Seco SOM-ETX-BT Owner's manual

ETX-A61

ETX® 3.0 compliant module with the

Intel® Atom E3800 and Celeron® Bay Trail family

SOCs

ETX-A61

2

Unauthorised use, duplication, modification or disclosure of the information to a third-party by any means without prior consent of SECO S.r.l. is prohibited.

Every effort has been made to ensure the accuracy of this manual. However, SECO S.r.l. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.r.l. reserves the right to change precise specifications without prior notice to supply the best product possible.

Some of the information found in the BIOS SETUP Chapter has been extracted from the following copyrighted Insyde Software Corp. documents:

InsydeH2O Setup Utility - User Reference Guide

For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the

dedicated web form available at http://www.seco.com (registration required).

Our team is read to assist you.

Revision

Date

Note

Rif

1.0

2nd December 2015

First Release

SB

1.1

26th January 2016

Minor corrections

BIOS Section updated

SB

1.2

7th September 2017

Industrial temperature removed from Technical features

ISA limitations added (par. 3.2.5.4.1)

Double PATA configuration reset workaround added (par. 3.2.5.10.1)

BIOS Section updated

SB

REVISION HISTORY

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INDEX

INTRODUCTION .......................................................................................................................................................................... 5 Chapter 1.

1.1 Warranty ........................................................................................................................................................................................................................................ 6

1.2 Information and assistance ............................................................................................................................................................................................................. 7

1.3 RMA number request ..................................................................................................................................................................................................................... 7

1.4 Safety ............................................................................................................................................................................................................................................ 8

1.5 Electrostatic Discharges ................................................................................................................................................................................................................. 8

1.6 RoHS compliance .......................................................................................................................................................................................................................... 8

1.7 Terminology and definitions ............................................................................................................................................................................................................ 9

1.8 Reference specifications .............................................................................................................................................................................................................. 11

OVERVIEW ............................................................................................................................................................................... 12 Chapter 2.

2.1 Introduction .................................................................................................................................................................................................................................. 13

2.2 Technical Specifications ............................................................................................................................................................................................................... 14

2.3 Electrical Specifications ................................................................................................................................................................................................................ 15

2.3.1 Power Rails meanings .......................................................................................................................................................................................................... 15

2.3.2 Power Consumption ............................................................................................................................................................................................................ 15

2.4 Mechanical Specifications ............................................................................................................................................................................................................ 16

2.5 Block Diagram ............................................................................................................................................................................................................................. 17

CONNECTORS ......................................................................................................................................................................... 18 Chapter 3.

3.1 Introduction .................................................................................................................................................................................................................................. 19

3.2 Connectors description ................................................................................................................................................................................................................ 20

3.2.1 FAN Connector .................................................................................................................................................................................................................... 20

3.2.2 SATA connectors ................................................................................................................................................................................................................. 20

3.2.3 μSD Card Slot ..................................................................................................................................................................................................................... 20

3.2.4 ETX® Module connectors ..................................................................................................................................................................................................... 21

3.2.5 Signals description ............................................................................................................................................................................................................... 29

BIOS SETUP ............................................................................................................................................................................. 43 Chapter 4.

4.1 InsydeH2O setup Utility ................................................................................................................................................................................................................ 44

4.2 Main setup menu ......................................................................................................................................................................................................................... 45

4.2.1 System Time / System Date ................................................................................................................................................................................................. 45

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4.3 Advanced menu .......................................................................................................................................................................................................................... 46

4.3.1 Boot configuration submenu ................................................................................................................................................................................................. 47

4.3.2 PCI Express configuration submenu ..................................................................................................................................................................................... 47

4.3.3 USB configuration submenu ................................................................................................................................................................................................. 48

4.3.4 Audio configuration submenu ............................................................................................................................................................................................... 49

4.3.5 LPSS & SCC configuration submenu .................................................................................................................................................................................... 50

4.3.6 Miscellaneous Configuration submenu .................................................................................................................................................................................. 51

4.3.7 Security configuration submenu ............................................................................................................................................................................................ 52

4.3.8 Video configuration submenu ............................................................................................................................................................................................... 52

4.3.9 Chipset configuration submenu ............................................................................................................................................................................................ 55

4.3.10 SATA configuration submenu ............................................................................................................................................................................................... 56

4.3.11 Console Redirection submenu.............................................................................................................................................................................................. 57

4.3.12 ACPI Table/features submenu .............................................................................................................................................................................................. 58

4.3.13 Super I/O configuration submenu ......................................................................................................................................................................................... 58

4.3.14 Virtual SuperI/O configuration submenu ................................................................................................................................................................................ 59

4.3.15 INT/IRQ configuration submenu ............................................................................................................................................................................................ 59

4.3.16 LPC to ISA Bridge Configuration submenu ............................................................................................................................................................................ 60

4.4 Security menu.............................................................................................................................................................................................................................. 61

4.4.1 USB Disk Signature Option submenu ................................................................................................................................................................................... 61

4.5 Power menu ................................................................................................................................................................................................................................ 62

4.5.1 Advanced CPU control submenu ......................................................................................................................................................................................... 63

4.5.2 EC Watchdog Configuration submenu .................................................................................................................................................................................. 64

4.5.3 Thermal Zone configuration submenu ................................................................................................................................................................................... 64

4.6 Boot menu .................................................................................................................................................................................................................................. 65

4.6.1 Fixed Legacy Boot Order Settings Submenu ......................................................................................................................................................................... 66

4.6.2 Legacy submenu ................................................................................................................................................................................................................. 67

4.7 Exit menu .................................................................................................................................................................................................................................... 68

Appendices .............................................................................................................................................................................. 69 Chapter 5.

5.1 Thermal Design ............................................................................................................................................................................................................................ 70

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Chapter 1.

 Warranty

 Information and assistance

 RMA number request

 Safety

 Electrostatic Discharges

 RoHS compliance

 Terminology and definitions

 Reference specifications

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1.1 Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts 1 year.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.

Items cannot be returned unless previously authorised by the supplier.

The authorisation is released after completing the specific form available on the web-site http://www.seco.com (RMA Online). The RMA authorisation number must

be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original packaging, with no signs of

damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and must accompany the returned item.

If any of the above mentioned requirements for RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.

Following a technical analysis, the supplier will verify if all the requirements for which a warranty service applies are met. If the warranty cannot be applied, the

Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

Warning!

All changes or modifications to the equipment not explicitly approved by SECO S.r.l. could impair the equipment’s functionality and

could void the warranty

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1.2 Information and assistance

What do I have to do if the product is faulty?

SECO S.r.l. offers the following services:

 SECO website: visit http://www.seco.com to receive the latest information on the product. In most of the cases it is possible to find useful information to

solve the problem.

 SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.

 SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct

solution. E-mail: technical.se[email protected]

Fax (+39) 0575 340434

- Repair centre: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

o Returned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.

o Returned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before requesting technical assistance:

- Name and serial number of the product;

- Description of Customer’s peripheral connections;

- Description of Customer’s software (operating system, version, application software, etc.);

- A complete description of the problem;

- The exact words of every kind of error message encountered.

1.3 RMA number request

To request a RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online” and follow the procedure described.

A RMA Number will be sent within 1 working day (only for on-line RMA requests).

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8

Whenever handling an ETX-A61 module, ground yourself through an anti-static wrist strap. Placement of the board on an anti-static

surface is also highly recommended.

1.4 Safety

The ETX-A61 module uses only extremely-low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

1.5 Electrostatic Discharges

The ETX-A61 module, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all the

devices and/or components on-board.

1.6 RoHS compliance

The ETX-A61 module is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other boards.

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid

short circuits due to unwanted contacts with other board components.

If the board has become wet, never connect it to any external power supply unit or battery.

Check carefully that all cables are correctly connected and that they are not damaged.

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1.7 Terminology and definitions

ACPI Advanced Configuration and Power Interface, an open industrial standard for the board’s devices configuration and power management

AHCI Advanced Host Controller Interface, a standard which defines the operations modes of SATA interface

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

BIOS Basic Input / Output System, the Firmware Interface that initializes the board before the OS starts loading

CRT Cathode Ray Tube. Initially used to indicate a type of monitor, this acronym has been used over time to indicate the analog video interface used

to drive them.

DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)

DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock

DDR3 DDR, 3rd generation

DP Display Port, a type of digital video display interface

DVI Digital Visual interface, a type of digital video display interface

eDP embedded Display Port, a type of digital video display interface developed especially for internal connections between boards and digital displays

EHCI Enhanced Host Controller interface, a high-speed controller for USB ports, able to support USB2.0 standard

GbE Gigabit Ethernet

Gbps Gigabits per second

GND Ground

GPI/O General purpose Input/Output

HD Audio High Definition Audio, most recent standard for hardware codecs developed by Intel® in 2004 for higher audio quality

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

ISA Bus Industry Standard Architecture Bus, an old parallel bus for the connection of expansion boards.

LPC Bus Low Pin Count Bus, a low speed interface based on a very restricted number of signals, deemed to management of legacy peripherals

LVDS Low Voltage Differential Signaling, a standard for transferring data at very high speed using inexpensive twisted pairs copper cables, usually used

for video applications

Mbps Megabits per second

MMC/eMMC MultiMedia Card / embedded MMC, a type of memory card, having the same interface as the SD card. The eMMC is the embedded version of

the MMC. They are devices that incorporate the flash memories on a single BGA chip.

N.A. Not Applicable

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10

N.C. Not Connected

OpenGL Open Graphics Library, an Open Source API dedicated to 2D and 3D graphics

OS Operating System

PCI Peripheral Component Interconnect, a parallel bus working at 33MHz for the connection of external expansion board

PCI-e Peripheral Component Interconnect Express

PSU Power Supply Unit

PWM Pulse Width Modulation

PWR Power

PXE Preboot Execution Environment, a way to perform the boot from the network ignoring local data storage devices and/or the installed OS

SATA Serial Advance Technology Attachment, a differential half duplex serial interface for Hard Disks

SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like smart batteries and

other power supply-related devices

TBM To be measured

TMDS Transition-Minimized Differential Signaling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces

TTL Transistor-transistor Logic

UEFI Unified Extensible Firmware Interface, a specification defining the interface between the OS and the board’s firmware. It is meant to replace the

original BIOS interface

USB Universal Serial Bus

V_REF Voltage reference Pin

VGA Video Graphics Array. An analog computer display standard, commonly referred to also as CRT.

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1.8 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

ACPI

http://www.acpi.info

AHCI

http://www.intel.com/content/www/us/en/io/serial-ata/ahci.html

DDC

http://www.vesa.org

ETX

http://www.etx-ig.org/specs/specs.php

Gigabit Ethernet

http://standards.ieee.org/about/get/802/802.3.html

HD Audio

http://www.intel.com/content/dam/www/public/us/en/documents/product-specifications/high-definition-audio-specification.pdf

I2C

http://www.nxp.com/documents/other/UM10204_v5.pdf

LPC Bus

http://www.intel.com/design/chipsets/industry/lpc.htm

LVDS

http://www.ti.com/ww/en/analog/interface/lvds.shtml

http://www.ti.com/lit/ml/snla187/snla187.pdf

MMC/eMMC

http://www.jedec.org/committees/jc-649

OpenGL

http://www.opengl.org

PCI

https://www.pcisig.com/specifications/conventional

PCI Express

http://www.pcisig.com/specifications/pciexpress

SATA

https://www.sata-io.org

SM Bus

http://www.smbus.org/specs

UEFI

http://www.uefi.org

USB 2.0

http://www.usb.org/developers/docs/usb_20_070113.zip

Intel® Bay trail family

http://ark.intel.com/products/codename/55844/Bay-Trail#@Embedded

ETX-A61

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Chapter 2.

 Introduction

 Technical Specifications

 Electrical Specifications

 Mechanical Specifications

 Block Diagram

ETX-A61

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2.1 Introduction

The ETX-A61 is a ETX® 3.0 compliant module, based on the Intel® family of System-on-Chips (SOCs) formerly coded as Bay Trail, a series of Single/ Dual / Quad

Core SOCs with 64-bit instruction set. These SOCs embed all the features usually obtained by combination of CPU + platform Controller hubs, all in one single IC,

which allows, therefore, the system minimisation and performance optimisation. A complete list of SOCs available is detailed in the next subchapter.

All the supported SOCs offer a 64-bit Instruction set, and provide direct access to the memory. Frequencies up to 1333MHz are supported, with a maximum

capacity up to 8GB. Please notice that total amount of memory available is OS dependant, and depends also on the SOC.

All SOCs integrate an Intel® HD Graphics 4000 Series Controller, which offer high graphical performances, with support for Microsoft® DirectX11, OpenGL 3.0,

OpenCL 1.2, OpenGL ES 2.0 and HW acceleration for video decoding of H.264, MPEG2, MVG, VC-1, VP8 and MJPEG video standards (for H.264, MPEG2 and

MVG also HW encoding is offered). This embedded GPU is able to drive two independent displays; this can be obtained by exploiting both the native CRT (VGA)

interface and the LVDS interface, which is realised through an eDP-to-LVDS bridge placed on one of the native Digital Display Interfaces available on the SOC.

For mass storage, on board it is possible to mount an optional eMMC disk. Furthermore, it is possible to connect external Hard Disk Drives by using the two native

SATA channels of the SOC. ETX® specifications foresee the possibilities of having Parallel ATA interface on connector X4 and/or additional SATA connectors on

top of the board. For this reason, since SATA channels available are only two, it is possible (as a factory option) to mount onboard one or two SATA-to-PATA

bridges. Depending on the configuration purchased, therefore, it will be possible to have modules with two SATA connectors on top, or with two PATA interfaces

on connector X4, or with one PATA interface on X4 and one SATA connector on top of the module.

The native HD Audio interface is connected to a Realtek ALC262 HD Audio Codec, so that it is possible to have analog audio channels (Stereo Output, Stereo

auxiliary input and microphone input) on ETX connector X1.

Four USB 2.0 ports are supported directly by the SOC, ad are carried out directly on connector X1.

To complete the functionalities of the module, and make it compliant to ETX specifications, there are onboard a Gigabit Ethernet Controller (Intel® I210/I2111),

which makes available the 10/100Mbps Ethernet interface, and a PCI-e-to-PCI bridge, to implement the PCI bus. Both these devices are managed by using two of

the PCI-express ports #0 and #1, respectively.

Furthermore, on the LPC bus, are placed a LPC-to-ISA bridge, used to implement the ISA bus which characterize the ETX modules, and a Nuvoton SUperI/O,

which makes available two full-modem serial ports, a parallel port shared with Floppy Disk interface, and PS/2 interface for Mouse and Keyboard.

The functionalities of this module are completed by the Real Time Clock, SM Bus, I2C Bus and the Watchdog. Please refer to following chapter for a complete list

of all peripherals integrated and characteristics.

The module has a very rugged design, since it is based on soldered down DDR3L memories, ceramic capacitors only and high quality AEC-Q200 grade-1

inductors. The possibility of having an embedded storage device, the eMMC, makes this module particularly suited for applications where vibrations can represent

a problem that must be faced.

The product is ETX® Rel.3.0 standard compliant, an industry standard defined specifically for COMs (computer on modules) which require ensuring support for

legacy peripherals (like those requiring ISA bus, PCI bus and/or PS/2 interface). Its definition provides the ability to make a smooth transition from legacy parallel

interfaces to the newest technologies based on serial buses available.

2.2 Technical Specifications

SOC

Intel® Atom E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP

Intel® Atom E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP

Intel® Atom E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP

Intel® Atom E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP

Intel® Atom E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP

Intel® Celeron® J1900, Quad Core @2.0GHz, 2MB Cache, 10W TDP

Intel® Celeron® N2930, Quad Core @1.83GHz, 2MB Cache, 7.5W TDP

Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

Memory

Soldered down DDR3L memory

E3845, E3827, J1900, N2930: up to 8GB Dual-Channel DDR3L 1333MHz

E3826: up to 8GB Dual-Channel DDR3L 1066MHz

N2807: up to 4GB Single-Channel DDR3L 1333MHz

E3825, E3815: up to 4GB Single-Channel DDR3L 1066MHz

Graphics

Integrated Intel® HD Graphics 4000 series controller

Dual independent display support

HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats

HW encoding of H.264, MPEG2 and MVC formats

Video Interfaces

VGA standard analog video interface

18/24 bit single/dual channel LVDS interface (VESA and JEIDA color mapping

compatible)

Video Resolutions

CRT Interface: up to 2560 x 1600 @ 60Hz

LVDS interface: Up to 1920 x 1200 @ 60Hz

Mass Storage

Optional eMMC disk soldered on board

2 x external S-ATA or 2 x P-ATA or 1x P-ATA + 1 x S-ATA channels (factory

options)

μSD Card Slot

USB

4 x USB 2.0 Host ports

Networking

Gigabit Ethernet controller, makes available a 10/100Mbps Ethernet interface

Audio

HD Audio codec, Realtek ALC262

Serial Ports

2 x Serial ports (TX/RX/RTS/CTS signals, TTL interface)

Other Interfaces

PCI Bus rel. 2.3 compliant, realised using a PCI-e to PCI bridge

ISA Bus, realised using a LPC to ISA bridge

LPT interface shared with Floppy Disk Drive interface

PS/2 mouse and keyboard interface

I2C Bus

SM bus

Watch Dog timer

Power Management Signals

Power supply voltage: +5VDC ± 5% and + 5VSB (optional)

Operating temperature: 0°C ÷ +60°C (commercial version) **

Dimensions: 114 x 95 mm (4.49” x 3.74”)

** Temperatures indicated are the minimum and maximum temperature that

the heatspreader / heatsink can reach in any of its parts. This means that it is

customer

’

s responsibility to use any passive cooling solution along with an

application-dependent cooling system, capable to ensure that the

heatspreader / heatsink temperature remains in the range above indicated.

Please also check paragraph 5.1

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2.3 Electrical Specifications

According to ETX® specifications, the ETX-A61 board needs to be supplied only with an external +5VDC ± 5% voltage (+5V_S).

5 Volts standby voltage needs to be supplied for working in ATX mode.

For Real Time Clock working and CMOS memory data retention, it is also needed a backup battery voltage. It must be provided using pin 8 (BATT) of connector X4

(CN7).

All these voltages are supplied directly through ETX Connectors X1 (CN6), X2 (CN5), X3 (CN8) and X4 (CN7).

All remaining voltages needed for board’s working are generated internally from +5V_S power rail.

According to ETX® specifications, the +3.3V_S voltage present on connector X1 pins 12, 16 and 24 is generated internally; therefore, it must be considered as a

power output for devices on the carrier board that need this voltage. According to ETX® specifications, maximum external load admitted on +3.3V_S power rail is

500mA.

2.3.1 Power Rails meanings

In all the tables contained in this manual, Power rails are named with the following meaning:

_S: Switched voltages, i.e. power rails that are active only when the board is in ACPI’s S0 (Working) state. Examples: +3.3V_S, +5V_S.

_A: Always-on voltages, i.e. power rails that are active both in ACPI’s S0 (Working), S3 (Standby) and S5 (Soft Off) state. Examples: +5V_A, +3.3V_A.

_U: unswitched ACPI S3 voltages, i.e. power rails that are active both in ACPI’s S0 (Working) and S3 (Standby) state. Examples: +1.5V_U.

2.3.2 Power Consumption

TBM

Since +3.3V_S is generated internally on ETX-A61 module, do not connect +3.3V_S pins to external 3.3V power supply units.

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2.4 Mechanical Specifications

The ETX-A61 is an ETX® 3.0 compliant module; therefore its dimensions are 114 mm x 95 mm (4.49” x 3.74”).

Printed circuit of the board is made of ten layers, some of them are ground planes, for disturbance rejection.

The ETX plugs used will allow a clearance under the module of about 3mm. Since there are components on the bottom of the module, it is necessary to avoid

placing any component on the carrier board in the area under the ETX® module.

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Intel® Bay

Trail family

SOC

SATA-to-PATA

bridge

eMMC disk

FACTORY ALTERNATIVES

DDR3L System

Memory Soldered

Down

ETX connector X1

SATA #0

IDE #1

eMMC

+5V_S

4 x USB 2.0 ports

Power section

USB 2.0 ports #0 ÷ #3

Intel® Ethernet

Controller

I210/I211

10/100 Ethernet

LPC Bus

PCU SPI

ETX connector X2

ETX connector X3 ETX connector X4

FINTEK F85226AF

LPC-to-ISA bridge

TI XIO2001

PCIe-to-PCI

bridge

Realtek ALC262

HD Audio Codec

ISA Bus

PCI-e #1

HD Audio

SATA Connector

#1

SATA-to-PATA

bridge

IDE #2

SATA Connector

#2

FACTORY ALTERNATIVES

PCI-e #0

SATA #1

SM Bus

I2C Bus

PWR Management

CRT

eDP-to-LVDS

bridge PTN3460

LVDS

W83627DHG

SuperI/O

COM1 / COM2

LPT / FDC

PS/2 MS+KEYB

+3.3V_S

+VBATT

+5V_A

BIOS SPI Flash

DDR3L System

Memory Soldered

Down

LPC Bus

μSD Slot

2.5 Block Diagram

ETX-A61

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Chapter 3.

 Introduction

 Connectors description

ETX-A61

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3.1 Introduction

According to ETX® specifications, all interfaces to the board are available through two 220 pin connectors, for a total of 440 pin. Simplifying the terminology in this

documentation, the primary connector is called A-B and the secondary C-D, since each one consists of two rows.

In addition, a Fan connector has been placed on one side of the board, in order to allow an easier connection of active heatsinks to the module.

TOP SIDE

Ext. FAN

Connector

ETX connector

X1

BOTTOM SIDE

Optional SATA

connectors

ETX connector

X3

ETX connector

X2

ETX connector

X4

Please be aware that, depending on the configuration purchased, the appearance of the board could be different from the following pictures.

ETX-A61

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3.2 Connectors description

3.2.1 FAN Connector Depending on the usage model of ETX-A61 module, for critical applications/environments on the module itself it is available a 3-

pin dedicated connector for an external +5VDC FAN.

FAN Connector is a 3-pin single line SMT connector, type MOLEX 53261-0319 or equivalent, with pinout shown in

the table on the left.

Mating connector: MOLEX 51021-0300 receptacle with MOLEX 50079-8000 female crimp terminals.

Please be aware that the use of an external fan depends strongly on customer’s application/installation.

Please refer to chapter 5.1 for considerations about thermal dissipation.

FAN_POWER: +5V_S derived power rail for FAN, managed by the embedded microcontroller via PWM signal.

FAN_TACHO_IN: tachometric input from the fan to the embedded microcontroller, +3.3V_S electrical level signal.

3.2.2 SATA connectors The SOCs used on ETX-A61 module have an integrated S-ATA controller, which offers a

SATA II, 3.0 Gps interface, capable to use up to two independent devices. These two

channels can be carried out on externally on connectors CN2 and CN3, which are standard

right-angle S-ATA connectors, to be used for connection of external Mass Storage Devices.

Both these connectors are optional, since the two SATA channels can be used

(as a factory option) to drive a SATA-to-PATA bridge, which will make available

the primary and/or the secondary IDE Channel on ETX connector X4 (CN7).

Please also check par. 3.2.5.10.

3.2.3 μSD Card Slot

The SOCs used on ETX-A61 module offer a SD 3.0 compliant interface, that can be used to implement another mass storages media other than the optional

internal eMMC and the two SATA/PATA interfaces.

This SD interface is carried to a standard μSD card slot, soldered on top side of the module, push-push type.

FAN Connector - CN3

Signal

1

GND

2

FAN_POWER

3

FAN_TACHO_IN

Optional SATA #0

Connector - CN3

Optional SATA #1

Connector - CN2

Signal

1

GND

1

GND

2

SATA0_TX+

2

SATA1_TX+

3

SATA0_TX-

3

SATA1_TX-

4

GND

4

GND

5

SATA0_RX-

5

SATA1_RX-

6

SATA0_RX+

6

SATA1_RX+

7

GND

7

GND

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