LG RD-JS31 User manual

Brand: LG

Model: RD-JS31

Category: Data projectors

Type: User manual

DLP PROJECTOR

Website : http://biz.LGservice.com

E-mail:http://www.LGEservice.com/techsup.h

MODEL : RD-JS31

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in

the Schematic Diagram and Replacement Parts List.

It is essential that these special safety parts should be replaced with the same components as recommended in this manual to

prevent X-RADIATION, Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

General Guidance

An lsolation Transformer should always be used during

the servicing of a receiver whose chassis is not isolated from

the AC power line. Use a transformer of adequate power rating

as this protects the technician from accidents resulting in

personal injury from electrical shocks.

It will also protect the receiver and it's components from being

damaged by accidental shorts of the circuitary that may be

inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,

replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film

Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Due to high vacuum and large surface area of picture tube,

extreme care should be used in handling the Picture Tube.

Do not lift the Picture tube by it's Neck.

X-RAY Radiation

Warning:

To determine the presence of high voltage, use an accurate

high impedance HV meter.

Adjust brightness, color, contrast controls to minimum.

Measure the high voltage.

The meter reading should indicate

23.5

!1.5KV: 14-19 inch, 26!1.5KV: 19-21 inch,

29.0

!1.5KV: 25-29 inch, 30.0 ! 1.5KV: 32 inch

If the meter indication is out of tolerance, immediate service

and correction is required to prevent the possibility of

premature component failure.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed

metallic parts of the cabinet, such as antennas, terminals, etc.,

to be sure the set is safe to operate without damage of

electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source,

connect an electrical jumper across the two AC plug prongs.

Place the AC switch in the on positioin, connect one lead of

ohm-meter to the AC plug prongs tied together and touch other

ohm-meter lead in turn to each exposed metallic parts such as

antenna terminals, phone jacks, etc.

If the exposed metallic part has a return path to the chassis, the

measured resistance should be between 1MΩ and 5.2MΩ.

When the exposed metal has no return path to the chassis the

reading must be infinite.

An other abnormality exists that must be corrected before the

receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor

between a known good earth ground (Water Pipe, Conduit, etc.)

and the exposed metallic parts.

Measure the AC voltage across the resistor using AC

voltmeter with 1000 ohms/volt or more sensitivity.

Reverse plug the AC cord into the AC outlet and repeat AC

voltage measurements for each esposed metallic part. Any

voltage measured must not exceed 0.75 volt RMS which is

corresponds to 0.5mA.

In case any measurement is out of the limits sepcified, there is

possibility of shock hazard and the set must be checked and

repaired before it is returned to the customer.

Leakage Current Hot Check circuit

The source of X-RAY RADIATION in this TV receiver is the

High Voltage Section and the Picture Tube.

For continued X-RAY RADIATION protection, the

replacement tube must be the same type tube as specified in

the Replacement Parts List.

1.5 Kohm/10W

To Instrument's

exposed

METALLIC PARTS

Good Earth Ground

such as WATER PIPE,

CONDUIT etc.

AC Volt-meter

IMPORTANT SAFETY NOTICE

0.15uF

CAUTION: Before servicing receivers covered by this service

manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety

precautions on page 3 of this publication, always follow the

safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC

power source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect

polarity installation of electrolytic capacitors may result

in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate

high voltage meter or other voltage measuring device (DVM,

FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first connecting

one end of an insulated clip lead to the degaussing or kine

aquadag grounding system shield at the point where the

picture tube socket ground lead is connected, and then (b)

touch the other end of the insulated clip lead to the picture

tube anode button, using an insulating handle to avoid

personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its

assemblies.

5. Unless specified otherwise in this service manual, clean

electrical contacts only by applying the following mixture to

the contacts with a pipe cleaner, cotton-tipped stick or

comparable nonabrasive applicator; 10% (by volume)

Acetone and 90% (by volume) isopropyl alcohol (90%-99%

strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication

of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks with

which receivers covered by this service manual might be

equipped.

7. Do not apply AC power to this instrument and/or any of its

electrical assemblies unless all solid-state device heat sinks

are correctly installed.

8. Always connect the test receiver ground lead to the

receiver chassis ground before connecting the test receiver

positive lead.

Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to

any heatsink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged

easily by static electricity. Such components commonly are

called Electrostatically Sensitive (ES) Devices. Examples of

typical ES devices are integrated circuits and some fieldeffect

transistors and semicounductor "chip" components. The

following techniques should be used to help reduce the

incidence of component damage caused by static by static

electricity.

1. Immediately before handling any semiconductor component

or semiconductor-equipped assembly, drain off any

electostatic charge on your body by touching a known earth

ground. Alternatively, obtain and wear a commercially

available discharging wrist strap device, which should be

removed to prevent potential shock reasons prior to

applying power to the unit under test.

2. After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or

exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder

ES devices.

4. Use only an anti-static type solder removal device. Some

solder removal devices not classified as "anti-static" can

generate electrical charges sufficent to demage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Do not remove a repalcement ES device from its protective

package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads

electrically shorted together by conductive foam, aluminum

foil or comparable conductive material).

7. Immediately before removing the protective material from

the ieads of a replacement ES device, touch the protective

material to the chassis or circuit assembly into which the

device will be installed.

CAUTION:Be sure no power is applied to the chassis or

circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged

replacement ES devices. (Otherwise harmless motion such

as the bruching together of your clothes fabric or the lifting

of your foot from a carpeted floor can generate static

electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and

appropriate tip size and shape that will maintan tip

temperature within the range or 500cF to 600cF.

2. Use an appropriate gauge of RMA resin-core solder

composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thorohly clean the surfaces to be soldered. Use a mall

wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500cF to 600cF)

b. Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the

circuiboard printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal

temperature (500cF to 600cF)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

SERVICING PRECAUTIONS

c. Qulckly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it

there only until the solder flows onto and around both the

component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

d. Closely inspect the solder area and remove any excess

or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through

which the IC leads are inserted and then bent flat against the

circuit foil. When holes are the slotted type, the following

technique should be used to remove and replace the IC. When

working with boards using the familiar round hole, use the

standard technique as outlined in parapraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by

gently prying up on the lead with the soldering iron tip as the

solder melts.

2. Draw away the melted solder with an anti-static suction-

type solder removal device (or with solder braid) before

removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit boare.

2. Carefully bend each IC lead against the circuit foil pad and

solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as

close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads

remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the

corresponding leads extending from the circuit board and

crimp the "U" with long nose pliers to insure metal to metal

contact then solder each connection.

Power Output, Transistor Device

Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heatsink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the

circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heatsink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as

possible to diode body.

2. Bend the two remaining leads perpendicula y to the circuit

board.

3. Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them

and if necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board

hollow stake.

2. Securely crimp the leads of replacement component around

notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between the replaced

component and adjacent components and the circuit board

to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit

board will weaken the adhesive that bonds the foil to the circuit

board causing the foil to separate from or "lift-off" the board.

The following guidelines and procedures should be followed

whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the

following procedure to install a jumper wire on the copper

pattern side of the circuit board. (Use this technique only on IC

connections).

1. Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely

necessary).

2. carefully scratch away the solder resist and acrylic coating

(if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away

copper pattern and let it overlap the previously scraped end

of the good copper pattern. Solder the overlapped area and

clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper

pattern at connections other than IC Pins. This technique

involoves the installation of a jumper wire on the component

side of the circuit board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a

hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the

pattern break and locate the nearest component that is

directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of

the nearest component on one side of the pattern break to

the lead of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so

the it does not touch components or sharp edges.

tion may be reproduced, transmitted, transcribed, stored in a retrieval system, or

translated into any language or computer language, in any form or by any means,

electronic, mechanical, magnetic, optical, chemical, manual or otherwise, without the

prior written permission of LG.

Disclaimer

The information in this guide is subject to change without notice.

LG makes no representations or warranties, either expressed or implied, with

respect to the contents here of and specifically disclaims any warranties of

merchantability or fitness for any particular purpose. Any LG software described

in this manual is sold or licensed “as is”. Should the programs prove defective

following their purchase, the buyer (and not LG, itsdistributor, or its dealer)

assumes the entire cost of all necessary servicing, repair, and any incidental or

consequential damages resulting from any defect in the software.

LG is a registered trademark of LG Corporation.

Intel is a registered trademark of Intel Corporation.

Pentium and Pentium II/III are trademarks of Intel Corporation.

Other brand and product names are trademarks and/or registered trademarks of their respec-

tive holders.

Conventions

The following conventions are used in this manual

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Chapter 1 System Introduction 1

Technical Specification .......................................................................................................1

System Block Diagram .......................................................................................................3

Optics Conceptual Drawing................................................................................................4

Chapter 2 Firmware Update 5

Setup Tool / Equipment.......................................................................................................5

Upgrading Procedure .........................................................................................................6

Chapter 3 Machine Dissassembly and Replacement 7

General Information ............................................................................................................8

Disassemble Lamp Module................................................................................................9

Disassemble IO Cover ......................................................................................................10

Disassemble Top Cover and Front Fan............................................................................11

Disassemble Main Board..................................... ..............................................................12

Disassemble Middle Cover...............................................................................................13

Disassemble Ballast Module..............................................................................................14

Dissassemble Optical Engine ..........................................................................................15

Disassemble Power Outlet Set..........................................................................................16

Disassemble Power Board................................................................................................17

Disassemble Foot Screw Assembly................................................................................. 18

Exploded Overview...........................................................................................................19

Chapter 4 Trouble shooting 20

Video Signal troubleshooting............................................................................................21

Operation FunctionTroubleshooting..................................................................................24

Power SourceTroubleshooting..........................................................................................25

Function Test and Alignment...............................................................................................26

Equipment Needed...................................................................................................26

Test Condition............................................................................................................26

Display Modes and Patterns ............................................................................................27

Compatible Modes ...................................................................................................27

Function Test Display Pattern...................................................................................28

Table of Contents

Chapter 5 Connector Information 30

Introduction...........................................................................................................................30

Main Board......................................................................................................................... 30

Power Board .....................................................................................................................37

Ballast Board ......................................................................................................................39

Chapter 6 Replacement Parts List 40

RPL......................................................................................................................................40

Chapter 7 LED indicator for RD-JS31.....................................................................................45

1 Chapter 1

System Introduction

Chapter

Technical Specification

Item Description

Display Type Single Panel 0.55" DLP Projector

Lamp Type P-VIP 200W

Brightness 1500 ANSI Lumen

Contrast Ratio 1200 : 1(Full on/off)

Resolution(Pixels) 800 x 600( 480,000 dot x 1)

Uniformity 85 %

Optical Compensation Light Tunnel

Focal Length 20.2 ~ 24.2 mm

Screen Size 100"@3.67m

Throw Distance 1.2 ~ 10 Meter

Projection Type

Front, Rear, Ceiling

Compatibility

"Horizontal frequency (31~79KHz" )

"Vertical frequency ( 50~85Hz" )

Pixel Rate 108 MHz

Keystone Correction Vertical: +/-15 (In Wild mode +/-10)

Audio System 2W x 1

Aspect Ratio 16:9 , 4:3

Video Input PAL , NTSC , SECAM

Input Source Computer , HDTV , S-Video , Video

Analog RGB (Input Signal) D-Sub Connector

Chapter 1 2

Item Description

Operation Humidity 35~85%

Other Key Feature

3:2 Pull Down

Progressive Scan

Blank

Auto Source Detection

Auto Tracking/Sync.

Plastic Body

Sound Noise <30dBA (In ECO mode)

Power Requirement 100~240v, 50~60Hz

Dimension(W x D x H) 274 x 210 x 104 mm

Weight 2.2 KG (<4.5 lb)

Remote Mouse Multifunctional

OSD Language

English, French, German, Swedish, Russian, Italian,

Spanish, Simplified Chinese, Korean, Portuguese,

Power Consumption 250 W

Operation Temperature +5 ~ +35C

Certification

UL/ cUL, GS, CB, MIC, CE , FCC Class B , SABS, PSB,

GOST, C-Tick, CCC,

3 Chapter 1

System Block Diagram

Chapter 1 4

Optics-Conceptual Drawing

Mirror

Aspherical

Lamp Housing

Lens Assembly (3680V00116H)

Light Tunnel

Color WheelLens-C1

Osram Lamp (6912B22006E)

FAN (5900V03002K)

Heatsink

DMD (0.55 inch)

Lens-C2

DMD PCB

Thermal PCB (6871VSN257R)

5 Chapter 2

Upgrading Procedure

Firmware Upgrade

This chapter provides the equipment needed, setup and upgrading procedure for

Firmware upgrade.

Chapter 2

Setup Tool / Equipment

1. Computer

2. USB Cable (see right picture)

3. Power Coard

1. Connect Download Cable to projector

2. Open burning program (DLP Composer Lite)

Chapter 2 6

3. After turn on AC switch, press the buttons according to below sequences

Menu -> Auto -> Menu -> Source -> Menu -> OK

4. Click the Start Download button and then start to burning of program .

5. Completion of Burning than remove Power Cord and Burning Cord .

7 Chapter 3

Machine Disassembly and Replacement

This section provides disassembly procedures for RD-JS31 DLP Projector. Before you begin

any of these procedures, be sure to turn off the power, computer system, and other attached

devices; then disconnect the power cable from the electronically outlet. Moreover, when you

disassemble the projector, be sure to put the screws in a safe place and separate them accord-

ing to grouping.

Tool Needed

Chapter

Item PHOTO

Long Nose Nipper

Hex Sleeves 5mm

Screw Bit (+) : 107

Screw Bit (+) : 101

Screw Bit (+) : 102

Chapter 3 8

General Information

Before You Begin

Before proceeding with the disassembly procedure, make sure that you do the following:

1. Turn off the power to the system and all peripherals.

2. Unplug the AC adapter and all power and signal cables from the system.

3. Wear Anti-static wrist strap.

9 Chapter 3

1. Loosen two screws of Lamp Cover

2. Remove Lamp Cover

3. Loosen two screws of Lamp Module .

4. Grasp the lamp handle and pull out Lamp Module

Disassemble Lamp Module

Note:Unplug all the cord before disassembling the Projector.

3580V00094K

3110V00321H

Chapter 3 10

1. Remove 3 screws of IO cover.

2. Separate all parts individually

Disassemble IO Cover

1. Remove the 2 screws on middle cover

2. Remove the 2 screws on botton cover

3720V00206E

11 Chapter 3

Disassemble Front Fan

1. Then life up the fan set directly .

1. Dispatch the top cover

2. Remove the FFC cable and main board mylar

Disassemble Top Cover

3110V00320N

5900V03002L

Chapter 3 12

1. Remove the 4 screws of main board .

2. Unplug all wires on the board (Main Board PIN location of connectors pls refer to

Chapter 5 )

3. Remove the Main Board.

Disassemble Main Board

6871VMN657M

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LG RD-JS31 User manual

Brand: LG

Model: RD-JS31

Category: Data projectors

Type: User manual

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LG RD-JS31 User manual

LG RD-JS31 User manual

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