Kingston Technology KHX4300D2K2/512 Datasheet

Kingston Technology
Brand
Kingston Technology
Model
KHX4300D2K2/512
Category
Memory modules
Type
Datasheet

Kingston Technology KHX4300D2K2/512 is a high-performance 512MB memory module kit designed to enhance your computer's speed and efficiency. With its DDR2-533 CL3 configuration and low latency timings of 3-3-3-10, it delivers faster data transfer rates and improved responsiveness for demanding applications, multitasking, and gaming. The kit includes two 256MB modules, each featuring a high-performance heat spreader for enhanced thermal management, ensuring stable operation even under intensive workloads.

Kingston Technology KHX4300D2K2/512 is a high-performance 512MB memory module kit designed to enhance your computer's speed and efficiency. With its DDR2-533 CL3 configuration and low latency timings of 3-3-3-10, it delivers faster data transfer rates and improved responsiveness for demanding applications, multitasking, and gaming. The kit includes two 256MB modules, each featuring a high-performance heat spreader for enhanced thermal management, ensuring stable operation even under intensive workloads.

Memory Module Specification
Document No. 4804022-001.A00
08/11/04
KHX4300D2K2/512
512MB (256MB 32M x 64-Bit x 2 pcs.)
PC2-4300 CL3 240-Pin DIMM Kit
KEYED
Page 1
DESCRIPTION:
Kingston's KHX4300D2K2/512 is a kit of two 32M x 64-bit (256MB) DDR2-533 CL3 SDRAM
(Synchronous DRAM) memory modules, based on four 32M x 16-bit DDR2 FBGA components (per
module). Total kit capacity is 512MB. Each pair has been tested to run at DDR2 533MHz at low
latency timing of 3-3-3-10 at 1.85V. The SPDs are programmed to JEDEC standard latency timing
of 4-4-4-12 at 1.8V. Each 240-pin DIMM uses gold contact fingers and requires +1.8V. The
electrical and mechanical specifications are as follows:
FEATURES:
Power supply : Vdd: 1.8V ± 0.1V, Vddq: 1.8V ± 0.1V
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 3 (clock)
Burst Length: 4, 8 (Interleave/nibble sequential)
Programmable Burst type (sequential & interleave)
Timing Reference: 3-3-3-10 at +1.85V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval (8K/64ms refresh)
Serial presence detect with EEPROM
High Performance Heat Spreader
PCB : Height 1.180” (30.00mm), single sided component
PERFORMANCE:
Clock Cycle Time (tCK) CL=3 5ns (min.) / 8ns (max.)
Row Cycle Time (tRC) 60ns (min.)
Refresh to Active/Refresh Command Time (tRFC) 105ns
Row Active Time (tRAS) 45ns (min.) / 70,000ns (max.)
Single Power Supply of +1.8V (+/- .1V)
Power 0.864 W (operating per module)
UL Rating 94 V - 0
Operating Temperature 0
o
C to 55
o
C
Storage Temperature -55
o
C to +125
o
C
TECHNOLOGY
Kingston Technology
Document No. 4804022-001.A00 Page 2
MODULE DIMENSIONS:
131.35
Units : Millimeters
133.35
10.00
128.95
(2)
2.50
(2X)4.00
30.00
2.30
17.80
SPD
1.270 ± 0.10
2.7
2.50
1.00
0.20
2.50±0.20
Detail B
5.00
Detail A
4.00
1.50±0.10
0.80±0.05
4.00
3.80
3.00
4.00
A
B
63.00
55.00
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not
operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to
run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to
computer components.
For more information, go to www.kingston.com
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Kingston Technology KHX4300D2K2/512 Datasheet

Kingston Technology
Brand
Kingston Technology
Model
KHX4300D2K2/512
Category
Memory modules
Type
Datasheet

Kingston Technology KHX4300D2K2/512 is a high-performance 512MB memory module kit designed to enhance your computer's speed and efficiency. With its DDR2-533 CL3 configuration and low latency timings of 3-3-3-10, it delivers faster data transfer rates and improved responsiveness for demanding applications, multitasking, and gaming. The kit includes two 256MB modules, each featuring a high-performance heat spreader for enhanced thermal management, ensuring stable operation even under intensive workloads.

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