Molex KK 254 Crimp Housing, Friction Ramp, 2 Circuits, Natural User manual

Type
User manual
TEST SUMMARY
REVISION:
RELEASED
EC UCP2005-2431
SAMIEC 5/5/2005
TITLE:
TEST SUMMARY
KK 100 CENTER PRODUCTS
WITH LEAD FREE TIN PLATING
SHEET No.
A
1 of 2
DOCUMENT NUMBER:
CREATED / REVISED BY:
CHECKED BY:
TS-10-07
SAMIEC
SAMIEC
TEMPLATE FILENAME: TEST_SUMMARY[SIZE_A](V.1).DOC
1.0 SCOPE
This Product Specification covers the 2.54 mm (.100 inch) centerline (pitch) 0.64 mm (.025) square
pin headers when mated with either printed circuit board (PCB) connectors or connectors terminated
with 22 to 28 AWG wire using crimp or IDT technology.
2.0 PRODUCT DESCRIPTION
2.1 PRODUCT NAME AND SERIES NUMBERS
Crimp Terminals: 2759, 41572, 6459
Crimp Housings: 2695
PCB Connectors: 4455, 42625
IDT Connectors: 7720, 40554
Headers: 4030, 4094, 6373, 7478, 42225, 42226, 42227, 42228, 42152, 42153, 42375, 42376,
42377, 42624.
Other products conforming to this specification are noted on the individual drawings.
2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS
Terminal Material: Brass or Phos. Bronze
Housing: Nylon or Polyester
Pins: Brass or Phos. Bronze
Finish: Tin over Nickel or Copper
For more information on dimensions, materials, and plating see the individual drawings.
2.3 SAFETY AGENCY APPROVALS
UL File Number …….. E29179
CSA …………………....LR19980
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
3.1 TESTING PROCEDURES AND SEQUENCES
Reference Appendix ***
3.2 OTHER DOCUMENTS AND SPECIFICATIONS
4.0 QUALIFICATION
Laboratory conditions and sample selection are in accordance with EIA-364.
TEST SUMMARY
REVISION:
RELEASED
EC UCP2005-2431
SAMIEC 5/5/2005
TITLE:
TEST SUMMARY
KK 100 CENTER PRODUCTS
WITH LEAD FREE TIN PLATING
SHEET No.
A
2 of 2
DOCUMENT NUMBER:
CREATED / REVISED BY:
CHECKED BY:
TS-10-07
SAMIEC
SAMIEC
TEMPLATE FILENAME: TEST_SUMMARY[SIZE_A](V.1).DOC
5.0 PERFORMANCE
5.1 ELECTRICAL REQUIREMENTS
DESCRIPTION
TREATMENT
REQUIREMENT
MEAN
MINIMUM
MAXIMUM
Contact
Resistance
(Low Level)
Initial Resistance
30 milliohms MAXIMUM
6.85 m
5.90 m
10.81 m
After Durability
10 milliohms MAXIMUM*
-0.21m
-3.41 m
2.70 m
After Thermal Aging
10 milliohms MAXIMUM*
-0.40 m
-3.43 m
1.64 m
No Damage
No Visual or Dimensional Change
After Thermal Shock
10 milliohms MAXIMUM*
0.37 m
-2.92 m
6.37 m
No Damage
No Visual or Dimensional Change
After Vibration
10 milliohms MAXIMUM*
-0.30 m
-3.42 m
0.49 m
No Discontinuity
Discontinuity < 1 microsecond
After Humidity (Cyclic)
10 milliohms MAXIMUM*
2.41 m
-2.31 m
5.88 m
No Damage
No Visual or Dimensional Change
* change from initial
5.2 MECHANICAL PERFORMANCE RESULTS
DESCRIPTION
TREATMENT
REQUIREMENT
MEAN
MINIMUM
MAXIMUM
Pin
Pushout Force
Initial
8.90 N MINIMUM
(2.0 lbf) MINIMUM
33.72 N
(7.58 lbf)
15.21 N
(3.42 lbf)
50.93 N
(11.45 lbf)
Pin
Pushout Force
After Thermal Aging
---
21.00 N
(4.72 lbf)
8.45 N
(1.90 lbf)
37.10 N
(8.34 lbf)
5.3 ENVIRONMENTAL PERFORMANCE RESULTS
DESCRIPTION
TREATMENT
REQUIREMENT
MEAN
MINIMUM
MAXIMUM
Solderability
Final
95% Coverage
MINIMUM
Coverage > 95%
Solder
Resistance
Final
No Damage
No Visual or Dimensional Change
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Molex KK 254 Crimp Housing, Friction Ramp, 2 Circuits, Natural User manual

Type
User manual

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