Seco SOM-COMe-CT6-R1000 Owner's manual

Brand: Seco

Model: SOM-COMe-CT6-R1000

Type: Owner's manual

COMe-C89

CT6

COM-Express Rel 3.0 Type 6 Module with the AMD

Ryzen Embedded R1000 family of SoCs

COMe-C89-CT6

Unauthorised use, duplication, modification or disclosure of the information to a third-party by any means without prior consent of SECO S.p.A. is prohibited.

Every effort has been made to ensure the accuracy of this manual. However, SECO S.p.A. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.p.A. reserves the right to change precise specifications without prior notice to supply the best product possible.

For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the

dedicated web form available at http://www.seco.com (registration required).

Our team is ready to assist you.

Revision

Date

Note

Rif

1.0

14 December 2020

First Official Release

1.1

11 June 2021

Second Official Release

- Added safety policy (par. 1.7)

- Minor changes modifications

REVISION HISTORY

 
 COMe-C89-CT6 
COMe-C89-CT6 User Manual - Rev. First Edition: 1.0 - Last Edition: 1.1 - Author: A.R. - Reviewed by E.S. Copyright © 2021 SECO S.p.A. 

INDEX 
   INTRODUCTION .......................................................................................................................................................................... 5 
1 Warranty .................................................................................................................................................................................................................................................... 6 
2 Information and assistance ........................................................................................................................................................................................................................... 7 
3 RMA number request .................................................................................................................................................................................................................................. 7 
4 Safety ........................................................................................................................................................................................................................................................ 8 
5 Electrostatic Discharges ............................................................................................................................................................................................................................... 8 
6 RoHS compliance ....................................................................................................................................................................................................................................... 8 
7 Safety Policy ............................................................................................................................................................................................................................................... 9 
8 Terminology and definitions ........................................................................................................................................................................................................................ 10 
9 Reference specifications ............................................................................................................................................................................................................................ 12 
  OVERVIEW ................................................................................................................................................................................13 
1 Introduction .............................................................................................................................................................................................................................................. 14 
2 Technical Specifications ............................................................................................................................................................................................................................. 15 
3 Electrical Specifications .............................................................................................................................................................................................................................. 16 
3.1 Power Rails meanings .................................................................................................................................................................................................. 16 
3.2 Power Consumption .................................................................................................................................................................................................... 16 
4 Mechanical Specifications .......................................................................................................................................................................................................................... 18 
5 Block Diagram .......................................................................................................................................................................................................................................... 19 
  CONNECTORS ..........................................................................................................................................................................20 
1 Introduction .............................................................................................................................................................................................................................................. 21 
2 Connectors description .............................................................................................................................................................................................................................. 22 
2.1 FAN Connector ........................................................................................................................................................................................................... 22 
2.2 JTAG Connector.......................................................................................................................................................................................................... 22 
2.3 SO-DIMM DDR4 Slots ................................................................................................................................................................................................. 23 
2.4 BIOS Restore switch .................................................................................................................................................................................................... 23 
2.5 COM Express® Module connectors ............................................................................................................................................................................... 24 
2.6 BOOT Strap Signals ..................................................................................................................................................................................................... 49 
  BIOS SETUP ..............................................................................................................................................................................50 
1 Aptio setup Utility ...................................................................................................................................................................................................................................... 51 
2 Main menu ............................................................................................................................................................................................................................................... 52 
2.1 System Time / System Date ......................................................................................................................................................................................... 52 

 
 COMe-C89-CT6 
COMe-C89-CT6 User Manual - Rev. First Edition: 1.0 - Last Edition: 1.1 - Author: A.R. - Reviewed by E.S. Copyright © 2021 SECO S.p.A. 

3 Advanced menu........................................................................................................................................................................................................................................ 53 
3.1 Battery Failure Manager submenu ................................................................................................................................................................................. 54 
3.2 Trusted Computing submenu........................................................................................................................................................................................ 54 
3.3 TPM selection submenu ............................................................................................................................................................................................... 55 
3.4 ACPI Settings submenu................................................................................................................................................................................................ 55 
3.5 SATA presence submenu ............................................................................................................................................................................................. 55 
3.6 DXIO Settings submenu ............................................................................................................................................................................................... 55 
3.7 S5 RTC Wake Settings submenu .................................................................................................................................................................................. 57 
3.8 Serial Port Console Redirection submenu....................................................................................................................................................................... 58 
3.9 CPU configuration submenu ......................................................................................................................................................................................... 59 
3.10 AMI graphic Output Protocol Policy submenu ................................................................................................................................................................. 59 
3.11 PCI Subsystem Settings submenu ................................................................................................................................................................................ 59 
3.12 USB configuration submenu ......................................................................................................................................................................................... 60 
3.13 CSM configuration submenu......................................................................................................................................................................................... 61 
3.14 NVMe configuration submenu ....................................................................................................................................................................................... 61 
3.15 Main Thermal Configuration submenu ............................................................................................................................................................................ 62 
3.16 SMBIOS Information ..................................................................................................................................................................................................... 62 
3.17 Embedded Controller submenu..................................................................................................................................................................................... 63 
3.18 LPC Window Configuration ........................................................................................................................................................................................... 67 
3.19 Network Stack configuration submenu ........................................................................................................................................................................... 67 
3.20 AMD CBS submenu .................................................................................................................................................................................................... 68 
3.21 AMD Platform submenu ............................................................................................................................................................................................... 70 
3.22 RAM Disk Configuration ................................................................................................................................................................................................ 70 
3.23 Intel® I210 Gigabit Network Connection   
Mac 
Address submenu .................................................................................................................................... 71 
4 Chipset menu ........................................................................................................................................................................................................................................... 72 
4.1 South Bridge Configuration submenu ............................................................................................................................................................................ 72 
4.2 North Bridge Configuration submenu ............................................................................................................................................................................. 72 
5 Security menu .......................................................................................................................................................................................................................................... 73 
5.1 Secure Boot submenu ................................................................................................................................................................................................. 73 
6 Boot menu ............................................................................................................................................................................................................................................... 75 
7 Save & Exit menu ...................................................................................................................................................................................................................................... 77 
  APPENDICES .............................................................................................................................................................................78 
1 Thermal Design ......................................................................................................................................................................................................................................... 79 
 

COMe-C89-CT6

• Warranty

• Information and assistance

• RMA number request

• Safety

• Electrostatic Discharges

• RoHS compliance

• Safety Policy

• Terminology and definitions

• Reference specifications

COMe-C89-CT6

1.1 Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts 1 year.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.

Items cannot be returned unless previously authorised by the supplier.

The authorisation is released after completing the specific form available on the web-site http://www.seco.com/en/prerma (RMA Online). The RMA authorisation

number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original packaging, with

no signs of damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and must accompany the returned item.

If any of the above mentioned requirements for RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.

Following a technical analysis, the supplier will verify if all the requirements for which a warranty service applies are met. If the warranty cannot be applied, the Supplier

will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

Warning!

All changes or modifications to the equipment not explicitly approved by SECO S.p.A. could impair the equipments and could void

the warranty

COMe-C89-CT6

1.2 Information and assistance

What do I have to do if the product is faulty?

SECO S.p.A. offers the following services:

• SECO website: visit http://www.seco.com to receive the latest information on the product. In most cases it is possible to find useful information to solve the

problem.

• SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.

• SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct

solution. E-mail: technical.service@seco.com

Fax (+39) 0575 340434

• Repair centre: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

o Returned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.

o Returned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before asking for technical assistance:

- Name and serial number of the product;

- Description of Customer’s peripheral connections;

- Description of Customer’s software (operating system, version, application software, etc.);

- A complete description of the problem;

- The exact words of every kind of error message encountered.

1.3 RMA number request

To request a RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online” and follow the procedure described.

A RMA Number will be sent within 1 working day (only for on-line RMA requests).

COMe-C89-CT6

1.4 Safety

The COMe-C89-CT6 module uses only extremely-low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

1.5 Electrostatic Discharges

The COMe-C89-CT6 module, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or

all the devices and/or components on-board.

1.6 RoHS compliance

The COMe-C89-CT6 module is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other boards.

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid

short circuits due to unwanted contacts with other board components.

If the board has become wet, never connect it to any external power supply unit or battery.

Check carefully that all cables are correctly connected and that they are not damaged.

Whenever handling a COMe-C89-CT6 module, ground yourself through an anti-static wrist strap. Placement of the board on an anti-

static surface is also highly recommended.

COMe-C89-CT6

1.7 Safety Policy

In order to meet the safety requirements of EN62368-1:2014 standard for Audio/Video, information and communication technology equipment, the COMe-C89

Module shall be:

- used inside a fire enclosure made of non-combustible material or V-1 material (the fire enclosure is not necessary if the maximum power supplied to the

module never exceeds 100 W, even in worst-case fault);

- used inside an enclosure; the enclosure is not necessary if the temperature of the parts likely to be touched never exceeds 70 °C and If the module is unlikely

that a person will touch the part intentionally under normal operating conditions

- installed inside an enclosure compliant with all applicable IEC 62368-1 requirements;

The manufacturer which include a COMe-C89 module in his end-user product shall:

- verify the compliance with B.2 and B.3 clauses of the EN62368-1 standard when the module works in its own final operating condition

- Prescribe temperature and humidity range for operating, transport and storage conditions;

- Prescribe to perform maintenance on the module only when it is off and has already cooled down;

COMe-C89-CT6

1.8 Terminology and definitions

ACPI Advanced Configuration and Power Interface, an open industrial standard for the board’s devices configuration and power management

AHCI Advanced Host Controller Interface, a standard which defines the operation modes of SATA interface

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

BIOS Basic Input / Output System, the Firmware Interface that initializes the board before the OS starts loading

CRT Cathode Ray Tube. Initially used to indicate a type of monitor, this acronym has been used over time to indicate the analog video interface used to

drive them.

DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)

DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock

DDR4 DDR, 4th generation

DP Display Port, a type of digital video display interface

DVI Digital Visual interface, a type of digital video display interface

ECC Error Correcting Code, a peculiar type of memory module with 72-bit of data instead of 64, where the additional 8 bit are used to detect and correct

possible errors on the remaining 64-bit data bus

eDP embedded Display Port, a type of digital video display interface specifically developed for the internal connections between boards and digital

displays

GbE Gigabit Ethernet

Gbps Gigabits per second

GND Ground

GPI/O General purpose Input/Output

HD Audio High Definition Audio, most recent standard for hardware codecs developed by Intel® in 2004 for higher audio quality

HDMI High Definition Multimedia Interface, a digital audio and video interface

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

LPC Bus Low Pin Count Bus, a low speed interface based on a very restricted number of signals, deemed to management of legacy peripherals

LVDS Low Voltage Differential Signaling, a standard for transferring data at very high speed using inexpensive twisted pair copper cables, usually used

for video applications

Mbps Megabits per second

N.A. Not Applicable

N.C. Not Connected

COMe-C89-CT6

OS Operating System

PCI-e Peripheral Component Interface Express

PSU Power Supply Unit

PWM Pulse Width Modulation

PWR Power

PXE Preboot Execution Environment, a way to perform the boot from the network ignoring local data storage devices and/or the installed OS

SATA Serial Advance Technology Attachment, a differential half duplex serial interface for Hard Disks

SD Secure Digital, a memory card type

SDHC Secure Digital Host Controller

SDIO Secure Digital Input/Output, an evolution of the SD standard that allows the use of the same SD interface to drive different Input/Output devices,

like cameras, GPS, Tuners and so on

SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and

other power supply-related devices

SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed of a master and one or more slaves, individually

enabled through a Chip Select line

TBM To be measured

TMDS Transition-Minimized Differential Signaling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces

TTL Transistor-transistor Logic

UEFI Unified Extensible Firmware Interface, a specification defining the interface between the OS and the board’s firmware. It is meant to replace the

original BIOS interface

UMA Unified Memory Architecture, synonym of Integrated Graphics, uses a portion of a computer’s system RAM dedicated to graphics rather than using

dedicated graphics memory only.

USB Universal Serial Bus

V_REF Voltage reference Pin

xHCI eXtensible Host Controller Interface, Host controller for USB 3.0 ports, which can also manage USB 2.0 and USB1.1 ports

COMe-C89-CT6

1.9 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

ACPI

http://www.uefi.org/acpi/specs

AHCI

http://www.intel.com/content/www/us/en/io/serial-ata/ahci.html

Com Express

https://www.picmg.org/openstandards/com-express/

Com Express Carrier Design Guide

http://picmg.org//wp-content/uploads/PICMG_COMDG_2.0-RELEASED-2013-12-061.pdf

DDC

http://www.vesa.org

DP, eDP

http://www.vesa.org

Gigabit Ethernet

http://standards.ieee.org/about/get/802/802.3.html

HD Audio

http://www.intel.com/content/dam/www/public/us/en/documents/product-specifications/high-definition-audio-specification.pdf

HDMI

http://www.hdmi.org/index.aspx

I2C

https://cache.nxp.com/documents/user_manual/UM10204.pdf?fsrch=1&sr=2&pageNum=1

LPC Bus

http://www.intel.com/design/chipsets/industry/lpc.htm

LVDS

http://www.ti.com/ww/en/analog/interface/lvds.shtml

http://www.ti.com/lit/ml/snla187/snla187.pdf

PCI Express

http://www.pcisig.com/specifications/pciexpress

SATA

https://www.sata-io.org

SD Card Association

https://www.sdcard.org

SM Bus

http://www.smbus.org/specs

UEFI

http://www.uefi.org

USB 2.0

http://www.usb.org/developers/docs/usb_20_070113.zip

USB 3.0

http://www.usb.org/developers/docs/usb_30_spec_070113.zip

xHCI

http://www.intel.com/content/www/us/en/io/universal-serial-bus/extensible-host-controler-interface-usb-xhci.html?wapkw=xhci

COMe-C89-CT6

• Introduction

• Technical Specifications

• Electrical Specifications

• Mechanical Specifications

• Block Diagram

COMe-C89-CT6

2.1 Introduction

The COMe-C89-CT6 is a COM Express® Type 6, basic Form Factor, based on the AMD Ryzen™ Embedded R1000 family of System-on-Chips (SOCs). A complete

list of processors available is detailed in the next chapter.

All of these SoCs are Dual-Core, Dual Thread, offer a 64-bit Instruction set and provide direct access to the memory, which is available on two DDR4 SODIMM

memory modules (speed up to 2400). Both ECC and non-ECC memory modules are supported. The total amount of memory available is OS dependant.

All SOCs embed an AMD Radeon Graphics Vega x GPU with up to 3 Compute Units, which offers an advanced 2D and 3D graphic engine and it is able to manage

up to 3 independent displays using the native Digital Display Interfaces (DDIs), the eDP interface and/or the PCI-e Graphics (PEG) x4 interface. On all DDIs, it is

possible to support DP++ 1.3, DVI, HDMI 1.4 / 2.0 interfaces. As factory options, it is possible to have also one LVDS interface by using a dedicated bridge placed

on native eDP interface.

Further graphical possibilities are given by the SoC’s PCI Express graphics (PEG) x4 interface.

All the SoCs available on this module offer four PCI-express x 1 Gen 3 ports; two of them are carried out externally, one is used to manage directly a Gigabit Ethernet

controller, and another one is carried to an optional PCI-Express switch, which would make available three further Com Express connector’s PCI-e Gen2 ports.

The module functionalities are completed by the Audio HD Interface, 2 x Serial ATA Gen3 channels, 8 USB 2.0 ports, 4 USB 3.0 ports, 2 UARTs, 4 GPIs and 4

GPOs, Real Time Clock, LPC and SM Bus.

The module can be offered with an optional additional TPM module.

Please refer to following chapter for a complete list of all peripherals integrated and characteristics.

The product is COM Express® Rel.3.0 standard compliant, an open industry standard defined specifically for COMs (computer on modules). Its definition provides

the ability to make a smooth transition from legacy parallel interfaces to the newest technologies based on serial buses available. Specifically, COMe-C89-CT6 is a

COM Express® module, Basic Form factor, Type 6 (95mm x 95mm).

COM Express® module integrates all the core components and has to be mounted onto an application-specific carrier board; carrier board designers can utilize as

little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all the interface connectors required to attach the system to the

application specific peripherals. This versatility allows the designer to create a dense and optimised package, which results in a more reliable product while simplifying

system integration. Most important, COM Express® modules are scalable, which means that once an application has been created there is the ability to diversify the

product range through the use of different performance class or form factor size modules. Simply unplug one module and replace it with another, no redesign is

necessary.

The robust thermal and mechanical concept, combined with extended power-management capabilities, is perfectly suited for all applications.

2.2 Technical Specifications

CPU Four

Thread @ 2.6GHz (3.5 Boost), TDP 12-25W Four

Thread @ 2.4GHz (3.3 Boost), TDP 12-25W

3 Four

Thread @ 1.5GHz (2.8 Boost), TDP 8-10W

Memory

Two DDR4 ECC SO-DIMM Slots supporting DDR4-2400 Memory, up to 32GB

Graphics

DirectX® 12 supported

H.265 (10-bit) decode and 8-bit video encode

VP9 decode

Up to 3 independent displays supported

Video Interfaces

Up to 3 x Digital Display Interfaces (DDIs), supporting DP1.3, DVI and HDMI 1.4/2.0

eDP or Single/Dual-Channel 18-/24- bit LVDS interface

Video Resolutions

DDIs, eDP: up to 4K

LVDS: up to 1920x1200 @ 60Hz

Mass Storage

2 x external S-ATA Gen3 Channels

USB

8 x USB 2.0 Host Ports

Up to 4 x USB 3.0 Host ports

Networking

Gigabit Ethernet interface

Intel® I210 or I211 GbE Controller (MAC + PHY)

Audio

HD Audio interface

PCI Express

2 x PCI-e x1 Gen3 lanes

Additional 3rd PCI-e x1 Gen3 lane or 3x PCI-e x1 Gen2 lanes (factory alternatives)

PCI-express Graphics (PEG) x4

Serial Ports

2 x UARTs

Other Interfaces

SPI, I2C, SM Bus, LPC bus, Thermal Management, FAN management

4 x GPI, 4 x GPO

LID# / SLEEP# / PWRBTN#, Watchdog

Optional TPM 2.0 on-board

Power supply voltage: +12VDC ± 10% and + 5VSB (optional)

Operating System:

Microsoft® Windows 10 (64-bit)

Linux Ubuntu (64 bit)

Operating temperature:

0°C ÷ +60°C (Commercial version) **

Dimensions: 95 x 95 mm

** Temperatures indicated are the minimum and maximum temperature that the

heatspreader / heatsink can reach in any of its parts. This means that it is customer

’

responsibility to use any passive cooling solution along with an application-dependent

cooling system, capable to ensure that the heatspreader / heatsink temperature

remains in the range above indicated. Please also check paragraph 5.1

COMe-C89-CT6

2.3 Electrical Specifications

According to COM Express® specifications, the COMe-C89-CT6 board needs to be supplied only with an external +12VDC power supply.

5 Volts standby voltage needs to be supplied for working in ATX mode.

For Real Time Clock working and CMOS memory data retention, it is also needed a backup battery voltage. All these voltages are supplied directly through COM

Express Connectors CN6-AB and CN6-CD.

All remaining voltages needed for board’s working are generated internally from +12VDC power rail.

2.3.1 Power Rails meanings

In all the tables contained in this manual, Power rails are named with the following meaning:

_RUN: Switched voltages, i.e. power rails that are active only when the board is in ACPI’s S0 (Working) state. Examples: +3.3V_RUN, +5V_RUN.

_ALW: Always-on voltages, i.e. power rails that are active both in ACPI’s S0 (Working), S3 (Standby) and S5 (Soft Off) state. Examples: +5V_ALW, +3.3V_ALW.

_SUS: unswitched ACPI S3 voltages, i.e. power rails that are active both in ACPI’s S0 (Working) and S3 (Standby) state. Examples: +1.5V_SUS.

2.3.2 Power Consumption

COMe-C89-CT6 module, like all COM Express modules, needs a carrier board for its normal working. All connections with the external world come through this

carrier board, which provides also the required voltage to the board, deriving it from its power supply source.

Therefore, power consumptions of the board are measured using a CCOMe-C96 Carrier board on +12V_RUN power rail that supplies the board. For this reason,

the values indicated in the table below are real power consumptions of the board, and are independent from those of the peripherals connected to the Carrier Board.

Power consumption in Suspend and Soft-Off States have been measured on +5V_ALW power rail. RTC power consumption has been measured on carrier board’s

backup battery when the system is not powered (VCC_RTC power rail). For the measurements, it has been used a DC Power Analyzer Keysight N6700B.

The current consumptions, written in the table of next page, have been measured using the following setup:

Board Configurations:

• O.S. Windows 10

• AMD Ryzen Embedded R1505G (config 1), AMD Ryzen Embedded R1606G (config 2), AMD Ryzen Embedded R1305G (config 3)

• TPM present, LVDS (config 1) or eDP (config 2, 3), PCI-e Packed Switch + GbE Controller (I210 on config 1 and 3, I211 on config 2) + USB 3.0 Hub present,

Commercial Temperature Range

• 16GB DDR4 (2 x 8GB SO-DIMM DDR4 Trascend 2133MT/s)

• USB mouse and keyboard connected

COMe-C89-CT6

Status

Config 1

Config 2

Config 3

Average Value

Peak Value

Average Value

Peak Value

Average Value

Peak Value

Idle, power saving configuration

6.2W

0.52A

10.2W

0.85A

6.1W

0.51A

11.9W

0.99A

5.3W

0.44A

9.5W

0.79A

OS Boot, power saving

configuration

17W

1.42A

34.3W

2.86A

19W

1.58A

35.8W

2.98A

13.7W

1.14A

21.4W

1.78A

Video reproduction@4K, power

saving configuration

10.9W

0.91A

12.5W

1.04A

12W

13.4W

1.12A

11W

0.92A

12.4W

1.03A

Internal Test, maximum

performance

19.9W

1.66A

21.2W

1.77A

18.7W

1.56A

19.7W

1.64A

13.2W

1.1A

13.8W

1.15A

Suspend to RAM (typical)

124mA

126mA

125mA

Soft Off (typical)

70mA

67mA

72mA

COMe-C89-CT6

2.4 Mechanical Specifications

The COMe-C89-CT6 is a COM Express board, Compact form Factor type; therefore its dimensions are 95 mm x 95 mm (3.74” x 3.74”).

Printed circuit of the board is made of twelve layers, some of them are ground planes, for disturbance rejection.

According to COM Express specifications, the carrier board plug can be of two different heights, 5mm and 8mm.

Whichever connector’s height is chosen, in designing a custom carrier board please remember that the SO-DIMM connector on bottom side of COMe-C89-CT6 is

4mm high (it is the component with the maximum height).

This value must be kept in high consideration when choosing the carrier board plugs’ height, if it is necessary to place components on the carrier board in the zone

under the COM Express® module.