KYOCERA 5861 Series User manual

Type
User manual

KYOCERA 5861 Series is a board-to-board connector with a 0.35mm pitch, designed to miniaturize outer dimensions for high-density mounting. It is suitable for applications requiring high-speed data transmission and low power consumption, such as smartphones, tablets, and other portable devices. The connector is also suitable for use in industrial automation, medical equipment, and automotive electronics. It offers reliable electrical performance, stable signal transmission, and excellent durability, making it ideal for use in harsh environments.

KYOCERA 5861 Series is a board-to-board connector with a 0.35mm pitch, designed to miniaturize outer dimensions for high-density mounting. It is suitable for applications requiring high-speed data transmission and low power consumption, such as smartphones, tablets, and other portable devices. The connector is also suitable for use in industrial automation, medical equipment, and automotive electronics. It offers reliable electrical performance, stable signal transmission, and excellent durability, making it ideal for use in harsh environments.

106-03-003 ๐Ÿ„ซ 2020 KYOCERA Corporation
No.
:
205-03-300
ๅ–ๆ‰ฑ่ชฌๆ˜Žๆ›ธ
INSTRUCTION MANUAL
5861
Series
0.35mm Pitch Board-to-Board Connector
D DCN20371 2020/04/07 K. Azuma H. Watanabe A. Tsunemura
C DCN-643 2017/06/29 K. Shiobara K. Yamane
O EDN-506 2015/10/27 K. Hirata K. Yamane
NO EDN/DCN DATE PREPARED by CHECKED by APPROVED by
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็›ฎๆฌก
TABLE OF CONTENTS
1. ๆฆ‚่ฆ OUTLINE ยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยท 2
2. ้ƒจๅ“ๅ็งฐใŠใ‚ˆใณๅž‹็•ช PART NAMES AND MODEL NUMBERS ยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยท 2
2-1. ้ƒจๅ“ๅ็งฐ PART NAMES ยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยท 2
2-2. ๅž‹็•ช MODEL NUMBERS ยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยท 3
3. ๅ–ใ‚Šๆ‰ฑใ„ไธŠใฎๆณจๆ„ PRECAUTIONS IN HANDLING ยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยท 4
3-1. ๅŸบๆฟๅฏพๅŸบๆฟๅตŒๅˆใงใฎไฝฟ็”จใซ้–ขใ—ใฆ USING FOR BOARD-TO-BOARD CONNECTION ยทยทยทยทยทยทยทยทยทยท 4
3-2. ๅŸบๆฟๅฏพ๏ผฆ๏ผฐ๏ผฃๅตŒๅˆใงใฎไฝฟ็”จใซ้–ขใ—ใฆ USING FOR BOARD-TO-FPC CONNECTION ยทยทยทยทยทยทยทยทยทยทยทยทยท 5
3-3. ๅฎŸ่ฃ…ใซ้–ขใ—ใฆ MOUNTING ยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยท 6
3-4. ๅตŒๅˆใซ้–ขใ—ใฆ ENGAGEMENT ยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยท 8
3-5. ใƒใ‚งใƒƒใ‚ซใƒผใซ้–ขใ—ใฆ CHECKER ยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยท 9
3-6. ๆดป็ทšๆŒฟๆŠœ้–ขใ—ใฆ HOT SWAP ยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยท 9
3-7. ใƒ—ใƒชใƒณใƒˆๅŸบๆฟใŠใ‚ˆใณใƒกใ‚ฟใƒซใƒžใ‚นใ‚ฏ้–‹ๅฃ้ƒจๆŽจๅฅจๅฏธๆณ•ใซ้–ขใ—ใฆ
PCB AND RECOMMENDED DIMENSIONS OF THE OPENING AREA IN THE METAL MASK ยทยท 10
3-8. ๆŽจๅฅจๅธ็€ใƒŽใ‚บใƒซๅฏธๆณ•ใซ้–ขใ—ใฆ
RECOMMENDED DIMENSIONS OF THE PICK-UP NOZZLE ยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยทยท 13
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1. ๆฆ‚่ฆ OUTLINE
ๆœฌ่ฃฝๅ“ 5861 ใ‚ทใƒชใƒผใ‚บใ‚ณใƒใ‚ฏใ‚ฟใฏใ€ๅธ‚ๅ ดใซใŠใ‘ใ‚‹้ซ˜ๅฏ†ๅบฆๅฎŸ่ฃ…ๅŒ–ใซๅฏพๅฟœใ™ในใ้–‹็™บใ•ใ‚ŒใŸใ€0.35mm ใƒ”ใƒƒใƒใฎ
ใƒœใƒผใƒ‰ใƒ„ใƒผใƒœใƒผใƒ‰ใ‚ณใƒใ‚ฏใ‚ฟใงใ™ใ€‚
Series 5861 connector is a board-to-board connector with 0.35mm pitch designed to miniaturize outer
dimension for high-density mounting.
2. ้ƒจๅ“ๅ็งฐใŠใ‚ˆใณๅž‹็•ช PART NAMES AND MODEL NUMBERS
2-1. ้ƒจๅ“ๅ็งฐ PART NAMES
(1) ใƒ—ใƒฉใ‚ฐ Plug
(2) ใƒชใ‚ปใƒ—ใ‚ฟใ‚ฏใƒซ Receptacle
ใ‚ณใƒณใ‚ฟใ‚ฏใƒˆ
Contact
ใ‚คใƒณใ‚ทใƒฅใƒฌใƒผใ‚ฟ
Insulator
ใ‚คใƒณใ‚ทใƒฅใƒฌใƒผใ‚ฟ
Insulator
ใ‚ณใƒณใ‚ฟใ‚ฏใƒˆ
Contact
ใ‚ณใƒณใ‚ฟใ‚ฏใƒˆ
Contact
ใ‚ขใƒณใ‚ซใƒผใƒ—ใƒฌใƒผใƒˆ
Anchor Plate
ใ‚ขใƒณใ‚ซใƒผใƒ—ใƒฌใƒผใƒˆ
Anchor Plate
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2-2. ๅž‹็•ช MODEL NUMBERS
(1) ใƒ—ใƒฉใ‚ฐ Plug
Plug : 14 5861 XXX 024 829 +
14 : Plug
ใ‚ทใƒชใƒผใ‚บ็•ชๅท Series Number
ๆฅตๆ•ฐ Number of Pos.
ใƒใƒชใ‚จใƒผใ‚ทใƒงใƒณ Variation
ใ‚ใฃใใ‚ณใƒผใƒ‰ Plating Code
้‰›ใƒ•ใƒชใƒผ Lead Free
(2) ใƒชใ‚ปใƒ—ใ‚ฟใ‚ฏใƒซ Receptacle
Rec. : 24 5861 XXX 004 829 +
24 : Rec.
ใ‚ทใƒชใƒผใ‚บ็•ชๅท Series Number
ๆฅตๆ•ฐ Number of Pos.
ใƒใƒชใ‚จใƒผใ‚ทใƒงใƒณ Variation
ใ‚ใฃใใ‚ณใƒผใƒ‰ Plating Code
้‰›ใƒ•ใƒชใƒผ Lead Free
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3. ๅ–ใ‚Šๆ‰ฑใ„ไธŠใฎๆณจๆ„ PRECAUTIONS IN HANDLING
3-1. ๅŸบๆฟๅฏพๅŸบๆฟๅตŒๅˆใงใฎไฝฟ็”จใซ้–ขใ—ใฆ USING FOR BOARD-TO-BOARD CONNECTION
(1) ๅŸบๆฟๅŒๅฃซใ‚’ใƒใ‚ธๆญขใ‚ใ—ใฆๅ›บๅฎšใ™ใ‚‹้š›ใฏใ€ใ‚ณใƒใ‚ฏใ‚ฟใƒผใ‚’ใญใ˜ใ‚‰ใชใ„ใ‚ˆใ†ใซใ”ๆณจๆ„ไธ‹ใ•ใ„ใ€‚ ๅŸบๆฟใ‚„
ใƒใ‚ธ็ฉด็ญ‰ใฎใƒใƒฉใคใใซใ‚ˆใ‚Šใ€ใ‚ณใƒใ‚ฏใ‚ฟใƒผใŒใญใ˜ใ‚‰ใ‚ŒใŸ็Šถๆ…‹ใงๅ›บๅฎšใ•ใ‚Œใ‚‹ๆใ‚ŒใŒใ‚ใ‚Šใพใ™ใ€‚
When the printed circuit boards on which connectors are mounted were fixed by using screw,
the mated connector could be twisted due to variations in dimensions of such as screw holes.
So great attention should be given not to twist connectors when fixing the boards.
(2) ใ‚ณใƒใ‚ฏใ‚ฟใƒผใŒๅŸบๆฟใซๅฏพใ—ใฆใ‚ปใƒณใ‚ฟใƒผใซๅฎŸ่ฃ…ใ•ใ‚Œใชใ„ๅ ดๅˆใ€ใ‚‚ใ—ใใฏๅคงใใ„ๅŸบๆฟๅŒๅฃซใฎๅตŒๅˆใฎๅ ดๅˆใซ
ๅตŒๅˆใŒๅ‚พใๆใ‚ŒใŒใ‚ใ‚Šใพใ™ใฎใงใ€ไธ‹ๅ›ณใฎใ‚ˆใ†ใชๅ‚พใ้˜ฒๆญข็”จใฎใ‚นใƒšใƒผใ‚ตใƒผใŠใ‚ˆใณๅตŒๅˆๆ–นๅ‘ใธใฎๆŠผใ•ใˆ
ใซใ‚ˆใ‚‹ๅ›บๅฎšใ‚’ใŠๅ‹งใ‚ใ—ใพใ™ใ€‚
When connectors are mounted off-center of the printed circuit board, or when the printed circuit
boards to be connected are rather large, mating may tilt. In order to avoid tilting, it is recommended
that the printed circuit boards are fixed by the spacer and something that generates a force to retain
the proper mated condition.
ๆŠผใ•ใˆ
Retaining Force
ใ‚นใƒšใƒผใ‚ตใƒผ
Spacer
ๅŸบๆฟ
PCB
ใƒใ‚ธ
Screw
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3-2. ๅŸบๆฟๅฏพ๏ผฆ๏ผฐ๏ผฃๅตŒๅˆใงใฎไฝฟ็”จใซ้–ขใ—ใฆ USING FOR BOARD-TO-FPC CONNECTION
(1)ใ‚ณใƒใ‚ฏใ‚ฟใ‚’ๆŒฟๆŠœใ™ใ‚‹้š›ใ€่ฃฝๅ“ใซ็›ดๆŽฅ่ฒ ่ทใŒใ‹ใ‹ใ‚‰ใชใ„ใ‚ˆใ†ใซ FPC ใฎ่ฃ้ขใซ่ฃœๅผทๆฟใ‚’่ฒผใ‚Šใคใ‘ใŸ็Šถ
ๆ…‹ใงใฎไฝฟ็”จใ‚’ใŠ้ก˜ใ„่‡ดใ—ใพใ™ใ€‚
่ฃœๅผทๆฟไป•ๆง˜ใซ้–ขใ—ใพใ—ใฆใฏๅผŠ็คพ่ฃฝๅ“ๅค–ๅฝขใ‚ˆใ‚Šๅคงใใ„ใ‚‚ใฎใ‚’ไฝฟ็”จใ—ใ€ๆฟๅŽšใซใคใ„ใฆใฏๅฎŸ่ทตใซใ‚ˆใ‚‹็ขบ
่ชใ‚’ใŠ้ก˜ใ„่‡ดใ—ใพใ™ใ€‚
ๅฐšใ€ๅผŠ็คพใงใฎ็ขบ่ช็ตๆžœใ‹ใ‚‰ FPC+่ฃœๅผทๆฟใฎๅŽšใฟใฏ 0.3mm ไปฅไธŠใ‚’ๆŽจๅฅจ่‡ดใ—ใพใ™ใ€‚
๏ผˆๅผŠ็คพๆกไปถใฏ FPC๏ผš0.1mm ๏ผ‹ ็†ฑๆŽฅ็€ๅฑค๏ผš0.05mm ๏ผ‹SUS ่ฃœๅผทๆฟ 0.15 ใซใฆๅฎŸๆ–ฝ๏ผ‰
Please make sure to attach reinforcing board to FPCโ€™s back๏ผŒso that it will relieve the product from the stress
caused by connector insertion /extraction๏ผŽ
Such reinforcing board should be bigger than our product๏ผŒand its suitable thickness should be decided through
actual test๏ผŽ
In addition, the thickness of FPC+reinforcing board recommends 0.3mm or more from our check result. (Our
condition is FPC:0.1mm + heat adhesive line:0.05mm + SUS Supporting Tape 0.15mm)
(2) ่ฝไธ‹ใƒป่กๆ’ƒใ‚„ FPC ๅ–ใ‚Šๅ›žใ—ใฎ้š›ใฎๅๅŠ›ใŒๅคงใใๅŠ ใ‚ใ‚‹ใ“ใจใŒๆ‡ธๅฟตใ•ใ‚Œใ‚‹ๅ ดๅˆใฏใ‚ณใƒใ‚ฏใ‚ฟใฎๅตŒๅˆๆ–นใธ
ใฎๆŠผใ•ใˆใซใ‚ˆใ‚‹ๅ›บๅฎšใ‚’ใŠๅ‹งใ‚่‡ดใ—ใพใ™ใ€‚
When such possibility as the product may fall๏ผŒreceive any impact or reaction force from being thrashed is
expected๏ผŒand then it is recommended to fix them in the direction of engagement๏ผŽ
๏ฝบ๏พˆ๏ฝธ๏พ€
pattern supporting
connector
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3-3. ๅฎŸ่ฃ…ใซ้–ขใ—ใฆ MOUNTING
(1) ๅฎŸ่ฃ…ใฎ้š›ใซใฏๆŽฅ่งฆ้ƒจๅŠใณใƒ†ใƒผใƒซ้ƒจใซไธ่ฆใชๅค–ๅŠ›ใŒๅŠ ใ‚ใ‚Šๅค‰ๅฝข็ญ‰ใŒ็”Ÿใ˜ใชใ„ใ‚ˆใ†ใ€ใ”ๆณจๆ„ใŠ้ก˜ใ„่‡ดใ—ใพใ™ใ€‚
Please make sure that the product is free from deformity caused by the unnecessary stress to the contacting
points and the tail๏ผŽ
(2) ่‡ชๅ‹•ๅฎŸ่ฃ…ใฎ้š›ใซใฏๅผŠ็คพๆŽจๅฅจใƒ‘ใ‚ฟใƒผใƒณๅ›ณใงใฎใ‚ฏใƒชใƒผใƒ ใฏใ‚“ใ ๅฐๅˆทๅŠใณๅฎŸ่ฃ…ใ‚’ใŠ้ก˜ใ„่‡ดใ—ใพใ™ใ€‚
When the connectors are automatically mounted๏ผŒplease apply cream soldering printing in the process in
accordance with the pattern chart of our recommendation๏ผŽ
(3) ๅค–็ทšใƒชใƒ•ใƒญใƒผใซใ‚ˆใ‚‹ใฏใ‚“ใ ไป˜ใ‘ใฏไธ‹่จ˜ใซ็คบใ™ๅผŠ็คพๆŽจๅฅจใƒชใƒ•ใƒญใƒผๆธฉๅบฆใƒ—ใƒญใƒ•ใ‚กใ‚คใƒซๆกไปถใงใฎๅฎŸๆ–ฝใ‚’ใŠ้ก˜ใ„่‡ด
ใ—ใพใ™ใ€‚
โ€ปๆธฉๅบฆใฏใ‚ณใƒใ‚ฏใ‚ฟ่กจ้ขใงๆธฌๅฎšใ—ใŸๅ€คใจใ—ใพใ™ใ€‚
For the soldering through infrared reflow๏ผŒplease apply our recommended temperature and profile condition
as the chart below๏ผŽ(Solder : Sn-3.0Ag-0.5Cu)
โ€ปThe temperature should be measured on the surface of connector๏ผŽ
(4) N2ใƒชใƒ•ใƒญใƒผใซใ‚ˆใ‚‹ใฏใ‚“ใ ไป˜ใ‘ใฏใ€O2ๆฟƒๅบฆใŒ 1000ppm ็จ‹ๅบฆใงไธ‹่จ˜ใซ็คบใ™ๅผŠ็คพใƒชใƒ•ใƒญใƒผๆธฉๅบฆใƒ—ใƒญใƒ•ใ‚กใ‚คใƒซๆกไปถ
ใงใฎๅฎŸๆ–ฝใ‚’ๆŽจๅฅจ่‡ดใ—ใพใ™ใ€‚ใชใŠใ€ใƒชใƒ•ใƒญใƒผใฏ 2 ๅ›žไปฅไธ‹ใ‚’ๆŽจๅฅจใ—ใพใ™ใ€‚
For the soldering through N2 reflow๏ผŒplease apply our recommended temperature and profile condition as the
chart below under the condition of 1000 ppm of O2 level๏ผŽAnd, the reflow recommend 2 times or less.
(Solder : Sn-3.0Ag-0.5Cu)
(5) ๅฎŸ่ฃ…ๆกไปถใŒๅผŠ็คพๆŽจๅฅจใƒชใƒ•ใƒญใƒผๆธฉๅบฆใƒ—ใƒญใƒ•ใ‚กใ‚คใƒซๆกไปถใจ็•ฐใชใ‚‹ๅ ดๅˆใฏใ‚ใ‚‰ใ‹ใ˜ใ‚ๅฎŸ่ฃ…ๅพŒใซใ‚ณใƒใ‚ฏใ‚ฟใฎๅค‰ๅฝขใ€
ๅค‰่‰ฒใŒ็„กใ„ใ“ใจใ‚’ใ”็ขบ่ชใฎไธŠใ€ๅฎŸ่ฃ…ใ‚’่กŒใฃใฆใใ ใ•ใ„ใ€‚
When the mounting condition differs from those of our profile in any way๏ผŒplease make sure that you do not
observe any deformity nor color change with the mounted connector beforehand๏ผŽ
250
230
180
150
TEMP ON THE PARTS(โ„ƒ)
PEAK
PRE HEAT
TIME(s)
90ยฑ30 s
30ยฑ10 s
TIME(s)
250
230
180
150
TEMP ON THE PARTS(โ„ƒ)
PEAK
PRE HEAT
30ยฑ10s
90ยฑ30 s
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(6) ๆ‰‹ไป˜ใ‘ใฏใ‚“ใ ใฎ้š›ใซใฏใƒ†ใƒผใƒซ้ƒจๅŠใณๅŸบๆฟใธใฎใƒ•ใƒฉใƒƒใ‚ฏใ‚นๅก—ๅธƒใฏใ—ใชใ„ใงไธ‹ใ•ใ„ใ€‚ใ‚ณใƒใ‚ฏใ‚ฟๅ†…้ƒจๅŠใณๆŽฅ่งฆ้ƒจ
ใธใฎใƒ•ใƒฉใƒƒใ‚ฏใ‚นไธŠใŒใ‚ŠๅŠใณ้ฃ›ๆ•ฃใฎๅŽŸๅ› ใจใชใ‚ŠๆŽฅ่งฆไธ่‰ฏ็ญ‰ใฎไธๅ…ทๅˆใŒ็™บ็”Ÿใ™ใ‚‹ๅ ดๅˆใŒใ‚ใ‚Šใพใ™ใ€‚
ๅˆใ€ใฏใ‚“ใ ใ”ใฆใง็ซฏๅญใซ่ฒ ่ทใ‚’ใ‹ใ‘ใฆใฏใ‚“ใ ไป˜ใ‘ใ‚’่กŒใ†ใจใƒ†ใƒผใƒซ้ƒจๅค‰ๅฝข ๅŠใณใ‚คใƒณใ‚ทใƒฅใƒฌใƒผใ‚ฟใฎๆบถใ‘็ญ‰ใฎ
ๆใ‚ŒใŒใ‚ใ‚Šใพใ™ใฎใงใ”ๆณจๆ„ใŠ้ก˜ใ„่‡ดใ—ใพใ™ใ€‚
Please do not apply flux onto the tail and PC board๏ผŒwhen it is soldered manually๏ผŽSplattered or migrated
flux inside the connector or to the contact points may cause imperfect contact๏ผŽ
Also avoid giving any stress to the product with the soldering iron๏ผŽIt could deform tail or melt insulator๏ผŽ
(7) PLUG ๅดใฏๆŽฅ็‚นใŒๅค–ๅดใซ้œฒๅ‡บใ—ใฆใ„ใ‚‹็‚บใ€ๅฎŸ่ฃ…ใฎ้š›ใฏใƒ•ใƒฉใƒƒใ‚ฏใ‚นใฎ้ฃ›ๆ•ฃใซ ใ”ๆณจๆ„ใŠ้ก˜ใ„่‡ดใ—ใพใ™ใ€‚
Since the contacting areas of the plug connector are exposed to the outer side, pay attention that the areas
would not be splashed with flux in the soldering process.
(8) ๅฎŸ่ฃ…ๅพŒใ€้…ธๅŒ–ใฎๅฝฑ้Ÿฟใงใฏใ‚“ใ ไป˜ใ‘้ƒจใซๅค‰่‰ฒใŒ่ฆ‹ใ‚‰ใ‚Œใ‚‹ไบ‹ใŒใ‚ใ‚Šใพใ™ใŒใ€่ฃฝๅ“ๆ€ง่ƒฝใซๅฝฑ้Ÿฟใฏใ‚ใ‚Šใพใ›ใ‚“ใ€‚
There is no influence in the product performance thought discoloration might be seen in
the soldering tail after mounting.
(9) ๅฎŸ่ฃ…ๅพŒใ€ใƒ†ใƒผใƒซไธŠ้ขใซใฏใ‚“ใ ๆฟกใ‚ŒๅบƒใŒใ‚Šใฎใชใ„ๅ ดๅˆใŒใ‚ใ‚Šใพใ™ใŒใ€่ฃฝๅ“ๆ€ง่ƒฝใซๅฝฑ้Ÿฟใฏใ‚ใ‚Šใพใ›ใ‚“ใ€‚
There is no influence in the product performance though the tail surface doesn't get wet with solder after
mounting.
ๆŽฅ ่งฆ ้ƒจ
Contact area
ใฏใ‚“ใ ใ”ใฆ
soldering iron
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3-4. ๅตŒๅˆใซ้–ขใ—ใฆ ENGAGEMENT
(1) ใ‚ณใƒใ‚ฏใ‚ฟใฎๆŽฅ่งฆ้ƒจใซ่งฆใ‚ŒใŸใ‚Šใ€็•ฐ็‰ฉใ‚’ๅ…ฅใ‚Œใ‚‹ใจใƒใƒใฎๅค‰ๅฝข็ญ‰ใฎๅŽŸๅ› ใจใชใ‚Šใพใ™ใฎใงใ”ๆณจๆ„ใŠ้ก˜ใ„่‡ดใ—ใพใ™ใ€‚
If something touches the contact points or with some foreign object๏ผŒthe spring could be deformed๏ผŽ
(2) ๆœฌ่ฃฝๅ“ใฏๅฐๅž‹ใ€่ปฝ้‡ๅŒ–ใ‚’ใ™ใ‚‹็‚บใซๆˆๅฝขๅ“ใฎ่‚‰ๅŽšใ‚’่–„ใใ—ใฆใŠใ‚Šใ€ๅตŒๅˆใƒป้›ข่„ฑๆ™‚ใซ้Žๅบฆใชใญใ˜ใ‚ŠๆŒฟๆŠœใฏๆˆๅฝข
ๅ“ใฎ็ ดๅฃŠใ€็ซฏๅญใฎๅค‰ๅฝขใ€ใƒ†ใƒผใƒซ้ƒจใฏใ‚“ใ ๅ‰ฅ้›ขใฎๅŽŸๅ› ใจใชใ‚Šใพใ™ใฎใงๆณจๆ„ใŠ้ก˜ใ„่‡ดใ—ใพใ™ใ€‚
We minimized the thickness of this product to achieve downsizing and light weightiness๏ผŽBecause of this๏ผŒ
distorted attachment at engagement /disengagement could cause destruction๏ผŒterminal deformity๏ผŒplating
detachment on the tail๏ผŽ
ใ“ใ˜ใ‚Š
Uneven Pressure
ใญใ˜ใ‚Š
Distorted Attachment
ไธ‡ใŒไธ€ใ“ใ˜ใ‚ŠๆŠœๅŽปใ‚’่กŒใ†ๅฟ…่ฆใŒใ‚ใ‚‹ๅ ดๅˆใฏใ€้•ทๆ‰‹ๆ–นๅ‘ใซ่กŒใฃใฆไธ‹ใ•ใ„ใ€‚ไฝ†ใ—ใ€้•ทๆ‰‹ๆ–นๅ‘ใธใฎไฝœๆฅญใฏใ€
ใ“ใ˜ใ‚‹ๅดใฎๅฎŸ่ฃ…ๅŸบๆฟใƒปFPC ๅŽšใฟใซใ‚ˆใ‚Šใ€ใ‚ณใƒใ‚ฏใ‚ฟใŒๅฑฑๅใ‚Šๆ–นๅ‘ใซๅค‰ๅฝขใ€ใพใŸใฏใ€็ ดๆใ™ใ‚‹ๅ ดๅˆใŒ
ใ‚ใ‚Šใพใ™ใ€‚ไบ‹ๅ‰ใซใ”็ขบ่ชใฎไธŠใ€ไฝœๆฅญใ‚’่กŒใฃใฆไธ‹ใ•ใ„ใ€‚
If it is required to unmate connectors with uneven pressure, apply such pressure to the long side of the
connector. Applying the uneven pressure to the long side of the connector may cause doomed warpage or
destruction on the connector depending on the PCB/FPC thickness. Please make sure beforehand when you
apply the uneven pressure to the long side of the connector.
้•ทๆ‰‹ๆ–นๅ‘ ๏ผˆโ–ณ๏ผ‰ ็Ÿญๆ‰‹ๆ–นๅ‘ ๏ผˆร—๏ผ‰
uneven pressure distorted attachment
ๅŸบๆฟ
๏ผฆ๏ผฐ๏ผฃ
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(3) ๅตŒๅˆใฏไฝ็ฝฎๅˆใ‚ใ›ใ‚’่กŒใฃใŸไธŠใงใ€Plug ๅดใ€Rec.ๅดใฎไธกๆ–นใŒๅนณ่กŒใซใชใ‚‹็Šถๆ…‹ใง่กŒใฃใฆไธ‹ใ•ใ„ใ€‚
ใชใŠใ€ๅตŒๅˆไฝ็ฝฎๅˆใ‚ใ›ใฏใ€้ŽๅบฆใชๅŠ›ใ‚’ๅŠ ใˆใšใซ่กŒใฃใฆไธ‹ใ•ใ„ใ€‚้ŽๅบฆใชๅŠ›ใ‚’ๅŠ ใˆใŸๅ ดๅˆใ€ๆˆๅฝขๅ“ใฎ็ ดๅฃŠ็ญ‰ใ€
็™บ็”Ÿใ™ใ‚‹ๅ ดๅˆใŒใ‚ใ‚Šใพใ™ใ€‚
Align connectors before mating, and apply pressure on plug and receptacle connectors so that they would be
mated straight in parallel. Do not apply an excessive pressure when aligning them, or mold goods could be
damaged or broken.
(4) ่ฃฝๅ“ๅน…ใŒๅฐใ•ใ„ใŸใ‚ใ€ๅตŒๅˆไฝ็ฝฎๅˆใ‚ใ›ใฏ Plugใ€Rec.ใŒๅคงใใใ‚บใƒฌใชใ„ใ‚ˆใ†ใซใ€ใ”ๆณจๆ„ใ‚’ใŠ้ก˜ใ„่‡ดใ—ใพใ™ใ€‚
Because the connector is very small, be careful not to move the plug or receptacle connector when aligning
them.
(5) ๆœฌ่ฃฝๅ“ใฏใ‚ณใƒใ‚ฏใ‚ฟใฎใฟใงใฎๅŸบๆฟไฟๆŒใฏๅ‡บๆฅใพใ›ใ‚“ใ€‚ๆŠผใ•ใˆใŒ็„กใ„ๅ ดๅˆใ€ๅตŒๅˆใฎใฏใšใ‚Œใ€
ใƒ†ใƒผใƒซใฏใ‚“ใ ๅ‰ฅ้›ขใ€ๆŽฅ่งฆไธๅฎ‰ๅฎšใŒๆ‡ธๅฟตใ•ใ‚Œใพใ™ใ€‚ใ‚นใƒšใƒผใ‚ตใƒผใชใฉใ‚’ใ”ไฝฟ็”จ้ ‚ใใ€ใญใ˜ๆญขใ‚ใชใฉใฎ
ๅตŒๅˆๅ›บๅฎšใŒๅฟ…่ฆใงใ™ใ€‚
The connector is impossible to support the PCB by itself. Without other supporting objects,
imperfect mating , peeling of tails or contacting failure may be caused. As supporting objects,
use spacers fixed by screws.
3-5. ใƒใ‚งใƒƒใ‚ซใƒผใซ้–ขใ—ใฆ CHECKER
ๆœฌ่ฃฝๅ“ใ‚’ใใฎใพใพใƒใ‚งใƒƒใ‚ซใƒผใจใ—ใฆใ”ไฝฟ็”จใ™ใ‚‹ๅ ดๅˆใ€่€ไน…ๆ€งใŒๅŠฃใ‚‹ใ“ใจใ€็›ธๆ‰‹ๅด่ฃฝๅ“ใซ้Žๅบฆใซใƒ€ใƒกใƒผใ‚ธใ‚’ไธŽใˆ
ใ‚‹ๅ ดๅˆใŒใ‚ใ‚Šใพใ™ใฎใงใ€ใ”ๆณจๆ„้ก˜ใ„ใพใ™ใ€‚ใƒใ‚งใƒƒใ‚ซใƒผใ‚’ใ”่ฆๆœ›ใฎ้š›ใฏๅผŠ็คพใพใงใ”้€ฃ็ตก้ก˜ใ„ใพใ™ใ€‚
If the connector targeted in this manual is used as a checker, please be informed that durability
may not be high enough or the product to be checked could be damaged excessively.
Please contact us when you request
our specified
plug or receptacle for the checker.
3-6. ๆดป็ทšๆŒฟๆŠœ้–ขใ—ใฆ HOT SWAP
ๆœฌ่ฃฝๅ“ใซ้›ปๆตใ‚’ๆตใ—ใŸ็Šถๆ…‹ใงใฎๆŒฟๆŠœใฏใ€ใชใ•ใ‚‰ใชใ„ใ‚ˆใ†ๅพก้ก˜ใ„่‡ดใ—ใพใ™ใ€‚
Insertion and separation under live current shall not be done.
NG OK
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3-7. ใƒ—ใƒชใƒณใƒˆๅŸบๆฟใŠใ‚ˆใณใƒกใ‚ฟใƒซใƒžใ‚นใ‚ฏ้–‹ๅฃ้ƒจๆŽจๅฅจๅฏธๆณ•ใซ้–ขใ—ใฆ
PCB AND RECOMMENDED DIMENSIONS OF THE OPENING AREA IN THE METAL MASK
ๆœฌใ‚ณใƒใ‚ฏใ‚ฟใฏใ€ใƒ”ใƒƒใƒ้–“้š”ใŒ 0.35mm ใงใ‚ใ‚Šใ€้ซ˜ๅฏ†ๅบฆๅฎŸ่ฃ…ใŒ่ฆๆฑ‚ใ•ใ‚Œใ‚‹ใ‚ณใƒใ‚ฏใ‚ฟใจใชใฃใฆใŠใ‚Šใพใ™ใ€‚ ้ซ˜ๅฏ†ๅบฆๅฎŸ่ฃ…
ใŒ่ฆๆฑ‚ใ•ใ‚Œใ‚‹ใ‚ณใƒใ‚ฏใ‚ฟใซ้–ขใ—ใฆใฏใ€ๅŠ็”ฐใƒ–ใƒชใƒƒใ‚ธใซใ‚ˆใ‚‹ใ‚ทใƒงใƒผใƒˆ็ญ‰ใฎๅฎŸ่ฃ…ไธๅ…ทๅˆใ‚’ๆธ›ใ‚‰ใ™ใŸใ‚ใซ้ฉๆญฃใชใฏใ‚“ใ ้‡
ใฎ็ฎก็†ใŒๅฟ…่ฆใจใชใ‚Šใพใ™ใ€‚ ใคใใพใ—ใฆใฏใ€ๆทปไป˜ๆŽจๅฅจๅฏธๆณ•ๅ›ณใ‚’ใ”ๅ‚่€ƒ้ก˜ใ„ใพใ™ใ€‚ ๏ผˆใƒ—ใƒชใƒณใƒˆๅŸบๆฟๅฏธๆณ•ใฎ่ฉณ็ดฐใซใค
ใใพใ—ใฆใฏใ€ๅผŠ็คพ่ฃฝๅ“ๅ›ณ้ขใ‚’ใ”ๅ‚็…งใใ ใ•ใ„๏ผ‰
This series of connector is required to be mounted in the high density due to its 0.35mm pitches. The connectors
mounted in the high density need to be controlled adequate amount of solder in order to prevent failures in the
mounting process such as short-circuit caused by solder bridge. For the dimensions of the metal mask opening,
therefore, please refer to our recommended dimensions shown in the attached drawing. (For detailed dimensions of
the printed circuit board, please refer to our product drawings.)
As dimensions shown in the drawings are our recommendations. Please feel free to
contact us if you have any questions and
๏ผ
or concerns about these dimensions.
ใƒ—ใƒชใƒณใƒˆๅŸบๆฟใŠใ‚ˆใณใƒกใ‚ฟใƒซใƒžใ‚นใ‚ฏ้–‹ๅฃ้ƒจๅฏธๆณ•ใฏๆŽจๅฅจใงใ™ใฎใงไธๆ˜Ž็‚นใ‚„ๆ‡ธๅฟต็‚น็ญ‰ใŒใ”ใ–ใ„ใพใ—ใŸใ‚‰ใ”
็›ธ่ซ‡ใ„ใŸใ ใ‘ใพใ™ใ‚ˆใ†ใŠ้ก˜ใ„ใ—ใพใ™ใ€‚
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5861 SERIES INSTRUCTION MANUAL No. 205-03-300
106-03-004 ๐Ÿ„ซ 2020 KYOCERA Corporation PAGE 11/13
PLUG REC.
Pad
Stencil
๏ฝ”๏ผ0.12mm
Stencil
๏ฝ”๏ผ0.1mm
5
58
86
61
1
S
Se
er
ri
ie
es
s:
:
0
0.
.3
35
5
m
mm
m
P
Pi
it
tc
ch
h
Recommended Pad & Stencil size ๏ผˆSIGNAL CONTACT๏ผ‰
0.18mm
0.55mm
0.18mm
0.38mm
0.18mm
0.35mm
0.18mm
0.39mm
0.18mm
0.38mm
0.18mm
0.32mm
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5861 SERIES INSTRUCTION MANUAL No. 205-03-300
106-03-004 ๐Ÿ„ซ 2020 KYOCERA Corporation PAGE 12/13
PLUG REC.(SPAN) REC.(PITCH)
Pad
Stencil
๏ฝ”๏ผ0.12mm
Stencil
๏ฝ”๏ผ0.1mm
REC. MOUNTING LAYOUT
5
58
86
61
1
S
Se
er
ri
ie
es
s
:
:
0
0.
.3
35
5
m
mm
m
P
Pi
it
tc
ch
h
Recommended Pad & Stencil size ๏ผˆANCHOR PLATE๏ผ‰
PITCH
SIGNAL
0.3mm
1.0mm
0.4mm(15.8mil)
1.2mm
0.35mm
0.8m
0.8mm
0.4mm
0.3mm
0.2mm
0.25mm
0.34mm
0.35mm
0.2mm
0.21mm
0.28mm
0.315mm
0.18mm
0.35mm
0.35mm
0.8mm
0.3mm
0.35m
1.0mm
0.3mm
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5861 SERIES INSTRUCTION MANUAL No. 205-03-300
106-03-004 ๐Ÿ„ซ 2020 KYOCERA Corporation PAGE 13/13
3-8. ๆŽจๅฅจๅธ็€ใƒŽใ‚บใƒซๅฏธๆณ•ใซ้–ขใ—ใฆ
RECOMMENDED DIMENSIONS OF THE PICK-UP NOZZLE
ๆŽจๅฅจๅธ็€ใƒŽใ‚บใƒซๅฏธๆณ•ใฏไปฅไธ‹ใฎ้€šใ‚Šใงใ™ใ€‚
The following is the recommended dimensions of the pick-up nozzle.
ใ‚ณใƒใ‚ฏใ‚ฟใŒๅŸบๆฟไธŠใซๆœ‰ใ‚‹้š›ใฎๆœ€ๅคงๅŠ ๅœง่ท้‡ ๏ผš 20N
Maximum pressure when the connector is placed on a PCB: 20N
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KYOCERA 5861 Series User manual

Type
User manual

KYOCERA 5861 Series is a board-to-board connector with a 0.35mm pitch, designed to miniaturize outer dimensions for high-density mounting. It is suitable for applications requiring high-speed data transmission and low power consumption, such as smartphones, tablets, and other portable devices. The connector is also suitable for use in industrial automation, medical equipment, and automotive electronics. It offers reliable electrical performance, stable signal transmission, and excellent durability, making it ideal for use in harsh environments.

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