ZE51/61-2.4 RF module User Guide
1VV0300868 Rev.4 – 23/06/2011
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CONTENTS
CHAPTER I. INTRODUCTION ................................................................................................................... 6
I.1. AIM OF THE DOCUMENT .................................................................................................................................................................................... 6
I.2. CONTACT INFORMATION, SUPPORT .................................................................................................................................................................. 6
I.3. REFERENCE DOCUMENTS ................................................................................................................................................................................. 7
I.4. DOCUMENT CHANGE LOG ................................................................................................................................................................................. 7
I.5. GLOSSARY ...................................................................................................................................................................................................... 8
CHAPTER II. REQUIREMENTS ................................................................................................................ 9
II.1. REGULATIONS REQUIREMENTS ........................................................................................................................................................................ 9
II.2. FUNCTIONAL REQUIREMENTS........................................................................................................................................................................ 12
II.3. SOFTWARE .................................................................................................................................................................................................. 12
II.4. TEMPERATURE REQUIREMENTS .................................................................................................................................................................... 13
CHAPTER III. GENERAL CHARACTERISTICS ...................................................................................... 14
III.1. MECHANICAL CHARACTERISTICS ................................................................................................................................................................. 14
III.2. MECHANICAL DIMENSIONS ........................................................................................................................................................................... 15
III.3. DC CHARACTERISTICS ................................................................................................................................................................................ 16
III.4. FUNCTIONAL CHARACTERISTICS .................................................................................................................................................................. 17
III.5. DIGITAL CHARACTERISTICS ......................................................................................................................................................................... 20
III.6. ABSOLUTE MAXIMUM RATINGS .................................................................................................................................................................... 21
III.7. ORDERING INFORMATION ............................................................................................................................................................................ 22
CHAPTER IV. TECHNICAL DESCRIPTION ............................................................................................ 23
IV.1. PIN-OUT OF THE SMD MODULE .................................................................................................................................................................... 23
IV.2. DIP MODULE MECHANICAL DIMENSIONS AND PIN-OUT ................................................................................................................................... 25
IV.3. PIN-OUT CORRESPONDENCE TABLE .............................................................................................................................................................. 26
IV.4. DESCRIPTION OF THE SIGNALS ..................................................................................................................................................................... 27
CHAPTER V. PROCESS INFORMATION ............................................................................................... 28
V.1. DELIVERY ..................................................................................................................................................................................................... 28
V.2. STORAGE ..................................................................................................................................................................................................... 29
V.3. SOLDERING PAD PATTERN ............................................................................................................................................................................. 29
V.4. SOLDER PASTE COMPOSITION (ROHS PROCESS) ........................................................................................................................................... 31
V.5. PLACEMENT .................................................................................................................................................................................................. 31
V.6. SOLDERING PROFILE (ROHS PROCESS) ......................................................................................................................................................... 32
CHAPTER VI. BOARD MOUNTING RECOMMENDATION ..................................................................... 34
VI.1. ELECTRICAL ENVIRONMENT .......................................................................................................................................................................... 34