Single Board Computer in pico-ITX form factor (just 100 x 72mm) based on the Intel® Atom family of System-on-Chips (SOCs) formerly coded

as Bay Trail, a series of Single/ Dual / Quad Core SOCs with 64-bit instruction set.

These SOCs embed all the features usually obtained by combination of CPU + platform Controller hubs, all in one single IC, which allows, therefore, the system

minimisation and performance optimisation, which is essential for boards with sizes so reduced as for picoITX SBCs, which offers all functionalities of standard PC

boards in just 100x72mm.

This single chip solution includes the memory controller, which gives support for up to 8GB of DDR3L-1333 ECC SODIMM Memory.

Please be aware that only

ECC SO-DIMM modules are supported, non-ECC modules will not work and

All SOCs (except for E3805) embed an Intel® HD Graphics 4000 series controller, which offer high graphical performances, with support for Microsoft® DirectX11,

OpenGL 3.0, OpenCL 1.2, OpenGLES 2.0 and HW acceleration for video decoding of H.264, MPEG2, MVG, VC-1, VP8 and MJPEG video standards (for H.264,

MPEG2 and MVG also HW encoding is offered). This embedded GPU is able to drive two independent displays, by using the HDMI and/or LVDS interfaces. Any

combinations of these video interfaces are supported. It is also available with the Intel Atom E3805 Processor for headless applications and IoT smart gateways.

Further features, managed directly by the E3800 Atom SOCs and included in SBC-A44-pITX board, are two SATA Channels (one used for common SATA disks,

the other used to implement a mSATA interface), microSD card slot, five USB ports (two USB 3.0 and three USB 2.0 only), HD Audio and three PCI Express lanes

(two PCI express lanes are used for the implementation of two Gigabit Ethernet interfaces, the other is carried out on half size miniCard express slot, which is

shared with mSATA interface).

Born for the industrial market with native -40° to +85 °C temperature range and ECC memory support, this SBC is specifically designed for harsh environments

and is ideal for critical applications such as automotive and outdoor solutions where data coherence and security is crucial. This full-industrial SBC also offers a

broad range of video and native serial connectivity options, along with SATA and PCI-e.

The board is directly available in EXTREME configuration, with all the components mounted onboard certified for industrial temperature ranges.

Please refer to following chapter for a complete list of all peripherals integrated and characteristics.

2.2 Technical specifications

SOC

Intel® Atom E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP

Intel® Atom E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP

Intel® Atom E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP

Intel® Atom E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP

Intel® Atom E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP

Intel® Atom E3805, Dual Core @1.33GHz, 1MB Cache, 3W TDP

Memory

Up to 8GB on DDR3L-1333 ECC SO-DIMM Slot *

(DDR3L-1333 with E3845 and E3827, DDR3L-1067 the others)

Graphics (not for E3805)

Integrated Intel® HD Graphics 4000 series controller

Dual independent display support

HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats

HW encoding of H.264, MPEG2 and MVC formats

Video Interfaces

HDMI connector

Single/Dual Channel 18-/24-bit LVDS connector

Video Resolution

HDMI, resolution up to 1080p @ 60Hz

LVDS, resolution up to 1920 x 1200

Mass Storage

Optional eMMC drive on-board

1 x standard S-ATA connector

mini mSATA interface on miniCard slot (shared with miniPCI-e)

microSD Card slot

Networking

Dual Gigabit Ethernet connector

* Please notice that total amount of 8GB would be usable only with 64-bit OS. Total

amount of memory available with a 32-bit OS depends on the OS itself (it will be less

than 4GB, however).

USB

2 x USB 3.0 Host ports on Dual Type-A socket

2 x USB 2.0 Host port on internal pin header

1 x USB 2.0 host port on miniPCI-e slot

Audio

Optional HD Audio Codec Cirrus Logic CS4207

Mic In, Line out internal pin header connector

Serial Ports

2 x optional RS-232 / RS-422 / RS-485 Serial ports on internal pin Header

Other Interfaces

Half-miniCard slot (accepts both Half-mini PCI-e cards and mSATA disks)

8 x GPIOs

FAN connector

Switch/LED Front Header

I2C connector with INT and RST# signals

Power supply voltage: +12VDC ± 5%

RTC Battery with lead cable and connector

Operating temperature: 0°C ÷ +60°C** (Commercial temperature)

-40° ÷ +85°C (Industrial temperature)

Dimensions: 72 x 100 mm (2.83” x 3.93”).

Supported Operating Systems:

Microsoft® Windows® 7 (32/64 bit)

Microsoft® Windows® 8.1 (32/64 bit)

Microsoft® Windows® 10 (32/64 bit)

Microsoft® Windows® 10 IoT

Microsoft® Windows® Embedded Standard 7 /8 (32/64 bit)

Microsoft® Windows® Embedded Compact 7

Linux (32/64 bit)

** Temperatures indicated are the maximum temperature that the

heatspreader / heatsink can reach in any of its parts. This means that it is

customer

’

s responsibility to use any passive cooling solution along with an

application-dependent cooling system, capable to ensure that the

heatspreader / heatsink temperature remains in the range above indicated.

Please also check paragraph 5.1

2.3 Electrical specifications

SBC-A44-pITX needs to be supplied only with an external 12VDC ± 5% power supply, minimum 40W for basic functionalities

recommended.

This voltage can be supplied through a standard 6.3mm (internal pin, diameter 2.0 mm) Power Jack (CN8).

Internal pin is VIN power line.

As an alternative, the board can be equipped with an internal straight “mini-Fit” connector, type MOLEX p/n 39-28-

1023 or equivalent, which can be used for the connection of an external PSU.

2.3.1 Power available

When powering SBC-A44-pITX with a PSU with characteristics greater or equal to the one described at beginning of previous paragraph, please consider well

what is the typical scenario for using the board (i.e., which peripherals will be connected)

Internal power section is able to supply a maximum of 8A@5V for external devices supplied directly by the module (i.e. USB devices, optionally SSD or SATA disks,

display).

Consider that each USB 2.0 port requires 500mA, and USB 3.0 ports need 0.9A each, so if all 5 USB ports are used, then the 5V power section would be able to

supply further 4.7A (about 24W) to other peripherals, like SATA Disk and/or LVDS display. Anyway, if all this current is needed by external peripherals, a 40W PSU

cannot supply further power tor internal circuitry of the board.

Since all the power must be supplied by an external PSU only, please balance well the typical final configuration, considering both the power consumption of the

board itself (in paragraph 2.3.2 are detailed current consumption for possible different SOCs) and the power consumption of external devices.

This way it is possible to calculate preliminarily if a 40W PSU can be sufficient for system needing or if most powerful PSUs are required.

Optional Power connector - CN22

Signal

1

GND

2

VIN

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2.3.2 Power consumption

Using the following setup, and using all possible SOCs offered for SBC-A44-pITX board, the current consumption has been measured on +12VDC VIN power line.

 O.S. Windows 10 Professional

 4GB DDR3L-133MHz ECC SODIMM (ADATA p/n ADDH1600W4G11-BMIE)

 16GB eMMC onboard

 USB mouse and keyboard connected

 HDMI display connected, resolution 1920x11080.

 Network connection plugged to Gigabit Ethernet Network.

 Optional adapter module for audio jacks, pushbuttons and status LEDs connected.

 Bios Release 1.09 Rc03.

 No FAN connected.

Independently by the SOC mounted onboard, the following power consumptions are common to all boards:

Battery Backup power consumption: 2,5μA

Soft-Off State power consumption: 88mA (wake on LAN enabled)

Suspend State power consumption: 100mA (resume from LAN + Resume from USB enabled)

Status

SOC

E3845

E3827

E3825

E3815

Idle, power saving configuration

390mA

356mA

324mA

312mA

OS Boot, power saving configuration

1040mA

1020mA

702mA

760mA

Video reproduction@720p, power saving configuration

633mA

660mA

567mA

509mA

Video reproduction@1080p, power saving configuration

800mA

722mA

626mA

545mA

3DMark2006 benchmark, power saving configuration

931mA

853mA

718mA

619mA

3DMark2006 benchmark, maximum performance

1030mA

928mA

730mA

635mA

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CAUTION: handling batteries incorrectly or replacing with not-approved devices may present a risk of fire or explosion.

2.3.3 RTC Battery

For the occurrences when the module is not powered with an external power supply, on board there is a cabled coin Lithium Battery to supply, with a 3V voltage,

the Real Time Clock embedded inside the Intel® Atom SOC.

Battery used is a cabled CR2032-LD Lithium coin-cell battery, with a nominal capacity of 220mAh.

The battery is not rechargeable, and can be connected to the board using dedicated connector CN5 which is a 2-pin

p1.27 mm type MOLEX p/n 53398-0271 or equivalent, with pinout shown in the table on the left.

Mating connector: MOLEX 51021-0200 receptacle with MOLEX 50079-8000 female crimp terminals.

In case of exhaustion, the battery should only be replaced with devices of the same type. Always check the orientation before

inserting and make sure that they are aligned correctly and are not damaged or leaking.

Never allow the batteries to become short-circuited during handling.

Batteries supplied with SBC-A44-pITX are compliant to requirements of European Directive 2006/66/EC regarding batteries and accumulators. When putting out of

order SBC-A44-pITX, remove the batteries from the board in order to collect and dispose them according to the requirement of the same European Directive

above mentioned. Even when replacing the batteries, the disposal has to be made according to these requirements.

2.3.4 Power rails naming convention

In all the tables contained in this manual, Power rails are named with the following meaning:

_S: Switched voltages, i.e. power rails that are active only when the board is in ACPI’s S0 (Working) state. Examples: +3.3V_S, +5V_S.

_A: Always-on voltages, i.e. power rails that are active both in ACPI’s S0 (Working), S3 (Standby) and S5 (Soft Off) state. Examples: +5V_A, +3.3V_A.

_U: unswitched ACPI S3 voltages, i.e. power rails that are active both in ACPI’s S0 (Working) and S3 (Standby) state. Examples: +1.5V_U

Other suffixes are used for application specific power rails, which are derived from same voltage value of voltage switched rails, if it is not differently stated (for

example, +5VHDMI is derived from +5V_S, and so on).