User Manual
CB71C
Rugged COM Express Module with AMD V1000
ANSI-VITA 59 RCE Module
2018-06-2920CB71C00 E1
20CB71C00 E1
2018-06-29
Page 2
Contents
Contents
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
About this Document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Product Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Legal Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1 Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.1 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.2 Product Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
1.2.1 Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.2.2 Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
1.3 Technical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.4 Cooling Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
1.4.1 Cooling of Rugged COM Express Modules (VITA 59). . . . . . . . . . . .16
1.4.2 Cooling of COM Express Modules (COM.0) . . . . . . . . . . . . . . . . . . .17
1.5 Product Identification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2 Getting Started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.1 Configuring the Hardware. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
2.2 Connecting and Starting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.3 Installing Operating System Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
2.4 Installing Driver Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.5 Using the CB71C under Linux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.5.1 Accessing SMBus/I2C Devices using Standard Linux I2C Tools. . . 22
2.5.2 Managing RTC Time Adjustments . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3 Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.1 Power Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
3.2 CPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
3.2.1 Processor Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.3 Trusted Platform Module (TPM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
3.4 Supervision and Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.4.1 Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.4.2 Temperature Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
3.4.3 Event Logging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
3.5 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.6 Real-Time Clock (RTC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.6.1 Software Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.7 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.7.1 System RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
3.7.2 Boot Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.8 Mass Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
3.8.1 Serial ATA (SATA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
3.8.2 eMMC Multimedia Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.9 Video. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.10 Audio. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
3.11 USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
3.12 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
3.12.1 Ethernet Status LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
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Contents
3.13 PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
3.14 UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
3.15 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
3.15.1 Software Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.16 Rugged COM Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.16.1 COM Express Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
4 Hardware/Software Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
4.1 SMBus/I2C Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Figures
Figure 1. Board layout – RCE inside cover and frame, connector side . . . . . . . . . . . . . . 11
Figure 2. Board layout – connector side (CB71 COM Express) . . . . . . . . . . . . . . . . . . . . 12
Figure 3. Functional diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 4. RCE thermal concept – cooling wings between frame and cover . . . . . . . . . . 17
Figure 5. Product labels. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Tables
Table 1. Ethernet status LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 2. Connector types – COM Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 3. Pin assignment of COM Express connectors J1 and J2 . . . . . . . . . . . . . . . . . . .31
Table 4. Signal Mnemonics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Table 5. SMBus/I2C devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
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About this Document
About this Document
This user manual is intended only for system developers and integrators, it is not
intended for end users.
It describes the design, functions and connection of the product. The manual does not
include detailed information on individual components (data sheets etc.).
History
CB71C product page with up-to-date information and downloads:
www.men.de/products/cb71c/
Issue Comments Date
E1 First issue 2018-06-29
20CB71C00 E1
2018-06-29
Page 5
About this Document
Conventions
Indicates important information or warnings concerning situations which
could result in personal injury, or damage or destruction of the
component.
Indicates important information concerning electrostatic discharge which
could result in damage or destruction of the component.
Indicates important information or warnings concerning proper
functionality of the product described in this document.
The globe icon indicates a hyperlink that links directly to the Internet.
When no globe icon is present, the hyperlink links to specific information
within this document.
Italics Folder, file and function names are printed in italics.
Comment
Comments embedded into coding examples are shown in green text.
IRQ#
/IRQ
Signal names followed by a hashtag "#" or preceded by a forward slash "/"
indicate that this signal is either active low or that it becomes active at a
falling edge.
In/Out Signal directions in signal mnemonics tables generally refer to the
corresponding board or component, "in" meaning "to the board or
component", "out" meaning "from the board or component".
0xFF Hexadecimal numbers are preceded by "0x".
0b1111 Binary numbers are preceded by "0b".
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Product Safety
Product Safety
Electrostatic Discharge (ESD)
Computer boards and components contain electrostatic sensitive devices.
Electrostatic discharge (ESD) can damage components. To protect the PCB
and other components against damage from static electricity, you should
follow some precautions whenever you work on your computer.
Power down and unplug your computer system when working on the
inside.
Hold components by the edges and try not to touch the IC chips, leads,
or circuitry.
Use a grounded wrist strap before handling computer components.
Place components on a grounded antistatic pad or on the bag that came
with the component whenever the components are separated from the
system.
Only store the product in its original ESD-protected packaging. Retain
the original packaging in case you need to return the product to MEN for
repair.
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Legal Information
Legal Information
Changes
MEN Mikro Elektronik GmbH ("MEN") reserves the right to make changes without further
notice to any products herein.
Warranty, Guarantee, Liability
MEN makes no warranty, representation or guarantee of any kind regarding the
suitability of its products for any particular purpose, nor does MEN assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims
any and all liability, including, without limitation, consequential or incidental damages.
TO THE EXTENT APPLICABLE, SPECIFICALLY EXCLUDED ARE ANY IMPLIED WARRANTIES
ARISING BY OPERATION OF LAW, CUSTOM OR USAGE, INCLUDING WITHOUT LIMITATION,
THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR
PURPOSE OR USE. In no event shall MEN be liable for more than the contract price for
the products in question. If buyer does not notify MEN in writing within the foregoing
warranty period, MEN shall have no liability or obligation to buyer hereunder.
The publication is provided on the terms and understanding that:
1. MEN is not responsible for the results of any actions taken on the basis of
information in the publication, nor for any error in or omission from the publication; and
2. MEN is not engaged in rendering technical or other advice or services.
MEN expressly disclaims all and any liability and responsibility to any person, whether a
reader of the publication or not, in respect of anything, and of the consequences of
anything, done or omitted to be done by any such person in reliance, whether wholly or
partially, on the whole or any part of the contents of the publication.
Conditions for Use, Field of Application
The correct function of MEN products in mission-critical and life-critical applications is
limited to the environmental specification given for each product in the technical user
manual. The correct function of MEN products under extended environmental
conditions is limited to the individual requirement specification and subsequent
validation documents for each product for the applicable use case and has to be agreed
upon in writing by MEN and the customer. Should the customer purchase or use MEN
products for any unintended or unauthorized application, the customer shall indemnify
and hold MEN and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim or personal injury or death associated with
such unintended or unauthorized use, even if such claim alleges that MEN was negligent
regarding the design or manufacture of the part. In no case is MEN liable for the correct
function of the technical installation where MEN products are a part of.
Qualified Personnel
The product/system described in this documentation may be operated only by
personnel qualified for the specific task in accordance with the relevant documentation,
in particular its warning notices and safety instructions. Qualified personnel are those
who, based on their training and experience, are capable of identifying risks and
avoiding potential hazards when working with these products/systems.
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Legal Information
Conformity
MEN products are no ready-made products for end users. They are tested according to
the standards given in the Technical Data and thus enable you to achieve certification of
the product according to the standards applicable in your field of application.
RoHS
Since July 1, 2006 all MEN standard products comply with RoHS legislation.
Since January 2005 the SMD and manual soldering processes at MEN have already been
completely lead-free. Between June 2004 and June 30, 2006 MEN’s selected component
suppliers have changed delivery to RoHS-compliant parts. During this period any change
and status was traceable through the MEN ERP system and the boards gradually became
RoHS-compliant.
WEEE Application
Nevertheless, MEN is registered as a manufacturer in Germany. The registration number
can be provided on request.
Copyright © 2018 MEN Mikro Elektronik GmbH. All rights reserved.
The WEEE directive does not apply to fixed industrial plants and tools. The
compliance is the responsibility of the company which puts the product
on the market, as defined in the directive; components and sub-
assemblies are not subject to product compliance.
In other words: Since MEN does not deliver ready-made products to end
users, the WEEE directive is not applicable for MEN. Users are
nevertheless recommended to properly recycle all electronic boards
which have passed their life cycle.
Germany
MEN Mikro Elektronik GmbH
Neuwieder Straße 3-7
90411 Nuremberg
Phone +49-911-99 33 5-0
France
MEN Mikro Elektronik SAS
18, rue René Cassin
ZA de la Châtelaine
74240 Gaillard
Phone +33-450-955-312
USA
MEN Micro Inc.
860 Penllyn Blue Bell Pike
Blue Bell, PA 19422
Phone 215-542-9575
China
MEN Mikro Elektronik Co., Ltd.
Room 301A,
#971 Dongfang Road
200122 Shanghai
Phone +86-21-5058-0963
www.men.de
www.men-france.fr
sales@menmicro.com
www.menmicro.com
sales@men-china.cn
www.men-china.cn
Product Overview
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1 Product Overview
1.1 Product Description
Ultra-rugged VITA 59 COM Express
The CB71C is an ultra-rugged COM Express module for rail, public transportation and
industrial applications, e.g. data acquisition, infotainment, transcoding, live 3D. It is 100%
compatible to COM Express Type 6 Pin-Out and conforms to the VITA 59 standard which
specifies the mechanics to ensure reliable operation even under the harshest
environmental conditions.
Perfect for Harsh Environments
The modules are embedded in a closed aluminum frame, which ensures optimum EMC
protection and efficient conduction cooling. Direct air cooling is possible by placing a
heat sink on the cover. The CB71C is designed for operation from -40°C to +85°C
(housing). To withstand serious shock and vibration, only soldered components are
used. The design is optimized for conformal coating.
Powerful Processing and Graphics on a Single Chip
The CB71C is based on AMD's V1000 APU family. It is equipped with a Radeon Vega next-
generation 3D graphics engine and supports up to 4 displays with a resolution of up to
4k without the need for additional graphics hardware. With up to four high-performance
processor cores and AMD-V extension, the CB71C is also suitable for virtualization.
Excellent Price/Performance Ratio, Flexible Design
The CB71C can be equipped with a wide range of long-term available processors with
scalable performance, all supporting ECC. Passive cooling is possible with low-power
versions.
Safety and Security
The board features an advanced board management controller with monitoring
functions for safety-relevant applications. In addition, the CB71C has a Trusted Platform
Module and supports hardware memory encryption, providing protection against both
physical and inter-VM storage attacks. This is essential for security-critical applications
such as payment and ticketing terminals, fleet management or monitoring.
Memory and I/O
The CB71C can be equipped with up to 32 GB of directly soldered DDR4 main memory
and up to 64 GB eMMC. Available high-speed interfaces include PCI Express 3.0 links, DDI
(DP, eDP, HDMI), SATA 3.0, Gigabit Ethernet and USB 3.0.
Product Overview
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1.2 Product Architecture
1.2.1 Interfaces
1.2.1.1 CB71C Rugged COM Express Board Layout
Figure 1. Board layout – RCE inside cover and frame, connector side
Screwsconnectingtheframeandcoverofthemodule .Donotremove.
HolesformountingtheRuggedCOMExpressmoduleona carrierboard.
A110
B110
C110
D110
COMExpressConnectors
CoolingWing
CoolingWing
CoolingWing
CoolingWing
B1
A1
C1
D1
HolesformountingaCOMExpressmodule versiononacarrierboard.
Product Overview
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1.2.1.2 CB71 COM Express Board Layout
Figure 2. Board layout – connector side (CB71 COM Express)
C1
D1
C110
D110
B1
A1
A110
B110
HolesformountingtheCOMExpressmoduleonacarrierboard.
Product Overview
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1.2.2 Functions
Figure 3. Functional diagram
SATA(6Gb)
AMDV1000APU
USB2.0
ECCDDR4
SDRAM
COMExpressConnectors
B
PCIe3.0x1
UART
HDAudio
DDI
USB3.1
PCIe3.0x4
Reset
Boot
Flash
TPM
SPI
BMC
SMBus
I/O
Expander
4GPO
4GPI
RTC
B Onboard Options
eMMC
GbEthernet
Ethernet
Ctrl
PCIe2.0x1
PCIe
Switch
Product Overview
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1.3 Technical Data
CPU
The following CPU types are supported:
- AMD V1404I, 4 cores, 4 threads, tbd GHz, 15W, 2 MB cache
- AMD V1807B, 4 cores, 8 threads, 3.35 GHz, 35-54W, 2 MB cache
Memory
System RAM
- Soldered DDR4, ECC
- 32 GB max.
Security
TPM (Trusted Platform Module 2.0)
Mass Storage
The following mass storage devices are assembled:
- eMMC (soldered); 16 GB
Graphics
Processor graphics
Maximum resolution: 4096x2160 pixels @ 60 Hz, 36 bpp
Interfaces
SATA
- 2x SATA Revision 3.x, board to board
Video
- 4x DDI, board to board
HD Audio
- 1x, board to board
USB
- 3x USB 3.1, board to board
- 3x USB 2.0, board to board
PCI Express
- 1x PCIe 3.0, x4, board to board
- 5x PCIe 3.0, x1, board to board
- 2x PCIe 2.0, x1, board to board
Ethernet
- 1x 1000BASE-T, board to board
Serial
- 2x UART, board to board
- Physical interfaces, e.g., RS232 or RS422/RS485, depending on implementation
on carrier board
GPIO
- 4x GPI, board to board
- 4x GP0, board to board
Product Overview
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Reset
- 1x, board to board
Supervision and Control
Board management controller
Watchdog timer
Temperature measurement
Real-time clock
Product Standard
VITA 59 RCE: Basic, Pin-out Type 6, VITA 59 RCE Rugged COM Express in process
COM Express: Basic, Pin-out Type 6, PICMG COM.0 COM Express Module Base
Specification
Electrical Specifications
Supply voltage
- +12 V (9.5 to 15.5 V)
Mechanical Specifications
Dimensions
- 135 mm x 105 mm x 18 mm (models conforming to VITA 59 RCE Basic format,
PCB mounted between a cover and a frame)
- 125 mm x 95 mm (models conforming to PICMG COM.0 COM Express Basic
format)
Environmental Specifications
Temperature range (operation)
- -40°C to +85°C Tcase (VITA 59 cover/frame), compliant with EN 50155:2007,
class TX (model 15CB71C00)
Temperature range (storage): -40°C to +85°C, compliant with EN 50155:2007
Cooling Concept
- Conduction-cooled versions according to VITA 59 RCE: Rugged COM Express in
process
- Air-cooled versions according to PICMG COM.0 COM Express standard
Humidity: EN 50155:2007 (+25/+55 °C, 90-100 %)
Altitude: -300 m to +3000 m
Shock: EN 61373:2010
- Location: Vehicle body (Cat. 1; Class B)
See the MEN website for technical product drawings including the
exact dimensions of CB71C:
www.men.de/products/cb71c/#doc
See the COM Express COM.0 specification for the dimensions of
COM Express Compact modules. See COM Express Specification &
Design Guide.
Product Overview
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Vibration: EN 61373: 2010
- Location: Vehicle body (Cat. 1; Class B)
Reliability
MTBF: 363 958 h @ 40°C according to IEC/TR 62380 (RDF 2000) (model 15CB71C00)
Safety
Electrical Safety
- EN 50155:2007
- EN 50153:2014
- EN 50124-1:2001 + A1:2003 + A2:2005
EMC (Railway)
Radiated Emission: EN 50121-3-2:2015
Conducted Emission: EN 50121-3-2:2015
Immunity: EN 50121-3-2:2015
EMC (Automotive)
ECE R10 Rev.5 (E-mark)
BIOS
AMI Aptio UEFI Firmware
Software Support
Linux
Windows (on request)
See the MEN website for supported operating system versions, available
software and more details on supported functions:
www.men.de/products/cb71c/#downl
Product Overview
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1.4 Cooling Concept
1.4.1 Cooling of Rugged COM Express Modules (VITA 59)
Rugged COM Express modules (VITA 59) are equipped with four cooling wings for
conduction cooling. These transport the heat generated on the board to a frame and
cover enclosing the module.
The frame and cover are only part of the thermal solution for a module. They provide a
common interface between the Rugged COM Express module and implementation-
specific thermal solutions.
The module can, e.g., be cooled via conduction cooling, where the heat is transported to
a housing or a heat sink built on top of the cover. It depends on the system configuration
and airflow if an additional heat sink is needed or not. In any case you should check your
thermal conditions and implement appropriate cooling.
Figure 4. RCE thermal concept – cooling wings between frame and cover
See Chapter 3.3 Trusted Platform Module (TPM) on page 23.
If you do not use the cover and frame supplied by MEN and/or no heat
sink, warranty on functionality and reliability of the CB71C may cease. If
you have any questions or problems regarding thermal behavior, contact
MEN.
Screwsconnectingtheframeandcoverofthemodule .Donotremove.
HolesformountingtheRuggedCOMExpressmoduleona carrierboard.
A110
B110
C110
D110
COMExpressConnectors
CoolingWing
CoolingWing
CoolingWing
CoolingWing
B1
A1
C1
D1
HolesformountingaCOMExpressmodule versiononacarrierboard.
Product Overview
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1.4.2 Cooling of COM Express Modules (COM.0)
MEN’s modules are also available without the cooling wings, frame and cover as
standard COM Express modules in accordance with the PICMG COM.0 standard. They
are suitable for applications where operating temperatures are moderate and a suitable
low-power processor and airflow is used.
COM Express modules may also need additional cooling facilities, depending on the
configuration of the board and the general system design, i.e. integration of the
computer-on-module into the system. Implementation is up to the customer.
A general heat spreader solution, e.g., for evaluation purposes, is available from MEN as
an accessory for COM Express models.
See Chapter 3.3 Trusted Platform Module (TPM) on page 23.
See the MEN website for ordering information:
www.men.de/products/cb71c/#ord
Product Overview
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1.5 Product Identification
MEN documentation may describe several different models and design revisions of the
CB71C. You can find the article number, design revision and serial number affixed to the
CB71C.
Article number: Indicates the product family and model. This is also MEN’s main
ordering number. To be complete it must have 9 characters.
Revision number: Indicates the design revision of the product.
Serial number: Unique identification assigned during production.
If you need support, you should communicate these numbers to MEN.
Figure 5. Product labels
&%&
Revisionnumber Serialnumber
Completearticlenumber
Getting Started
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2 Getting Started
2.1 Configuring the Hardware
Check your hardware requirements before installing the board in a system.
Modifications are difficult or impossible to do when the board is integrated in a system.
2.2 Connecting and Starting
Use the following check lists when installing the board for the first time and with
minimum configuration.
Using USB Keyboard and Mouse and a Display
Carrier board requirements:
Space around the COM Express connectors (’landing zones’) for the RCE frame
USB connectors and display connector for connecting keyboard, mouse and display
The following steps are necessary:
» Power down the system.
» Plug the CB71C on your carrier board, making sure that the COM Express connec-
tors are properly aligned.
» Fasten the screws connecting the COM Express module to the carrier.
» Connect a USB keyboard and mouse to the USB connectors of your carrier board.
» Connect a display to the display connector of your carrier board.
» Power up the system.
» You can start up the UEFI firmware setup menu by hitting the <F2> key.
» Now you can make configurations in the UEFI firmware.
» Observe the installation instructions for the respective software.
Using RS232 Terminal Program
Carrier board requirements:
Space around the COM Express connectors (’landing zones’) for the RCE frame
RS232 interface for terminal connection
Host PC Requirements:
Terminal emulation program
MEN offers suitable accessory articles for CB71C.
See the MEN website for ordering information:
www.men.de/products/cb71c/#ord
See Chapter Mechanical Specifications on page 14.
See Chapter 1.2.1 Interfaces on page 10 for the position of mounting holes.
Getting Started
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RS232 interface for terminal connection
The following steps are necessary:
» Power down the system.
» Plug the CB71C on your carrier board, making sure that the COM Express connec-
tors are properly aligned.
» Fasten the screws connecting the COM Express module to the carrier.
» Power up the system.
» Start up a terminal program on your host PC and open a terminal connection.
» Set your terminal connection to the following protocol:
- 115 200 baud data transmission rate
- 8 data bits
- 1 stop bit
- No parity
» You can start up the UEFI firmware setup menu by hitting the <F2> key.
» Now you can make configurations in the UEFI firmware.
» Observe the installation instructions for the respective software.
See Chapter 1.2.1 Interfaces on page 10 for the position of mounting holes.
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