Asus P735 User manual

CSC Lv3Lv4 Repair Manual

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ASUS P735 Service Manual

CSC Lv3Lv4 Repair Manual

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Index

1.OVERVIEW ..........................................................................................................................5

1.2

T

EST STATION ARRANGEMENT IN

F

ACTORY AND

CSC........................................................5

2.CONFIGURAOR TOOL IN CSC .......................................................................................6

2.1

ASUS

R

ELEASE

W

AY FOR

CSC

C

ONFIGURATOR

T

OOL

......................................................6

2.4

T

OOL

’

S

I

NPUT AND

O

UTPUT FILE

.......................................................................................9

3.MAPPING TABLE IMPLEMENT ...................................................................................10

4.FIELD OF XML FILE EXPLANATION ......................................................................... 11

5.SIM LOCK PROCESS.......................................................................................................12

6.BASEBAND REPAIR ABSTRACT: .................................................................................13

7.INTRODUCTION...............................................................................................................13

8.1SPECIFICAITONS.........................................................................................................13

8.2

ID

C

ONCEPT

....................................................................................................................14

9.TEST SET AND TOOL ......................................................................................................14

9.1

P

OWER

S

UPPLY

...............................................................................................................14

9.2

O

SCILLOSCOPE

................................................................................................................15

9.3

M

ICROSCOPE

................................................................................................................15

9.4

O

THER

ME

T

OOL

..........................................................................................................15

9.5

P735

C

HARGER

.............................................................................................................16

10.PCBA OUTLOOK ............................................................................................................17

10.1

PCBA-

TOP

SIDE

........................................................................................................17

10.2

PCBA-

B

OTTOM SIDE

..................................................................................................18

11. UNDERFILL REWORK NOTICE ................................................................................19

11.1

S

COPE

: ..........................................................................................................................19

11.2

N

ECESSARY TOOL AND EQUIPMENT

： .........................................................................19

11.3

W

ORK METHOD

：.......................................................................................................19

11.4

P

RECAUTIONS

: ............................................................................................................20

11.5

U

NDER FILL

C

HIPS

L

OCATION

.....................................................................................20

12. P735 BLOCK DIAGRAM...............................................................................................21

13. P735 PRACTICAL REPAIRING FLOW DIAGRAM:................................................22

14. P735 REPAIR NOTICE PART :.....................................................................................23

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14.1

SR

N

OTICE

L

IST

............................................................................................................23

14.2

ER1

N

OTICE

L

IST

..........................................................................................................23

14.3

ER2

N

OTICE

L

IST

..........................................................................................................24

15 TROUBLESHOOTING ...................................................................................................25

15.1

D

EBUG PROCESS

............................................................................................................25

15.2

R

EPAIR

C

ASE

.................................................................................................................26

S

YSTEM FAIL TO BOOT UP

......................................................................................................26

N

O BOOT

: ..............................................................................................................................26

LCD

P

ROBLEM

: ....................................................................................................................28

AUDIO.................................................................................................................................29

Receiver no sound ............................................................................................................29

Speaker no sound .............................................................................................................29

MIC no sound...................................................................................................................29

Fail to record ...................................................................................................................30

BLUE

TOOTH

ABNORMAL

..................................................................................................30

KEYPAD

ABNORMAL

...........................................................................................................30

SIDE KEY.........................................................................................................................30

Key pad FPC....................................................................................................................30

C

AMERA ABNORMAL

.............................................................................................................30

2M CAMERA no preview .................................................................................................30

Preview abnormal ............................................................................................................30

16. TROUBLE SHOOTING:................................................................................................31

16.1

Q

WERTY

K

EYPAD PROBLEM

: .........................................................................................31

16.2

M

ICRO

-SD

CARD PROBLEM

:..........................................................................................32

16.3

C

AMERA PROBLEM

:.......................................................................................................33

16.4

BT

PROBLEM

:................................................................................................................33

16.5

SIM

CARD PROBLEM

: ....................................................................................................34

16.6

A

UDIO PROBLEM

: ..........................................................................................................34

16.7

USB

PROBLEM

: .............................................................................................................36

16.8

S

WITCH CONNECTOR PROBLEM

: ....................................................................................37

16.9

V

IBRATOR PROBLEM

:.....................................................................................................37

17.POWER CONSUMPTION TEST...................................................................................38

17.1

E

NVIRONMENT

S

ETTING

................................................................................................38

17.2

D

EEP

S

LEEP

M

ODE

........................................................................................................38

17.3

S

TANDBY

M

ODE

/S

LEEP

M

ODE

......................................................................................39

17.4

C

HARGING

C

URRENT

T

EST

............................................................................................42

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18. RF REPAIR SW & HW REQUIREMENT ...................................................................45

18.1

SW：............................................................................................................................45

18.2

HW： ...........................................................................................................................45

18.3

E

QUIPMENT

：...............................................................................................................45

19. P735 RF BLOCK DIAGRAM ........................................................................................46

19.1

S

YSTEM

B

LOCK

D

IAGRAM

............................................................................................46

19.2

GSM/GPRS

–

GSM

RFMD

P

OLARIS

I

B

LOCK

D

IAGRAM

............................................47

19.3

WCDMA

–

M

AXIM

3G

B

LOCK

D

IAGRAM

....................................................................48

19.4

B

LUETOOTH

–

CSR

BC04

B

LOCK

D

IAGRAM

................................................................49

20. RF CIRCUIT TEST POINTS LOCATION...................................................................50

20.1

B

ACKSIDE

A

NTENNA

A

REA

T

EST

P

OINTS

......................................................................50

20.2

GSM/GPRS

T

EST

P

OINTS

.............................................................................................50

20.3 WCDMA TEST POINTS ..............................................................................................52

21. GSM & WCDMA RF TX/RX PATH..............................................................................53

21.1

GSM

T

X PATH

...............................................................................................................53

21.2

GSM

R

X PATH

...............................................................................................................53

21.3

WCDMA

T

X PATH

........................................................................................................54

21.4

WCDMA

R

X PATH

........................................................................................................54

22. RF TEST & REPAIR FLOW CHART ..........................................................................55

22.1.

C

ONDUCTIVE

&

A

NTENNA

T

EST

P

ROCEDURE

..............................................................55

22.3

WCDMA

T

EST

&

R

EPAIR

P

ROCEDURE

.........................................................................57

22.4

B

LUETOOTH

T

EST

&

R

EPAIR

P

ROCEDURE

.....................................................................59

23. TEST POINTS SIGNAL EXAMPLES ..........................................................................60

23.1

GSM900 .......................................................................................................................60

23.2

DCS1800......................................................................................................................63

23.3

PCS1900.......................................................................................................................66

23.4

WCDMA ......................................................................................................................69

23.5

B

LUETOOTH

..................................................................................................................75

24. APPENDIX .......................................................................................................................80

24.1

T

YPICAL

V

ALUE OF

GSM/GPRS

C

ONDUCTIVE

T

X

/

R

X

T

EST

.......................................80

24.2

T

YPICAL

V

ALUE OF

WCDMA

C

ONDUCTIVE

T

X

/R

X

T

EST

.............................................80

24.4

R

X

T

EST

E

NVIRONMENT

S

ETUP

.....................................................................................82

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6.BaseBand Repair Abstract:

For the training, the document mainly describes how to repair P735 if main board was

damaged. Another topic focuses on EPE bug list from SR to DVT according to every run of

repairing experience.

7.Introduction

P735 WCDMA/GSM PDA phone

8.1SPECIFICAITONS

•Frequency Band: –GSM: Tri-band operation in GSM 900/1800/1900 networks

–UMTS: 3GPP Band •UE Class:

–GSM: Class B, Multi-slot Class 10

–WCDMA: 384 kbps Class (UL/DL 384k)

•Operation System: Microsoft Windows Mobile 6.0 OS

•3G RF/BB: Intel Hermon + Dual mode RF+AFE+PA

CPU: Marvelll PXA270 520 MHz

•Memory: 256MB Flash, 64 MB SDRAM

•Extended Memory: mini-SD Card

•Antenna: Build-in solution

•Bluetooth: Bluetooth V2.0 spec. Class 2

•3GPP Video Streaming and Video Telephony

•Messaging: SMS, MMS

•WAP2.0

•JAVA: MIDP2.0, JSR184, Etc•

•LCM: Main: 2.8” Toppoly 320*RGB*240 TFT(65K) include Touch Screen

•Dual Camera: 2.0M pixels with auto focus and VGA

•Connective: Bluetooth / USB1.1 (Client and Host) / mini-SD

•Audio: Speaker/ MIC/ Receiver

•Battery: Maxell 1300 mAh

3G 2M camera WM6.0

Bar type

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8.2 ID Concept

9.Test Set and Tool

9.1 Power Supply

MOTECH programmable DC power Supply or equivalence *1

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9.2 Oscilloscope

Tektrniox TDS5054B Digital Phosphor Oscilloscope or equivalence *1

( Bandwidth 200MHz )

9.3 Microscope

(10X,40X)

9.4 Other ME Tool

(Plastic wrench ,Screwdriver T5 and #00)

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9.5 P735 Charger

The default charger adaptor for P735 is TAMURA PACIFIC JSP050090UC.

Meanwhile, P735 support USB charging with 500mA.

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10.PCBA Outlook

10.1 PCBA- TOP side

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10.2 PCBA- Bottom side

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11. Underfill Rework Notice

Purpose：

Set up the underfill rework role, guarantee the quality that FAE repairs.

11.1 Scope:

Personnel that all is maintained and the reworked is correlated with

11.2 Necessary tool and equipment：

：：

：

5.2.1 Iron：16-T00531807（SD-80）

5.2.2 Iron-head：16GPFT008046

5.2.3 Hot Air Gun：20-T004A3002

5.2.4 Solder Measurement device：16-000603100

5.2.5 Solder-wire：16GSST012011 （Lead free (T=0.6MM)）

5.2.6 Flux：16GPCT001010 （α Lead free EF-8000）

5.2.7 Cleaner：16GPCT020053 （IC-TS00）

5.2.8 Cotton

：

16-T00380809

（

315MM*10.5M

）

5.2.9 Solder paste

：

16GPCT022057 ( PF601)

11.3 Work method：

：：

：

5.3.1 It must last 8 hours to toast PCB board by 125 degrees Centigrade before the

rework of underfill

。

5.3.2 Use the hot air gun to invite 10cm distance above the part and set up and heat

time as 20sec, use the tweezers to remove glueing in the white glue part of BGA.

5.3.3 Use BGA machine to remove the underfill part, the temperature is set up to 255

degrees, use the tweezers to remove component in the 10 sec lastly.

。

5.3.4 Use Iron and soldering paste to clean incomplete glue and soldering ball of PCB

PAD.

5.3.5 Remove incomplete glue and soldering ball of PCB, add the tin once again by

PCB PAD part, and visual have incomplete glue.

5.3.6 Whether it is intact and damaging to examine PCB PAD in item after using the

sanitizer to polish PCB PAD clean.

5.3.7 Use the soldering paste to daub on PCB PAD, put the new part and rework.

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11.4 Precautions:

5.4.1 Before cleaning the glue movements, confirm whether the Iron temperature knob

pointed to "390 degrees Centigrade " scale.

5.4.2 Before cleaning the glue movements, really implement the ESD.

5.4.3 After using the cleaner to polish, and then observe the part and around have PU

incomplete glue.

5.4.4 While changing the part, there is a apt part damaged around to find the part , use

and defend.the sticky tape to protect, prevent the part from being destroyed.

11.5 Under fill Chips Location

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12. P735 Block Diagram

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13. P735 practical repairing flow diagram:

Boot?

Inspect consumed

current?

No

Yes

0 ~ 100mA:

Inspect power on

sequence

If the peripheral

devices are fail,

please follow

trouble shooting

guide line to debug.

100 ~200mA:

Inspect hermon

interface (MSL) or

other damarged

peripheral chips

200~230mA:

Inspect crystal of

hermon and cpu or

cs(chip select)

No

Yes

START

STOP

1.prepare tools

2.set

voltage:3.8~4.2

V

3.set limited

current:2A

Run diagnosis

program

Show logo and

boot OS display

No

Yes

Run next test item

Yes

No

Over 300mA:

Inspect whether

PMU or peripheral

chip is leakage

current or not?

Yes

No

Yes

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14. P735 Repair Notice Part :

14.1 SR Notice List

Station Problem

Symptom

Preliminary

Analysis

Root Cause Remark

SYS

MMI

Can not

preview form

camera

function.

Connector is

damaged or data

bus solders fail.

Connector is damaged by

operation problem to

cause preview fail.

SYS

MMI

SIM card fail SIM Connector

is damaged or

data bus pin fail.

can't build network lock,

so SIM card detect fail

SYS

MMI

No boot U1(CPU) or

(U20)PMU fail

SMT issue.(solder ball of

U1 is short circuit)

14.2 ER1 Notice List

Station Problem

Symptom

Preliminary

Analysis

Root Cause Remark

Board

level

MMI

MIC no

function

U19(codec) fail Solder ball of U19 is

short circuit to cause

MIC no function.

SYS

MMI

Can't not

preview

CMOS

PLL function of

CMOS fail, so it

can not preview

Walton camera module

fails (PLL). (camera

issue)

SYS LCD abnormal Topply LCD Modify SW image for

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MMI display, 2mm

line

timing problem LCD timing.

SYS

MMI

LCD White

screen

LCD panel is fail

LCD is damaged in left

below side as shown

in report

SYS

MMI

LCD white fail

1.LCD backlight

not uniform, send

to vendor for

analysis

2. From vendor

analysis, the

mura was caused

by the assembly

issue of the B/L.

Toppoly LCD issue

14.3 ER2 Notice List

Station Problem

Symptom

Preliminary

Analysis

Root Cause Remark

Board

level

MMI

Sleep mode

current fail

CE3(RTC) is short

circuit, so it cause

leakage current in

standby mode

SMT issue

Board

level

MMI

Sleep mode

current fail

OS can not suspend

resume to cause

sleep mode current

fail.

U1(CPU) issue

Board

level

MMI

Sleep mode

current fail

leakage current is

from U20(PMU) to

cause charge fail

U20(PMU) issue.

Board

level

MMI

Earphone_L

FREQ FAIL

Audio amplify L

path fail cause to

earphone L freq no

sound

U14(audio amp.)

issue

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15 Troubleshooting

15.1 Debug process

No

YES

Yes

Inspect PCBA

(any chip or mechanical

component damaged ?)

Inspect consumed

current

Run diagnosis app.

Pass all test items?

Repair O.K

Current abnormal

Rework

Damaged Component

Fail

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15.2 Repair Case

System fail to boot up

1. if consumed current is zero，inspect battery connector if normal。

2. if consumed current is above normal (300~500mA)，touch and feel any chip if

getting heat abnormally。

3. If consumed current is increasing to 180mA, and while after, become zero. It often

means Bulverde abnormal, check Bulverde first if solder crack, chip

damaged, X’tal abnormal (32.768KHz and 13 MHz) and etc.

4. If system hangs at the following display, it often means Hermon abnormal.

Sometimes, it caused by PMIC ADC error, therefore, cause HW version

detection error.

5. If current going down suddenly to 0 mA while booting

a. Inspect power domain and clock of Bulverde and Hermon。

b. Inspect Bulverde power on sequence, clarify CPU side problem or

PMIC side problem。

No boot:

1.

Inspect power on timing of CPU and PMU as show in Pig.3 and Pig. 4, if the current = 0

mA.

2.

Inspect PMU power domain such as LDO and Buck voltage, if the current = 40 ~ 60mA.

3.

Inspect hermon interface, if the current = 100 ~ 200mA

4.

Inspect crystal of hermon and CPU or CS (Chip Select) from flash memory, if the current

= 200 ~ 230mA.

5.

If the consumed current is over 300mA, please check PMU, peripheral device and other

chip.

Bulverde power on sequence and timing

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Hermon power on sequence and timing

Sys_EN C224 PWR_EN D30 nReset TP71

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LCD Problem:

1.

Inspect LCD connector and power on signals, which are LCD_VDD (R49.1) and

nLCD_RST (R49.2), as shown in Pig 5-1, if panel can not monitor.

2.

Inspect PCLK (C80.2) signal of CPU as shown in Pig.5-2, if panel appear white monitor.

3.

Inspect FCLK (C779.2)signal of CPU as shown in of Pig.5-2, if panel appear horizontal

line.

4.

Inspect LCLK (C780.2)signal of CPU as shown in of Pig.5-2, if panel appear shift

monitor.

5.

Inspect LCD back light driver as shown in Pig.5-3, if panel can not drive back light.

Pig.5-1 61 pin of LCD connector and power domain located in P735 bottom side

Pig.5-2 PCLK, FCLK and LCLK

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