Document Number: 002-00856 Rev. *E Page 2 of 59
Contents
1. Simultaneous Read/Write Operations with Zero
Latency ......................................................................... 3
1.1 S29JL064J Features...................................................... 3
2. Product Selector Guide............................................... 4
3. Block Diagram.............................................................. 4
4. Connection Diagrams.................................................. 5
4.1 48-pin TSOP Package ................................................... 5
4.2 48-ball FBGA Package .................................................. 6
5. Pin Description............................................................. 6
6. Logic Symbol ............................................................... 7
7. Ordering Information................................................... 8
8. Device Bus Operations................................................ 9
8.1 Word/Byte Configuration................................................ 9
8.2 Requirements for Reading Array Data......................... 10
8.3 Writing Commands/Command Sequences.................. 10
8.4 Simultaneous Read/Write Operations with
Zero Latency ................................................................ 10
8.5 Standby Mode.............................................................. 11
8.6 Automatic Sleep Mode................................................. 11
8.7 RESET#: Hardware Reset Pin..................................... 11
8.8 Output Disable Mode ................................................... 12
8.9 Autoselect Mode .......................................................... 16
8.10 Boot Sector/Sector Block Protection and Unprotection 17
8.11 Write Protect (WP#) ..................................................... 18
8.12 Temporary Sector Unprotect........................................ 19
8.13 Secured Silicon Region................................................ 21
8.14 Hardware Data Protection............................................ 22
9. Common Flash Memory Interface (CFI)................... 23
10. Command Definitions................................................ 26
10.1 Reading Array Data ..................................................... 26
10.2 Reset Command.......................................................... 26
10.3 Autoselect Command Sequence ................................. 27
10.4 Enter Secured Silicon Region/Exit Secured
Silicon Region Command Sequence ........................... 27
10.5 Byte/Word Program Command Sequence................... 27
10.6 Chip Erase Command Sequence ................................ 29
10.7 Sector Erase Command Sequence ............................. 29
10.8 Erase Suspend/Erase Resume Commands ................ 30
11. Write Operation Status .............................................. 32
11.1 DQ7: Data# Polling ...................................................... 32
11.2 RY/BY#: Ready/Busy#................................................. 33
11.3 DQ6: Toggle Bit I ......................................................... 34
11.4 DQ2: Toggle Bit II ........................................................ 35
11.5 Reading Toggle Bits DQ6/DQ2.................................... 36
11.6 DQ5: Exceeded Timing Limits ..................................... 36
11.7 DQ3: Sector Erase Timer............................................. 36
12. Absolute Maximum Ratings...................................... 37
13. Operating Ranges...................................................... 38
14. DC Characteristics..................................................... 38
14.1 CMOS Compatible........................................................ 38
14.2 Zero-Power Flash ......................................................... 39
15. Test Conditions........................................................... 40
16. Key To Switching Waveforms.................................... 41
17. AC Characteristics...................................................... 42
17.1 Read-Only Operations .................................................. 42
17.2 Hardware Reset (RESET#)........................................... 43
17.3 Word/Byte Configuration (BYTE#)................................ 44
17.4 Erase and Program Operations .................................... 45
17.5 Temporary Sector Unprotect......................................... 49
17.6 Alternate CE# Controlled Erase and Program
Operations .................................................................... 50
18. Erase and Programming Performance ..................... 52
19. Pin Capacitance .......................................................... 52
20. Physical Dimensions.................................................. 53
20.1 TS 048—48-Pin Standard TSOP.................................. 53
20.2 VBK048—48-Pin FBGA................................................ 54
21. Revision History.......................................................... 55