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Contents
1 INTRODUCTION ..................................................................... 1
1.1 OVERVIEW ................................................................................................................... 1
1.2 KEY FEATURES ............................................................................................................. 2
1.3 INTERFACE ................................................................................................................... 3
2 PRODUCT INSTALLATION ..................................................... 3
2.1 INSTALLATION PREPARATION ........................................................................................ 3
2.2 HARDWARE INSTALLATION ............................................................................................ 4
3 TECHNICAL SPECIFICATIONS ................................................ 6
3.1 ELECTRICAL SPECIFICATIONS ......................................................................................... 6
3.2 OPERATION CONDITION................................................................................................. 6
3.3 DIMENSIONS ................................................................................................................ 6
3.4 PIN DEFINITION(TOP VIEW) ...................................................................................... 7
3.5 PCB PACKAGING ......................................................................................................... 8
4 HARDWARE DESIGN .............................................................. 9
4.1 DESIGN IN CONSIDERATIONS ......................................................................................... 9
4.2 AVOID POWER CONNECTION ........................................................................................ 10
4.3 ANTENNA .................................................................................................................. 10
4.4 SERIAL PORT ............................................................................................................. 11
5 DISASSEMBLY .................................................................... 11
6 PACKAGE ............................................................................ 12
6.1 PRODUCT LABEL DESCRIPTION .................................................................................... 12
6.2 PACKAGE DESCRIPTION .............................................................................................. 12
7 CLEAN ................................................................................. 14
8 REFLOW SOLDERING ........................................................... 14