Second edition –September 2013 – B30067A0-MN002-01
USER MANUAL
Adbc8034
Computer On Module
DIGITAL TECHNOLOGIES FOR A BETTER WORLD
www.eurotech.com
DIGITAL TECHNOLOGIES FOR A BETTER WORLD
www.eurotech.com
© 2011-2013 Advanet Inc.
Preface
Thank you for choosing the Adbc8034. Please read this manual before using the Adbc8034 so that
you may obtain the greatest benefit from using the device.
This manual presents the specifications, functions, and method of use of the Adbc8034.
Eurotech has made every effort to carefully inspect each product and has taken great care to package
and to ship the product. In the unlikely event of the product’s failure to operate normally due to
problems in shipping or otherwise, the company will repair or replace the product at its own
responsibility.
If you have any questions, contact your local Eurotech Sales Office.See Eurotech Worldwide Presence,
page49 for full contact details.
Trademarks
All trademarks both marked and not marked appearing in this document are the property of their
respective owners.
This document does not give permission to the implementation of patents or other rights held by
Eurotech or third parties.
Document Revision History
VERSION
DATE
Publication Number
First edition
Dec 22,2011 Issued
B30067A0-MN002-00
Second edition
Sep 5,2013 Issued
B30067A0-MN002-01
DIGITAL TECHNOLOGIES FOR A BETTER WORLD
www.eurotech.com
Table of Contents
3
B30067A0-MN002-01
Table of Contents
Document Revision History ............................................................................................................................ 2
Table of Contents ............................................................................................................................................ 3
1. Important User Information ........................................................................................................................ 5
1.1 Safety Notices and Warnings ................................................................................................................... 5
1.2 Life Support Policy ................................................................................................................................... 7
1.3 Warranty ................................................................................................................................................... 7
1.4 RoHS ........................................................................................................................................................ 7
1.5 Technical Assistance ............................................................................................................................... 7
1.6 Conventions ............................................................................................................................................. 7
1.7 Electromagnetic Compatibility .................................................................................................................. 7
2. Summary ...................................................................................................................................................... 8
2.1. Features .................................................................................................................................................. 8
2.2. Block Diagram ......................................................................................................................................... 9
3. Hardware Specifications ........................................................................................................................... 10
3.1. Processor .............................................................................................................................................. 10
3.1.1. Processor Options ........................................................................................................................ 10
3.1.2. Cache Memory ............................................................................................................................. 10
3.1.3. I/O Address Map ........................................................................................................................... 10
3.1.4. Memory Address Map .................................................................................................................. 11
3.1.5. CPLD Internal Register ................................................................................................................. 11
3.2. Memory ................................................................................................................................................. 12
3.2.1. Main Memory ................................................................................................................................ 12
3.2.2. Boot ROM ..................................................................................................................................... 12
3.2.3. External Memory Interface ........................................................................................................... 13
3.3. Communication Specifications .............................................................................................................. 13
3.3.1. PCI Express Graphics .................................................................................................................. 13
3.3.2. PCI Express .................................................................................................................................. 14
3.3.3. USB .............................................................................................................................................. 14
3.3.4. Serial ATA ..................................................................................................................................... 14
3.3.5. Ethernet ........................................................................................................................................ 14
3.3.6. SMBus
（
System Management Bus
）
............................................................................................. 14
3.3.7. PCI ................................................................................................................................................ 15
3.3.8. LPC ............................................................................................................................................... 15
3.4. I/O .......................................................................................................................................................... 16
3.4.1. GPIO ............................................................................................................................................. 16
3.4.2. Graphics SDVO ............................................................................................................................ 16
3.4.3. Graphics LVDS ............................................................................................................................. 16
3.4.4. Analog VGA .................................................................................................................................. 16
3.4.5. Buzzer ........................................................................................................................................... 16
3.4.6. Suspend Status ............................................................................................................................ 17
3.5. LED ....................................................................................................................................................... 17
4. Mechanical Specifications ........................................................................................................................ 18
4.1. External Dimension ............................................................................................................................... 18
4.2. Attachment to Carrier Board ................................................................................................................. 19
4.3. Heat Spreader ....................................................................................................................................... 20
5. Cautions for Designing a Carrier Board .................................................................................................. 21
5.1. Trace Length Specification ................................................................................................................... 21
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5.1.1. USB .............................................................................................................................................. 21
5.1.2. Serial ATA ..................................................................................................................................... 21
5.1.3. SDVO ............................................................................................................................................ 21
5.1.4. LVDS ............................................................................................................................................ 21
5.2. Pull-up Register ..................................................................................................................................... 21
5.3. Power Sequence ................................................................................................................................... 22
6. Connectors and Jumpers ......................................................................................................................... 23
6.1. Adbc8034 On-board Components ........................................................................................................ 23
6.1.1. 12V Auxiliary Power Connector .................................................................................................... 23
6.2. Setting ................................................................................................................................................... 24
6.2.1. JP1 (CMOS clear pin) ................................................................................................................... 24
6.3. Pin Layout ............................................................................................................................................. 24
6.3.1. CN1 (SPI-ROM writing connector) ............................................................................................... 24
6.3.2. CN3 (CPLD data writing connector) ............................................................................................. 24
6.3.3. CN4 (COM Express stacking connector) ..................................................................................... 25
7. System Specifications............................................................................................................................... 27
7.1. Power Supply ........................................................................................................................................ 27
7.2. Electrical Specifications ........................................................................................................................ 27
7.2.1. GPIO ............................................................................................................................................. 27
7.3. Environmental Specifications ................................................................................................................ 27
8. BIOS Setup ................................................................................................................................................. 28
8.1. Main Menu ............................................................................................................................................ 28
8.1.1. System Date ................................................................................................................................. 28
8.1.2. System Time ................................................................................................................................. 28
8.1.3. System Information ....................................................................................................................... 28
8.1.4. Boot Features ............................................................................................................................... 29
8.1.5. Error Manager............................................................................................................................... 29
8.2. Advanced Menu .................................................................................................................................... 30
8.2.1. Select Language ........................................................................................................................... 30
8.2.2. ACPI Configuration ....................................................................................................................... 30
8.2.3. Processor Configuration ............................................................................................................... 31
8.2.4. Peripheral Configuration ............................................................................................................... 34
8.2.5. HDD Configuration ....................................................................................................................... 34
8.2.6. Memory Configuration .................................................................................................................. 35
8.2.7. System Agent (SA) Configuration................................................................................................. 36
8.2.8. South Bridge Configuration .......................................................................................................... 40
8.2.9. Network Configuration .................................................................................................................. 43
8.2.10. LPC Configuration ...................................................................................................................... 43
8.2.11. SMBIOS Event Log .................................................................................................................... 44
8.2.12. ME Configuration ........................................................................................................................ 44
8.2.13. Thermal Configuration ................................................................................................................ 45
8.2.14. ICC Configuration ....................................................................................................................... 46
8.2.15. Intel Rapid Start Technology ...................................................................................................... 47
8.3. Security Menu ....................................................................................................................................... 47
8.4. Boot Menu ............................................................................................................................................. 47
8.5. Exit Menu .............................................................................................................................................. 48
Eurotech Worldwide Presence ..................................................................................................................... 49
Important User Information
5
B30067A0-MN002-01
1. Important User Information
In order to lower the risk of personal injury, electric shock, fire, or equipment damage, users must
observe the following precautions as well as good technical judgment, whenever this product is
installed or used.
All reasonable efforts have been made to ensure the accuracy of this document; however, Eurotech
assumes no liability resulting from any error/omission in this document or from the use of the
information contained herein.
Eurotech reserves the right to revise this document and to change its contents at any time without
obligation to notify any person of such revision or changes. Reproduction of all or part of this
document without Eurotech’s permission is prohibited.
1.1 Safety Notices and Warnings
The following general safety precautions must be observed during all phases of operation, service, and
repair of this equipment. Failure to comply with these precautions or with specific warnings elsewhere
in this manual violates safety standards of design, manufacture, and intended use of the equipment.
Eurotech assumes no liability for the customer’s failure to comply with these requirements.
The safety precautions listed below represent warnings of certain dangers of which Eurotech is
aware.You, as the user of the product, should follow these warnings and all other safety precautions
necessary for the safe operation of the equipment in your operating environment.
Alerts that can be found throughout this manual
The following alerts are used within this manual and indicate potentially dangerous situations.
Danger, electrical shock hazard:
Information regarding potential electrical shock hazards:
Personal injury or death could occur. Also damage to the system, connected peripheral
devices, or software could occur if the warnings are not carefully followed.
Appropriate safety precautions should always be used, these should meet the
requirements set out for the environment that the equipment will be deployed in.
Warning:
Information regarding potential hazards:
Personal injury or death could occur. Also damage to the system, connected peripheral
devices, or software could occur if the warnings are not carefully followed.
Appropriate safety precautions should always be used, these should meet the
requirements set out for the environment that the equipment will be deployed in.
Information and/or Notes:
These will highlight important features or instructions that should be observed.
Protect the device from vibration and impact
Do not place the product in a location where it can fall or can be subject to vibration or impact because
this may cause device failure.
Do not modify the device
For safety reasons, under no circumstances should you modify the device. Eurotech will not repair
products that have been modified.
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Protect the product from water and chemicals
Contact between the product and water or chemicals can result in product failure, electrocution, or fire.
Protect the product from foreign material
Make sure that foreign material does not get into the product during use, storage, or transport because
this can result in product failure.
Use precautions in handling to ensure that you are not injured
The sharp projections on this product may cause injury. Take care in handling this product in order to
avoid injury.
Do not disassemble the product
In order to maintain guaranteed product performance, do not disassemble this productunder any
circumstances.
Keep the product away from radios and TVs
Do not use the product near radios, television sets, or other devices generating strong magnetic or
electrical fields. This could result in failure or malfunction.
Keep the product away from flame, humidity, and direct sunlight
Do not use or store the product in any of the following locations, as this could result in product failure:
Places where there is fire
Locations high in humidity or exposed to rain
Locations exposed to direct sunlight
Dusty or dirty locations
Locations containing excessive water or chemical vapors
Install the product in well-ventilated locations
Install the product in well-ventilated locations to efficiently disperse heat generated by the product.
Remove the power plug from the receptacle when not using the product
Turn off the main switch and remove the power plug from the receptacle when not using the product or
when there is the risk of lightning strike.
Use the device within rated parameters
Be sure to use the product within the ratings specified in this manual. Failure to do so may result in
malfunction.
Use care when cleaning the product
If the product becomes dirty, wipe it with a dry soft cloth. A thinned neutral cleaner may be used if the
product is particularly dirty. Do not use benzene, thinners, or other solvents under any circumstances.
Ground the product in order to prevent electrocution
Be sure to ground the product by connecting it to a 3-pole AC receptacle or by using an AC receptacle
having a grounding terminal.
Dispose of the product properly
Use appropriate methods for handling industrial wastes when disposing of this product.
Wire the product correctly
Failure to wire the product correctly can result in malfunction or fire. Read this manual and wire the
product correctly.
Important User Information
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B30067A0-MN002-01
Use antistatic precautions
This product comprises electronic parts that are highly susceptible to static electricity. Static electricity
can cause the product to malfunction. Take care not to touch any of the terminals, connectors, ICs, or
other parts with the hands.
Do not use a malfunctioning product
Stop using the product if you believe it is malfunctioning. Continuing to use a malfunctioning product
can cause the malfunction to spread to other products and can cause short circuits or fire.
1.2 Life Support Policy
Eurotech products are not authorized for use as critical components in life support devices or systems
without the express written approval of Eurotech.
1.3 Warranty
For warranty terms and conditions users should contact their local Eurotech Sales Office.
See Eurotech Worldwide Presence, page49 for full contact details.
1.4 RoHS
This device, including all its components, subassemblies and the consumable materials that are an
integral part of the product, has been manufactured in compliance with the European directive
2002/95/EC known as the RoHS directive (Restrictions on the use of certain Hazardous Substances).
This directive targets the reduction of certain hazardous substances previously used in electrical and
electronic equipment (EEE).
1.5 Technical Assistance
If you have any technical questions, cannot isolate a problem with your device, or have any enquiry
about repair and returns policies, contact your local Eurotech Technical Support Team.
See Eurotech Worldwide Presence, page 49for full contact details.
Transportation
When transporting any module or system, for any reason, it should be packed using anti-static material
and placed in a sturdy box with enough packing material to adequately cushion it.
Warning:
Any product returned to Eurotech that is damaged due to inappropriate packaging will not be covered by the
warranty.
1.6 Conventions
The following table describes the conventions for signal names used in this document.
Convention
Explanation
GND
Digital ground plane
#
Active low signal
+
Positive signal in differential pair
-
Negative signal in differential pair
NC
No connection
RSVD
Use is reserved to Eurotech
1.7 Electromagnetic Compatibility
This product is intended for industrial assembly only and is not for commercial use. Therefore, this
product is not an apparatus and so does not need to be subject to the EMC Directive.
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2. Summary
Adbc8034 is a Computer-On-Module (COM) based on Intel®Core
TM
i7 / Core
TM
i5 mobile processor
and compatible with PICMG COM.0 R1.0. You can build a wide range of embedded systems by
combining this COM with a carrier board you prefer.
Adbc8034 offers 4 choices of processors for different performances required.
Based on Hyper-Threading technology, the Intel®Core
TM
i7 2715QE mobile processor enables
simultaneous performance of 8 threads on quad-core, and is suited for applications requiring high
performance. Performance in single thread is improved by the Turbo Boost function. It also supports
dual displays with its built-in High-performance graphics function. It speeds up encryption and
decryption with its built-in AES code engine.
Intel®Core
TM
i5 2515E / Core
TM
i7 2655LE / Core
TM
i7 2610UE mobile processors enable simultaneous
performance of 4 threads on dual-core.
Having a direct-mounted DDR3-1333 supporting ECC as the main memory, Adbc8034 is suitable for
embedded systems requiring high reliability and high performance. Maximum memory capacity is 8GB.
The memory automatically corrects 1 bit corruption within 72 bits, and can also detect 2 bit corruption.
2.1. Features
Adbc8034 has the following features:
Intel®Core
TM
i7 / Core
TM
i5 mobile processor
COM Express CPU module (type2 pin-out)
COM Express Basic Module size (125mm x 95mm)
ECC supported DDR3-1333 memory direct-mounted on board (maximum capacity of memory: 8GB)
1 port of 10/100/1000Base-T Ethernet
1 port of SDVO graphics interface
1 port of LVDS graphics interface
1 port of Analog VGA graphics
2 ports of SATA-600 interface
2 ports of SATA-300 interface
8 ports of USB2.0 interface
1 port of PCI Express Graphics X16 link (also available as 2 ports of X8 at factory option)
1 port of PCI Express X4 link (also available as 4 ports of X1)
2 ports of PCI Express X1 link
1 port of PCI 32bit/33MHz
1 port of LPC Bus
Various OS including Windows 7, Windows Embedded Standard 7, and Wind River Linux are
supported
RoHS compliant
Summary
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2.2. Block Diagram
Adbc8034 Block Diagram is shown in Fig.1.
Fig.1 Block Diagram
PCIe
X16
PCIe
SDVO
LVDS
SATA
SATA
SATA
SATA
Power Regulators
Reset Generators
BIOS
CPLD
PCIe
X1
PCIe
X1
VGA
X4
FDI
COMe CN.
PEG
DMI2
Intel
®
Sandy Bridge+ECC
Processor
X4
X8
Dual Channel Mode Supported
72
DDR3-1333 SDRAM
with ECC
72
DDR3-1333 SDRAM
with ECC
X1
10/100/1000
BASE-T
LPC
SMBus
I
2
CBus
PCI32/33
X1
Ethernet
Intel 82579
4
32
PCI Bridge
PLX 8112
Intel
®
Cougar Point
Chipset
SPI
SMBus
LPC
PCIe
SDVO
LVDS
SATA
SATA
SATA
SATA
USB
USB
USB
USB
USB
USB
USB
USB
USB
USB
USB
USB
USB
USB
USB
USB
PCIe
SDVO
LVDS
SATA
SATA
SATA
SATA
PCIe
PCIe
PCIe
VGA
PCIe
Multiplex
EEPROM
PCIe
PCIe
VGA
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3. Hardware Specifications
3.1. Processor
3.1.1. Processor Options
The following 4 processors are available at factory option:
Intel®Core
TM
i7-2715QEMobile Processor at 2.1GHz(TDP:45W)
Intel®Core
TM
i5-2515EMobile Processor at 2.5GHz(TDP:35W)
Intel®Core
TM
i7-2655LEMobile Processor at 2.2GHz(TDP:25W)
Intel®Core
TM
i7-2610UEMobile Processor at 1.5GHz(TDP:17W)
3.1.2. Cache Memory
Adbc8034 has the following cache memory:
L1 cache
32kB for data, 32kB for instruction (per core)
L2 cache
256kB for data and instruction (per core)
L3 cache (shared by all cores)
o Core
TM
i7-2715QE:6MB
o Core
TM
i5-2515E:3MB
o Core
TM
i7-2655LE:4MB
o Core
TM
i7-2610UE:4MB
3.1.3. I/O Address Map
I/O space Address Map is shown in Table 1.
Table 1. I/O space Address Map
Device
Address
DMA Controller
0000h - 001Fh
Interrupt Controller
0020h - 002Dh
LPC SIO
002Eh - 002Fh
Interrupt Controller
0030h - 003Dh
Timer/Counter
0040h - 0043h
LPC SIO
004Eh - 004Fh
Timer/Counter
0050h - 0053h
Microcontroller
0060h
NMI Controller
0061h
Microcontroller
0062h - 0066h
RTC Controller
0070h - 0077h
DMA Controller
0080h - 0091h
Reset Generator
0092h
DMA Controller
0093h - 009Fh
Interrupt Controller
00A0h - 00B1h
Power Management
00B2h - 00B3h
Interrupt Controller
00B4h - 00BDh
DMA Controller
00C0h - 00DFh
PCI and Master Abort
00F0h
Serial ATA
0170h - 0177h
Serial ATA
01F0h - 01F7h
Serial ATA
0376h
Serial ATA
03F6h
Interrupt Controller
04D0h - 04D1h
Reset Generator
0CF9h
Hardware Specifications
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B30067A0-MN002-01
3.1.4. Memory Address Map
Memory space Address Map is shown in Table 2.
Table 2. Memory space Address Map
Device
Address
Main Memory
0000_0000h
--- 000D_FFFFh
LPC(BIOS)(*1)
000E_0000h
--- 000F_FFFFh
Main Memory / PCI Device
0010_0000h
--- TOM(*2)
I/O APIC
FEC0_0000h
--- FECF_FFFFh
High Precision Event Timers
FED0_0000h
--- FED0_33FFh
TPM on LPC
FED4_0000h
--- FED4_BFFFh
LPC(BIOS)(*1)
FF00_0000h
--- FFFF_FFFFh
*1: Occupied area depends on the setting of Firmware Hub Decode Enable.
*2: Most significant address depends on the setting of TOM register.
3.1.5. CPLD Internal Register
CPLD Internal Register is shown in Table 3.
Table 3. CPLD Internal Register map
Register Name
Address
Item
LED Control Register
0000h
3.1.5.1.
Status Register
0001h
3.1.5.2.
Thermal Monitor Select Register
0002h
3.1.5.3.
Thermal Monitor Register
0003h
3.1.5.4.
CPLD is mounted as internal control logic on Adbc8034.
CPLD internal register is accessible by LPC bus of 3.3.8. LPC on page 15. The base address is 0280h.
The register is configured with 8-bit. Both Read (shown below as: R) and Write (shown below as: W)
are performed by 8-bit length.
R/W : Read and Write
RO : Read only
WO : Write only
3.1.5.1. LED Control Register (offset：0000h)
This register controls LED on Adbc8034.
Table 4. LED Control Register
bit
Name
Meaning
Initial Value
Access
7..3
RSVD
RSVD
00000
RO
2
LED_EN
1：RED/GRN_LED control enabled
0：RED/GRN_LED control disabled
0
R/W
1
RED_LED
1：LED (RED) On
0：LED (RED) Off
0
R/W
0
GRN_LED
1：LED (GRN) On
0：LED (GRN) Off
0
R/W
※ LED_EN=’0’: RED_LED turns on during assertion of the Platform reset that is output by
PCH,while GRN_LED turns on during de-assertion. Please refer to 3.5. LED on page 17 for
further details.
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3.1.5.2. Status Register (offset：0001h)
This register shows the logic of SPD Write Protect signal and input signal from carrier board.
Table 5. Status Register
bit
Name
Meaning
Initial Value
Access
7..4
RSVD
RSVD
000000
RO
3
BIOS_DISABLE#
Request signal from carrier board
-
RO
2
THRM#
1：Temperature sensor on carrier board shows a
normal value
0：Temperature sensor on carrier board is shows
an abnormal value
-
RO
1
BATLOW#
1：battery voltage on carrier board is a normal value
0：battery voltage on carrier board is an abnormal
value
-
RO
0
SPD_WP
WP of EEPROM for SPD
Write 0 when rewriting software
1
R/W
3.1.5.3. Thermal Monitor Select Register (offset：0002h)
This register selects a thermal monitor connected to the CPLD that is being read out.
Table 6. Thermal status register
bit
Name
Meaning
Initial Value
Access
7..2
RSVD
RSVD
000000
RO
1..0
THRM_MONI_SEL
Thermal monitor temperature selected from the
following options can be read out by thermal
monitor register (offset：0003h).
11：RSVD
10：GBE_THRM (ambient temperatureof
GbE(82579))
01：DDR3B_THRM(ambient temperature of
DDR3(solder side))
00：DDR3A_THRM(ambient temperature of DDR3
(component side))
00
R/W
3.1.5.4. Thermal Monitor Register (offset：0003h)
This register displays temperature value read out by the thermal monitor.
Table 7. Thermal Monitor Register
bit
Name
Meaning
Initial Value
Access
7..0
THRM
Displays the temperature value read out from the
thermal monitor selected by THRM_MONI_SEL
(0 to 255℃, 1℃/LSB)
00000000
RO
3.2. Memory
Adbc8034 memory is shown below.
3.2.1. Main Memory
The main memory of Adbc8034 is DDR3-1333 SDRAM.
You can choose the memory capacity from 1GB, 2GB, 4GB, or 8GB at factory option.
It supports ECC, automatically corrects 1-bit error, and also detects 2-bit errors.
3.2.2. Boot ROM
This is a SPI-FLASH memory directly-mounted on Adbc8034 with 8MB of capacity.
It saves BIOS data and configuration data.
Hardware Specifications
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3.2.3. External Memory Interface
Adbc8034 has the following 2 external memory interfaces for mass storage devices and boot option.
They are connected by 6.3.3. CN4 (COM Express stacking connector) on page 25.
Serial ATA
Adbc8034 has 4 serial ATA ports, which can boot from mass storage devices connected to the serial
ATA port such as HDD and SSD.
USB
Adbc8034 has 8 USB ports, which can boot from USB floppy or USB-CD (DVD)-ROM.
3.3. Communication Specifications
Adbc8034 has the following communication specifications with external devices. It is connected by
6.3.3. CN4 (COM Express stacking connector) on page 25 to communicate with external devices.
3.3.1. PCI Express Graphics
You can choose a PCI Express Graphics link configuration from the following three options.
Link Configuration 1 : 1 port of X8 Link+ 2 ports of X4 Link (option)
Link Configuration 2 : 2 ports of X8 Link (option)
Link Configuration 3 : 1 port of X16 Link (default)
All ports are compliant with PCI Express Rev2.0 standard.
PCI Express Graphics Link configuration is shown in Table 8.
Table 8. PCI Express Graphics Link Configuration
COM Express
Pin Name
PCI Express
Lane
Link Configuration
1
Link Configuration
2
Link Configuration
3
PCIE15
15
X 4
X 8
X 16
PCIE14
14
PCIE13
13
PCIE12
12
PCIE11
11
X 4
PCIE10
10
PCIE9
9
PCIE8
8
PCIE7
7
X 8
X 8
PCIE6
6
PCIE5
5
PCIE4
4
PCIE3
3
PCIE2
2
PCIE1
1
PCIE0
0
Lane reverse setting to reverse the row of PCI Express lanes is also available at factory option.
Lane is not reversed at the factory default as is shown in Table 8.
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3.3.2. PCI Express
Adbc8034 is compliant with PCI Express Rev2.0 standard.
There are 4 options for PCI Express Link configuration at factory option as shown in Table 9.
The factory default is Link Configuration 4.
Table 9. PCI Express Link Configuration
COM Express
Pin Name
PCI Express
lane
Link Configuration 1
Link Configuration 2
Link Configuration 3
Link Configuration 4
PCIE5
4
X 1(*3)
PCIE4
3
X 1
PCIE3
8
X 1(*3)
X 1(*3)
X 2(*3)
X 4
PCIE2
7
X 1(*3)
X 1(*3)
PCIE1
6
X 1(*3)
X 2
X 2
PCIE0
5
X 1
*3: under evaluation
3.3.3. USB
Adbc8034 has 8 USB ports compliant with the USB2.0 standard.
3.3.4. Serial ATA
Adbc8034 has 4 ports of Serial ATA in total; 2 ports (SATA0/1) of Serial ATA 3 (maximum transfer
speed: 6Gb/s) and 2 ports (SATA2/3) of Serial ATA 2 (maximum transfer speed: 3Gb/s).
3.3.5. Ethernet
Adbc8034 has an Ethernet port compliant with the10/100/1000Base-T standard.
It also supports Intel® AMT7.0.
3.3.6. SMBus
（
System Management Bus
）
Adbc8034 has an I
2
C multiplexer at the SMBus interface to carrier board.
It also has a SMBus port compliant with the SMBus 2.0 standard. The SMBus address map is shown
in Table 10.
Table 10. SMBus Address Map
Device
Address
Main Memory SPD(channel A)
1010 000b
Main memory SPD(channel B)
1010 001b
I
2
C multiplexer (PCA9544APW)
1110 000b
I
2
C multiplexer channel map is shown in Table 11.
Table 11. I
2
C multiplexer channel map
Device
Address
Unused
0
Carrier board SMBus
1
Carrier board I
2
C
2
Unused
3
Channel is not selected after BIOS start up. Do not switch to channel 0 or channel 3 as they are
unused.
Please refer to the PCA9544APW (NXP) datasheet for I
2
C multiplexer setting method.
Hardware Specifications
15
B30067A0-MN002-01
3.3.7. PCI
Adbc8034 has a 32bit/33MHz PCI bus compliant with the PCI Local Bus Specification Revision 2.3
standard.
Signal level: 3.3V.
PCI devices are shown in Table 12.
Table 12. List of PCI devices
Bus
number
Device
number
Function
number
Device
Device model
number
0
0
0
DRAM Controller
Intel
®
Core
TM
i7/i5
1
0
PCI Express Controller 1
Intel
®
Core
TM
i7/i5
1
PCI Express Controller 2
Intel
®
Core
TM
i7/i5
2
PCI Express Controller 3
Intel
®
Core
TM
i7/i5
2
0
Integrated Graphics Device
Intel
®
Core
TM
i7/i5
6
0
PCI Express Controller 4
Intel
®
Core
TM
i7/i5
22
0
Intel
®
Management Engine Interface #1
Intel
®
QM67
1
Intel
®
Management Engine Interface #2
Intel
®
QM67
2
IDE-R
Intel
®
QM67
3
KT
Intel
®
QM67
25
0
Gigabit Ethernet Controller
Intel
®
QM67
26
0 to 7
USB EHCI Controller #2
Intel
®
QM67
27
0 to 7
Intel
®
High Definition Audio Controller
Intel
®
QM67
28
0
PCI Express Port 1
Intel
®
QM67
1
PCI Express Port 2
Intel
®
QM67
2
PCI Express Port 3
Intel
®
QM67
3
PCI Express Port 4
Intel
®
QM67
4
PCI Express Port 5
Intel
®
QM67
5
PCI Express Port 6
Intel
®
QM67
6
PCI Express Port 7
Intel
®
QM67
7
PCI Express Port 8
Intel
®
QM67
29
0 to 7
USB EHCI Controller #1
Intel
®
QM67
30
0
PCI-to-PCI Bridge
Intel
®
QM67
31
0
LPC Controller
Intel
®
QM67
2
SATA Controller #1
Intel
®
QM67
3
SMBus Controller
Intel
®
QM67
5
SATA Controller #2
Intel
®
QM67
6
Thermal Subsystem
Intel
®
QM67
M(*4)
－
－
PCI Express
－
*4：M depends on the largest bus number shown on PCI Express.
3.3.8. LPC
Adbc8034 has a port compliant with the LPC1.1 standard.
The LPC bus is used for general purpose I/O extension and communication with low bandwidth
devices.
Adbc8034 - User Manual
16
B30067A0-MN002-01
3.4. I/O
Adbc8034 has the following interfaces to external devices.
They are connected by 6.3.3. CN4 (COM Express stacking connector) on page 25.
3.4.1. GPIO
Adbc8034 has a GPI control register and a GPO control register.
The features of GPIO are shown below.
3.4.1.1. GPI
Adbc8034 is equipped with 4 general inputs. They can be read out from the Intel QM67 PCH register.
GPI is set as input pin in BIOS. The register where GPI is allocated is shown in Table 13.
Table 13. GPI control register
Signal
Intel QM67connecting pin
Supporting register Bit
GPI0
GPIO68
GP_LVL3 bit 4
GPI1
GPIO69
GP_LVL3 bit 5
GPI2
GPIO70
GP_LVL3 bit 6
GPI3
GPIO71
GP_LVL3 bit 7
High logic level (“1”) is read from the register while High level voltage is applied to the input pin, and
Low logic level (“0”) is read from the register while Low level voltage is applied to the input pin. Please
refer to 7.2. Electrical Specifications on page 27 for electrical specifications.
3.4.1.2. GPO
Adbc8034 is equipped with 4 general outputs. Status can be changed by writing in the Intel QM67
PCH register. GPO is set as the output pin in BIOS. The register where GPO is allocated is shown in
Table 14.
Table 14. GPO control register
Signal
Intel QM67connecting
pin
Supporting register Bit
Initial setting
(logic level)
GPO0
GPIO8
GP_LVL bit 8
High
GPO1
GPIO15
GP_LVL bit 15
Low
GPO2
GPIO24
GP_LVL bit 24
Low
GPO3
GPIO28
GP_LVL bit 28
Low
It outputs High level voltage when High logic level (“1”) is written in the register, while it outputs Low
level voltage when Low logic level (“0”) is written in it. Please refer to 7.2. Electrical Specifications on
page 27 for electrical specifications.
3.4.2. Graphics SDVO
Adbc8034 has a SVDO port.
When using our carrier board Adbc8031-CAR, the maximum resolution is 1920×1200.
3.4.3. Graphics LVDS
Adbc8034 has a LVDS port.
It is confirmed to operate at the resolution of 1920×1200.
3.4.4. Analog VGA
Adbc8034 has an Analog VGA port for monitoring VGA.
3.4.5. Buzzer
Adbc8034 outputs buzzer output SPKR signal from 6.3.3. CN4 (COM Express stacking connector) on
page 25.
Hardware Specifications
17
B30067A0-MN002-01
3.4.6. Suspend Status
Adbc8034 outputs SUS_STAT#/SUS_S3#/SUS_S4#/SUS_S5# signal from 6.3.3. CN4 (COM Express
stacking connector) on page 25.
3.5. LED
Adbc8034 has green and red LEDs.
The conditions for turning on and off the LEDs are shown in Table 15.
Table 15. LED Condition
LED_EN
PCH platform reset
LED1(Green)
LED2(Red)
0
Assert
Off
On
De-assert
On
Off
1
-
GRN_LED=’1’→On
RED_LED=’1’→On
-
GRN_LED=’0’→ Off
RED_LED=’0’→Off
※Assert of PCH platform reset means that the internal board is being initialized, and de-assert means
that the initialization is finished.
Adbc8034 - User Manual
18
B30067A0-MN002-01
4. Mechanical Specifications
Adbc8034 is compliant with the PICMG COM.0 COM Express Module Base Specification Rev 1.0
standard. Mechanical specifications are shown in Table 16.
Table 16. Mechanical Specifications
Characteristic
Contents
Form Factor
125mm x 95mm x 21mm (basic module size)
※21mm is the height between the component side of carrier board and upper
side of heat spreader with the stack height of 8mm
Pin out type
Compliant with Type 2
Advanet’s original pin layout is used for some parts
Weight
285g (Including heat spreader and attachment spacers)
4.1. External Dimension
External dimensions of Adbc8034 are shown in Fig.2.
Unit : mm
*5: Height of the mounted components (on the solder side) does not exceed 3.8mm.
Fig.2 External dimensions of Adbc8034
Mechanical Specifications
19
B30067A0-MN002-01
4.2. Attachment to Carrier Board
Please follow the instructions below to attach the Adbc8034 to your carrier board.
Please handle the board with ESD measures such as wearing an antistatic bracelet so as not to
damage the device by static electricity.
Fig.3. Attachment to Carrier Board
○Attachment to Carrier Board
(1) Turn off the power to the board.
(2) Remove spacer and other components attached to the bottom of the carrier board.
(3) Place the Adbc8034 on the carrier board so that the 5 stacking connectors and the corresponding
holes for fixing the spacers match.
(4) Press both ends of stacking connectors of heat spreader on the Adbc8034 to put them into the
carrier board connectors. In order to avoid flexing the carrier board, place a support at the bottom
of the carrier board stacking connector. Confirm that the connectors fit correctly.
(5) Double check that the Adbc8034 and the carrier board fit correctly.
(6) Fix the boards with the five screws (M2.5 x 5mm sems screw) from the bottom side of the carrier
board.
○Removal from Carrier Board
Please follow the instructions below to remove the Adbc8034 from the carrier board.
Please handle the board with ESD measures such as wearing an antistatic bracelet so as not to
damage the device by static electricity.
(1) Turn off the power to the board.
(2) Remove the 5 screws from the bottom of the carrier board.
(3) Keep the Adbc8034 horizontal and lift it upward to remove from the carrier board.
Adbc8034 - User Manual
20
B30067A0-MN002-01
4.3. Heat Spreader
The Adbc8034 comes with a heat spreader. Please place a cooling system such as a heat sink on the
heat spreader so that the CPU can dissipate its heat during operation.
Capabilities required for the cooling system such as heat sink varies depending on the conditions such
as ambient temperature and wind velocity. Each processor requires a cooling system with the following
heat resistance value attached on the heat spreader when it is operated below 60℃.
Table 17. Required heat resistance for cooling system
Processor Type
TurboBoost
Heat resistance of cooling system
Intel
®
Core
TM
i7-2715QE
ON
Below 0.19℃/W
OFF
Below 0.40℃/W
Intel
®
Core
TM
i5-2515E
ON
Below 0.42℃/W
OFF
Below 0.65℃/W
Intel
®
Core
TM
i7-2655LE
ON
Below 0.62℃/W
OFF
Below 1.11℃/W
Intel
®
Core
TM
i7-2610UE
ON
Below 1.18℃/W
OFF
Below 1.86℃/W
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