Aaeon FWS-8600 User manual

Category
Motherboards
Type
User manual
Last Updated: September 23, 2019
FWS-8600
Network Appliance
Users Manual 1
st
Ed
Preface II
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-
8600
Copyright Notice
This document is copyrighted, 2019. All rights are reserved. The original manufacturer
reserves the right to make improvements to the products described in this manual at
any time without notice.
No part of this manual may be reproduced, copied, translated, or transmitted in any
form or by any means without the prior written permission of the original
manufacturer. Information provided in this manual is intended to be accurate and
reliable. However, the original manufacturer assumes no responsibility for its use, or for
any infringements upon the rights of third parties that may result from its use.
The material in this document is for product information only and is subject to change
without notice. While reasonable efforts have been made in the preparation of this
document to assure its accuracy, AAEON assumes no liabilities resulting from errors or
omissions in this document, or from the use of the information contained herein.
AAEON reserves the right to make changes in the product design without notice to its
users.
Preface III
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Acknowledgement
All other products’ name or trademarks are properties of their respective owners.
Microsoft Windows is a registered trademark of Microsoft Corp.
Intel, Xeon, and Xeon SP
are registered trademarks of Intel Corporation
ITE is a trademark of Integrated Technology Express, Inc.
IBM, PC/AT, PS/2, and VGA are trademarks of International Business Machines
Corporation.
All other product names or trademarks are properties of their respective owners.
Preface IV
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Packing List
Before setting up your product, please make sure the following items have been
shipped:
Item
Quantity
FWS-8600
1
Gift Box (Including Console Cable x 1, SATA Cable x 1,
SATA Power Cable x 1, and Ear Bracket Kit x 1)
1
CPU cooler
2
If any of these items are missing or damaged, please contact your distributor or sales
representative immediately.
Preface V
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About this Document
This User’s Manual contains all the essential information, such as detailed descriptions
and explanations on the product’s hardware and software features (if any), its
specifications, dimensions, jumper/connector settings/definitions, and driver installation
instructions (if any), to facilitate users in setting up their product.
Users may refer to the product page at AAEON.com for the latest version of this
document.
Preface VI
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Safety Precautions
Please read the following safety instructions carefully. It is advised that you keep this
manual for future references
1. All cautions and warnings on the device should be noted.
2. All cables and adapters supplied by AAEON are certified and in accordance with
the material safety laws and regulations of the country of sale. Do not use any
cables or adapters not supplied by AAEON to prevent system malfunction or
fires.
3. Make sure the power source matches the power rating of the device.
4. Position the power cord so that people cannot step on it. Do not place anything
over the power cord.
5. Always completely disconnect the power before working on the systems
hardware.
6. No connections should be made when the system is powered as a sudden rush
of power may damage sensitive electronic components.
7. If the device is not to be used for a long time, disconnect it from the power
supply to avoid damage by transient over-voltage.
8. Always disconnect this device from any AC supply before cleaning.
9. While cleaning, use a damp cloth instead of liquid or spray detergents.
10. Make sure the device is installed near a power outlet and is easily accessible.
11. Keep this device away from humidity.
12. Place the device on a solid surface during installation to prevent falls
13. Do not cover the openings on the device to ensure optimal heat dissipation.
14. Watch out for high temperatures when the system is running.
15. Do not touch the heat sink or heat spreader when the system is running
16. Never pour any liquid into the openings. This could cause fire or electric shock.
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17. As most electronic components are sensitive to static electrical charge, be sure to
ground yourself to prevent static charge when installing the internal components.
Use a grounding wrist strap and contain all electronic components in any
static-shielded containers.
18. If any of the following situations arises, please the contact our service personnel:
i. Damaged power cord or plug
ii. Liquid intrusion to the device
iii. Exposure to moisture
iv. Device is not working as expected or in a manner as described in
this manual
v. The device is dropped or damaged
vi. Any obvious signs of damage displayed on the device
19. DO NOT LEAVE THIS DEVICE IN AN UNCONTROLLED ENVIRONMENT WITH
TEMPERATURES BEYOND THE DEVICES PERMITTED STORAGE TEMPERATURES
(SEE CHAPTER 1) TO PREVENT DAMAGE.
Preface VIII
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FCC Statement
This device complies with Part 15 FCC Rules. Operation is
subject to the following two conditions: (1) this device may not
cause harmful interference, and (2) this device must accept any
interference received including interference that may cause
undesired operation.
Caution:
There is a danger of explosion if the battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by the manufacturer. Dispose of used batteries
according to the manufacturer’s instructions and your local government’s recycling or
disposal directives.
Attention:
Il y a un risque d’explosion si la batterie est remplacée de façon incorrecte.
Ne la remplacer qu’avec le même modèle ou équivalent recommandé par le constructeur.
Recycler les batteries usées en accord avec les instructions du fabricant et les directives
gouvernementales de recyclage.
Preface IX
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China RoHS Requirements (CN)
产品中有毒有害物质或元素名称及含量 AAEON System QO4-381 Rev.A0
部件名称
有毒有害物质或元素
(Hg)
(Cd)
六价铬
(Cr(VI))
多溴联苯
(PBB)
多溴二苯醚
(PBDE)
印刷电路板
及其电子组件
外部信号
连接器及线材
外壳
中央处理器
与内存
硬盘
液晶模块
×
光驱
触控模块
电源
电池
本表格依据 SJ/T 11364 的规定编制。
:表示该有毒有害物质在该部件所有均质材料中的含量均在
GB/T 26572标准规定的限量要求以下。
×:表示该有害物质的某一均质材料超出了GB/T 26572的限量要求,然而该部件
仍符合欧盟指令2011/65/EU 的规范。
备注:
一、此产品所标示之环保使用期限,系指在一般正常使用状况下。
二、上述部件物质中央处理器、内存、硬盘、光驱、电源为选购品。
三、上述部件物质液晶模块、触控模块仅一体机产品适用。
Preface X
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China RoHS Requirement (EN)
Hazardous and Toxic Materials List
AAEON System QO4-381 Rev.A0
Component Name
Hazardous or Toxic Materials or Elements
Lead (Pb)
Mercury (Hg)
Cadmium (Cd)
Hexavalent
Chromium (Cr(VI))
Polybrominated
biphenyls (PBBs)
Polybrominated
diphenyl ethers
(PBDEs)
PCB and Components
X
O
O
O
O
O
Wires & Connectors for
Ext. Connections
X
O
O
O
O
O
Chassis
O
O
O
O
O
O
CPU & RAM
X
O
O
O
O
O
HDD Drive
X
O
O
O
O
O
LCD Module
X
X
O
O
O
O
Optical Drive
X
O
O
O
O
O
Touch Control Module
X
O
O
O
O
O
PSU
X
O
O
O
O
O
Battery
X
O
O
O
O
O
This form is prepared in compliance with the provisions of SJ/T 11364.
O: The level of toxic or hazardous materials present in this component and its parts is below the
limit specified by GB/T 26572.
X: The level of toxic of hazardous materials present in the component exceed the limits specified
by GB/T 26572, but is still in compliance with EU Directive 2011/65/EU (RoHS 2).
Notes:
1. The Environment Friendly Use Period indicated by labelling on this product is applicable only
to use under normal conditions.
2. Individual components including the CPU, RAM/memory, HDD, optical drive, and PSU are
optional.
3. LCD Module and Touch Control Module only applies to certain products which feature these
components.
Preface XI
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Table of Contents
Chapter 1 - Product Specifications ............................................................................................... 1
1.1 Specifications ............................................................................................................... 2
Chapter 2 Hardware Information ............................................................................................. 5
2.1 Dimensions .................................................................................................................. 6
2.1.1 System .......................................................................................................... 6
2.1.2 Board ............................................................................................................. 7
2.1.3 PER-T488 Expansion Riser ....................................................................... 9
2.1.4 PER-T489 I/O Card................................................................................... 10
2.2 Jumpers and Connectors ......................................................................................... 11
2.2.1 Board ............................................................................................................ 11
2.2.2 PER-T488 Expansion Riser ...................................................................... 13
2.2.3 PER-T489 I/O Card................................................................................... 14
2.3 List of Jumpers ........................................................................................................... 15
2.3.1 RTC Reset (CMOS1) .................................................................................. 15
2.3.2 Auto Power Button (PWRBTN) Selection (JP2) ................................. 15
2.4 List of Connectors ..................................................................................................... 16
2.4.1 Digital I/O (DIO1) ...................................................................................... 17
2.4.2 LCM Connector (CN6) ............................................................................. 18
2.4.3 Keypad Connector (CN24) ..................................................................... 19
2.4.4 HDD Power Connector (CN11~CN16) ................................................. 19
2.4.5 USB 3.0 Port (USB1) .................................................................................. 19
2.4.7 Front Panel Connector 2 (FP2) ............................................................. 20
2.4.8 Front Panel Connector 1 (FP1) .............................................................. 20
2.5 Installing Chassis Mounted Hard Drive ................................................................ 21
2.6 Installing CPU and Heat Sink ................................................................................. 26
2.7 Installing Expansion Card ....................................................................................... 29
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2.8 Installing Network Interface Module (NIM) ....................................................... 30
Chapter 3 - AMI BIOS Setup ...................................................................................................... 32
3.1 System Test and Initialization................................................................................. 33
3.2 AMI BIOS Setup ........................................................................................................ 34
3.3 Setup Submenu: Main ............................................................................................ 35
3.4 Setup Submenu: Advanced ................................................................................... 36
3.4.1 Advanced: Trusted Computing ............................................................ 37
3.4.2 Advanced: USB Configuration .............................................................. 39
3.4.3 Advanced: Hardware Monitor .............................................................. 40
3.4.4 Advanced: SIO Configuration .............................................................. 43
3.4.4.1 Serial Port 1 Configuration ....................................................... 44
3.4.4.2 Serial Port 2 Configuration ...................................................... 45
3.4.4.3 Parallel Port Configuration ...................................................... 46
3.4.5 Advanced: Serial Port Console Redirection ...................................... 48
3.4.5.1 COM0 Console Redirection Settings .................................... 49
3.4.5.2 Legacy Console Redirection Settings.................................... 52
3.4.5.3 Console Redirection Settings .................................................. 53
3.4.6 Advanced: NVMe Configuration ......................................................... 55
3.4.7 Advanced: Power Management .......................................................... 56
3.4.8 Advanced: LAN Bypass Configuration ............................................... 57
3.4.9 Advanced: Digital IO Port Configuration .......................................... 59
3.4.10 Advanced: Network Stack Configuration ........................................... 61
3.5 Setup Submenu: Security ....................................................................................... 63
3.5.1 Security: Secure Boot .............................................................................. 64
3.5.1.1 Key Management ....................................................................... 65
3.6 Setup Submenu: Boot ............................................................................................. 68
3.7 Setup Submenu: Save & Exit ................................................................................. 69
3.8 Setup Submenu: Platform Configuration ........................................................... 70
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3.8.1 Platform Configuration: PCH Configuration ...................................... 71
3.8.1.1 PCH SATA Configuration .......................................................... 72
3.8.1.2 PCH sSATA Configuration ........................................................ 73
3.8.2 Platform Configuration: Server ME Configuration ......................... 74
3.9 Setup Submenu: Socket Configuration .............................................................. 75
3.9.1 Socket Configuration: Processor Configuration .............................. 76
3.9.2 Socket Configuration: Memory Configuration ................................ 77
3.9.2.1 Memory Topology ..................................................................... 78
3.9.3 Socket Configuration: Advanced Power Management
Configuration ............................................................................................................ 79
3.9.3.1 Hardware PM State Control .................................................... 80
Chapter 4 Drivers Installation ................................................................................................... 81
4.1 Drivers Installation .................................................................................................... 82
Appendix A - Watchdog Timer Programming ....................................................................... 83
A.1 Watchdog Timer Initial Program .......................................................................... 84
Appendix B Standard LAN Bypass Platform Settings ........................................................ 90
B.1 Status LED ................................................................................................................... 91
B.1.1 Status LED Configuration ....................................................................... 91
B.1.2 Sample Code ............................................................................................ 92
B.2 LAN Bypass ................................................................................................................ 94
B.2.1 LAN Bypass Configuration .................................................................... 94
B.2.2 Sample Code ............................................................................................ 95
B.3 Software Button (General Purpose Input) .......................................................... 97
B.3.1 Software Button Configuration ............................................................ 97
B.3.2 Sample Code ............................................................................................ 97
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Chapter 1
Chapter 1 - Product Specifications
Chapter 1 Product Specifications 2
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1.1 Specifications
Platform
Form Factor
2U Rackmount Network Platform
Processor
Dual Intel® Xeon® Processor Skylake-SP &
Cascade Lake-SP processor
Chipset
Intel®C621
System Memory
DDR4 2133/2400/2666 R-DIMM, Up to 512 GB
Network
Ethernet
Intel® i211 Gigabit Ethernet x 2
Bypass
Depends on NIM module
NIM Slot
NIM x 4 (up to NIM x 8)
Display
Graphic Controller
Connector
VGA Option
Storage
HDDs
Internal 2.5” HDD x 2 or 3.5” HDD x 1 Option,
M.2 x 1
CF/CFast/mSATA
(mSATAx1 Optional ,cannot use with Mini-Card )
Internal/Expansion Interface
PCIe slot
PCIe [x16] slots x 2 (Optional)
M.2 Slot (2260 M Key) x 1
Mini-Card slot
Mini Card x 1
Chapter 1 Product Specifications 3
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Internal/Expansion Interface
IPMI
Keyboard and Mouse
USB
USB 3.0 x 2 (USB 3.0 x 2 ,Box Header 2.0mm
optional)
Miscellaneous
RTC
Internal RTC
Watchdog Timer
1~255 steps by software programmable
Software Button
GPIO Programmable push button x 1
TPM
TPM 2.0 9665 (TPM v1.2 9660 optional)
GPIO
4 bits input, 4 bits output (optional)
FAN
5
MTBF (Hours)
TBD
Color
Black
Environmental Parameters and Dimension
Power Requirement
550 ~ 600W Redundant Power
Operating Temperature
32°F ~ 104°F (0°C ~ 40°C)
Storage Temperature
-4°F ~ 140°F (-20°C ~ 60°C)
Operating Humidity
10% ~ 80% relative humidity, non-condensing
Storage Humidity
10% ~ 80% @40°C; non-condensing
Vibration
0.5 Grms/ 5 ~ 500Hz / operation (2.5” Hard Disk
Drive)
1.5 Grms/ 5 ~ 500Hz / non operation
Shock
10 G peak acceleration (11 m sec. duration),
operation
20 G peak acceleration (11 m sec. duration),
non-operation
Chapter 1 Product Specifications 4
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Environmental Parameters and Dimension
Dimension (W X D X H)
17.48” x 22.83” x3.46” (444mm x 580mm x
88mm)
I/O Interfaces
Front Panel
Power LED x 1
Status LED x 1
HDD Active LED x 1
USB 3.0 Ports x 2
RJ-45 Console x 1
Parallel LCM display and 4 keypad x 1
Software Programmable Button x1
RJ-45 LAN x 2
Rear Panel
AC Power Input x 2
Power Switch x 1
VGA port (Optional)
Rear Expansion Slot x 2 (PCIe [x16] Optional)
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Chapter 2
Chapter 2 Hardware Information
Chapter 2 Hardware Information 6
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2.1 Dimensions
2.1.1 System
Chapter 2 Hardware Information 7
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2.1.2 Board
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Aaeon FWS-8600 User manual

Category
Motherboards
Type
User manual

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