UM10486
UBA2015P reference design 120 V (AC)
Rev. 1.1 — 8 September 2011 User manual
Document information
Info Content
Keywords UBA2015P, 2x TL5HE35W ballast
Abstract This document describes the UBA2015P reference design for 120 V (AC).
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User manual Rev. 1.1 — 8 September 2011 2 of 18
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
NXP Semiconductors
UM10486
UBA2015P reference design 120 V (AC)
Revision history
Rev Date Description
v.1.1 20110908 updated issue
v.1 20110624 first issue
Modifications:
• Figure 11 “Schematic diagram” has been updated.
• Bill of Materials (Table 4) has been updated.
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UM10486
UBA2015P reference design 120 V (AC)
1. Introduction
This document describes the specification and use of the UBA2015P board. This
reference ballast design is intended to drive two TL5HE35W lamps.
The Printed-Circuit Board Assembly (PCBA) has the 12NC 7022 001 15932.
Do not power the board without IC. The VDD decoupling capacitor voltage exceeds the
rated value when the IC does not limit the voltage to 13 V.
2. Safety warning
Connect the board to the mains voltage. Avoid touching the board at all times when it is
connected to the mains voltage. An isolated housing is obligatory when used in
uncontrolled, non-laboratory environments. Galvanic isolation of the mains phase using a
variable transformer is always recommended.
WARNING
Lethal voltage and fire ignition hazard
The non-insulated high voltages that are present when operating this product, constitute a
risk of electric shock, personal injury, death and/or ignition of fire.
This product is intended for evaluation purposes only. It shall be operated in a designated test
area by personnel qualified according to local requirements and labor laws to work with
non-insulated mains voltages and high-voltage circuits. This product shall never be operated
unattended.
Fig 1. UBA2015P reference board
019aac653
a. Isolated b. Non-isolated
Fig 2. Variac isolation symbols
019aab173
019aab174
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UM10486
UBA2015P reference design 120 V (AC)
3. Specifications
4. Board information
4.1 Block diagram
The input section includes:
• The fuse
• Surge protection against fast AC transients
• ElectroMagnetic Interference (EMI) filter
• Full-wave rectifier
• Pre-conditioner or Power Factor Correction (PFC)
The output of the PFC connects to an electrolytic buffer capacitor to supply the half-bridge
circuit. The lamp connects to the half-bridge circuit. The UBA2015P controller IC controls
the PFC and the half-bridge circuit.
The PFC is implemented as an up converter in boundary conduction mode. The resonant
circuit is voltage fed by the half-bridge which consists of two N-channel MOSFETs. The
resonant circuit includes a transformer for electrode preheating and heating.
Table 1. Electrical board specification
Description Product(s)
Ballast type electronic
Starting method programmed start with preheat
Starting time < 1 s
Lamp terminals 7
Lamp connection parallel
Line voltage 108 V (AC) to 132 V (AC)
Line frequency 50 Hz/60 Hz
Number of lamps 2
Dimming interface none
Transient protection compatibility IEC61547
Table 2. Supported lamps
Lamp type Description
TL5HE35W 35 W TL5 high-efficiency fluorescent lamp
TL5HE28W 28 W TL5 high-efficiency fluorescent lamp
Table 3. Ballast performance
Lamp type Number of
lamps
Rated lamp
power (W)
Maximum THD
(%)
Maximum lamp
current crest factor
Power factor Nominal lamp
current (A)
TL5HE35W 2 35 10 1.7 0.98 0.170
TL5HE28W 2 28 10 1.7 0.97 0.170
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UM10486
UBA2015P reference design 120 V (AC)
This type of topology with inductive heating is used in many commercial ballasts whose
power exceeds 25 W, making it a cost-effective application.
The lamps are connected in parallel.
4.2 Performance indicators
4.2.1 Input power, power factor and Total Harmonic Distortion (THD)
4.2.2 Lamp end of life detection
IEC asymmetrical power test: The End-Of-Life (EOL) resistor R
EOL
is increased (manually
controlled rheostat of 1 k) until the ballast shuts down. A rheostat is a two-terminal
variable resistor. See IEC-61347-2-3 Section 17.3 where this test is described. When the
EOL voltage exceeds the thresholds of the internal window comparator, the slow fault
timer (CPT pin) starts.
Fig 3. Block diagram
019aac299
mains
voltage
input
FUSE
SURGE
PROT
EMI
FILTER
AC
RECTIFIER
PFC
BUFFER
CAP
HALF
BRIDGE
RESONANT
CIRCUIT
UBA2015
CONTROLLER
lamps
(1) Power factor
(2) Current THD
(3) Input power (W)
Fig 4. THD, power factor and input power as a function of AC mains input voltage
Mains voltage (V)
90 150130110100 140120
019aac485
77
78
76
79
80
Power
(W)
75
0.4
0.6
0.2
0.8
1.0
Power factor
THD
0.0
(1)
(3)
(2)
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UM10486
UBA2015P reference design 120 V (AC)
Measurements: P2 = Mean(PEOL) between divisions 4 and 5 on the plot
Traces:
(1) C1 = Z1 = EOL
(2) C2 = Z2 = CPT
(3) F1 = F2 P
(REOL)
Fig 5. EOL shutdown triggered by V
th(low)EOL
019aac291
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UM10486
UBA2015P reference design 120 V (AC)
4.2.3 Lamp removal detection
The UBA2015/UBA2016 family has several fast protection features for lamp removal
detection:
• Capacitive Mode Protection (CMP)
• Saturation protection
• OverVoltage Protection (OVP)
In this application, overvoltage protection is triggered during lamp removal. Other
applications with a different operating frequency with respect to the resonance frequency
can be triggered differently. The main function of the IC is to shut down as fast as possible
when a lamp is removed.
The fast protection on the VFB pin is repeatedly triggered (V
VFB
> 3.35 V (typical)) during
the lamp removal process. As a result the fast fault detection timer t
det(fault)
ends.
In this application, the shutdown is not triggered by pin SLHB because of the 340 ns
leading edge blanking time on this pin.
Measurements: P2 = Mean(PEOL) between divisions 4 and 5 on the plot
Traces:
(1) C1 = Z1 = EOL
(2) C2 = Z2 = CPT
(3) F1 = F2 P
(REOL)
Fig 6. EOL shutdown triggered by V
th(high)EOL
019aac292
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UM10486
UBA2015P reference design 120 V (AC)
(1) C1 = Z1 = GLHB
(2) C2 = Z2 = SLHB
(3) C3 = Z3 = VFB
(4) C4 = Z4 = SHHB
Fig 7. Shutdown after lamp removal triggered by V
th(ov)(VFB)
019aac293
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UM10486
UBA2015P reference design 120 V (AC)
4.2.4 ElectroMagnetic Interference (EMI) - conducted emission tests
The board with lamp complies with FCC-15 quasi-peak and average measurements, no
metal shielding required for acceptable EMI performance. The ballast was tested on a
reference luminaire with two TL5HE35W lamps.
Fig 8. Photograph of the EMI conducted emission measurement setup
019aac300
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UM10486
UBA2015P reference design 120 V (AC)
a. Line L
b. Line N
Fig 9. EMI: conducted emission test results
1 P
K
M
AXH
2 A
V
CLRW
R
SGL
6DB
NXP Semiconductors
TDF
dBµVdBµV
9 kHz 30 MHz
OVLD
MT 15 ms
RBW 9 kHz
PREAMP OFFAtt 20 dB
04.May 11 15:16
100 kHz 1 MHz 10 MHz
0
10
20
30
40
50
60
70
80
90
100
1
Marker 1 [T2 ]
61.79 dBµV
9.000000000 kHz
FCC15AVQ
FCC15BVQ
019aac486
(1)
(2)
NXP Semiconductors
1 P
K
M
AXH
2 A
V
CLRW
R
SGL
6DB
TDF
dBµVdBµV
9 kHz 30 MHz
OVLD
MT 15 ms04.May 11 15:36
RBW 9 kHz
PREAMP OFFAtt 20 dB
100 kHz 1 MHz 10 MHz
0
10
20
30
40
50
60
70
80
90
100
1
Marker 1 [T2 ]
60.66 dBµV
9.000000000 kHz
FCC15AVQ
FCC15BVQ
019aac487
(1)
(2)
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UM10486
UBA2015P reference design 120 V (AC)
5. Wiring diagram
Connect the ballast as shown in Figure 10.
Connect the chassis to ground using mounting hole E1.
Keep the hot wires to the lamps as short as possible (red and blue wires), so parasitic
capacitance remains as low as possible.
Fig 10. Wiring diagram
019aac296
BALLAST
J2-7
RED
J2-6
RED
GREEN/YELLOW
J1-1
BLACK
J1-2
WHITE
J1-3
protective ground
hot
neutral
J2-5
BLUE
J2-4
BLUE
J2-3
BLACK
J2-2
GREEN
J2-1
GREEN
LAMP
LAMP
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UM10486
UBA2015P reference design 120 V (AC)
6. Schematic
Fig 11. Schematic diagram
019aac488
180 kΩ
R2
0.62 Ω
R3
3.48 kΩ
R18
180 kΩ
R20
1 kΩ
R12
464 kΩ
R19
1 kΩ
D13
1N4937
D12
1N4937
41.2 kΩ
41.2 kΩ
R22
1 MΩ
R13
1 Ω
R4
562 kΩ
R5
562 kΩ
R1
R21
C1
D14
nm
D6
1N4118
R16
10 MΩ
R15
L3A
7608000901
3.9 mH
R17
D11
1N4148
D10
1N4148
D5
UF4006
X3
2.2 nF
250 V
F1
FUSE HOLDER
20 × 5 mm
F3 fuse holder cover,
20 × 5 mm
F2 T1A
V1
710 V
C2
220 nF
C21
47 nF
C15
100 nF
C18
220 nF
C20
47 nF
C19
2.7 nF
C22
2.7 nF
C4
10 nF
D3
1N4007
D1
1N4007
C3
470 nF
C14
1 nF
D4
1N4007
D2
1N4007
C5
22 μF
Q2
2SK3567
WB1
1
3
6mains N
4
L1
2 × 3.3 mH
1
10
4
81
109
AUXPFCGND
GND
GND
8
T2A
T2B
1.1 mH
C27
220 nF
4.7 Ω
J1
J2
X2
T5HE35W
STARTUP
GPFC
GHHB
SHHB
VFB
FBPFC
1
2
3
82 kΩ
R11
33 kΩ
R10
180 kΩ
R14
X11
GND
jumper
link
1 kΩ
R8
10 kΩ
R6
nm
R7
D7
1N5244B
C7
470 nF
C6
1 nF
390 kΩ
R9
C16
82 nF
C13
200 pF
C17
100 nF
C11
100 nF
E1
3.5 mm
E2
E3 E4
mounting hole
3.5 mm non plated
E5 E6
C9
D9
1N4148
D8
1N4148
100 nF
C8
4.7 nF
C12
68 nF
C10
22 nF
UBA2015P
in socket
GND
GNDGND
GND
GND
U1
11
PH/ENFBPFC
FBPFCAUXPFC
AUXPFC
10
12
n.c.COMPPFC
9
13
CPTAUXPFC
8
14
CFGPFC
GPFC 7
15
CIFBGND
6
16
IREFVDD
VDD 5
17
VFBGLHB
GLHB 4
18
EOLSHHB
SHHB 3
19
IFBFSHB
2
20
SLHB
VFB
EOL
SLHB
GHHB
GHHB 1
X4
X1
X2
mains L
TMP-3093
chassis
L4C
9 μH
C23
68 nF
109
L3C
9 μH
45
L4B
9 μH
45
7
X5
6
X6
5
X7
4
X8
3
X9
2
X10
1
12
34
7
6
5
4
3
2
1
L3B
9 μH
C25
68 nF
C26
68 nF
C24
68 nF
L4A
7608000901
3.9 mH
81
Q3
2SK3567
GLHB
SLHB
STARTUP
EOL
VDD
X1
T5HE35W
12
34
TMP-3094
U
Q1
TK12A50D
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xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x
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UM10486
UBA2015P reference design 120 V (AC)
7. PCB layout
Fig 12. PCB layout
019aac297
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UM10486
UBA2015P reference design 120 V (AC)
8. Bill of materials
Table 4. Bill of materials
Item
number
Part
reference
Description/value Manufacturer Part number
1 C1 2.2 nF; 20 %; 250 V Murata DE1E3KX222MA5B
2 C2 220 nF; 20 %; 310 V Vishay BFC233922224
3 C3 470 nF; 20 %; 400 V Vishay MKP1840447404M
4C4 10nF; 20 %, +80 %; 50 V Vishay K103Z15Y5VF5TH5
5C5 22F; 20 %; 450 V Panasonic EEU-EB2W220S
6 C6 1 nF; 10 %; 500 V Vishay H102K25X7RL63J5R
7 C7 470 nF; 5 %; 63 V Kemet R82DC3470DQ60J
8 C8 4.7 nF; 10 %; 100 V Kemet SR211C472KAR
9 C9 100 nF; 10 %; 100 V Vishay BFC236525104
10 C10 22 nF; 10 %; 100 V BC components 2222 370 21223
11 C11 100 nF; 10 %; 100 V Vishay BFC236525104
12 C12 68 nF; 5 %; 63 V Kemet MMK5683K63J01L16.5TA182
13 C13 200 pF; 5 %; 100 V Multicomp MC0805N201J101A2.54MM
14 C14 1 nF; 10 %; 50 V Vishay K102K15X7RF5TH5
15 C15 100 nF; 10 %; 100 V Vishay BFC236525104
16 C16 82 nF; 5 %; 63 V Kemet MMK5823M63J01L4BULK
17 C17 100 nF; 10 %; 100 V Vishay BFC236525104
18 C18 220 nF; 10 %; 400 V Xicon 146-MEF2G224K
19 C19 2.7 nF; 5 %; 2000 V Vishay BFC238361272
20 C20 47 nF; 5 %; 100 V Kemet R82EC2470AA60J
21 C21 47 nF; 5 %; 100 V Kemet R82EC2470AA60J
22 C22 2.7 nF; 5 %; 2000 V Vishay BFC238361272
23 C23 68 nF; 10 %; 400 V Epcos B32521C6683K
24 C24 68 nF; 10 %; 400 V Epcos B32521C6683K
25 C25 68 nF; 10 %; 400 V Epcos B32521C6683K
26 C26 68 nF; 10 %; 400 V Epcos B32521C6683K
27 C27 220 nF; 20 %; 310 V Vishay MKP1840447404M
28 D1 1N4007-E3/51 Vishay 1N4007-E3/51
29 D2 1N4007-E3/51 Vishay 1N4007-E3/51
30 D3 1N4007-E3/51 Vishay 1N4007-E3/51
31 D4 1N4007-E3/51 Vishay 1N4007-E3/51
32 D5 UF4006-E3/73 Vishay UF4006-E3/73
33 D6 1N4148 NXP Semiconductors 1N4148,133
34 D7 1N5244B Fairchild Semiconductor 1N5244B
35 D8 1N4148 NXP Semiconductors 1N4148,133
36 D9 1N4148 NXP Semiconductors 1N4148,133
37 D10 1N4148 NXP Semiconductors 1N4148,133
38 D11 1N4148 NXP Semiconductors 1N4148,133
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UM10486
UBA2015P reference design 120 V (AC)
39 D12 1N4937/54; 600 V; 1 A Vishay 1N4937-E3/54
40 D13 1N4937/54; 600 V; 1 A Vishay 1N4937-E3/54
41 D14 1N4007-E3/51 Vishay 1N4007-E3/51
42 F1 fuse holder; 20 5 mm Multicomp MCHTC-15M
43 F2 fuse T1A Schurter 34.3117
44 F3 fuse holder cover; 20 5 mm Multicomp MCHTC-150M
45 J1 PCB mounted screw terminal
MKDSN2,5/3-5.08
Phoenix Contact 1888690
46 J2 PCB mounted screw terminal
MKDS 1/7-3,81
Phoenix Contact 1727065
47 L1 B82731T2182A020; 2 3.3 mH Epcos B82731T2182A020
48 L3 Transformer; 3.9 mH; 9 H;
9 H
Würth ElektroniK 7608000901
49 L4 Transformer; 3.9 mH; 9 H;
9 H
Würth ElektroniK 7608000901
50 Q1 TK12A50D Toshiba TK12A50D
51 Q2 2SK3567 Toshiba 2SK3567
52 Q3 2SK3567 Toshiba 2SK3567
53 R1 180 k; 5 %; 2 W Welwyn MFP2-180KJI
54 R2 0.62 ; 5 %; 1 W; 500 V KOA Speer MOSX1CT52RR62J
55 R3 3.48 k; 1 %; 0.6 W Vishay MRS25000C3481FCT00
56 R4 562 k; 1 %; 0.6 W Vishay MRS25000C5623FCT00
57 R5 562 k; 1 %; 0.6 W Vishay MRS25000C5623FCT00
58 R6 10 k; 1 %; 0.25 W Xicon 271-10K-RC
59 R7 1 k; 1 %; 0.25 W Xicon 271-1K-RC
60 R8 1 k; 1 %; 0.25 W Xicon 271-1K-RC
61 R9 390 k; 1 %; 0.25 W Xicon 271-390K-RC
62 R10 33 k; 1 %; 0.25 W Xicon 271-33K-RC
63 R11 82 k; 1 %; 0.6 W Vishay MRS25000C8202FCT00
64 R12 464 k; 1 %; 0.6 W Vishay MRS25000C4643FCT00
65 R13 1 ; 5 %; 1 W; 400 V KOA Speer MOSX1/2CT52R1R0J
66 R14 180 k; 5 %; 2 W Welwyn MFP2-180KJI
67 R15 10 M; 1 %; 0.6 W Vishay MRS25000C1005FRP00
68 R16 41.2 k; 1 %; 0.25 W Xicon 271-41.2K-RC
69 R17 41.2 k; 1 %; 0.25 W Xicon1 271-41.2K-RC
70 R18 180 k; 1 %; 0.25 W Xicon 271-180K-RC
71 R19 1 k; 1 %; 0.25 W Xicon 271-1K-RC
72 R20 1 k; 1 %; 0.25 W Xicon 271-1K-RC
73 R21 4.7 ; 20 %; 1.4 W Epcos B57153S479M
74 R22 1 M; 1 %; 0.6 W Vishay MRS25000C1004FCT00
Table 4. Bill of materials
…continued
Item
number
Part
reference
Description/value Manufacturer Part number
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UM10486
UBA2015P reference design 120 V (AC)
75 T2 Transformer; L
p
=1.1mH;
2.7 A; N
p
/N
s
= 57
Würth ElektroniK 750312407
76 U1 UBA2015P NXP Semiconductors UBA2015P
77 V1 275 V (AC); 85 C; 3.5 kA;
710 V
clamp
Littelfuse V10E275P
78 WB1 wire-bridge-4E 3M 923345-04
79 X11 jumper link Fischer Elektro LB 03 G
Table 4. Bill of materials
…continued
Item
number
Part
reference
Description/value Manufacturer Part number
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UBA2015P reference design 120 V (AC)
9. Legal information
9.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
9.2 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express, implied
or statutory, including but not limited to the implied warranties of
non-infringement, merchantability and fitness for a particular purpose. The
entire risk as to the quality, or arising out of the use or performance, of this
product remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be liable
to customer for any special, indirect, consequential, punitive or incidental
damages (including without limitation damages for loss of business, business
interruption, loss of use, loss of data or information, and the like) arising out
the use of or inability to use the product, whether or not based on tort
(including negligence), strict liability, breach of contract, breach of warranty or
any other theory, even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by customer
for the product or five dollars (US$5.00). The foregoing limitations, exclusions
and disclaimers shall apply to the maximum extent permitted by applicable
law, even if any remedy fails of its essential purpose.
9.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
NXP Semiconductors
UM10486
UBA2015P reference design 120 V (AC)
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddre[email protected]
Date of release: 8 September 2011
Document identifier: UM10486
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
10. Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Safety warning . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3 Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4 Board information . . . . . . . . . . . . . . . . . . . . . . . 4
4.1 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . 4
4.2 Performance indicators. . . . . . . . . . . . . . . . . . . 5
4.2.1 Input power, power factor
and Total Harmonic Distortion (THD) . . . . . . . . 5
4.2.2 Lamp end of life detection . . . . . . . . . . . . . . . . 5
4.2.3 Lamp removal detection. . . . . . . . . . . . . . . . . . 7
4.2.4 ElectroMagnetic Interference
(EMI) - conducted emission tests . . . . . . . . . . . 9
5 Wiring diagram. . . . . . . . . . . . . . . . . . . . . . . . . 11
6 Schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7 PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8 Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . 14
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
9.1 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
9.2 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
9.3 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
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