7K500 OEM SPECIFICATION
Page 3 of 176
Table of Contents
Table of ContentsTable of Contents
Table of Contents
Ā©COPYRIGHT HITACHI G
Ā©COPYRIGHT HITACHI GĀ©COPYRIGHT HITACHI G
Ā©COPYRIGHT HITACHI GLOBAL S
LOBAL SLOBAL S
LOBAL STORAGE TECHNOLOGIES
TORAGE TECHNOLOGIESTORAGE TECHNOLOGIES
TORAGE TECHNOLOGIES ................................
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22
2
GENERAL
GENERALGENERAL
GENERAL ................................
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88
8
1
I
NTRODUCTION
.......................................................................................................................................8
1.1
Abbreviations.............................................................................................................................8
References...........................................................................................................................................11
1.2
General caution .......................................................................................................................11
1.3
Drive handling precautions ....................................................................................................11
2
O
UTLINE OF THE DRIVE
.........................................................................................................................12
PART 1 FUNCTIONAL SP
PART 1 FUNCTIONAL SPPART 1 FUNCTIONAL SP
PART 1 FUNCTIONAL SPECIFICATION
ECIFICATIONECIFICATION
ECIFICATION ................................
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......................... 13
1313
13
3
F
IXED DISK SUBSYSTEM DESCRIPTION
..................................................................................................14
3.1
Control Electronics ..................................................................................................................14
3.2
Head disk assembly data ........................................................................................................14
4
F
IXED DISK CHARACTERISTICS
..............................................................................................................15
4.1
Formatted capacity by model number....................................................................................15
4.2
Data sheet ................................................................................................................................16
4.3
Cylinder allocation ..................................................................................................................16
4.4
Performance characteristics ...................................................................................................18
5
D
ATA INTEGRITY
...................................................................................................................................22
5.1
Data loss on power off .............................................................................................................22
5.2
Write Cache .............................................................................................................................22
5.3
Equipment status ....................................................................................................................22
5.4
WRITE safety...........................................................................................................................22
5.5
Data buffer test........................................................................................................................23
5.6
Error recovery..........................................................................................................................23
5.7
Automatic reallocation ............................................................................................................23
5.8
ECC ..........................................................................................................................................24
6
S
PECIFICATION
.....................................................................................................................................25
6.1
Environment ............................................................................................................................25
6.3
Reliability.................................................................................................................................29
6.4
Mechanical specifications........................................................................................................32
6.5
Vibration and shock.................................................................................................................34
6.6
Acoustics ..................................................................................................................................36
6.7
Identification labels.................................................................................................................37
6.8
Electromagnetic compatibility................................................................................................37
6.9
Safety........................................................................................................................................38
6.10
Packaging.................................................................................................................................38
6.11
Substance restriction requirements .......................................................................................38
7
E
LECTRICAL INTERFACE SPECIFICATIONS
............................................................................................39
7.1
Cabling .....................................................................................................................................39
7.2
Interface connector ..................................................................................................................39
7.3
Signal definitions.....................................................................................................................40
PART 2 INTERFACE SPE
PART 2 INTERFACE SPEPART 2 INTERFACE SPE
PART 2 INTERFACE SPECIFICATION
CIFICATIONCIFICATION
CIFICATION ................................
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............................ 44
4444
44
8
G
ENERAL
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8.1
Introduction .............................................................................................................................45
8.2
Terminology .............................................................................................................................45
9
D
EVIATIONS FROM
S
TANDARD
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10
P
HYSICAL
I
NTERFACE
.........................................................................................................................46
11
R
EGISTERS
..........................................................................................................................................46
11.1
Register naming convention ...................................................................................................47
11.2
Command register ...................................................................................................................47
11.3
Device Control Register ..........................................................................................................47
11.4
Device Register ........................................................................................................................48