All CPUs integrate an Intel® UHD 620 /610 Graphics Controller, which offers an advanced 2D and 3D graphic engine and it is able to manage up to 3 independent

displays (any combination possible between HDMI, DVI, DP++, eDP, LVDS and VGA). It makes available three Digital Display Interfaces that can be used to drive

external Display Port, HDMI or DVI displays; the DDI interface #0 can be carried out on COM Express connector AB directly for the use as eDP interface or used to

realise a VGA interface by using a dedicated DP-to-VGA bridge.

The SoC’s embedded PCH (Intel® 300 Series PCH) completes the functionalities of the board offering HD Audio Interface, 9 x PCI Express ports (one of them used

to manage a Gigabit Ethernet controller, up to four of them can be grouped to offer a PEG x4 interface), up to 3x Serial ATA channels, eMMC interface, 8 USB 2.0

ports, 4 USB 3.0 ports, Real Time Clock, SPI interfaces, LPC and SM Bus.

The module can be offered with an optional additional TPM module.

application specific peripherals. This versatility allows the designer to create a dense and optimised package, which results in a more reliable product while simplifying

system integration. Most important, COM Express® modules are scalable, which means that once an application has been created there is the ability to diversify the

product range using different performance class or form factor size modules. Simply unplug one module and replace it with another, no redesign is necessary.

The robust thermal and mechanical concept, combined with extended power-management capabilities, is perfectly suited for all applications.