ADLINK Technology VPX3010 Series User manual

Advance Technologies; Automate the World.

Manual Rev.: 0.10

Revision Date: January 25, 2017

Part No: 50-15107-2000

VPX3010 Series

Performance Rugged Conduction Cooled

3U VPX Intel

®

Xeon

®

Processor D-1500

Processor Blade

Revision History

Revision Release Date Description of Change(s)

0.10 2017/01/25 Preliminary release

Preface iii

VPX3010

Preface

This document contains proprietary information protected by copy-

right. All rights are reserved. No part of this manual may be repro-

duced by any mechanical, electronic, or other means in any form

without prior written permission of the manufacturer.

Disclaimer

The information in this document is subject to change without prior

notice in order to improve reliability, design, and function and does

not represent a commitment on the part of the manufacturer.

In no event will the manufacturer be liable for direct, indirect, spe-

cial, incidental, or consequential damages arising out of the use or

inability to use the product or documentation, even if advised of

the possibility of such damages.

Environmental Responsibility

ADLINK is committed to fulfill its social responsibility to global

environmental preservation through compliance with the Euro-

pean Union's Restriction of Hazardous Substances (RoHS) direc-

tive and Waste Electrical and Electronic Equipment (WEEE)

directive. Environmental protection is a top priority for ADLINK.

We have enforced measures to ensure that our products, manu-

facturing processes, components, and raw materials have as little

impact on the environment as possible. When products are at their

end of life, our customers are encouraged to dispose of them in

accordance with the product disposal and/or recovery programs

prescribed by their nation or company.

Trademarks

Product names mentioned herein are used for identification pur-

poses only and may be trademarks and/or registered trademarks

of their respective companies.

iv Preface

Conventions

Take note of the following conventions used throughout this

manual to make sure that users perform certain tasks and

instructions properly.

NOTE:

Additional information, aids, and tips that help users perform

tasks.

CAUTION:

Information to prevent minor physical injury, component dam-

age, data loss, and/or program corruption when trying to com-

plete a task.

WARNING:

Information to prevent serious physical injury, component

damage, data loss, and/or program corruption when trying to

complete a specific task.

Table of Contents v

VPX3010

Table of Contents

Revision History...................................................................... ii

Preface.................................................................................... iii

List of Figures....................................................................... vii

List of Tables.......................................................................... ix

1 Introduction ........................................................................ 1

1.1 Overview.............................................................................. 1

1.2 Features............................................................................... 3

1.3 Block Diagrams.................................................................... 5

1.4 Model Number Decoder - Processor Blade ........................ 6

1.5 Package Contents ............................................................... 8

2 Specifications..................................................................... 9

2.1 VPX3010 Blade Specifications ............................................ 9

2.2 VPX-R3010 RTM Specifications........................................ 12

2.3 Power Consumption .......................................................... 13

3 Functional Description .................................................... 17

3.1 Processors......................................................................... 17

3.2 Intel® Turbo Boost Technology ......................................... 20

3.3 USB ................................................................................... 21

3.4 SPI BIOS ........................................................................... 21

3.5 System Management Bus.................................................. 22

3.6 Real Time Clock ................................................................ 22

3.7 Serial ATA Controller ......................................................... 22

3.8 PCI Express Interface........................................................ 22

3.9 Intel ® 82580EB Gigibit Ethernet Controller ...................... 22

3.10 Graphics ............................................................................ 23

3.11 GPIO Expander PCA9554 ................................................. 23

vi Table of Contents

3.12 UART NCT5104................................................................. 23

3.13 TPM AT97SC3204............................................................. 23

3.14 XMC Site............................................................................ 24

4 VPX3010 Board Interfaces ............................................... 25

4.1 VPX3010 Board Layout ..................................................... 25

4.2 VPX3010 Mechanical Drawing .......................................... 26

4.3 VPX3010 Connector Pin Assignments .............................. 27

4.4 Switches and LEDs............................................................ 33

5 VPX-R3010 RTM................................................................ 35

5.1 Connector Allocation.......................................................... 35

5.2 VPX-R3010 Block Diagram................................................ 37

5.3 VPX-R3010 RTM Board Layout......................................... 38

5.4 VPX-R3010 RTM Connector Pin Assignments.................. 41

5.5 VPX-R3010 Switches......................................................... 48

Important Safety Instructions............................................... 49

Getting Service...................................................................... 51

List of Figures vii

VPX3010

List of Figures

Figure 1-1: VPX3010 Functional Block Diagram................................ 5

Figure 4-1: VPX3010 Component Side Layout ................................ 25

Figure 4-2: VPX3010 Component Side Layout ................................ 25

Figure 4-3: VPX3010 Mechanical Dimensions................................. 26

Figure 4-4: VPX3010 Front View ..................................................... 33

Figure 4-5: VPX3010 Switches and LEDs solder side..................... 33

Figure 5-1: VPX-R3010 RTM Functional Block Diagram ................. 37

Figure 5-2: VPX-R3010 RTM Board Layout..................................... 38

Figure 5-3: VPX-R3010 Solder Side Layout .................................... 39

Figure 5-4: VPX-R3010-L2 Board Layout ........................................ 40

Figure 5-5: VPX-R3010-L2-1 Board Layout..................................... 40

viii List of Figures

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List of Tables ix

VPX3010

List of Tables

Table 1-1: VPX3010 SKU Table ....................................................... 7

Table 2-1: VPX3010 Blade Specifications ........................................ 9

Table 2-2: VPX-R3010 RTM Specifications.................................... 12

xList of Tables

This page intentionally left blank.

Introduction 1

VPX3010

1 Introduction

1.1 Overview

The VPX3010 Series is a 3U VPX processor blade based on the

Intel® Xeon® Processor D-1500 Family on 14nm silicon technol-

ogy and integrating the CPU and chipset in a single sys-

tem-on-chip (SoC). The VPX3010 is available with three different

eTMP processors: D-1559 (12 cores, 1.5GHz, TDP 45W), D-1539

(8 cores, 1.6GHz, TDP 35W) and D-1519 (4 cores, 1.5GHz, TDP

25W). The VPX3010 Series supports DDR4-2133 ECC soldered

memory up to 16GB. For storage, the VPX3010 provides a high

endurance soldered SLC SSD up to 64GB. The VPX3010 is com-

pliant with the VITA48 and VITA 65 specifications.

The VPX3010 Series with Intel® server grade processor brings

extreme computing power with low power consumption. The

VPX3010 supports two Ethernet interface options: 2x 10G-KR and

2x 1000BASE-T or 1x 1000BASE-T and 2x 1000BASE-BX (by

BOM option). The VPX3010 provides one PCI Express x8 Gen3

signal to rear and one PCI Express x8 Gen3 XMC.3 site with VITA

46.9 rear IO, or one PCI Express x16 Gen3 and one PCI Express

x1 Gen3 (by BOM option). Display support is provided by a Silicon

Motion SM750 2D graphics chip with VGA to P2. I/O features

include 1x SATA 6Gb/s to P1 or 1x SATA 6Gb/s to P1 and 1x

SATA 6Gb/s to P2 (by BOM option), 2x USB 3.0 to P1 and P2, 1x

USB 2.0 to P1, one RS-232 to P1 and one RS-232/422/485 to P2.

The ADLINK VPX3010 provides an Atmel TPM 1.2 chip for system

security, dual BIOS functionality, as well as an ADLINK ABSDiag

self-diagnosis tool. These features bring additional value by ensur-

ing high reliability.

All components on the VPX3010 Series are soldered on the PCB

board to ensure product reliability and quality, and enable compli-

ance with MIL-STD-810G shock and vibration. The VPX3010 sup-

ports a wide operating temperature range from -40°C to +75°C

(optionally up to +85°C)

.

2Introduction

A VPX-R3010 Rear Transition Module is available to access rear

I/O signals for users to validate VPX3010 functionality.

The VPX3010 Series is available in a rugged conduction cooled

version with conformal coating and an air cooled version to meet

different application needs. The rugged conduction cooled version

is ideal for mission critical applications in radar; intelligence, sur-

veillance and reconnaissance (ISR); and UAV/UGV platforms. The

air cooled version is suited for use in defense control centers.

Introduction 3

VPX3010

1.2 Features

X 3U VPX VITA 46, OpenVPX VITA 65, VPX REDI 48

X 1" rugged conduction cooled and air cooled 3U VPX blade

with conformal coating

X 14nm uFC-BGA Intel® Xeon® Processor D-1500 family

Z Intel® Xeon® processor D-1559, 12-core, 18M Cache,

1.50/1.8 GHz, 45W TDP, -40°C to 85°C

Z Intel® Xeon® processor D-1539, 8-core, 12M Cache,

1.60/1.9 GHz, 35W TDP, -40°C to 85°C

Z Intel® Xeon® processor D-1519, 4-core, 6M Cache,

1.50/1.8GHz, 35W TDP, -40°C to 85°C

X Dual channel DDR4-2133 SDRAM with ECC soldered

onboard, up to 16GB

X Onboard SLC SATA Solid State Drive up to 64GB

X Silicon Motion SM750 2D graphics chip with VGA output to

P2

X Onboard PCI Express x8 Gen3 XMC site with VITA 46.9

rear I/O

X Dual 10G-KR to rear

X Data Plane: VITA 46.4 PCI Express x8 Gen3, or 2x PCI

Express x4 Gen3 to P1, supports NTB function

X Control Plane: VITA 46.6 2x 1000BASE-T or 1x

1000BASE-T and 2x 1000BASE-BX (BOM option)

X Rear I/O:

Z P1: 1x PCI Express x8, 2x1000BASE-T(or

1x1000BASE-T and 2x 1000BASE-BX), 1x SATA 6

Gb/s, 1x RS-232, 1x USB 3.0 and 1x USB 2.0

Z P2: 2x 10G-KR, 1x VGA, 1x RS-232/422/485, 1x USB 3.0,

XMC to rear IO x8d+x12d

Z P2 (BOM option): 2x 10G-KR, 1x VGA, 1x USB 3.0,

1x RS-232/422/485, 1x PCI Express x8 Gen3, 1x PCI

Express x1, 1x SATA 6Gb/s,

X uEFI BIOS 64Mb SPI flash

X ADLINK Dual BIOS mechanism

4Introduction

X ABSDiag self-diagnosis tool

X MOD3-PAY-2F2T-16.2.5-3 or MOD3-PAY-2F2U-16.2.3-3

(BOM option)

X Slot Profile: SLT3-PAY-2F2U-14.2.5 or

SLT3-PAY-2F2U-14.2.3 (BOM option)

Introduction 5

VPX3010

1.3 Block Diagrams

Figure 1-1: VPX3010 Functional Block Diagram

P1 P0

P2

DDR4 DDR4NAND Flash

BIOS_0

BIOS_1

SPI

TPM

COM IC

IPMC

SPI Flash

IPMB_0

IPMB_1

RS-232

PCIe x4 Gen2

1000BASE-T

1000BASE-BX

1x USB 2.0

SATA 6Gb/s

1x USB 3.0

LPC

*PCIe x8

Gen3

*PCIe x8

Gen3

x8d+x12d

PCIe x1

Gen2

VGA

10G-KR

GPIO

Expansion

SMBus

P2

RS-232/

RS422

PCIe x1

Gen3

SKU2

BOM Option

SKU2

BOM Option

*

Optional PCIe x16 Gen3 to P1/P2, no XMC BOM option

2x 1000BASE-T

or

1x1000BASE-T +

2x 1000BASE-BX

*

Actual data transfer rate dependent on device specification

10G-KR

1x USB 3.0

GbE

Intel

82580EB

SATA 6Gb/s

XMC

SM750

Intel® Xeon® Processor D

6Introduction

1.4 Model Number Decoder - Processor Blade

(A) CPU Code

Z D-1559 = Intel® processor D-1559, 12 cores, TDP 45W,

1.5GHz

Z D-1539 = Intel® processor D-1539, 8 cores, TDP 35W,

1.6GHz

Z D-1519 = Intel® processor D-1519, 4 cores, TDP 25W,

1.5GHz

(B) Memory Size Code

Z M8 = 8GB DDR4-2133 ECC soldered SDRAM

Z M16 = 16GB DDR4-2133 ECC soldered SDRAM

(C) SATA NAND Flash Size Code

Z S32 = Soldered SLC NAND flash 32GB

Z S64 = Soldered SLC NAND flash 64GB

(D) PCI Express interface code

Z XMC = XMC interface

Z P16 = PCI Express x16 Gen3 (BOM option)

(E) Ruggedized Level Code

Z R0 = Conduction Cooled version supporting 0°C to

+50°C at card edge

Z R1 = Conduction Cooled version supporting -40°C to

+75°C at card edge

Z R2 = Conduction Cooled version supporting -40°C to

+85°C at card edge

Z A0 = Air Cooled version supporting 0°C to +50°C

Z A1 = Air Cooled version supporting -40°C to +75°C

VPX3010/1559/M16/S32/XMC-R2

(E) (A) (B) (C) (D)

Introduction 7

VPX3010

VPX3010 SKU Table

Note: Items in red differ between SKU options.

XMC Version “No XMC” BOM Option

Item Description Description

XMC

PCIe x8 Gen3 with Rear IO to

P2w7-X8d+X12d

N/A

Ethernet

2x 1000BASE-T to P1

1x 1000BASE-T + 2x 1000BASE-BX

to P1

2x 10GBASE-KR to P2 2x 10GBASE-KR to P2

PCI

Express

PCIe x8 Gen3 to P1 (or 2 x4 or 1

x8) to P1 with NTB-LAN 0 to LAN 3

PCIe x8 Gen3 to P1 (or 2 x4 or 1 x8)

to P1 with NTB-LAN 0 to LAN 3

N/A

PCIe x8 Gen3 to P2 (or PCIe x16 if

combined with P1 PCIe x8)

1x PCIe x1 Gen3 to P2

SATA

6Gbps

SATA 6 GB/S port 0 to P1

1x SATA 6 GB/S port 0 to P1,

1x SATA 6 GB/S port 2 to P2

SATA 6 GB/S port 1 to SATA 3 GB/s

NAND SLC flash, minimum 32GB,

64GB is optional

SATA 6 GB/S port 1 to SATA 3 GB/s

NAND SLC flash, minimum 32GB,

64GB is optional

GPIO

N/A 5V tolerance GPIO 0-7 from IPMC

Serial

1x RS-232 to P1 (full COM) 1x RS-232 to P1 (Tx/Rx only)

1x RS-232/422/485 to P2

(full RS-232/422/485)

1x RS-232/422/485 to P2

(full RS-422/485, RS-232 Tx/Rx only)

Table 1-1: VPX3010 SKU Table

8Introduction

1.5 Package Contents

The VPX3010 is packaged with the following components. If any

of the items on the contents list are missing or damaged, retain the

shipping carton and packing material and contact the dealer for

inspection. Please obtain authorization before returning any prod-

uct to ADLINK. The packing contents of the VPX3010 are

non-standard configurations and may vary depending on customer

requests.

Processor Blade

X VPX3010

Z CPU and memory specifications will differ depending on

options selected

Z Thermal module is assembled on the board

Rear Transition Module (optional)

X VPX-R3010 Layer 1 on RTM

X VPX-R3010L2 Layer 2 on RTM

X VPX-R3010L2-1 Layer 2 on RTM

Test Backplane (optional)

X tBP-VPX3000 test backplane

Test Frame (optional)

X 3U VPX conduction cooled chassis, up to 9 slots

NOTE:

The contents of non-standard VPX3010 configurations may vary

depending on the customer requirements.

CAUTION:

This product must be protected from static discharge and physi-

cal shock. Never remove any of the components except at a

static-free workstation. Use the anti-static bag shipped with the

product when putting the board on a surface. Wear an anti-static

wrist strap properly grounded on one of the system's ESD ground

jacks when installing or servicing system components.

Specifications 9

VPX3010

2 Specifications

2.1 VPX3010 Blade Specifications

VITA Standards • VITA 46.0 VPX Base Standard

• VITA 46.4 PCI Express on VPX Fabric Connector

• VITA 46.6 Gigabit Ethernet Control Plane on VPX

• VITA 46.9 PMC/XMC/Ethernet Signal Mapping to 3U/6U

VPX

• VITA 48.0 Ruggedized Enhanced Design Implementation

Mechanical Base Specification

• VITA 65 OpenVPX Architecture Framework for VPX

Mechanical • 3U VPX 0.8”

• Dimensions: 100mm x 160mm

Processor 14nm FC-BGA Intel Xeon D series SoC

• Xeon D-1559 12C@ 45W

• Xeon D-1539 8C@ 35W

• Xeon D-1519 4C@ 25W

1.5Mb per core LLC

Passive heatsink

Chipset • Integrated in processor

Memory • Dual channel 1.2V DDR4 2133MT/s SDRAM with ECC,

8Gb density support

• Channel A: soldered on board, up to 8GB

• Channel B: soldered on board, up to 8GB

USB • 1x USB 3.0 to P1 and 1x USB 3.0 to P2

• 1x USB 2.0 to P1

XMC • PCIe x8 Gen3 with rear IO to P2 X8d+X12d

Gigabit

Ethernet

• 2x 10/100/1000BASE-T to P1

• 1x 10/100/1000BASE-T + 2x 10/100/1000BASE-BX to P1

(SKU2 by BOM option)

• 2x 10GBASE-KR to P2

PCI Express • PCIe x8 Gen3 to P1 (or 2 PCIe x4, 1 PCIe x8) with NTB-

Lane 0 to lane 3

plus (“no XMC” BOM option only)

• PCIe x8 Gen3 to P2 (when combined with PCIe x8 to P1,

configurable as PCIe x16 Gen3, 2 PCIe x8 or 4 PCIe x4)

• PCIe x1 Gen3 to P2

Table 2-1: VPX3010 Blade Specifications

10 Specifications

SATA • SATA 6Gb/s port 0 to P1

• SATA 6Gb/s port 1 to SATA 3Gb/s NAND SLC flash, 32GB

(64GB optional)

• SATA 6Gb/s port 2 to P2 (“no XMC” BOM option only)

Graphics • Silicon Motion SM750 2D graphics chip via PCIe x1 with

VGA output to P2

IPMC • SmartFusion A2F200M3F-CSG288, compliant to VITA

46.11

• Local event log (SEL) in a non-versatile 32k EEPROM

• FRU data in a 32k EEPROM

• Sensor data record, including CPU, system voltage and

temperature

• Serial over LAN

• IPMI over LAN (via Intel® 82580)

•IPMC WDT

• OVT/UVT warning

•Dual BIOS

• Extended SPI flash

GPIO • 5V tolerance GPIO 0-7 from IPMC

• Build option with COM1/2

Serial • 1x RS-232 to P1

• 1x RS-232/422/485 to P2 (COM mode by BIOS setting)

Note: RS-232 supports Tx/Rx only on “no XMC” BOM option

version

RTC •To P1

TPM • Atmel AT97SC3204 industrial grade

• Version 1.2

Front Panel I/O • XMC front I/O on convection cooled version

LEDs • Power (green, on when power is on, off when powered

down)

• SATA (yellow, blinking when storage is active)

• Reset (red, when system is reset, the LED will light for 2

seconds)

• Dual BIOS LED (green: boot from BIOS1; orange: boot from

BIOS2; off: BIOS1 and BIOS2 fail)

Reset Button • On front panel

Profile • SLT3-PAY-2F2T-14.2.5

• MOD3-PAY-2F2T-16.2.5-3

Table 2-1: VPX3010 Blade Specifications

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