Gigabyte H223-S10 User manual

Category
Servers
Type
User manual
H223-S10-AAP1
High Density Server - 4th/5th Gen Intel® Xeon® Scalable
2U 3-Node UP 6-Bay E1.S Gen4 NVMe
User Manual
Rev. 1.0
Copyright
© 2024 Giga Computing Technology CO., LTD. All rights reserved.
The trademarks mentioned in this manual are legally registered to their respective owners.
Disclaimer
Information in this manual is protected by copyright laws and is the property of Giga Computing.
Changes to the specications and features in this manual may be made by Giga Computing
without prior notice. No part of this manual may be reproduced, copied, translated, transmitted, or
published in any form or by any means without Giga Computing's prior written permission.
Documentation Classications
In order to assist in the use of this product, Giga Computing provides the following types of documen-
tation:
User Manual: detailed information & steps about the installation, conguration and use of this
product (e.g. motherboard, server barebones), covering hardware and BIOS.

User Guide: detailed information about the installation & use of an add-on hardware or
software component (e.g. BMC rmware, rail-kit) compatible with this product.
Quick Installation Guide: a short guide with visual diagrams that you can reference easily for
installation purposes of this product (e.g. motherboard, server barebones).
Please see the support section of the online product page to check the current availability of these
documents.
For More Information
For related product specications, the latest rmware and software, and other information please visit our website at
http://www.gigabyte.com/Enterprise
For GIGABYTE distributors and resellers, additional sales & marketing materials are available from our reseller
portal: http://reseller.b2b.gigabyte.com
For further technical assistance, please contact your GIGABYTE representative or visit
https://esupport.gigabyte.com/ to create a new support ticket
For any general sales or marketing enquiries, you may also message GIGABYTE server directly by email:
Conventions
The following conventions are used in this user's guide:
NOTE!
Pieces of additional
information related to the current topic.
CAUTION!
Precautionary measures to
avoid possible hardware or software problems.
WARNING!
Alerts to any damage that might
result from doing or not doing specic actions.
Server Warnings and Cautions
Before installing a server, be sure that you understand the following warnings and cautions.
WARNING!
To reduce the risk of electric shock or damage to the equipment:
Do not disable the power cord grounding plug. The grounding plug is an important safety
feature.
Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all
times.
Unplug the power cord from the power supply to disconnect power to the equipment.
Do not route the power cord where it can be walked on or pinched by items placed against it.
Pay particular attention to the plug, electrical outlet, and the point where the cord extends from
the server.
WARNING!
To reduce the risk of personal injury from hot surfaces, allow the drives and the internal
system components to cool before touching them.
WARNING!
This server is equipped with high speed fans. Keep away from hazardous moving fan
blades during servicing.
CAUTION!
Do not operate the server for long periods with the access panel open or removed. Operat-
ing the server in this manner results in improper airow and improper cooling that can lead to
thermal damage.
Danger of explosion if battery is incorrectly replaced.
Replace battery with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
CAUTION!
Risk of explosion if battery is replaced incorrectly or with an incorrect type. Replace the battery
only with the same or equivalent type recommended by the manufacturer. Dispose of used bat-
teries according to the manufacturer’s instructions.
Electrostatic Discharge (ESD)
CAUTION!
ESD CAN DAMAGE DRIVES, BOARDS, AND OTHER PARTS. WE RECOMMEND THAT YOU
PERFORM ALL PROCEDURES AT AN ESD WORKSTATION. IF ONE IS NOT AVAILABLE,
PROVIDE SOME ESD PROTECTION BY WEARING AN ANTI-STATIC WRIST STRAP AT-
TACHED TO CHASSIS GROUND -- ANY UNPAINTED METAL SURFACE -- ON YOUR SERVER
WHEN HANDLING PARTS.
Always handle boards carefully, they can be extremely sensitive to ESD. Hold boards only by
their edges without touching any components or connectors. After removing a board from its
protective ESD bag or from the system, place the board component side up on a grounded, static
free surface. Use a conductive foam pad if available but not the ESD bag. Do not slide the board
over any surface.
System power on/off: To service components within the server, please ensure the power has
been disconnected.
e.g. Remove the node from the server chassis (to disconnect power) or disconnect the power
from the server chassis.
Make sure the system is removed from the rack before opening the chassis, adding, or removing
any non hot-plug components.
Hazardous conditions, devices and cables: Hazardous electrical conditions may be present
on power, telephone, and communication cables. Turn off the system chassis and disconnect the
cables attached to the system before servicing the chassis. Otherwise, personal injury or equip-
ment damage can result.
Electrostatic discharge (ESD) and ESD protection: ESD can damage drives, boards, and
other parts. We recommend that you perform all procedures in this chapter only at an ESD work-
station. If one is not available, provide some ESD protection by wearing an antistatic wrist strap
attached to chassis ground (any unpainted metal surface on the server) when handling parts.
ESD and handling boards: Always handle boards carefully. They can be extremely sensi-tive to
electrostatic discharge (ESD). Hold boards only by their edges. After removing a board from its
protective wrapper or from the system, place the board component side up on a grounded, static
free surface. Use a conductive foam pad if available but not the board wrapper. Do not slide
board over any surface.
Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over
two jumper pins. Some jumpers have a small tab on top that can be gripped with n-gertips or
with a pair of ne needle nosed pliers. If the jumpers do not have such a tab, take care when us-
ing needle nosed pliers to remove or install a jumper; grip the narrow sides of the jumper with the
pliers, never the wide sides. Gripping the wide sides can dam-age the contacts inside the jumper,
causing intermittent problems with the function con-trolled by that jumper. Take care to grip with,
but not squeeze, the pliers or other tool used to remove a jumper, or the pins on the board may
bend or break.
- 7 -
Table of Contents
Chapter 1 Hardware Installation .....................................................................................9
1-1 Installation Precautions .................................................................................... 9
1-2 Product Specications .................................................................................... 10
1-3 System Block Diagram ................................................................................... 14
Chapter 2 System Appearance .....................................................................................16
2-1 Front View ...................................................................................................... 16
2-2 Rear View ....................................................................................................... 16
2-3 Front Panel LED and Buttons ........................................................................ 17
2-4 RoT LEDs ....................................................................................................... 18
2-5 Front System LAN LEDs ................................................................................ 20
2-6 Power Supply Unit LED .................................................................................. 21
2-7 Storage LED ................................................................................................... 22
Chapter 3 System Hardware Installation ......................................................................23
3-1 Installing the EDSFF SSD .............................................................................. 24
3-2 Removing the Node ....................................................................................... 25
3-3 Removing Chassis Cover ............................................................................... 26
3-4 Removing and Installing the Fan Duct ........................................................... 27
3-5 Installing the CPU and Heat Sink ................................................................... 28
3-6 Installing Memory ........................................................................................... 30
3-6-1 Eight Channel Memory Conguration .....................................................................30
3-6-2 Installing the Memory ............................................................................................31
3-6-3 DIMM Population Table ..........................................................................................32
3-6-4 Processor and Memory Module Matrix Table .........................................................33
3-7 Installing the PCI Expansion Card ................................................................. 34
3-8 Installing the M.2 Device ................................................................................ 37
3-9 Installing the Mezzanine Card ........................................................................ 38
3-9-1 Installing the OCP 3.0 Mezzanine Card .................................................................38
3-10 Replacing the Fan Assembly .......................................................................... 39
3-11 Replacing the Power Supply .......................................................................... 40
3-12 Cable Routing ................................................................................................ 41
Chapter 4 Motherboard Components ...........................................................................44
4-1 Motherboard Components ............................................................................. 44
4-2 Jumper Setting .............................................................................................. 45
Chapter 5 BIOS Setup ..................................................................................................46
5-1 The Main Menu .............................................................................................. 48
- 8 -
5-2 Advanced Menu ............................................................................................. 51
5-2-1 Trusted Computing .................................................................................................52
5-2-2 Serial Port Console Redirection .............................................................................53
5-2-3 SIO Conguration ...................................................................................................56
5-2-4 PCI Subsystem Settings .........................................................................................57
5-2-5 USB Conguration ..................................................................................................58
5-2-6 Network Stack Conguration ..................................................................................59
5-2-7 Post Report Conguration ......................................................................................60
5-2-8 NVMe Conguration ...............................................................................................61
5-2-9 Chipset Conguration .............................................................................................62
5-2-10 Tls Auth Conguration ............................................................................................63
5-2-11 iSCSI Conguration ................................................................................................64
5-3 Chipset Menu ................................................................................................. 65
5-3-1 Processor Conguration .........................................................................................66
5-3-2 Common RefCode Conguration ...........................................................................69
5-3-3 UPI Conguration ...................................................................................................70
5-3-4 Memory Conguration ............................................................................................72
5-3-5 IIO Conguration ....................................................................................................75
5-3-6 Advanced Power Management Conguration ........................................................77
5-3-7 PCH Conguration ..................................................................................................79
5-3-8 Miscellaneous Conguration ..................................................................................81
5-3-9 Server ME Conguration ........................................................................................82
5-3-10 Runtime Error Logging Settings .............................................................................83
5-3-11 Power Policy ...........................................................................................................85
5-4 Server Management Menu ............................................................................. 87
5-4-1 System Event Log ..................................................................................................89
5-4-2 View FRU Information ............................................................................................90
5-4-3 BMC VLAN Conguration .......................................................................................91
5-4-4 BMC Network Conguration ...................................................................................92
5-4-5 IPv6 BMC Network Conguration ...........................................................................93
5-5 Security Menu ................................................................................................ 94
5-5-1 Secure Boot ...........................................................................................................95
5-6 Boot Menu ...................................................................................................... 98
5-7 Save & Exit Menu ......................................................................................... 100
5-8 BIOS Recovery ............................................................................................ 102
5-9 BIOS POST Beep code (AMI standard) ....................................................... 103
5-9-1 PEI Beep Codes ...................................................................................................103
5-9-2 DXE Beep Codes .................................................................................................103
- 9 -
Hardware Installation
1-1 Installation Precautions
The motherboard/system contain numerous delicate electronic circuits and components which
can become damaged as a result of electrostatic discharge (ESD). Prior to installation, carefully
read the user manual and follow these procedures:
Prior to installation, do not remove or break motherboard S/N (Serial Number) sticker or
warranty sticker provided by your dealer. These stickers are required for warranty validation.
Always remove the AC power by unplugging the power cord from the power outlet before
installing or removing the motherboard or other hardware components.
When connecting hardware components to the internal connectors on the motherboard,
make sure they are connected tightly and securely.
When handling the motherboard, avoid touching any metal leads or connectors.
It is best to wear an electrostatic discharge (ESD) wrist strap when handling electronic
components such as a motherboard, CPU or memory. If you do not have an ESD wrist
strap, keep your hands dry and rst touch a metal object to eliminate static electricity.
Prior to installing the motherboard, please have it on top of an antistatic pad or within an
electrostatic shielding container.
Before unplugging the power supply cable from the motherboard, make sure the power
supply has been turned off.
Before turning on the power, make sure the power supply voltage has been set according to
the local voltage standard.
Before using the product, please verify that all cables and power connectors of your
hardware components are connected.
To prevent damage to the motherboard, do not allow screws to come in contact with the
motherboard circuit or its components.
Make sure there are no leftover screws or metal components placed on the motherboard or
within the computer casing.
Do not place the computer system on an uneven surface
.
Do not place the computer system in a high-temperature environment.
Turning on the computer power during the installation process can lead to damage to
system components as well as physical harm to the user.
If you are uncertain about any installation steps or have a problem related to the use of the
product, please consult a certied computer technician.
Chapter 1 Hardware Installation
Hardware Installation
- 10 -
1-2 Product Specications
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
System
Dimension
2U 3-Node - Front access
447.8 (W) x 87.5 (H) x 500 (D) mm
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
CPU 5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Single processor per node
TDP up to 350W at ambient 35°C with 1 x PCIe slot occupied
TDP up to 350W at ambient 30°C with 2 x PCIe slots occupied
TDP up to 300W at ambient 35°C with 3 x PCIe slots occupied
TDP up to 300W at ambient 30°C with 4 x PCIe slots occupied
Please contact technical support for more details.
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
Socket Per Node:
1 x LGA 4677
Total:
3 x LGA 4677
Socket E
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
Chipset Intel® C741 Chipset
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
Memory Per Node:
8 x DIMM slots
Total:
DDR5 memory supported only
8-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
5th Gen Intel® Xeon®: Up to 5600MHz
4th Gen Intel® Xeo: Up to 4800MHz
Intel® Xeon® Max Series: Up to 4800MHz
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
LAN Total:
2 x CMC ports
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
Video Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
NOTE:
We reserve the right to make any changes to the product specications and product-related
information without prior notice.
- 11 -
Hardware Installation
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
Storage Per node:
2 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
Total:
6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
Expansion Slots Per node:
Riser Card CRSH02D:
2 x PCIe x16 (Gen5 x16) FHHL slots
Riser Card CRSH02E:
1 x PCIe x16 (Gen5 x16) low-prole slot
1 x PCIe x16 (Gen5 x8) low-prole slot
1 x M.2 slot (CFPH010):
M-key
SATA, from PCH
Supports 2242/2260/2280/22110 cards
Total:
Riser Card CRSH02D x 3:
6 x PCIe x16 (Gen5 x16) FHHL slots
Riser Card CRSH02E x 3:
3 x PCIe x16 (Gen5 x16) low-prole slots
3 x PCIe x16 (Gen5 x8) low-prole slots
3 x M.2 slots (CFPH010):
M-key
SATA, from PCH
Supports 2242/2260/2280/22110 cards
Hardware Installation
- 12 -
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
Internal I/O Per Node:
1 x TPM header
1 x VROC connector
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
Front I/O Per node:
1 x USB 3.2 Gen1 Type-C
1 x Mini-DP
1 x Power button with LED
1 x ID LED
1 x System status LED
Total:
3 x USB 3.2 Gen1 Type-C
3 x Mini-DP
3 x Power buttons with LED
3 x ID LEDs
3 x System status LEDs
2 x CMC ports
1 x CMC status LED
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
Backplane Board Speed and bandwidth:
PCIe Gen4 x4
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
TPM 1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
Power Supply 1+1 3000W 80 PLUS Titanium redundant power supplies
AC Input:
100-127V~/ 15.5A, 50-60Hz
200-220V~/ 15.5A, 50-60Hz
220-240V~/ 15.5A, 50-60Hz
DC Input:
240Vdc/ 15.5A
DC Output:
Max 1000W/ 100-127V~
+ 12.2V/ 81A
+ 12Vsb/ 3A
Max 2600W/ 200-220V~
+ 12.2V/ 213A
+ 12Vsb/ 3A
Max 3000W/ 220-240V~ or 240Vdc Input
+ 12.2V/ 245A
+ 12Vsb/ 3A
NOTE: The system power supply requires C19 type power cord
Hardware Installation
- 13 -
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
System
Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Prole
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Conguration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings
Socket
Socket
Security
Security Server Operating Properties
Power SupplySystem fan
Operating
Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
- 14 -
Hardware Installation
1-3 System Block Diagram
Please Go to Chapter 4 Motherboard Components for Riser Slot information.
USB3.2 Gen1
(Type-C)
8-Channel DDR5, 8 x DIMMs
Speed up to 5600MHz
PCIe
x
1
USB2.0
eSPI
USB3.0
Mini-DP
SPI 64MB
SPI 64MB
SPI 64MB
SPI 64MB
TPM
BMC
ASPEED
AST2600
MAC
PCIe5.0 x16
PCIe5.0 x8
PCIe5.0 x16 LP slot
PCIe5.0 x8 LP slot
Riser Card CRSH02E
PCIe5.0 x16
PCIe5.0 x16
PCIe5.0 x16 FHHL slot
PCIe5.0 x16 FHHL slot
Riser Card CRSH02D
PCIe5.0 x16
4 x MCIO
PCIe5.0 x16
4th/5th Gen Intel Xeon
Scalable processors
(LGA4677 Socket)
M.2
PCH
Intel C741
chipset
DMI3 x8
SATAIII
2-bay 9.5mm E1.S NVMe
LAN Hub CMC
- 16 -
System Appearance
Chapter 2 System Appearance
2-1 Front View
Please Go to Chapter 2-3 Front Panel LED and Buttons for detail description of function
LEDs.
12 3 4
6 7
5
NODE1 NODE2
NODE3
PSU1PSU2
SLOT4 SLOT3
SLOT1
SSD0
SSD1
SSD2
SSD3
SSD4
SSD5
SLOT2
FAN1FAN2FAN3FAN4
No. Decription
1. Server Management LAN Port
2. CMC Status LED
3. EDSFF E1.S SSD Bay
4. PCIe Card Slot
5. LEDs and Button
6. USB Type-C Port
7. Mini DP Port
2-2 Rear View
- 17 -
System Appearance
2-3 Front Panel LED and Buttons
No. Name Color Status Description
1. CMC Status
LED
Green On System is operating normally.
Amber
On
Critical condition, may indicates:
Power module failure
System fan failure
Power supply voltage issue
System temperature
Blink
Non-critical condition, may indicates:
Redundant power module failure
Temperature and voltage issue
2. System Status
LED(Note)
Green Solid On System is operating normally.
Amber
Solid On
Critical condition, may indicate:
System fan failure
System temperature
Blink
Non-critical condition, may indicate:
Redundant power module failure
Temperature and voltage issue
Chassis intrusion
N/A Off
System is not ready, may indicate:
POST error
NMI error
Processor or terminator missing
3. ID Button with
LED(Note)
Blue On System identication is active.
N/A Off System identication is disabled.
4. Power button
with LED
Green On System is powered on
Green Blink System is in ACPI S1 state (sleep mode)
N/A Off
System is not powered on or in ACPI S5 state (power
off)
System is in ACPI S4 state (hibernate mode)
(Note) If your server features RoT function, please see the following section for detail LED behavior.
3
4
2
1
System Appearance
- 18 -
2-4 RoT LEDs
Status LE
D
ID LED
LED on Front panel(Note5)
ID LED Status LED
EC Firmware (FW) Authentication fail or not exit
EC FW is broken or not exit (Note1) OFF OFF
Authenticating/Recovering BMC/BIOS Images
Authenticating Images OFF OFF
Recovering BMC Active Flash Blinks Blue
4 times per second
Blinks Green
4 times per second
Recovering BIOS Active Flash Blinks Blue
4 times per second
Blinks Amber
4 times per second
Authentication (AUTH) Pass
Recovering BIOS Active Flash OFF OFF
BMC : AUTH pass after doing recovery
BIOS : AUTH pass after doing recovery OFF OFF
BMC : AUTH pass after doing recovery
BIOS : AUTH pass OFF OFF
BMC : AUTH pass
BIOS : AUTH pass after doing recovery OFF OFF
Active Flash Authentication (AUTH) Fail
BMC : AUTH Fail(Note2) Blinks Blue
1 time per second
Blinks Green
1 time per second
BIOS : AUTH fail(Note2) Blinks Blue
1 time per second
Blinks Amber
1 time per second
- 19 -
System Appearance
BMC : AUTH fail after doing recovery(Note3)
Blinks Blue
2 times per second
[ON OFF OFF]
Blinks Green
2 times per second
[ON OFF OFF]
BIOS : AUTH fail after doing recovery(Note3)
Blinks Blue
2 times per second
[ON OFF OFF]
Blinks Amber
2 times per second
[ON OFF OFF]
Backup Flash Authentication Fail(Note4)
BMC : AUTH fail
Blinks Blue
2 times per second
[ON OFF ON OFF]
Blinks Green
2 times per second
[ON OFF ON OFF]
BIOS : AUTH fail
Blinks Blue
2 times per second
[ON OFF ON OFF]
Blinks Amber
2 times per second
[ON OFF ON OFF]
NOTE!
1. EC FW is broken or not exited result in Microchip CEC1702 cannot load EC FW for authentication.
2 CEC1702’s bootloader load EC FW from BMC Flash1 when AC on. It must authenticate this FW rstly
before run the FW. If the authenticate fail or not get the FW successfully, CEC1702 is not allowed to
execute this FW and ECSTS_LED1 on the MB is OFF state.
3. if active ash is still authentication failed after recovery sequence, Microchip CEC1702 stop the process
and showing LED behavior.
4. If backup flash authentication is failed cause by configuration table, public key or protected area is
broken. Microchip CEC1702 stop the process and showing LED behavior.
5. Front panel LED is controlled by BMC or Microchip CEC1702. Once Microchip CEC1702 is working(Auth
or recovery), the front panel LED is controlled by Microchip CEC1702 and vice versa.
System Appearance
- 20 -
2-5 Front System LAN LEDs
No. Name Color Status Description
1. 1GbE
Speed LED
Yellow On 1Gbps data rate
Green On 100 Mbps data rate
N/A Off 10 Mbps data rate
2.
1GbE
Link/
Activity LED
Green
On Link between system and
network or no access
Blink Data transmission or receiving is occurring
N/A Off No data transmission or receiving is occurring
1
2
1
2
System Appearance
- 21 -
State Description
OFF No AC power to all power supplies
1Hz Green Blinking AC present / only standby on / Cold redundant mode
2Hz Green Blinking Power supply rmware updating mode
Amber
AC cord unplugged or AC power lost; with a second
power supply in parallel still with AC input power
Power supply critical event causing shut down:
failure, OCP, OVP, fan failure and UVP
1Hz Amber Blinking
Power supply warning events where the
power supply continues to operate:
high temp, high power, high current and slow fan
2-6 Power Supply Unit LED
PSU LED
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Gigabyte H223-S10 User manual

Category
Servers
Type
User manual

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