1
System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could
resultinareductionofasmuchas1GBormoreofphysicaladdressablememorybeingavailabletotheoperatingsystemandapplications,dependingonthesystemconguration
and operating system.
2
64-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64
architecture. Processors will not operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and
softwarecongurations.Seehttp://developer.intel.com/technology/intel64/index.htmformoreinformation.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intelproductsarenotintendedforuseinmedical,life-saving,orlife-sustainingapplications.Intelmaymakechangestospecicationsandproductdescriptionsatanytime,withoutnotice.
Allproducts,dates,andguresspeciedarepreliminarybasedoncurrentexpectations,andaresubjecttochangewithoutnotice.Availabilityindifferentchannelsmayvary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, Intel Core, Pentium, and Celeron are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
** Supports 65 W Thermal Design Power, Intel® Core™2 Quad and Intel® Core™2 Duo processors with 1333 / 1066 MHz system bus. For information, visit processormatch.intel.com
Copyright © 2009 Intel Corporation. All rights reserved. 0209/TC/MS/PDF 321399-001US
Technical Specications
Processor
Processor Support
• Intel®Core™2Quad**processor(upto65W
TDP)intheLGA775package
• Intel®Core™2Duo**processor(upto65W
TDP)intheLGA775package
• Intel®Pentium®processorintheLGA775package
• Intel®Celeron®processorintheLGA775package
• SupportsIntel®64Architecture
2
Chipset
Intel® G41 Express Chipset
• Intel®82G41GraphicsandMemoryController
Hub(GMCH)
• Intel®82801GBI/OControllerHub(ICH7)
Graphics Memory Controller Hub (GMCH)
• Designedtosupportupto8GB
1
ofsystem
memoryusingDDR2800/667SDRAM
memory
• Intel®FastMemoryAccess
• Intel®GraphicsMediaAcceleratorX4500
withIntel®ClearVideoTechnology
Intel® I/O Controller Hub (ICH)
• ThreeSATA(3.0Gb/s)ports
• Integrated10/100/1000networkconnection
• EightHi-SpeedUSB2.0ports(fourbackpanel
portsandanadditionalfourUSBportsviatwo
internalheaders)
System BIOS
• 8MbFlashEEPROMwithIntel®Platform
InnovationFrameworkforEFIPlugandPlay,
IDEdriveauto-congure
• Advancedcongurationandpowerinterface
V2.0b,DMI2.0,multilingualsupport
• SerialPeripheralInterface(SPI)Flash
System Memory
Memory Capacity
• Two240-pinDIMMconnectorssupporting
uptotwodouble-sidedDIMMs
Memory Types
• DDR2800/667SDRAMmemorysupport
• Non-ECCMemory
Memory Modes
• Dual-orsingle-channeloperationsupport
Memory Voltage
• 1.8V
Hardware Management Features
• Processorfanspeedcontrol
• Systemchassisfanspeedcontrol
• Voltageandtemperaturesensing
• Fansensorinputsusedtomonitorfanactivity
• PowermanagementsupportforACPI1.0b
Expansion Capabilities
• OnePCIbusadd-incardconnectors
Headers
• Oneserialportheader
Jumpers and Front-Panel Connectors
Jumpers
• Singlecongurationjumperdesign
• JumperaccessforBIOSmaintenancemode
Front-Panel Connectors
• Reset,HDDLED,PowerLEDs,poweron/off
• Twofront-panelHi-SpeedUSB2.0headers
• Front-panelaudioheader
Mechanical
Board Style
• ATX2.2-compliant
Board Size
• 6.7”x6.7”(17cmx17cm)
Baseboard Power Requirements
• ATX12V
Environment
Operating Temperature
• 0°Cto+55°C
Storage Temperature
• -20°Cto+70°C
Regulations and Safety Standards
United States and Canada
CSA/UL60950-1,FirstEdition
(BinationalStandard)
Europe
(LowVoltageDirective2006/95/EC)
EN60950-1:2006
International
IEC60950-1:2001,FirstEdition
EMC Regulations
(tested in representative chassis)
United States
FCC47CFRPart15,SubpartB
Canada
ICES-003ClassB
Europe
(EMCDirective2004/108/EC)
EN55022:2006andEN55024:1998
Australia/New Zealand
EN55022:2006ClassB
Japan
VCCIV-3/04.04,V-4/03.04,ClassB
South Korea
KN-22:2005andKN-24:2005
Taiwan
CNS13438:2006ClassB
International
CISPR22:2005+A1:2005+A2:2006ClassB
Environmental Compliance
Europe
EuropeRoHS(Directive2002/95/EC)
China
ChinaRoHS(MIIOrder#39)
Lead-Free:Thesymbolisusedto
identifyelectricalandelectronic
assembliesandcomponentsinwhich
thelead(Pb)concentrationlevelinany
oftherawmaterialsandtheendproductisnot
greaterthan0.1%byweight(1000ppm).This
symbolisalsousedtoindicateconformanceto
lead-freerequirementsanddenitionsadopted
undertheEuropeanUnion’sRestrictiononHaz-
ardousSubstances(RoHS)directive,2002/95/EC.
Ordering Information: See the Intel
Web site at www.intel.com. For the
most current product information,
visit developer.intel.com/products/
desktop/motherboard/