Adlink LEC-IMX8MP Owner's manual

Type
Owner's manual
COM-HPC-sIDH User’s Guide PICMG COM-HPC R1.1
Page 1 Copyright © 2023 ADLINK Technology, Inc.
LEC-IMX8M Plus
Revision: Rev. 1.0
Date: 2023-04-20
Part Number: 50M-00139-1000
Users Guide
LEC-iMX8M Plus User’s Guide SGET SMARC R2.1
Page 2 copyright © 2023 ADLINK Technology Inc.
Revision History
Revision
Description
Date
Author
1.0
Initial release
2023-04-20
CC
LEC-iMX8M Plus User’s Guide SGET SMARC R2.1
Page 3 copyright © 2023 ADLINK Technology Inc.
Preface
Disclaimer
Information in this document is provided in connection with ADLINK products. No license, express or implied, by estoppel or otherwise, to any
intellectual property rights is granted by this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products, ADLINK
assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products including
liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. If you intend to use ADLINK products in or as medical devices, you are solely responsible for all required regulatory compliance, including, without
limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any. ADLINK may make changes to specifications and product
descriptions at any time, without notice.
Environmental Responsibility
ADLINK is committed to fulfil its social responsibility to global environmental preservation through compliance with the European Union's Restriction of
Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for
ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product
disposal and/or recovery programs prescribed by their nation or company.
California Proposition 65 Warning: This product can expose you to chemicals including acrylamide, arsenic, benzene, cadmium, Tris(1,3-
dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials, which are known to
the State of California to cause cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC,
and vinyl materials, which are known to the State of California to cause birth defects or other reproductive harm. For more information go to
www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks / registered trademarks of respective companies.
Copyright © 2023 ADLINK Technology Incorporated
This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any
mechanical, electronic, or other means in any form without prior written permission of the manufacturer.
LEC-iMX8M Plus User’s Guide SGET SMARC R2.1
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Safety Instructions
For user safety, please read and follow all Instructions, WARNINGs, CAUTIONs, and NOTEs marked in this manual and on the associated equipment
before handling/operating the equipment.
Read these safety instructions carefully.
Keep this manual for future reference.
Read the specifications section of this manual for detailed information on the operating environment of this equipment.
Turn off power and unplug any power cords/cables when installing/mounting or un-installing/removing equipment.
To avoid electrical shock and/or damage to equipment:
Keep equipment away from water or liquid sources;
Keep equipment away from high heat or high humidity;
Keep equipment properly ventilated (do not block or cover ventilation openings);
Make sure to use recommended voltage and power source settings;
Always install and operate equipment near an easily accessible electrical socket outlet;
Secure the power cord (do not place any object on/over the power cord);
Only install/attach and operate equipment on stable surfaces and/or recommended mountings;
If the equipment will not be used for long periods of time, turn off the power source and unplug the equipment.
Conventions
The following conventions may be used throughout this manual, denoting special levels of information
Note: This information adds clarity or specifics to text and illustrations.
Caution: This information indicates the possibility of minor physical injury, component damage, data loss, and/or program corruption.
Warning: This information warns of possible serious physical injury, component damage, data loss, and/or program corruption.
LEC-iMX8M Plus User’s Guide SGET SMARC R2.1
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Getting Service
Ask an Expert: https://www.adlinktech.com/en/Askanexpert
ADLINK Technology, Inc.
No. 66, Huaya 1st Rd., Guishan District, Taoyuan City 333411, Taiwan
Tel: +886-3-216-5088
Fax: +886-3-328-5706
Email: service@adlinktech.com
Ampro ADLINK Technology, Inc.
6450 Via Del Oro, San Jose, CA 95119-1208, USA
Tel: +1-408-360-0200
Toll Free: +1-800-966-5200 (USA only)
Fax: +1-408-600-1189
ADLINK Technology (China) Co., Ltd.
300 Fang Chun Rd., Zhangjiang Hi-Tech Park, Pudong New Area, Shanghai, 201203, China
Tel: +86-21-5132-8988
Fax: +86-21-5132-3588
ADLINK Technology GmbH
Hans-Thoma-Strasse 11, D-68163 Mannheim, Germany
Tel: +49-621-43214-0
Fax: +49-621 43214-30
Please visit the Contact page at www.adlinktech.com for information on how to contact the ADLINK regional office nearest you.
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Table of Contents
Revision History ................................................................................................................................................................................................................................................................................................................ 2
Preface .................................................................................................................................................................................................................................................................................................................................. 3
Introduction ........................................................................................................................................................................................................................................................................................................................ 9
1.1 LEC-iMX8M Plus ............................................................................................................................................................................................................................................................................................................................. 9
1.2 The SMARC Form Factor ............................................................................................................................................................................................................................................................................................................. 9
2. Specifications ............................................................................................................................................................................................................................................................................................................. 10
2.1 Core System ................................................................................................................................................................................................................................................................................................................................... 10
2.2 Video ................................................................................................................................................................................................................................................................................................................................................ 11
2.3 Audio ................................................................................................................................................................................................................................................................................................................................................ 12
2.4 Dual Ethernet ................................................................................................................................................................................................................................................................................................................................. 12
2.5 1216 M.2 LGA Wi-Fi (optional) ................................................................................................................................................................................................................................................................................................ 13
2.6 Extension Busses .......................................................................................................................................................................................................................................................................................................................... 13
2.7 System Storage ............................................................................................................................................................................................................................................................................................................................. 14
2.8 SEMA® Board Management Controller .............................................................................................................................................................................................................................................................................. 15
2.9 Debug Header ............................................................................................................................................................................................................................................................................................................................... 15
2.10 Boot Modes .................................................................................................................................................................................................................................................................................................................................... 15
2.11 Power ................................................................................................................................................................................................................................................................................................................................................ 16
2.12 Mechanical and Environmental............................................................................................................................................................................................................................................................................................... 16
3. Block Diagram ........................................................................................................................................................................................................................................................................................................... 17
4. Pinout and Signal Descriptions .......................................................................................................................................................................................................................................................................... 18
4.1 Pin Summary .................................................................................................................................................................................................................................................................................................................................. 18
4.2 Signal Terminology Descriptions ........................................................................................................................................................................................................................................................................................... 22
4.3 Signal Description by Function ............................................................................................................................................................................................................................................................................................... 23
4.3.1 The First Display Interface ............................................................................................................................................................................................................................................................................................ 23
4.3.2 Second & Third Display Interfaces ............................................................................................................................................................................................................................................................................ 26
4.3.3 MIPI Camera Support ..................................................................................................................................................................................................................................................................................................... 28
4.3.4 I2S (Audio) .......................................................................................................................................................................................................................................................................................................................... 30
4.3.5 USB Ports ............................................................................................................................................................................................................................................................................................................................ 31
4.3.6 PCIe Ports ........................................................................................................................................................................................................................................................................................................................... 33
4.3.7 SATA Ports .......................................................................................................................................................................................................................................................................................................................... 34
4.3.8 LAN Ports ............................................................................................................................................................................................................................................................................................................................ 35
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4.3.9 SDIO ...................................................................................................................................................................................................................................................................................................................................... 37
4.3.10 SPI and ESPI ....................................................................................................................................................................................................................................................................................................................... 38
4.4 General Purpose I2C ................................................................................................................................................................................................................................................................................................................... 40
4.4.1 GPIO ...................................................................................................................................................................................................................................................................................................................................... 41
4.4.2 UART ..................................................................................................................................................................................................................................................................................................................................... 42
4.4.3 CAN Bus .............................................................................................................................................................................................................................................................................................................................. 43
4.4.4 Miscellaneous .................................................................................................................................................................................................................................................................................................................... 43
4.4.5 Power and System Management ............................................................................................................................................................................................................................................................................... 44
4.4.6 DB30 Multipurpose Connector ................................................................................................................................................................................................................................................................................... 45
4.4.7 Boot Select ......................................................................................................................................................................................................................................................................................................................... 46
4.4.8 Power ................................................................................................................................................................................................................................................................................................................................... 47
4.5 SMARC Pin-to-controller Mapping ....................................................................................................................................................................................................................................................................................... 48
5. Software Support ..................................................................................................................................................................................................................................................................................................... 60
5.1 Uboot / Yocto ................................................................................................................................................................................................................................................................................................................... 60
5.2 Ubuntu ................................................................................................................................................................................................................................................................................................................................. 60
5.3 Android ................................................................................................................................................................................................................................................................................................................................ 60
6. Mechanical .................................................................................................................................................................................................................................................................................................................. 61
7. Thermal Solutions .................................................................................................................................................................................................................................................................................................... 62
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List of Figures
Figure 1 Module function diagram ...................................................................................................................................................................................................................................................................... 17
Figure 2 Module top/botom side pin numbering ......................................................................................................................................................................................................................................... 19
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Introduction
1.1 LEC-iMX8M Plus
ADLINK LEC-iMX8MP is a SMARC module based on NXP iMX8M Plus (4-core Arm Cortex-A53) processor with an optional Neural Processing Unit (NPU)
operating at up to 2.3 TOPS. It is the first SMARC Revision 2.1 module focusing on machine learning and vision, advanced multimedia, and industrial
IoT, and with high reliability. The module also supports dual-image signal processors and 2x camera inputs for an effective vision system, and is
especially suited for applications such as smart home, smart city, and industrial 4.0.
1.2 The SMARC Form Factor
The SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor Computer on Module definition targeting applications that require low power
and high performance at low costs. Typically under 6W, the modules often utilize ARM and other alternative low-power option CPUs, and are used in
many familiar handheld devices, such as tablet computers and smart phones.
Two module sizes are defined in SMARC: 82 mm x 50 mm and 82 mm x 80 mm.
The module PCBs have 314 edge fingers that mate with a low-profile 314 pin 0.5 mm pitch right angle connector (the connector is sometimes identified
as a 321 pin connector, with 7 pins used by the key).
SMARC modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot
flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the module. Modules are used with
application-specific carrier boards that implement other features such as audio codecs, touch controllers, wireless devices, etc.
The modular approach allows scalability, faster time to market and upgradability while still maintaining low costs, low power, and small physical size.
SMARC module and carrier specifications are available online at: https://www.sget.org/standards/smarc.html
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2. Specifications
2.1 Core System
SoC
NXP iMX8M Plus series, available with standard (0°C to 70°C) or extreme rugged (-40°C to 85°C) operating temperature
i.MX8M-plus Quad NPU 4x Arm Cortex-A53 at 1.6 to 1.8GHz, 1x Arm Cortex-M7, NPU, GPU, VPU Decode/Encode
i.MX8M-plus Quad 4x Arm Cortex-A53 at 1.6 to 1.8GHz, 1x Arm Cortex-M7, GPU, VPU Decode/Encode
i.MX8M-plus QuadLite 4x Arm Cortex-A53 at 1.6 to 1.8GHz, 1x Arm Cortex-M7
L2 Cache
32KB I-cache, 32KB D-cache (A53), 512KB L2 Cache (ECC)
Memory
2/4/8GB LPDDR4 memory down (inline ECC)
Security
CryptoAuthentication™ Device, Microchip ATECC608A (optional)
Cryptographic co-processor with secure hardware-based key storage
Protected storage for up to 16 Keys, certificates or data
ECDH: FIPS SP800-56A Elliptic Curve Diffie-Hellman
NIST standard P256 elliptic curve support
SHA-256 & HMAC hash including off-chip context save/restore
AES-128: encrypt/decrypt, galois field multiply for GCM
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TPM 2.0 Device, ST Microelectronics ST33HTPH2X32AHD5 (optional)
Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific
TPM Platform Specifications 1.03
Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted (self-recovery)
SP800-193 compliant for protection, detection, and recovery requirements
2.2 Video
LEC-iMX8M Plus supports 1K-capable HDMI 2.0a, a single/dual channel 24-bit LVDS, and a 4-lane DSI.
GPU Core
Vivante GC7000UL 3D GC520L 2D
GPU/VPU Features
GPU: 2 shaders, OpenGL ES 1.1, 2.9, 3.0, OpenCL 1.2, OpenGL 3.0, and Vulkan, up to 1080p FHD resolutions
VPU : 1080p60 HEVC/H.265, H.264, VP9 Decoder | 1080p60 AVC/H.264/ HEVC/H.265 encoder
NPU (optional)
2.3 TOP/s Neural Network performance
Keyword detect, noise reduction, beamforming, Speech recognition (i.e. Deep Speech 2), Image recognition (i.e. ResNet-50)
HDMI
HDMI 2.0a supporting resolutions up to 1920×1080 at 60Hz
LVDS
LVDS single/dual channel 24-bit at max. 1920×080 at 60Hz
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MIPI DSI
DSI 4 lanes at max. 1080p@60fps display output (multiplexed with LVDS signal)
Camera Support
Compatible with MIPI Alliance Interface specification v2.1
2x MIPI-CSI2 camera inputs, 1x 4-lane and 1x 2-lane
2.3 Audio
Supports I2S audio codec interface, audio ADC and DAC (located on carrier)
2.4 Dual Ethernet
Primary LAN
Gigabit Ethernet controller with support for TSN in addition to Energy Efficient Ethernet (EEE), Ethernet AVB, and IEEE 1588
Supports 10/100/1000Mbps data transfer rates, both full-duplex and half-duplex
Secondary LAN
Gigabit Ethernet controller with support for Energy Efficient Ethernet (EEE), Ethernet AVB, and IEEE 1588
Supports 10/100/1000Mbps data transfer rates, both full-duplex and half-duplex
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2.5 1216 M.2 LGA Wi-Fi (optional)
Optional Wi-Fi LGA module support
In case of non-populated part, the footprint is still there and visible
Only Azurewave AW-CM276NF has been validated during DVT but other M.2 LGA modules could also be compatible if they use the same standard
interfaces, as listed below
- SDIO0 (main Wi-Fi interface)
- UART1 (main Bluetooth interface)
- PCM ( Bluetooth audio transfer interface )
- Note : AW-CM276F has been pre-certified by Azurewave for several countries and regions, ADLINK can assist in final device certification if
applicable. FCC ID: UAY-W8997-M1216
2.6 Extension Busses
PCIe
2x PCI Express Gen2 x1 interfaces
USB
CT temp 2x USB 3.0/2.0, 3x USB 2.0, 1x USB2.0 OTG
ER temp 1x USB 3.0, 1x USB2.0 OTG
UART
4x UART interface SER0, SER2 (Tx/Rx/CTS/RTS) and SER1, SER3(optional) (Tx/Rx)
7- or 8-bit data words, 1 or 2 stop bits, programmable parity (even, odd, or none)
Programmable baud rates up to 4 Mbps.
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CAN bus
2x CAN2.0B only or mixed CAN2.0B and CAN FB mode, data bit rate up to 8 Mbps
SPI
2x SPI
I2S
I2S interface (codec on carrier)
I2C
5x I2C interfaces
Supports 7-bit and 10-bit address mode
Software programmable clock frequency:
100 kbit/s in Standard-mode,
400 kbit/s in Fast-mode
1 Mbit/s in Fast-mode Plus
GPIO
14x GPIO with interrupt
2.7 System Storage
SDIO
1x SDIO (4-bit) compatible up to version 3.0.
eMMC
Soldered on module 16, 32 or 64GB (build option) either standard or -40 to 85oC temperature range
Compatible with eMMC specifications 4.41, 4.51, and 5.0
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2.8 SEMA® Board Management Controller
Voltage/current monitoring, boot configuration, logistics and forensic information, flat panel control, watchdog timer
2.9 Debug Header
30-pin multipurpose flat cable connector for use with optional DB-30 debug module
Provides JTAG, BMC access; UART, power test points; diagnostic LEDs, Power, Reset, Boot configuration
2.10 Boot Modes
eMMC and SD card boot modes are supported
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2.11 Power
Supply Voltage
4.75V 5.25V
2.12 Mechanical and Environmental
Form Factor
SGET SMARC Specifications v2.1
Dimension
SMARC small size module, 82mm x 50mm
Operating Temperature
Standard: 0°C to 60°C
Rugged: -40°C to 85°C (optional)
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I,
Condition A and Method 214A, Table 214-I, Condition D
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3. Block Diagram
Crypto Auth.
ATEC C608A
P MI C
LVDS0 / DSI0
LVDS1
HDMI
CSI0
CSI1
USB0
USB1
USB2
USB3
USB4
USB5
GbE0
GbE1
PCIeA
PCIeB
CAN0
CAN1
SPI0
SPI1
UART0
UART1
UART2
I2S0
SDIO
I2C_PM
I2C_GP
I2C_LCD
I2C_CAM0
I2C_CAM1
GP IO
NXP
iMX 8M Plus
USB1 2.0 (OTG)
USB2 3.0 (Host)
MIPI CSI 2-lanes
MIPI CSI 4-lanes
LVDS0
DSI0
LVDS1
HDMI 2.0a
USB HUB
2x USB 3.0/2.0
3x USB 2.0
MIPI MUX
PCIe Switch
ECSPI1
ECSPI2
SDHC2
1x PCIe x1
RGMII0
RGMII1
LAN PHY
LPDDR4
x32
eMMC 5.1
Wi-Fi/BT
GPIO
Expander1
LAN PHY
CAN0
CAN1
UART2
UART3
UART4
I2S0
DRAM
SDHC3
UART1
SDIO0
PCM
I2C1
I2C2
I2C3
I2C4
I2C5
I2C6
GPIO
Expander2
LITE
BMC
TPM RTC PC Ie
CLK
USB configuration for ER parts
USB0 USB2.0/OTG
USB2 USB3.0
No USB HUB
Figure 1 – Module function diagram
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4. Pinout and Signal Descriptions
4.1 Pin Summary
The below table is a comprehensible list of all signal pins on the MXM 3 connector in the standard specification SMARC 2.1.
Those signals not supported on LEC-iMX8M plus are strikethrough STRIKETHROUGH
Top Side
P1 P74 P75
Key
P156
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Figure 2 – Module top/botom side pin numbering
P-Pin
Primary (Top) Side
S-Pin
Secondary (Bottom) Side
S1
CSI1_TX+ / I2C_CAM1_CK
P1
SMB_ALERT_1V8#
S2
CSI1_TX- / I2C_CAM1_DAT
P2
GND
S3
GND
P3
CSI1_CK+
S4
RSVD
P4
CSI1_CK-
S5
CSI0_TX- / I2C_CAM0_CK
P5
GBE1_SDP
S6
CAM_MCK
P6
GBE0_SDP
S7
CSI0_TX+ / I2C_CAM0_DAT
P7
CSI1_RX0+
S8
CSI0_CK+
P8
CSI1_RX0-
S9
CSI0_CK-
P9
GND
S10
GND
P10
CSI1_RX1+
S11
CSI0_RX0+
P11
CSI1_RX1-
S12
CSI0_RX0-
P12
GND
S13
GND
P13
CSI1_RX2+
S14
CSI0_RX1+
P14
CSI1_RX2-
S15
CSI0_RX1-
P15
GND
S16
GND
P16
CSI1_RX3+
S17
GBE1_MDI0+
P17
CSI1_RX3-
S18
GBE1_MDI0-
P18
GND
S19
GBE1_LINK100#
P19
GBE0_MDI3-
S20
GBE1_MDI1+
P20
GBE0_MDI3+
S21
GBE1_MDI1-
P21
GBE0_LINK100#
S22
GBE1_LINK1000#
P22
GBE0_LINK1000#
S23
GBE1_MDI2+
P23
GBE0_MDI2-
S24
GBE1_MDI2-
P24
GBE0_MDI2+
S25
GND
P25
GBE0_LINK_ACT#
S26
GBE1_MDI3+
P26
GBE0_MDI1-
S27
GBE1_MDI3-
P27
GBE0_MDI1+
S28
GBE1_CTREF
P28
GBE0_CTREF
S29
PCIE_D_TX+ / SERDES_1_TX+
P-Pin
Primary (Top) Side
S-Pin
Secondary (Bottom) Side
P29
GBE0_MDI0-
S30
PCIE_D_TX- / SERDES_1_TX-
P30
GBE0_MDI0+
S31
GBE1_LINK_ACT#
P31
SPI0_CS1
S32
PCIE_D_RX+ / SERDES_1_RX+
P32
GND
S33
PCIE_D_RX- / SERDES_1_RX-
P33
SDIO_WP
S34
GND
P34
SDIO_CMD
S35
USB4+
P35
SDIO_CD#
S36
USB4-
P36
SDIO_CK
S37
USB3_VBUS_DET
P37
SDIO_PWR_EN
S38
AUDIO_MCK
P38
GND
S39
I2S0_LRCK
P39
SDIO_D0
S40
I2S0_SDOUT
P40
SDIO_D1
S41
I2S0_SDIN
P41
SDIO_D2
S42
I2S0_CK
P42
SDIO_D3
S43
ESPI_ALERT0#
P43
SPI0_CS0#
S44
ESPI_ALERT1#
P44
SPI0_CK
S45
MDIO_CLK
P45
SPI0_DIN
S46
MDIO_DAT
P46
SPI0_DO
S47
GND
P47
GND
S48
I2C_GP_CK
P48
SATA_TX+
S49
I2C_GP_DAT
P49
SATA_TX-
S50
HDA_SYNC / I2S2_LRCK
P50
GND
S51
HDA_SDO / I2S2_SDOUT
P51
SATA_RX+
S52
HDA_SDI / I2S2_SDIN
P52
SATA_RX-
S53
HDA_CK / I2S2_CK
P53
GND
S54
SATA_ACT#
P54
ESPI_CS0# / SPI1_CS0#
S55
USB5_EN_OC
P55
ESPI_CS1# / SPI1_CS1#
S56
ESPI_IO_2
P56
ESPI_CK / SPI1_CK
S57
ESPI_IO_3
P57
ESPI_IO_1 / SPI1_DIN
S58
ESPI_RESET#
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P-Pin
Primary (Top) Side
S-Pin
Secondary (Bottom) Side
P58
ESPI_IO_0 / SPI1_DO
S59
USB5+
P59
GND
S60
USB5-
P60
USB0+
S61
GND
P61
USB0-
S62
USB3_SSTX+
P62
USB0_EN_OC#
S63
USB3_SSTX-
P63
USB0_VBUS_DET
S64
GND
P64
USB0_OTG_ID
S65
USB3_SSRX+
P65
USB1+
S66
USB3_SSRX-
P66
USB1-
S67
GND
P67
USB1_EN_OC#
S68
USB3+
P68
GND
S69
USB3-
P69
USB2+
S70
GND
P70
USB2-
S71
USB2_SSTX+
P71
USB2_EN_OC#
S72
USB2_SSTX-
P72
RSVD
S73
GND
P73
RSVD
S74
USB2_SSRX+
P74
USB3_EN_OC#
S75
USB2_SSRX-
Key
Key
P75
PCIE_A_RST#
S76
PCIE_B_RST#
P76
USB4_EN_OC#
S77
PCIE_C_RST#
P77
PCIE_B_CKREQ#
S78
PCIE_C_RX+ / SERDES_2_RX+
P78
PCIE_A_CKREQ#
S79
PCIE_C_RX- / SERDES_2_RX-
P79
GND
S80
GND
P80
PCIE_C_REFCK+
S81
PCIE_C_TX+ / SERDES_2_TX+
P81
PCIE_C_REFCK-
S82
PCIE_C_TX- / SERDES_2_TX-
P82
GND
S83
GND
P83
PCIE_A_REFCK+
S84
PCIE_B_REFCK+
P84
PCIE_A_REFCK-
S85
PCIE_B_REFCK-
P85
GND
S86
GND
P86
PCIE_A_RX+
S87
PCIE_B_RX+
P87
PCIE_A_RX-
S88
PCIE_B_RX-
P88
GND
S89
GND
P89
PCIE_A_TX+
S90
PCIE_B_TX+
P-Pin
Primary (Top) Side
S-Pin
Secondary (Bottom) Side
P90
PCIE_A_TX-
S91
PCIE_B_TX-
P91
GND
S92
GND
P92
HDMI_D2+ / DP1_LANE0+
S93
DP0_LANE0+
P93
HDMI_D2- / DP1_LANE0-
S94
DP0_LANE0-
P94
GND
S95
DP0_AUX_SEL
P95
HDMI_D1+ / DP1_LANE1+
S96
DP0_LANE1+
P96
HDMI_D1- / DP1_LANE1-
S97
DP0_LANE1-
P97
GND
S98
DP0_HPD
P98
HDMI_D0+ / DP1_LANE2+
S99
DP0_LANE2+
P99
HDMI_D0- / DP1_LANE2-
S100
DP0_LANE2-
P100
GND
S101
GND
P101
HDMI_CK+ / DP1_LANE3+
S102
DP0_LANE3+
P102
HDMI_CK- / DP1_LANE3-
S103
DP0_LANE3-
P103
GND
S104
USB3_OTG_ID
P104
HDMI_HPD / DP1_HPD
S105
DP0_AUX+
P105
HDMI_CTRL_CK / DP1_AUX+
S106
DP0_AUX-
P106
HDMI_CTRL_DAT / DP1_AUX-
S107
LCD1_BKLT_EN
P107
DP1_AUX_SEL
S108
LVDS1_CK+/eDP1_AUX+/ DSI1_CLK+
P108
GPIO0 / CAM0_PWR#
S109
LVDS1_CK- / eDP1_AUX- / DSI1_CLK-
P109
GPIO1 / CAM1_PWR#
S110
GND
P110
GPIO2 / CAM0_RST#
S111
LVDS1_0+ / eDP1_TX0+ / DSI1_D0+
P111
GPIO3 / CAM1_RST#
S112
LVDS1_0- / eDP1_TX0- / DSI1_D0-
P112
GPIO4 / HDA_RST#
S113
eDP1_HPD / DSI1_TE
P113
GPIO5 / PWM_OUT
S114
LVDS1_1+ / eDP1_TX1+ / DSI1_D1+
P114
GPIO6 / TACHIN
S115
LVDS1_1- / eDP1_TX1- / DSI1_D1-
P115
GPIO7
S116
LCD1_VDD_EN
P116
GPIO8
S117
LVDS1_2+ / eDP1_TX2+ / DSI1_D2+
P117
GPIO9
S118
LVDS1_2- / eDP1_TX2- / DSI1_D2-
P118
GPIO10
S119
GND
P119
GPIO11
S120
LVDS1_3+ / eDP1_TX3+ / DSI1_D3+
P120
GND
S121
LVDS1_3- / eDP1_TX3- / DSI1_D3-
P121
I2C_PM_CK
S122
LCD1_BKLT_PWM
P122
I2C_PM_DAT
S123
GPIO13
P123
BOOT_SEL0#
S124
GND
P124
BOOT_SEL1#
S125
LVDS0_0+ / eDP0_TX0+ / DSI0_D0+
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Adlink LEC-IMX8MP Owner's manual

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Owner's manual

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