Intel Desktop Board D925XCV/D925XBC Technical Product Specification
Figures
1. Desktop Board D925XCV Components ....................................................................... 14
2. Desktop Board D925XBC Components ....................................................................... 16
3. Block Diagram.............................................................................................................. 18
4. Memory Channel and DIMM Configuration.................................................................. 21
5. Dual Channel (Interleaved) Mode Configuration with Two DIMMs .............................. 22
6. Dual Channel (Interleaved) Mode Configuration with Three DIMMs............................ 22
7. Dual Channel (Interleaved) Mode Configuration with Four DIMMs.............................. 23
8. Single Channel (Asymmetric) Mode Configuration with One DIMM............................. 24
9. Single Channel (Asymmetric) Mode Configuration with Three DIMMs ........................24
10. Front/Back Panel Audio Connector Options for 8-Channel (7.1) Audio Subsystem .... 32
11. 8-channel (7.1) Audio Subsystem Block Diagram........................................................ 33
12. Front/Back Panel Audio Connector Options for 6-Channel (5.1) Audio Subsystem .... 34
13. 6-Channel (5.1) Audio Subsystem Block Diagram....................................................... 34
14. LAN Connector LED Locations .................................................................................... 35
15. Thermal Monitoring for D925XCV Board .....................................................................38
16. Thermal Monitoring for D925XBC Board .....................................................................39
17. Location of the Standby Power Indicator LED on the D925XCV Board....................... 46
18. Detailed System Memory Address Map....................................................................... 56
19. Back Panel Connectors for 8-Channel (7.1) Audio Subsystem ................................... 64
20. Back Panel Connectors for 6-Channel (5.1) Audio Subsystem ................................... 66
21. D925XCV Component-side Connectors ...................................................................... 68
22. D925XBC Component-side Connectors ...................................................................... 70
23. Connection Diagram for Front Panel Connector .......................................................... 77
24. Connection Diagram for Front Panel USB Connectors................................................ 78
25. Connection Diagram for IEEE 1394a Connectors........................................................ 79
26. Location of the Jumper Block....................................................................................... 80
27. Desktop Board D925XCV Dimensions......................................................................... 81
28. Desktop Board D925XBC Dimensions......................................................................... 82
29. I/O Shield Dimensions for Boards with the 8-Channel (7.1) Audio Subsystem............ 83
30. I/O Shield Dimensions for Boards with the 6-Channel (5.1) Audio Subsystem............ 84
31. Processor Heatsink for Omni-directional Airflow.......................................................... 87
32. Localized High Temperature Zones ............................................................................. 88
Tables
1. Summary of Board Differences .................................................................................... 11
2. Feature Summary ........................................................................................................12
3. Manufacturing Options ................................................................................................. 13
4. D925XCV Components Shown in Figure 1.................................................................. 15
5. D925XBC Components Shown in Figure 2.................................................................. 17
6. Supported Memory Configurations ..............................................................................20
7. LAN Connector LED States .........................................................................................35
8. Effects of Pressing the Power Switch .......................................................................... 41
9. Power States and Targeted System Power ................................................................. 42
10. Wake-up Devices and Events ...................................................................................... 43
11. System Memory Map ................................................................................................... 57
12. DMA Channels ............................................................................................................. 57
13. I/O Map ........................................................................................................................ 58
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