8K x 8 Static RAM
f
ax
id
:
1013
CY7C185
Cypress Semiconductor Corporation
• 3901 North First Street • San Jose • CA 95134 • 408-943-2600
Au
g
ust 12
,
1998
Features
• High speed
—15 ns
• Fast t
DOE
• Low active power
—715 mW
• Low standby power
—220 mW
• CMOS for optimum speed/power
• Easy memory expansion with CE
1
, CE
2
, and OE features
• TTL-compatible inputs and outputs
• Automatic power-down when deselected
Functional Description
The CY7C185 is a high-performance CMOS static RAM orga-
nized as 8192 words by 8 bits. Easy memory expansion is
provided by an active LOW chip enable (CE
1
), an active HIGH
chip enable (CE
2
), and active LOW output enable (OE) and
three-state drivers. This device has an automatic power-down
feature (CE
1
or CE
2
), reducing the power consumption by 70%
when deselected. The CY7C185 is in a standard 300-mil-wide
DIP, SOJ, or SOIC package.
An active LOW write enable signal (WE
) controls the writ-
ing/reading operation of the memory. When CE
1
and WE in-
puts are both LOW and CE
2
is HIGH, data on the eight data
input/output pins (I/O
0
through I/O
7
) is written into the memory
location addressed by the address present on the address
pins (A
0
through A
12
). Reading the device is accomplished by
selecting the device and enabling the outputs, CE
1
and OE
active LOW, CE
2
active HIGH, while WE remains inactive or
HIGH. Under these conditions, the contents of the location ad-
dressed by the information on address pins are present on the
eight data input/output pins.
The input/output pins remain in a high-impedance state unless
the chip is selected, outputs are enabled, and write enable
(WE
) is HIGH. A die coat is used to insure alpha immunity.
Logic Block Diagram Pin Configurations
C185–1
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
0
A
10
A
9
A
11
A
12
I/O
0
C185–2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
WE
CE
2
A
3
A
2
A
1
OE
A
0
CE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
3
NC
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
I/O
0
I/O
1
I/O
2
GND
256 x 32 x 8
ARRAY
INPUT BUFFER
COLUMN DECODER
ROW DECODER
SENSE AMPS
POWER
DOWN
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
CE
1
CE
2
WE
OE
Top View
DIP/SOJ/SOIC
Selection Guide
[1]
7C185–15 7C185–20 7C185–25 7C185–35
Maximum Access Time (ns) 15 20 25 35
Maximum Operating Current (mA) 130 110 100 100
Maximum Standby Current (mA) 40/15 20/15 20/15 20/15
Note:
1. For military specifications, see the CY7C185A datasheet.
CY7C185
2
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Supply Voltage to Ground Potential............... –0.5V to +7.0V
DC Voltage Applied to Outputs
in High Z State
[2]
............................................ –0.5V to +7.0V
DC Input Voltage
[2]
......................................... –0.5V to +7.0V
Output Current into Outputs (LOW)............................. 20 mA
Static Discharge Voltage.......................................... >2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current.................................................... >200 mA
Operating Range
Range
Ambient
Temperature
V
CC
Commercial 0
°
C to +70
°
C 5V ± 10%
Industrial –40
°
C to +85
°
C 5V ± 10%
Electrical Characteristics
Over the Operating Range
7C185–15 7C185–20
Parameter Description Test Conditions Min. Max. Min. Max. Unit
V
OH
Output HIGH Voltage V
CC
= Min., I
OH
= –4.0 mA 2.4 2.4 V
V
OL
Output LOW Voltage V
CC
= Min., I
OL
= 8.0 mA 0.4 0.4 V
V
IH
Input HIGH Voltage 2.2 V
CC
+
0.3V
2.2 V
CC
+
0.3V
V
V
IL
Input LOW Voltage
[2]
–0.5 0.8 –0.5 0.8 V
I
IX
Input Load Current GND ≤ V
I
≤ V
CC
–5 +5 –5 +5
µA
I
OZ
Output Leakage
Current
GND ≤ V
I
≤ V
CC
,
Output Disabled
–5 +5 –5 +5
µA
I
OS
Output Short
Circuit Current
[3]
V
CC
= Max.,
V
OUT
= GND
–300 –300 mA
I
CC
V
CC
Operating
Supply Current
V
CC
= Max.,
I
OUT
= 0 mA
130 110 mA
I
SB1
Automatic
Power-Down Current
Max. V
CC
, CE
1
≥ V
IH
or CE
2
≤
V
IL
Min. Duty Cycle=100%
40 20
mA
I
SB2
Automatic
Power-Down Current
Max. V
CC
, CE
1
≥ V
CC
– 0.3V,
or CE
2
≤ 0.3V
V
IN
≥ V
CC
– 0.3V or V
IN
≤ 0.3V
15 15
mA
Notes:
2. Minimum voltage is equal to –3.0V for pulse durations less than 30 ns.
3. Not more than 1 output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
CY7C185
3
Electrical Characteristics
Over the Operating Range (continued)
7C185–25 7C185-35
Parameter Description Test Conditions Min. Max. Min. Max. Unit
V
OH
Output HIGH Voltage V
CC
= Min., I
OH
= –4.0 mA 2.4 2.4 V
V
OL
Output LOW Voltage V
CC
= Min., I
OL
= 8.0 mA 0.4 0.4 V
V
IH
Input HIGH Voltage 2.2 V
CC
+
0.3V
2.2 V
CC
+
0.3V
V
V
IL
Input LOW Voltage
[2]
–0.5 0.8 –0.5 0.8 V
I
IX
Input Load Current GND ≤ V
I
≤ V
CC
–5 +5 –5 +5
µA
I
OZ
Output Leakage
Current
GND ≤ V
I
≤ V
CC
,
Output Disabled
–5 +5 –5 +5
µA
I
OS
Output Short
Circuit Current
[3]
V
CC
= Max.,
V
OUT
= GND
–300 –300 mA
I
CC
V
CC
Operating
Supply Current
V
CC
= Max.,
I
OUT
= 0 mA
100 100 mA
I
SB1
Automatic
Power-Down Current
Max. V
CC
, CE
1
≥ V
IH
or
CE
2
≤
V
IL
Min. Duty Cycle=100%
20 20 mA
I
SB2
Automatic
Power-Down Current
Max. V
CC
, CE
1
≥ V
CC
– 0.3V
or CE
2
≤ 0.3V
V
IN
≥ V
CC
– 0.3V or V
IN
≤ 0.3V
15 15 mA
Capacitance
[4]
Parameter Description Test Conditions Max. Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz,
V
CC
= 5.0V
7 pF
C
OUT
Output Capacitance 7 pF
Note:
4. Tested initially and after any design or process changes that may affect these parameters.
AC Test Loads and Waveforms
R1 481
Ω
3.0V
5V
OUTPUT
R1 481
Ω
R2
255
Ω
30pF
GND
90%
90%
10%
≤
5ns
≤
5
ns
5V
OUTPUT
C185–4
R2
255
Ω
5
pF
C185–5
(a) (b)
OUTPUT 1.73V
INCLUDING
JIG AND
SCOPE
INCLUDING
JIGAND
SCOPE
10%
Equivalent to: THÉVENIN EQUIVALENT
ALL INPUT PULSES
167
Ω
CY7C185
4
Switching Characteristics
Over the Operating Range
[5]
7C185–15 7C185–20 7C185–25 7C185–35
Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Unit
READ CYCLE
t
RC
Read Cycle Time 15 20 25 35 ns
t
AA
Address to Data Valid 15 20 25 35 ns
t
OHA
Data Hold from
Address Change
3 5 5 5 ns
t
ACE1
CE
1
LOW to Data Valid 15 20 25 35 ns
t
ACE2
CE
2
HIGH to Data Valid 15 20 25 35 ns
t
DOE
OE LOW to Data Valid 8 9 12 15 ns
t
LZOE
OE LOW to Low Z 3 3 3 3 ns
t
HZOE
OE HIGH to High Z
[6]
7 8 10 10 ns
t
LZCE1
CE
1
LOW to Low Z
[7]
3 5 5 5 ns
t
LZCE2
CE
2
HIGH to Low Z 3 3 3 3 ns
t
HZCE
CE
1
HIGH to High Z
[6, 7]
CE
2
LOW to High Z
7 8 10 10 ns
t
PU
CE
1
LOW to Power-Up
CE
2
to HIGH to Power-Up
0 0 0 0 ns
t
PD
CE
1
HIGH to Power-Down
CE
2
LOW to Power-Down
15 20 20 20 ns
WRITE CYCLE
[8]
t
WC
Write Cycle Time 15 20 25 35 ns
t
SCE1
CE
1
LOW to Write End 12 15 20 20 ns
t
SCE2
CE
2
HIGH to Write End 12 15 20 20 ns
t
AW
Address Set-Up to
Write End
12 15 20 25 ns
t
HA
Address Hold from
Write End
0 0 0 0 ns
t
SA
Address Set-Up to
Write Start
0 0 0 0 ns
t
PWE
WE Pulse Width 12 15 15 20 ns
t
SD
Data Set-Up to Write End 8 10 10 12 ns
t
HD
Data Hold from Write End 0 0 0 0 ns
t
HZWE
WE LOW to High Z
[6]
7 7 7 8 ns
t
LZWE
WE HIGH to Low Z 3 5 5 5 ns
Notes:
5. Test conditions assume signal transition time of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
I
OL
/I
OH
and 30-pF load capacitance.
6. t
HZOE,
t
HZCE
, and t
HZWE
are specified with C
L
= 5 pF as in part (b) of AC Test Loads. Transition is measured
±
500 mV from steady state voltage.
7. At any given temperature and voltage condition, t
HZCE
is less than t
LZCE1
and t
LZCE2
for any given device.
8. The internal write time of the memory is defined by the overlap of CE
1
LOW, CE
2
HIGH, and WE LOW. All 3 signals must be active to initiate a write and either
signal can terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write.
CY7C185
5
Switching Waveforms
9. Device is continuously selected. OE, CE
1
= V
IL
. CE
2
= V
IH
.
10. WE is HIGH for read cycle.
11. Data I/O is High Z if OE = V
IH
, CE
1
= V
IH
, WE = V
IL
,
or CE
2
=V
IL
.
12. The internal write time of the memory is defined by the overlap of CE
1
LOW, CE
2
HIGH and WE LOW. CE
1
and WE must be LOW and CE
2
must be HIGH
to initiate write. A write can be terminated by CE
1
or WE going HIGH or CE
2
going LOW. The data input set-up and hold timing should be referenced to the
rising edge of the signal that terminates the write.
13. During this period, the I/Os are in the output state and input signals should not be applied.
ADDRESS
DATA OUT PREVIOUS DATA VALID
DATA VALID
t
RC
t
AA
t
OHA
C185–6
Read Cycle No.1
[9,10]
50%
50%
DATA VALID
t
RC
t
ACE
t
DOE
t
LZOE
t
LZCE
t
PU
HIGH IMPEDANCE
IMPEDANCE
ICC
ISB
t
HZOE
t
HZCE
t
PD
OE
HIGH
DATA OUT
V
CC
SUPPLY
CURRENT
CE
1
OE
CE
2
C185–7
Read Cycle No.2
[11,12]
C185–8
t
HD
t
SD
t
PWE
t
SA
t
HA
t
AW
t
WC
t
HZOE
DATA
IN
VALID
CE
CE
1
OE
WE
CE
2
DATA I/O
t
SCEI
t
SCE2
ADDRESS
NOTE 13
[10,12]
Write Cycle No. 1 (WE Controlled)
CY7C185
6
Notes:
14. The minimum write cycle time for write cycle #3 (WE
controlled, OE LOW) is the sum of t
HZWE
and t
SD
.
15. If CE
1
goes HIGH or CE
2
goes LOW simultaneously with WE HIGH, the output remains in a high-impedance state.
Switching Waveforms
(continued)
t
WC
t
AW
t
SA
t
HA
t
HD
t
SD
t
SCE1
WE
DATA I/O
ADDRESS
CE
1
C185–9
DATA
IN
VALID
t
SCE2
CE
2
W
rite Cycle No. 2 (CE Controlled)
[12,13,14]
t
HD
t
SD
t
LZWE
t
SA
t
HA
t
AW
t
WC
t
HZWE
C185–10
DATA
IN
VALID
t
SCE1
t
SCE2
CE
1
CE
2
ADDRESS
DATA I/O
WE
Write Cycle No. 3 (WE Controlled, OE LOW)
[12,13,14,15]
NOTE 13
CY7C185
7
Typical DC and AC Characteristics
–55 25 125
1.2
1.0
0.8
OUTPUT SOURCE CURRENT (mA)
AMBIENT TEMPERATURE (
°
C)
0.6
0.4
0.2
0.0
NORMALIZED I , I
CC
I
SB
V
CC
=5.0V
V
IN
=5.0V
I
CC
SB
1.2
1.4
1.0
0.6
0.4
0.2
4.0 4.5 5.0 5.5 6.0
1.6
1.4
1.2
1.0
0.8
–55 25 125
NORMALIZED t
AA
120
100
80
60
40
20
0.0 1.0 2.0 3.0 4.0
SUPPLY VOLTAGE (V)
NORMALIZED SUPPLY CURRENT
vs. SUPPLY VOLTAGE
NORMALIZED ACCESS TIME
vs. AMBIENT TEMPERATURE
AMBIENT TEMPERATURE (
°
C)
NORMALIZED SUPPLY CURRENT
vs. AMBIENT TEMPERATURE
OUTPUT VOLTAGE (V)
OUTPUT SOURCE CURRENT
vs. OUTPUT
VOLTAGE
0.0
0.8
1.4
1.3
1.2
1.1
1.0
0.9
4.0 4.5 5.0 5.5 6.0
NORMALIZED t
AA
SUPPLY VOLTAGE (V)
NORMALIZED ACCESS TIME
vs. SUPPLY
VOLTAGE
120
140
100
60
40
20
0.0 1.0 2.0 3.0 4.0
OUTPUT SINK CURRENT (mA)
0
80
OUTPUT VOLTAGE (V)
OUTPUT SINK CURRENT
vs. OUTPUT VOLTAGE
NORMALIZED I , I
CC SB
I
CC
V
CC
=5.0V
V
CC
=5.0V
T
A
=25
°
C
V
CC
=5.0V
T
A
=25
°
C
I
SB
T
A
=25
°
C
0.6
0.8
0
3.0
2.5
2.0
1.5
1.0
0.5
0.0 1.0 2.0 3.0 4.0
NORMALIZED I
PO
SUPPLY VOLTAGE (V)
TYPICAL POWER-ON CURRENT
vs. SUPPLY
VOLTAGE
30.0
25.0
20.0
15.0
10.0
5.0
0 200 400 600 800
DELTA t (ns)
AA
CAPACITANCE (pF)
TYPICAL ACCESS TIME CHANGE
vs. OUTPUT
LOADING
1.25
1.00
0.75
10 20 30 40
NORMALIZED I
CC
CYCLE FREQUENCY (MHz)
NORMALIZED I
CC
vs. CYCLE TIME
0.0
5.0
0.0
1000
0.50
V
CC
=4.5V
T
A
=25
°
C
V
CC
=5.0V
T
A
=25
°
C
V
CC
=0.5V
CY7C185
8
Document #: 38–00037–K
Truth Table
CE
1
CE
2
WE OE Input/Output Mode
H X X X High Z Deselect/Power-Down
X L X X High Z Deselect/Power-Down
L H H L Data Out Read
L H L X Data In Write
L H H H High Z Deselect
Address Designators
Address
Name
Address
Function
Pin
Number
A4 X3 2
A5 X4 3
A6 X5 4
A7 X6 5
A8 X7 6
A9 Y1 7
A10 Y4 8
A11 Y3 9
A12 Y0 10
A0 Y2 21
A1 X0 23
A2 X1 24
A3 X2 25
Ordering Information
Speed
(ns)
Ordering Code
Package
Name
Package Type
Operating
Range
15 CY7C185–15PC P21 28-Lead (300-Mil) Molded DIP Commercial
CY7C185–15SC S21 28-Lead Molded SOIC
CY7C185–15VC V21 28-Lead Molded SOJ
CY7C185–15VI V21 28-Lead Molded SOJ Industrial
20 CY7C185–20PC P21 28-Lead (300-Mil) Molded DIP Commercial
CY7C185–20SC S21 28-Lead Molded SOIC
CY7C185–20VC V21 28-Lead Molded SOJ
CY7C185–20VI V21 28-Lead Molded SOJ Industrial
25 CY7C185–25PC P21 28-Lead (300-Mil) Molded DIP Commercial
CY7C185–25SC S21 28-Lead Molded SOIC
CY7C185–25VC V21 28-Lead Molded SOJ
CY7C185–25VI V21 28-Lead Molded SOJ Industrial
35 CY7C185–35PC P21 28-Lead (300-Mil) Molded DIP Commercial
CY7C185–35SC S21 28-Lead Molded SOIC
CY7C185–35VC V21 28-Lead Molded SOJ
CY7C185–35VI V21 28-Lead Molded SOJ Industrial
CY7C185
9
Package Diagrams
51-85014-B
28-Lead(300-Mil) MoldedDIP P21
28-Lead(300-Mil) Molded SOIC S21
51-85026-A
CY7C185
© Cypress Semiconductor Corporation, 1998. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
Package Diagrams
(continued)
28-Lead (300-Mil) Molded SOJ V21
51-85031-B
/
