Eurotech Adbc8034 Owner's manual

Brand: Eurotech

Model: Adbc8034

Category: Motherboards

Type: Owner's manual

Second edition –September 2013 – B30067A0-MN002-01

USER MANUAL

Adbc8034

Computer On Module

DIGITAL TECHNOLOGIES FOR A BETTER WORLD

www.eurotech.com

DIGITAL TECHNOLOGIES FOR A BETTER WORLD

www.eurotech.com

Preface

Thank you for choosing the Adbc8034. Please read this manual before using the Adbc8034 so that

you may obtain the greatest benefit from using the device.

This manual presents the specifications, functions, and method of use of the Adbc8034.

Eurotech has made every effort to carefully inspect each product and has taken great care to package

and to ship the product. In the unlikely event of the product’s failure to operate normally due to

problems in shipping or otherwise, the company will repair or replace the product at its own

responsibility.

If you have any questions, contact your local Eurotech Sales Office.See Eurotech Worldwide Presence,

page49 for full contact details.

Trademarks

All trademarks both marked and not marked appearing in this document are the property of their

respective owners.

This document does not give permission to the implementation of patents or other rights held by

Eurotech or third parties.

Document Revision History

VERSION

DATE

Publication Number

First edition

Dec 22,2011 Issued

B30067A0-MN002-00

Second edition

Sep 5,2013 Issued

B30067A0-MN002-01

DIGITAL TECHNOLOGIES FOR A BETTER WORLD

www.eurotech.com

Table of Contents

B30067A0-MN002-01

Table of Contents

Document Revision History ............................................................................................................................ 2

Table of Contents ............................................................................................................................................ 3

1. Important User Information ........................................................................................................................ 5

1.1 Safety Notices and Warnings ................................................................................................................... 5

1.2 Life Support Policy ................................................................................................................................... 7

1.3 Warranty ................................................................................................................................................... 7

1.4 RoHS ........................................................................................................................................................ 7

1.5 Technical Assistance ............................................................................................................................... 7

1.6 Conventions ............................................................................................................................................. 7

1.7 Electromagnetic Compatibility .................................................................................................................. 7

2. Summary ...................................................................................................................................................... 8

2.1. Features .................................................................................................................................................. 8

2.2. Block Diagram ......................................................................................................................................... 9

3. Hardware Specifications ........................................................................................................................... 10

3.1. Processor .............................................................................................................................................. 10

3.1.1. Processor Options ........................................................................................................................ 10

3.1.2. Cache Memory ............................................................................................................................. 10

3.1.3. I/O Address Map ........................................................................................................................... 10

3.1.4. Memory Address Map .................................................................................................................. 11

3.1.5. CPLD Internal Register ................................................................................................................. 11

3.2. Memory ................................................................................................................................................. 12

3.2.1. Main Memory ................................................................................................................................ 12

3.2.2. Boot ROM ..................................................................................................................................... 12

3.2.3. External Memory Interface ........................................................................................................... 13

3.3. Communication Specifications .............................................................................................................. 13

3.3.1. PCI Express Graphics .................................................................................................................. 13

3.3.2. PCI Express .................................................................................................................................. 14

3.3.3. USB .............................................................................................................................................. 14

3.3.4. Serial ATA ..................................................................................................................................... 14

3.3.5. Ethernet ........................................................................................................................................ 14

3.3.6. SMBus

（

System Management Bus

）

............................................................................................. 14

3.3.7. PCI ................................................................................................................................................ 15

3.3.8. LPC ............................................................................................................................................... 15

3.4. I/O .......................................................................................................................................................... 16

3.4.1. GPIO ............................................................................................................................................. 16

3.4.2. Graphics SDVO ............................................................................................................................ 16

3.4.3. Graphics LVDS ............................................................................................................................. 16

3.4.4. Analog VGA .................................................................................................................................. 16

3.4.5. Buzzer ........................................................................................................................................... 16

3.4.6. Suspend Status ............................................................................................................................ 17

3.5. LED ....................................................................................................................................................... 17

4. Mechanical Specifications ........................................................................................................................ 18

4.1. External Dimension ............................................................................................................................... 18

4.2. Attachment to Carrier Board ................................................................................................................. 19

4.3. Heat Spreader ....................................................................................................................................... 20

5. Cautions for Designing a Carrier Board .................................................................................................. 21

5.1. Trace Length Specification ................................................................................................................... 21

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5.1.1. USB .............................................................................................................................................. 21

5.1.2. Serial ATA ..................................................................................................................................... 21

5.1.3. SDVO ............................................................................................................................................ 21

5.1.4. LVDS ............................................................................................................................................ 21

5.2. Pull-up Register ..................................................................................................................................... 21

5.3. Power Sequence ................................................................................................................................... 22

6. Connectors and Jumpers ......................................................................................................................... 23

6.1. Adbc8034 On-board Components ........................................................................................................ 23

6.1.1. 12V Auxiliary Power Connector .................................................................................................... 23

6.2. Setting ................................................................................................................................................... 24

6.2.1. JP1 (CMOS clear pin) ................................................................................................................... 24

6.3. Pin Layout ............................................................................................................................................. 24

6.3.1. CN1 (SPI-ROM writing connector) ............................................................................................... 24

6.3.2. CN3 (CPLD data writing connector) ............................................................................................. 24

6.3.3. CN4 (COM Express stacking connector) ..................................................................................... 25

7. System Specifications............................................................................................................................... 27

7.1. Power Supply ........................................................................................................................................ 27

7.2. Electrical Specifications ........................................................................................................................ 27

7.2.1. GPIO ............................................................................................................................................. 27

7.3. Environmental Specifications ................................................................................................................ 27

8. BIOS Setup ................................................................................................................................................. 28

8.1. Main Menu ............................................................................................................................................ 28

8.1.1. System Date ................................................................................................................................. 28

8.1.2. System Time ................................................................................................................................. 28

8.1.3. System Information ....................................................................................................................... 28

8.1.4. Boot Features ............................................................................................................................... 29

8.1.5. Error Manager............................................................................................................................... 29

8.2. Advanced Menu .................................................................................................................................... 30

8.2.1. Select Language ........................................................................................................................... 30

8.2.2. ACPI Configuration ....................................................................................................................... 30

8.2.3. Processor Configuration ............................................................................................................... 31

8.2.4. Peripheral Configuration ............................................................................................................... 34

8.2.5. HDD Configuration ....................................................................................................................... 34

8.2.6. Memory Configuration .................................................................................................................. 35

8.2.7. System Agent (SA) Configuration................................................................................................. 36

8.2.8. South Bridge Configuration .......................................................................................................... 40

8.2.9. Network Configuration .................................................................................................................. 43

8.2.10. LPC Configuration ...................................................................................................................... 43

8.2.11. SMBIOS Event Log .................................................................................................................... 44

8.2.12. ME Configuration ........................................................................................................................ 44

8.2.13. Thermal Configuration ................................................................................................................ 45

8.2.14. ICC Configuration ....................................................................................................................... 46

8.2.15. Intel Rapid Start Technology ...................................................................................................... 47

8.3. Security Menu ....................................................................................................................................... 47

8.4. Boot Menu ............................................................................................................................................. 47

8.5. Exit Menu .............................................................................................................................................. 48

Eurotech Worldwide Presence ..................................................................................................................... 49

Important User Information

B30067A0-MN002-01

1. Important User Information

In order to lower the risk of personal injury, electric shock, fire, or equipment damage, users must

observe the following precautions as well as good technical judgment, whenever this product is

installed or used.

All reasonable efforts have been made to ensure the accuracy of this document; however, Eurotech

assumes no liability resulting from any error/omission in this document or from the use of the

information contained herein.

Eurotech reserves the right to revise this document and to change its contents at any time without

obligation to notify any person of such revision or changes. Reproduction of all or part of this

document without Eurotech’s permission is prohibited.

1.1 Safety Notices and Warnings

The following general safety precautions must be observed during all phases of operation, service, and

repair of this equipment. Failure to comply with these precautions or with specific warnings elsewhere

in this manual violates safety standards of design, manufacture, and intended use of the equipment.

Eurotech assumes no liability for the customer’s failure to comply with these requirements.

The safety precautions listed below represent warnings of certain dangers of which Eurotech is

aware.You, as the user of the product, should follow these warnings and all other safety precautions

necessary for the safe operation of the equipment in your operating environment.

Alerts that can be found throughout this manual

The following alerts are used within this manual and indicate potentially dangerous situations.

Danger, electrical shock hazard:

Information regarding potential electrical shock hazards:

Personal injury or death could occur. Also damage to the system, connected peripheral

devices, or software could occur if the warnings are not carefully followed.

Appropriate safety precautions should always be used, these should meet the

requirements set out for the environment that the equipment will be deployed in.

Warning:

Information regarding potential hazards:

Personal injury or death could occur. Also damage to the system, connected peripheral

devices, or software could occur if the warnings are not carefully followed.

Appropriate safety precautions should always be used, these should meet the

requirements set out for the environment that the equipment will be deployed in.

Information and/or Notes:

These will highlight important features or instructions that should be observed.

Protect the device from vibration and impact

Do not place the product in a location where it can fall or can be subject to vibration or impact because

this may cause device failure.

Do not modify the device

For safety reasons, under no circumstances should you modify the device. Eurotech will not repair

products that have been modified.

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Protect the product from water and chemicals

Contact between the product and water or chemicals can result in product failure, electrocution, or fire.

Protect the product from foreign material

Make sure that foreign material does not get into the product during use, storage, or transport because

this can result in product failure.

Use precautions in handling to ensure that you are not injured

The sharp projections on this product may cause injury. Take care in handling this product in order to

avoid injury.

Do not disassemble the product

In order to maintain guaranteed product performance, do not disassemble this productunder any

circumstances.

Keep the product away from radios and TVs

Do not use the product near radios, television sets, or other devices generating strong magnetic or

electrical fields. This could result in failure or malfunction.

Keep the product away from flame, humidity, and direct sunlight

Do not use or store the product in any of the following locations, as this could result in product failure:

 Places where there is fire

 Locations high in humidity or exposed to rain

 Locations exposed to direct sunlight

 Dusty or dirty locations

 Locations containing excessive water or chemical vapors

Install the product in well-ventilated locations

Install the product in well-ventilated locations to efficiently disperse heat generated by the product.

Remove the power plug from the receptacle when not using the product

Turn off the main switch and remove the power plug from the receptacle when not using the product or

when there is the risk of lightning strike.

Use the device within rated parameters

Be sure to use the product within the ratings specified in this manual. Failure to do so may result in

malfunction.

Use care when cleaning the product

If the product becomes dirty, wipe it with a dry soft cloth. A thinned neutral cleaner may be used if the

product is particularly dirty. Do not use benzene, thinners, or other solvents under any circumstances.

Ground the product in order to prevent electrocution

Be sure to ground the product by connecting it to a 3-pole AC receptacle or by using an AC receptacle

having a grounding terminal.

Dispose of the product properly

Use appropriate methods for handling industrial wastes when disposing of this product.

Wire the product correctly

Failure to wire the product correctly can result in malfunction or fire. Read this manual and wire the

product correctly.

Important User Information

B30067A0-MN002-01

Use antistatic precautions

This product comprises electronic parts that are highly susceptible to static electricity. Static electricity

can cause the product to malfunction. Take care not to touch any of the terminals, connectors, ICs, or

other parts with the hands.

Do not use a malfunctioning product

Stop using the product if you believe it is malfunctioning. Continuing to use a malfunctioning product

can cause the malfunction to spread to other products and can cause short circuits or fire.

1.2 Life Support Policy

Eurotech products are not authorized for use as critical components in life support devices or systems

without the express written approval of Eurotech.

1.3 Warranty

For warranty terms and conditions users should contact their local Eurotech Sales Office.

See Eurotech Worldwide Presence, page49 for full contact details.

1.4 RoHS

This device, including all its components, subassemblies and the consumable materials that are an

integral part of the product, has been manufactured in compliance with the European directive

2002/95/EC known as the RoHS directive (Restrictions on the use of certain Hazardous Substances).

This directive targets the reduction of certain hazardous substances previously used in electrical and

electronic equipment (EEE).

1.5 Technical Assistance

If you have any technical questions, cannot isolate a problem with your device, or have any enquiry

about repair and returns policies, contact your local Eurotech Technical Support Team.

See Eurotech Worldwide Presence, page 49for full contact details.

Transportation

When transporting any module or system, for any reason, it should be packed using anti-static material

and placed in a sturdy box with enough packing material to adequately cushion it.

Warning:

Any product returned to Eurotech that is damaged due to inappropriate packaging will not be covered by the

warranty.

1.6 Conventions

The following table describes the conventions for signal names used in this document.

Convention

Explanation

GND

Digital ground plane

Active low signal

Positive signal in differential pair

Negative signal in differential pair

No connection

RSVD

Use is reserved to Eurotech

1.7 Electromagnetic Compatibility

This product is intended for industrial assembly only and is not for commercial use. Therefore, this

product is not an apparatus and so does not need to be subject to the EMC Directive.

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2. Summary

Adbc8034 is a Computer-On-Module (COM) based on Intel®Core

i7 / Core

i5 mobile processor

and compatible with PICMG COM.0 R1.0. You can build a wide range of embedded systems by

combining this COM with a carrier board you prefer.

Adbc8034 offers 4 choices of processors for different performances required.

Based on Hyper-Threading technology, the Intel®Core

i7 2715QE mobile processor enables

simultaneous performance of 8 threads on quad-core, and is suited for applications requiring high

performance. Performance in single thread is improved by the Turbo Boost function. It also supports

dual displays with its built-in High-performance graphics function. It speeds up encryption and

decryption with its built-in AES code engine.

Intel®Core

i5 2515E / Core

i7 2655LE / Core

i7 2610UE mobile processors enable simultaneous

performance of 4 threads on dual-core.

Having a direct-mounted DDR3-1333 supporting ECC as the main memory, Adbc8034 is suitable for

embedded systems requiring high reliability and high performance. Maximum memory capacity is 8GB.

The memory automatically corrects 1 bit corruption within 72 bits, and can also detect 2 bit corruption.

2.1. Features

Adbc8034 has the following features:

 Intel®Core

i7 / Core

i5 mobile processor

 COM Express CPU module (type2 pin-out)

 COM Express Basic Module size (125mm x 95mm)

 ECC supported DDR3-1333 memory direct-mounted on board (maximum capacity of memory: 8GB)

 1 port of 10/100/1000Base-T Ethernet

 1 port of SDVO graphics interface

 1 port of LVDS graphics interface

 1 port of Analog VGA graphics

 2 ports of SATA-600 interface

 2 ports of SATA-300 interface

 8 ports of USB2.0 interface

 1 port of PCI Express Graphics X16 link (also available as 2 ports of X8 at factory option)

 1 port of PCI Express X4 link (also available as 4 ports of X1)

 2 ports of PCI Express X1 link

 1 port of PCI 32bit/33MHz

 1 port of LPC Bus

 Various OS including Windows 7, Windows Embedded Standard 7, and Wind River Linux are

supported

 RoHS compliant

Summary

B30067A0-MN002-01

2.2. Block Diagram

Adbc8034 Block Diagram is shown in Fig.1.

Fig.1 Block Diagram

PCIe

X16

PCIe

SDVO

LVDS

SATA

Power Regulators

Reset Generators

BIOS

CPLD

PCIe

VGA

FDI

COMe CN.

PEG

DMI2

Intel

Sandy Bridge+ECC

Processor

Dual Channel Mode Supported

DDR3-1333 SDRAM

with ECC

DDR3-1333 SDRAM

with ECC

10/100/1000

BASE-T

LPC

SMBus

CBus

PCI32/33

Ethernet

Intel 82579

PCI Bridge

PLX 8112

Intel

Cougar Point

Chipset

SPI

SMBus

LPC

PCIe

SDVO

LVDS

SATA

USB

PCIe

SDVO

LVDS

SATA

PCIe

VGA

PCIe

Multiplex

EEPROM

PCIe

VGA

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3. Hardware Specifications

3.1. Processor

3.1.1. Processor Options

The following 4 processors are available at factory option:

 Intel®Core

i7-2715QEMobile Processor at 2.1GHz(TDP:45W)

 Intel®Core

i5-2515EMobile Processor at 2.5GHz(TDP:35W)

 Intel®Core

i7-2655LEMobile Processor at 2.2GHz(TDP:25W)

 Intel®Core

i7-2610UEMobile Processor at 1.5GHz(TDP:17W)

3.1.2. Cache Memory

Adbc8034 has the following cache memory:

 L1 cache

32kB for data, 32kB for instruction (per core)

 L2 cache

256kB for data and instruction (per core)

 L3 cache (shared by all cores)

o Core

i7-2715QE:6MB

o Core

i5-2515E:3MB

o Core

i7-2655LE:4MB

o Core

i7-2610UE:4MB

3.1.3. I/O Address Map

I/O space Address Map is shown in Table 1.

Table 1. I/O space Address Map

Device

Address

DMA Controller

0000h - 001Fh

Interrupt Controller

0020h - 002Dh

LPC SIO

002Eh - 002Fh

Interrupt Controller

0030h - 003Dh

Timer/Counter

0040h - 0043h

LPC SIO

004Eh - 004Fh

Timer/Counter

0050h - 0053h

Microcontroller

0060h

NMI Controller

0061h

Microcontroller

0062h - 0066h

RTC Controller

0070h - 0077h

DMA Controller

0080h - 0091h

Reset Generator

0092h

DMA Controller

0093h - 009Fh

Interrupt Controller

00A0h - 00B1h

Power Management

00B2h - 00B3h

Interrupt Controller

00B4h - 00BDh

DMA Controller

00C0h - 00DFh

PCI and Master Abort

00F0h

Serial ATA

0170h - 0177h

Serial ATA

01F0h - 01F7h

Serial ATA

0376h

Serial ATA

03F6h

Interrupt Controller

04D0h - 04D1h

Reset Generator

0CF9h

Hardware Specifications

B30067A0-MN002-01

3.1.4. Memory Address Map

Memory space Address Map is shown in Table 2.

Table 2. Memory space Address Map

Device

Address

Main Memory

0000_0000h

--- 000D_FFFFh

LPC(BIOS)(*1)

000E_0000h

--- 000F_FFFFh

Main Memory / PCI Device

0010_0000h

--- TOM(*2)

I/O APIC

FEC0_0000h

--- FECF_FFFFh

High Precision Event Timers

FED0_0000h

--- FED0_33FFh

TPM on LPC

FED4_0000h

--- FED4_BFFFh

LPC(BIOS)(*1)

FF00_0000h

--- FFFF_FFFFh

*1: Occupied area depends on the setting of Firmware Hub Decode Enable.

*2: Most significant address depends on the setting of TOM register.

3.1.5. CPLD Internal Register

CPLD Internal Register is shown in Table 3.

Table 3. CPLD Internal Register map

Address

Item

LED Control Register

0000h

3.1.5.1.

Status Register

0001h

3.1.5.2.

Thermal Monitor Select Register

0002h

3.1.5.3.

Thermal Monitor Register

0003h

3.1.5.4.

CPLD is mounted as internal control logic on Adbc8034.

CPLD internal register is accessible by LPC bus of 3.3.8. LPC on page 15. The base address is 0280h.

The register is configured with 8-bit. Both Read (shown below as: R) and Write (shown below as: W)

are performed by 8-bit length.

R/W : Read and Write

RO : Read only

WO : Write only

3.1.5.1. LED Control Register (offset：0000h)

This register controls LED on Adbc8034.

Table 4. LED Control Register

bit

Name

Meaning

Initial Value

Access

7..3

RSVD

00000

LED_EN

1：RED/GRN_LED control enabled

0：RED/GRN_LED control disabled

R/W

RED_LED

1：LED (RED) On

0：LED (RED) Off

R/W

GRN_LED

1：LED (GRN) On

0：LED (GRN) Off

R/W

※ LED_EN=’0’: RED_LED turns on during assertion of the Platform reset that is output by

PCH,while GRN_LED turns on during de-assertion. Please refer to 3.5. LED on page 17 for

further details.

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3.1.5.2. Status Register (offset：0001h)

This register shows the logic of SPD Write Protect signal and input signal from carrier board.

Table 5. Status Register

bit

Name

Meaning

Initial Value

Access

7..4

RSVD

000000

BIOS_DISABLE#

Request signal from carrier board

THRM#

1：Temperature sensor on carrier board shows a

normal value

0：Temperature sensor on carrier board is shows

an abnormal value

BATLOW#

1：battery voltage on carrier board is a normal value

0：battery voltage on carrier board is an abnormal

value

SPD_WP

WP of EEPROM for SPD

Write 0 when rewriting software

R/W

3.1.5.3. Thermal Monitor Select Register (offset：0002h)

This register selects a thermal monitor connected to the CPLD that is being read out.

Table 6. Thermal status register

bit

Name

Meaning

Initial Value

Access

7..2

RSVD

000000

1..0

THRM_MONI_SEL

Thermal monitor temperature selected from the

following options can be read out by thermal

monitor register (offset：0003h).

11：RSVD

10：GBE_THRM (ambient temperatureof

GbE(82579))

01：DDR3B_THRM(ambient temperature of

DDR3(solder side))

00：DDR3A_THRM(ambient temperature of DDR3

(component side))

R/W

3.1.5.4. Thermal Monitor Register (offset：0003h)

This register displays temperature value read out by the thermal monitor.

Table 7. Thermal Monitor Register

bit

Name

Meaning

Initial Value

Access

7..0

THRM

Displays the temperature value read out from the

thermal monitor selected by THRM_MONI_SEL

(0 to 255℃, 1℃/LSB)

00000000

3.2. Memory

Adbc8034 memory is shown below.

3.2.1. Main Memory

The main memory of Adbc8034 is DDR3-1333 SDRAM.

You can choose the memory capacity from 1GB, 2GB, 4GB, or 8GB at factory option.

It supports ECC, automatically corrects 1-bit error, and also detects 2-bit errors.

3.2.2. Boot ROM

This is a SPI-FLASH memory directly-mounted on Adbc8034 with 8MB of capacity.

It saves BIOS data and configuration data.

Hardware Specifications

B30067A0-MN002-01

3.2.3. External Memory Interface

Adbc8034 has the following 2 external memory interfaces for mass storage devices and boot option.

They are connected by 6.3.3. CN4 (COM Express stacking connector) on page 25.

 Serial ATA

Adbc8034 has 4 serial ATA ports, which can boot from mass storage devices connected to the serial

ATA port such as HDD and SSD.

 USB

Adbc8034 has 8 USB ports, which can boot from USB floppy or USB-CD (DVD)-ROM.

3.3. Communication Specifications

Adbc8034 has the following communication specifications with external devices. It is connected by

6.3.3. CN4 (COM Express stacking connector) on page 25 to communicate with external devices.

3.3.1. PCI Express Graphics

You can choose a PCI Express Graphics link configuration from the following three options.

 Link Configuration 1 : 1 port of X8 Link+ 2 ports of X4 Link (option)

 Link Configuration 2 : 2 ports of X8 Link (option)

 Link Configuration 3 : 1 port of X16 Link (default)

All ports are compliant with PCI Express Rev2.0 standard.

PCI Express Graphics Link configuration is shown in Table 8.

Table 8. PCI Express Graphics Link Configuration

COM Express

Pin Name

PCI Express

Lane

Link Configuration

PCIE15

X 4

X 8

X 16

PCIE14

PCIE13

PCIE12

PCIE11

X 4

PCIE10

PCIE9

PCIE8

PCIE7

X 8

PCIE6

PCIE5

PCIE4

PCIE3

PCIE2

PCIE1

PCIE0

Lane reverse setting to reverse the row of PCI Express lanes is also available at factory option.

Lane is not reversed at the factory default as is shown in Table 8.

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3.3.2. PCI Express

Adbc8034 is compliant with PCI Express Rev2.0 standard.

There are 4 options for PCI Express Link configuration at factory option as shown in Table 9.

The factory default is Link Configuration 4.

Table 9. PCI Express Link Configuration

COM Express

Pin Name

PCI Express

lane

Link Configuration 1

Link Configuration 2

Link Configuration 3

Link Configuration 4

PCIE5

X 1(*3)

PCIE4

X 1

PCIE3

X 1(*3)

X 2(*3)

X 4

PCIE2

X 1(*3)

PCIE1

X 1(*3)

X 2

PCIE0

X 1

*3: under evaluation

3.3.3. USB

Adbc8034 has 8 USB ports compliant with the USB2.0 standard.

3.3.4. Serial ATA

Adbc8034 has 4 ports of Serial ATA in total; 2 ports (SATA0/1) of Serial ATA 3 (maximum transfer

speed: 6Gb/s) and 2 ports (SATA2/3) of Serial ATA 2 (maximum transfer speed: 3Gb/s).

3.3.5. Ethernet

Adbc8034 has an Ethernet port compliant with the10/100/1000Base-T standard.

It also supports Intel® AMT7.0.

3.3.6. SMBus

（

System Management Bus

）

Adbc8034 has an I

C multiplexer at the SMBus interface to carrier board.

It also has a SMBus port compliant with the SMBus 2.0 standard. The SMBus address map is shown

in Table 10.

Table 10. SMBus Address Map

Device

Address

Main Memory SPD(channel A)

1010 000b

Main memory SPD(channel B)

1010 001b

C multiplexer (PCA9544APW)

1110 000b

C multiplexer channel map is shown in Table 11.

Table 11. I

C multiplexer channel map

Device

Address

Unused

Carrier board SMBus

Carrier board I

Unused

Channel is not selected after BIOS start up. Do not switch to channel 0 or channel 3 as they are

unused.

Please refer to the PCA9544APW (NXP) datasheet for I

C multiplexer setting method.

Hardware Specifications

B30067A0-MN002-01

3.3.7. PCI

Adbc8034 has a 32bit/33MHz PCI bus compliant with the PCI Local Bus Specification Revision 2.3

standard.

Signal level: 3.3V.

PCI devices are shown in Table 12.

Table 12. List of PCI devices

Bus

number

Device

number

Function

number

Device

Device model

number

DRAM Controller

Intel

Core

i7/i5

PCI Express Controller 1

Intel

Core

i7/i5

PCI Express Controller 2

Intel

Core

i7/i5

PCI Express Controller 3

Intel

Core

i7/i5

Integrated Graphics Device

Intel

Core

i7/i5

PCI Express Controller 4

Intel

Core

i7/i5

Intel

Management Engine Interface #1

Intel

QM67

Intel

Management Engine Interface #2

Intel

QM67

IDE-R

Intel

QM67

Intel

QM67

Gigabit Ethernet Controller

Intel

QM67

0 to 7

USB EHCI Controller #2

Intel

QM67

0 to 7

Intel

High Definition Audio Controller

Intel

QM67

PCI Express Port 1

Intel

QM67

PCI Express Port 2

Intel

QM67

PCI Express Port 3

Intel

QM67

PCI Express Port 4

Intel

QM67

PCI Express Port 5

Intel

QM67

PCI Express Port 6

Intel

QM67

PCI Express Port 7

Intel

QM67

PCI Express Port 8

Intel

QM67

0 to 7

USB EHCI Controller #1

Intel

QM67

PCI-to-PCI Bridge

Intel

QM67

LPC Controller

Intel

QM67

SATA Controller #1

Intel

QM67

SMBus Controller

Intel

QM67

SATA Controller #2

Intel

QM67

Thermal Subsystem

Intel

QM67

M(*4)

－

PCI Express

－

*4：M depends on the largest bus number shown on PCI Express.

3.3.8. LPC

Adbc8034 has a port compliant with the LPC1.1 standard.

The LPC bus is used for general purpose I/O extension and communication with low bandwidth

devices.

Adbc8034 - User Manual

B30067A0-MN002-01

3.4. I/O

Adbc8034 has the following interfaces to external devices.

They are connected by 6.3.3. CN4 (COM Express stacking connector) on page 25.

3.4.1. GPIO

Adbc8034 has a GPI control register and a GPO control register.

The features of GPIO are shown below.

3.4.1.1. GPI

Adbc8034 is equipped with 4 general inputs. They can be read out from the Intel QM67 PCH register.

GPI is set as input pin in BIOS. The register where GPI is allocated is shown in Table 13.

Table 13. GPI control register

Signal

Intel QM67connecting pin

Supporting register Bit

GPI0

GPIO68

GP_LVL3 bit 4

GPI1

GPIO69

GP_LVL3 bit 5

GPI2

GPIO70

GP_LVL3 bit 6

GPI3

GPIO71

GP_LVL3 bit 7

High logic level (“1”) is read from the register while High level voltage is applied to the input pin, and

Low logic level (“0”) is read from the register while Low level voltage is applied to the input pin. Please

refer to 7.2. Electrical Specifications on page 27 for electrical specifications.

3.4.1.2. GPO

Adbc8034 is equipped with 4 general outputs. Status can be changed by writing in the Intel QM67

PCH register. GPO is set as the output pin in BIOS. The register where GPO is allocated is shown in

Table 14.

Table 14. GPO control register

Signal

Intel QM67connecting

Supporting register Bit

Initial setting

(logic level)

GPO0

GPIO8

GP_LVL bit 8

High

GPO1

GPIO15

GP_LVL bit 15

Low

GPO2

GPIO24

GP_LVL bit 24

Low

GPO3

GPIO28

GP_LVL bit 28

Low

It outputs High level voltage when High logic level (“1”) is written in the register, while it outputs Low

level voltage when Low logic level (“0”) is written in it. Please refer to 7.2. Electrical Specifications on

page 27 for electrical specifications.

3.4.2. Graphics SDVO

Adbc8034 has a SVDO port.

When using our carrier board Adbc8031-CAR, the maximum resolution is 1920×1200.

3.4.3. Graphics LVDS

Adbc8034 has a LVDS port.

It is confirmed to operate at the resolution of 1920×1200.

3.4.4. Analog VGA

Adbc8034 has an Analog VGA port for monitoring VGA.

3.4.5. Buzzer

Adbc8034 outputs buzzer output SPKR signal from 6.3.3. CN4 (COM Express stacking connector) on

page 25.

Hardware Specifications

B30067A0-MN002-01

3.4.6. Suspend Status

Adbc8034 outputs SUS_STAT#/SUS_S3#/SUS_S4#/SUS_S5# signal from 6.3.3. CN4 (COM Express

stacking connector) on page 25.

3.5. LED

Adbc8034 has green and red LEDs.

The conditions for turning on and off the LEDs are shown in Table 15.

Table 15. LED Condition

LED_EN

PCH platform reset

LED1(Green)

LED2(Red)

Assert

Off

De-assert

Off

GRN_LED=’1’→On

RED_LED=’1’→On

GRN_LED=’0’→ Off

RED_LED=’0’→Off

※Assert of PCH platform reset means that the internal board is being initialized, and de-assert means

that the initialization is finished.

Adbc8034 - User Manual

B30067A0-MN002-01

4. Mechanical Specifications

Adbc8034 is compliant with the PICMG COM.0 COM Express Module Base Specification Rev 1.0

standard. Mechanical specifications are shown in Table 16.

Table 16. Mechanical Specifications

Characteristic

Contents

Form Factor

125mm x 95mm x 21mm (basic module size)

※21mm is the height between the component side of carrier board and upper

side of heat spreader with the stack height of 8mm

Pin out type

Compliant with Type 2

Advanet’s original pin layout is used for some parts

Weight

285g (Including heat spreader and attachment spacers)

4.1. External Dimension

External dimensions of Adbc8034 are shown in Fig.2.

Unit : mm

*5: Height of the mounted components (on the solder side) does not exceed 3.8mm.

Fig.2 External dimensions of Adbc8034

Mechanical Specifications

B30067A0-MN002-01

4.2. Attachment to Carrier Board

Please follow the instructions below to attach the Adbc8034 to your carrier board.

Please handle the board with ESD measures such as wearing an antistatic bracelet so as not to

damage the device by static electricity.

Fig.3. Attachment to Carrier Board

○Attachment to Carrier Board

(1) Turn off the power to the board.

(2) Remove spacer and other components attached to the bottom of the carrier board.

(3) Place the Adbc8034 on the carrier board so that the 5 stacking connectors and the corresponding

holes for fixing the spacers match.

(4) Press both ends of stacking connectors of heat spreader on the Adbc8034 to put them into the

carrier board connectors. In order to avoid flexing the carrier board, place a support at the bottom

of the carrier board stacking connector. Confirm that the connectors fit correctly.

(5) Double check that the Adbc8034 and the carrier board fit correctly.

(6) Fix the boards with the five screws (M2.5 x 5mm sems screw) from the bottom side of the carrier

board.

○Removal from Carrier Board

Please follow the instructions below to remove the Adbc8034 from the carrier board.

Please handle the board with ESD measures such as wearing an antistatic bracelet so as not to

damage the device by static electricity.

(1) Turn off the power to the board.

(2) Remove the 5 screws from the bottom of the carrier board.

(3) Keep the Adbc8034 horizontal and lift it upward to remove from the carrier board.

Adbc8034 - User Manual

B30067A0-MN002-01

4.3. Heat Spreader

The Adbc8034 comes with a heat spreader. Please place a cooling system such as a heat sink on the

heat spreader so that the CPU can dissipate its heat during operation.

Capabilities required for the cooling system such as heat sink varies depending on the conditions such

as ambient temperature and wind velocity. Each processor requires a cooling system with the following

heat resistance value attached on the heat spreader when it is operated below 60℃.

Table 17. Required heat resistance for cooling system

Processor Type

TurboBoost

Heat resistance of cooling system

Intel

Core

i7-2715QE

Below 0.19℃/W

OFF

Below 0.40℃/W

Intel

Core

i5-2515E

Below 0.42℃/W

OFF

Below 0.65℃/W

Intel

Core

i7-2655LE

Below 0.62℃/W

OFF

Below 1.11℃/W

Intel

Core

i7-2610UE

Below 1.18℃/W

OFF

Below 1.86℃/W

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Eurotech Adbc8034 Owner's manual

Brand: Eurotech

Model: Adbc8034

Category: Motherboards

Type: Owner's manual

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Eurotech Adbc8034 Owner's manual

Eurotech Adbc8034 Owner's manual

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