Texas Instruments WL1837MODCOM8I WLAN MIMO and BT Module EVB for TI Sitara Platform (Rev. A) User guide

Texas Instruments
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Texas Instruments
Model
WL1837MODCOM8I WLAN MIMO and BT Module EVB for TI Sitara Platform (Rev. A)
Type
User guide

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User's Guide
SWRU382A–November 2014–Revised December 2014
WL1837MODCOM8I WLAN MIMO and Bluetooth
®
Module
Evaluation Board for TI Sitara™ Platform
The WL1837MODCOM8I is a Wi-Fi
®
dual-band, Bluetooth, and BLE module evaluation board (EVB) with
the TI WL1837 module (WL1837MOD, with Bluetooth) or WL1807 module (WL1807MOD, without
Bluetooth). The WL18x7MOD is a certified WiLink™ 8 module from TI that offers high throughput and
extended range along with Wi-Fi and Bluetooth coexistence in a power-optimized design. The
WL1807MOD offers A 2.4- and 5-GHz module solution with two antennas supporting industrial
temperature grade. The module is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) and
client. TI offers drivers for high-level operating systems, such as Linux
®
, Android™, WinCE, and RTOS.TI.
Contents
1 Overview...................................................................................................................... 3
1.1 General Features ................................................................................................... 3
1.2 Key Benefits......................................................................................................... 3
1.3 Applications.......................................................................................................... 4
2 Board Pin Assignment ...................................................................................................... 4
2.1 Pin Description ...................................................................................................... 5
2.2 Jumper Connections ............................................................................................... 7
3 Electrical Characteristics.................................................................................................... 7
4 Approved Antenna Types and Maximum Gain Values ................................................................. 8
5 Antenna Characteristics..................................................................................................... 9
5.1 VSWR ................................................................................................................ 9
5.2 Efficiency ........................................................................................................... 10
5.3 Radio Pattern ...................................................................................................... 10
6 Circuit Design............................................................................................................... 11
6.1 EVB Reference Schematics ..................................................................................... 11
6.2 Bill of Materials (BOM)............................................................................................ 12
7 Layout Guidelines .......................................................................................................... 13
7.1 Board Layout....................................................................................................... 13
8 Ordering Information....................................................................................................... 18
List of Figures
1 WL1837MODCOM8I EVB (Top View) .................................................................................... 3
2 EVB Top View................................................................................................................ 4
3 EVB (Bottom View).......................................................................................................... 5
4 Antenna VSWR Characteristics............................................................................................ 9
5 Antenna Efficiency ......................................................................................................... 10
6 EVB Reference Schematics .............................................................................................. 11
7 WL1837MODCOM8I Layer 1 Layout .................................................................................... 13
8 WL1837MODCOM8I Layer 2 Layout .................................................................................... 13
9 WL1837MODCOM8I Layer 3 Layout .................................................................................... 14
10 WL1837MODCOM8I Layer 4 Layout .................................................................................... 14
Sitara, WiLink are trademarks of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
Android is a trademark of Google, Inc.
Linux is a registered trademark of Linus Torvalds.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
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11 Module Layout Guidelines (Top Layer).................................................................................. 15
12 Module Layout Guidelines (Bottom Layer).............................................................................. 15
13 Trace Design for the PCB Layout........................................................................................ 16
14 Layer 1 Combined With Layer 2.......................................................................................... 16
15 Top Layer – Antenna and RF Trace Routing Layout Guidelines .................................................... 17
16 Bottom Layer – Antenna and RF Trace Routing Layout Guidelines................................................. 17
17 MIMO Antenna Spacing................................................................................................... 18
List of Tables
1 Pin Description............................................................................................................... 5
2 Approved Antenna Types and Maximum Gain Values ................................................................. 8
3 BOM.......................................................................................................................... 12
4 Module Layout Guidelines ................................................................................................ 15
5 Antenna and RF Trace Routing Layout Guidelines.................................................................... 17
Warning
The WL1837MODCOM8I board is tested to comply with ETSI/R&TTE over temperatures from –40°C to
+85°C.
This board should not be modified to operate in other frequency bands other than what they are designed
for.
FCC Licensing Requirements for the Wi-Fi and Bluetooth Radio Module of the EVM:
For evaluation only; not FCC approved for resale. This kit is designed to allow:
1. Product developers to evaluate electronic components, circuitry, or software associated with the kit to
determine whether to incorporate such items in a finished product
2. Software developers to write software applications for use with the end product. This kit is not a
finished product and when assembled may not be resold or otherwise marketed unless all required
FCC equipment authorizations are first obtained. Operation is subject to the condition that this product
not cause harmful interference to licensed radio stations and that this product accept harmful
interference. Unless the assembled kit is designed to operate under part 15, part 18, or part 95 of this
chapter, the operator of the kit must operate under the authority of an FCC license holder or must
secure an experimental authorization under part 5 of this chapter.
Per TI’s Regulatory Compliance Information located in the WL1837MODCOM8I User’s Guide’s
“Evaluation Board/Kit/Module (EVM) Additional Terms,” this EVM cannot be used for production purposes
and is explicitly restricted from end-product introduction.
Use of this EVM requires the developer to provide a minimum distance of at least 20 cm from the antenna
to all persons in order to minimize risk of potential radiation hazards.
CAUTION
Do not leave the EVM powered when unattended.
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Overview
1 Overview
Figure 1 shows the WL1837MODCOM8I EVB.
Figure 1. WL1837MODCOM8I EVB (Top View)
1.1 General Features
The WL1837MODCOM8I EVB includes the following features:
• WLAN, Bluetooth, and BLE on a single module board
• 100-pin board card
• Dimensions: 76.0 mm (L) x 31.0 mm (W)
• WLAN 2.4- and 5-GHz SISO (20- and 40-MHz channels), 2.4-GHz MIMO (20-MHz channels)
• Support for BLE dual mode
• Seamless integration with TI Sitara and other application processors
• Design for the TI AM335X general-purpose evaluation module (EVM)
• WLAN and Bluetooth, BLE, and ANT cores that are software- and hardware-compatible with prior
WL127x, WL128x, and BL6450 offerings for smooth migration to device
• Shared host-controller-interface (HCI) transport for Bluetooth, BLE, and ANT using UART and SDIO for
WLAN
• Wi-Fi and Bluetooth single-antenna coexistence
• Built-in chip antenna
• Optional U.FL RF connector for external antenna
• Direct connection to the battery using an external switched-mode power supply (SMPS) supporting
2.9- to 4.8-V operation
• V
IO
in the 1.8-V domain
1.2 Key Benefits
The WL18x7MOD offers the following benefits:
• Reduces design overhead: Single WiLink 8 module scales across Wi-Fi and Bluetooth
• WLAN high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
• Bluetooth 4.1 + BLE (Smart Ready)
• Wi-Fi and Bluetooth single-antenna coexistence
• Low power at 30% to 50% less than the previous generation
• Available as an easy-to-use FCC-, ETSI-, and Telec-certified module
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• Lower manufacturing costs saves board space and minimizes RF expertise.
• AM335x Linux and Android reference platform accelerates customer development and time to market.
1.3 Applications
The WL1837MODCOM8I device is designed for the following applications:
• Portable consumer devices
• Home electronics
• Home appliances and white goods
• Industrial and home automation
• Smart gateway and metering
• Video conferencing
• Video camera and security
2 Board Pin Assignment
Figure 2 shows the top view of the EVB.
Figure 2. EVB Top View
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Board Pin Assignment
Figure 3 shows the bottom view of the EVB.
Figure 3. EVB (Bottom View)
2.1 Pin Description
Table 1 describes the board pins.
Table 1. Pin Description
No. Name Type Description
1 SLOW_CLK I Slow clock input option (default: NU)
2 GND G Ground
3 GND G Ground
4 WL_EN I WLAN enable
5 V
BAT
P 3.6-V typical voltage input
6 GND G Ground
7 V
BAT
P 3.6-V typical voltage input
8 V
IO
P V
IO
1.8-V (I/O voltage) input
9 GND G Ground
10 N.C. No connection
11 WL_RS232_TX O WLAN tool RS232 output
12 N.C. No connection
13 WL_RS232_RX I WLAN tool RS232 input
14 N.C. No connection
15 WL_UART_DBG O WLAN Logger output
16 N.C. No connection
17 N.C. No connection
18 GND G Ground
19 GND G Ground
20 SDIO_CLK I WLAN SDIO clock
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Board Pin Assignment
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Table 1. Pin Description (continued)
No. Name Type Description
21 N.C. No connection
22 GND G Ground
23 N.C. No connection
24 SDIO_CMD I/O WLAN SDIO command
25 N.C. No connection
26 SDIO_D0 I/O WLAN SDIO data bit 0
27 N.C. No connection
28 SDIO_D1 I/O WLAN SDIO data bit 1
29 N.C. No connection
30 SDIO_D2 I/O WLAN SDIO data bit 2
31 N.C. No connection
32 SDIO_D3 I/O WLAN SDIO data bit 3
33 N.C. No connection
34 WLAN_IRQ O WLAN SDIO interrupt out
35 N.C. No connection
36 N.C. No connection
37 GND G Ground
38 N.C. No connection
39 N.C. No connection
40 N.C. No connection
41 N.C. No connection
42 GND G Ground
43 N.C. No connection
44 N.C. No connection
45 N.C. No connection
46 N.C. No connection
47 GND G Ground
48 N.C. No connection
49 N.C. No connection
50 N.C. No connection
51 N.C. No connection
52 PCM_IF_CLK I/O Bluetooth PCM clock input or output
53 N.C. No connection
54 PCM_IF_FSYNC I/O Bluetooth PCM frame sync input or output
55 N.C. No connection
56 PCM_IF_DIN I Bluetooth PCM data input
57 N.C. No connection
58 PCM_IF_DOUT O Bluetooth PCM data output
59 N.C. No connection
60 GND G Ground
61 N.C. No connection
62 N.C. No connection
63 GND G Ground
64 GND G Ground
65 N.C. No connection
66 BT_UART_IF_TX O Bluetooth HCI UART transmit output
67 N.C. No connection
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Board Pin Assignment
Table 1. Pin Description (continued)
No. Name Type Description
68 BT_UART_IF_RX I Bluetooth HCI UART receive input
69 N.C. No connection
70 BT_UART_IF_CTS I Bluetooth HCI UART Clear-to-Send input
71 N.C. No connection
72 BT_UART_IF_RTS O Bluetooth HCI UART Request-to-Send output
73 N.C. No connection
74 RESERVED1 O Reserved
75 N.C. No connection
76 BT_UART_DEBUG O Bluetooth Logger UART output
77 GND G Ground
78 GPIO9 I/O General-purpose I/O
79 N.C. No connection
80 N.C. No connection
81 N.C. No connection
82 N.C. No connection
83 GND G Ground
84 N.C. No connection
85 N.C. No connection
86 N.C. No connection
87 GND G Ground
88 N.C. No connection
89 BT_EN I Bluetooth enable
90 N.C. No connection
91 N.C. No connection
92 GND G Ground
93 RESERVED2 I Reserved
94 N.C. No connection
95 GND G Ground
96 GPIO11 I/O General-purpose I/O
97 GND G Ground
98 GPIO12 I/O General-purpose I/O
99 TCXO_CLK_COM I Option to supply 26 MHz externally
100 GPIO10 I/O General-purpose I/O
2.2 Jumper Connections
The WL1837MODCOM8I EVB includes the following jumper connections:
• J1: Jumper connector for V
IO
power input
• J3: Jumper connector for V
BAT
power input
• J5: RF connector for 2.4- and 5-GHz WLAN and Bluetooth
• J6: Second RF connector for 2.4-GHz WLAN
3 Electrical Characteristics
For electrical characteristics, see the WL18xxMOD WiLink™ Single-Band Combo Module – Wi-Fi®,
Bluetooth®, and Bluetooth Low Energy (BLE) Data Sheet (SWRS170).
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Approved Antenna Types and Maximum Gain Values
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4 Approved Antenna Types and Maximum Gain Values
This device is intended only for OEM integrators under the following conditions:
• The antenna must be installed so that 20 cm is maintained between the antenna and users.
• The transmitter module cannot be co-located with any other transmitter or antenna.
• The radio transmitter can operate only using an antenna of a type and maximum (or lesser) gain
approved by TI. Table 2 lists the antennas approved by TI for use with the radio transmitter along with
maximum allowable gain values. Antenna types not included in the list or having a gain greater than
the maximum indicated are strictly prohibited for use with this transmitter.
Table 2. Approved Antenna Types and Maximum Gain Values
Antenna Type Brand 2.4 GHz 4.9 to 5.9 GHz
(1)
Unit
PCB Ethertronics –0.600 4.50
Dipole LSR 2.00 2.00
PCB Laird 2.00 4.00
dBi
Chip Pulse 3.20 4.20
PIFA LSR 2.00 3.00
Chip TDK 2.27 3.96
(1)
Range is approximate.
NOTE: If these conditions cannot be met (for example, with certain laptop configurations or co-
location with another transmitter), the FCC/IC authorization will not be considered valid and
the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM
integrator is responsible for reevaluating the end product (including the transmitter) and
obtaining a separate FCC/IC authorization.
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Antenna Characteristics
5 Antenna Characteristics
5.1 VSWR
Figure 4 shows the antenna VSWR characteristics.
Figure 4. Antenna VSWR Characteristics
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5.2 Efficiency
Figure 5 shows the antenna efficiency.
Figure 5. Antenna Efficiency
5.3 Radio Pattern
For information on the antenna radio pattern and other related information, see
productfinder.pulseeng.com/product/W3006.
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EDGE CONNECTOR - MALE
ANT2 - WL_2.4_IO1/WL_5GHzANT1 - WL_2.4_IO2/BT/WL_5GHz
R20 for test mode.
These two TPs for test mode
when WL_IRQ pull high.
WL_UART_DBG
BT_AUD_CLK
BT_AUD_FSYNC
BT_AUD_IN
WL_RS232_TX
WL_RS232_RX
BT_HCI_TX
BT_HCI_RX
BT_HCI_CTS
BT_HCI_RTS
BT_EN_SOC
BT_UART_DBG
SDIO_CLK_WL
SDIO_CMD_WL
SDIO_D0_WL
SDIO_D2_WL
SDIO_D3_WL
SDIO_D1_WL
WLAN_EN_SOC
BT_AUD_OUT
RESERVED1
GPIO9
GPIO11
GPIO12
GPIO10
SLOW_CLK
RESERVED2
WLAN_IRQ
RF_ANT1 RF_ANT2
SDIO_D3_WL
GPIO12
SDIO_D2_WL
GPIO11
SDIO_D0_WL
SDIO_D1_WL
GPIO9
WLAN_IRQ
GPIO10
RF_ANT2
WL_RS232_TX
WL_RS232_RX
RF_ANT1
RESERVED1
RESERVED2
BT_HCI_RX
BT_HCI_TX
BT_HCI_CTS
BT_HCI_RTS
BT_AUD_IN
BT_AUD_OUT
BT_AUD_CLK
BT_AUD_FSYNC
SDIO_CMD_WL
SDIO_CLK_WL
SLOW_CLK
WL_UART_DBG
BT_UART_DBG
BT_EN_SOC
WLAN_EN_SOC
EXT_CLK_REQ_OUT
EXT_CLK_REQ_OUT
TCXO_CLK_COM
TCXO_CLK_COM
VBAT_IN
VIO_IN
VIO_IN
VBAT_IN
VIO_IN
VIO_IN
VBAT_IN VIO_CLK
VIO_CLK
TP2
1
R14 0R 0402
R32
0R
0603
L3
1.8nH
0402
TP5
1
C2
10uF
0603
J3
NU_HEADER 1x2
H-1X2_2MM
1
2
L1
1.3nH
0402
R9 0R 0402
C14
2.4pF
0402
R15 0R 0402
R8 0R 0402
R29 0R 0402
R12 0R 0402
R5 NU
0402
R6
0R
0402
J2
NU_100pin Micro Edge MEC6
SD-100P
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
31 32
33 34
35 36
37 38
39 40
41 42
43 44
45 46
47 48
49 50
51 52
53 54
55 56
57 58
59 60
61 62
63 64
65 66
67 68
69 70
71 72
73 74
75 76
77 78
79 80
81 82
83 84
85 86
87 88
89 90
91 92
93 94
95 96
97 98
99 100
0RR26 0402
R1 0R 0402
R13 0R 0402
R35
NU
0402
TCXO1
NU_TCXO 26MHz
2.0x1.6x0.73mm
NC
1
VCC
4
OUT
3
GND
2
TP8
1
C7
NU_0R
0402
R18 0R 0402
R7 0R 0402
TP4
1
TP1
1
C1
1uF
0402
0RR24 0402
R31
0R
0603
J6
U.FL-R-SMT(10)
U.FL
1
2
3
C5
0R
0402
R28 0R 0402
TP3
1
R10 0R
0402
R20 10k
0402
TP6
1
R36 NU
0402
L4
2.2nH
0402
R34
NU
0402
U4
NU_TLV70518
XBGA-N4_0.8X0.8_0.4
VIN
B2
VOUT
B1
EN
A2
GND
A1
U1
WL1837MODGI
E-13.4X13.3-N100_0.75-TOP
GND
17
VIO
38
VBAT
47
EXT_32K
36
BT_AUD_FSYNC
58
BT_AUD_IN
56
BT_AUD_OUT
57
BT_AUD_CLK
60
WL_SDIO_D2
12
WL_SDIO_CLK
8
WL_SDIO_D3
13
WL_SDIO_D0
10
WL_SDIO_D1
11
WL_SDIO_CMD
6
BT_HCI_RTS
50
BT_HCI_RX
53
BT_HCI_TX
52
BT_HCI_CTS
51
GND
16
GPIO_4
25
GPIO_2
26
GPIO_1
27
BT_EN_SOC
41
WLAN_IRQ
14
WLAN_EN_SOC
40
BT_UART_DBG
43
WL_UART_DBG
42
GND
G13
GND
G14
GND
G15
GND
G16
GND
G9
GND
G10
GND
48
GND
G11
GND
G12
VBAT
46
GND
28
GND
G1
GND
G2
GND
G3
GND
G4
GND
G5
GND
G6
GND
G7
GND
G8
RF_ANT1
32
RESERVED
64
GND
1
GND
20
RESERVED1
21
RESERVED2
22
GND
37
GND
19
RESERVED3
62
GND
G17
GND
G18
GND
G19
GND
G20
GND
G21
GND
G22
GND
G23
GND
G24
GND
G25
GND
G26
GND
G27
GND
G28
GND
G29
GND
G30
GND
G31
GND
G32
GND
G33
GND
G34
GND
G35
GND
23
GND
59
GND
34
GND
29
GND
7
RF_ANT2
18
GND
49
GND
9
GND
31
GND
35
GND
15
GND
55
GND
45
GND
44
GND
30
GND
24
GND
63
GND
61
GND
39
GND
33
GND
54
GND
G36
GPIO11
2
GPIO9
3
GPIO10
4
GPIO12
5
OSC1
1V8 / 32.768kHz
OSC-3.2X2.5
EN
1
VCC
4
OUT
3
GND
2
ANT2
W3006
ANT-10.0X3.2MM_A
FEED
1
NC
2
R27 0R 0402
C4
0.1uF
0402
0RR19 0402
C6
0R
0402
C13
1pF
0402
R16 0R 0402
R25 0R 0402
L2
NU
0402
R33
0R
0402
C15
NU_1uF
0402
C8
NU_0R
0402
J5
U.FL-R-SMT(10)
U.FL
1
2
3
R3 0R 0402
0RR22 0402
R30 0R 0402
C3
0.1uF
0402
C32
NU_0.1uF
0402
TP7
1
R17
0R 0402
ANT1
W3006
ANT-10.0X3.2MM_B
FEED
1
NC
2
0RR21 0402
J1
NU_HEADER 1x2
H-1X2_2MM
1
2
R23 0R 0402
R2 0R 0402
R4 0R 0402
R11 0R 0402
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Circuit Design
6 Circuit Design
6.1 EVB Reference Schematics
Figure 6 shows the reference schematics for the EVB.
Figure 6. EVB Reference Schematics
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6.2 Bill of Materials (BOM)
Table 3 lists the BOM for the EVB.
Table 3. BOM
Item Description Part Number Package Reference Qty Mfr
1 TI WL1837 Wi-Fi / Bluetooth WL1837MODGI 13.4 mm x 13.3 mm U1 1 Jorjin
module x 2.0 mm
2 XOSC 3225 / 32.768KHZ / 1.8 V / 7XZ3200005 3.2 mm × 2.5 mm × OSC1 1 TXC
±50 ppm 1.0 mm
3 Antenna / Chip / 2.4 and 5 GHz W3006 10.0 mm × 3.2 mm ANT1, ANT2 2 Pulse
× 1.5 mm
4 Mini RF header receptacle U.FL-R-SMT-1(10) 3.0 mm × 2.6 mm × J5, J6 2 Hirose
1.25 mm
5 Inductor 0402 / 1.3 nH / ±0.1 nH / LQP15MN1N3B02 0402 L1 1 Murata
SMD
6 Inductor 0402 / 1.8 nH / ±0.1 nH / LQP15MN1N8B02 0402 L3 1 Murata
SMD
7 Inductor 0402 / 2.2 nH / ±0.1 nH / LQP15MN2N2B02 0402 L4 1 Murata
SMD
8 Capacitor 0402 / 1 pF / 50 V / C0G GJM1555C1H1R0BB01 0402 C13 1 Murata
/ ±0.1 pF
9 Capacitor 0402 / 2.4 pF / 50 V / GJM1555C1H2R4BB01 0402 C14 1 Murata
C0G / ±0.1 pF
10 Capacitor 0402 / 0.1 µF / 10 V / 0402B104K100CT 0402 C3, C4 2 Walsin
X7R / ±10%
11 Capacitor 0402 / 1 µF / 6.3 V / GRM155R60J105KE19D 0402 C1 1 Murata
X5R / ±10% / HF
12 Capacitor 0603 / 10 µF / 6.3 V / C1608X5R0J106M 0603 C2 1 TDK
X5R / ±20%
13 Resistor 0402 / 0R / ±5% WR04X000 PTL 0402 R1 to R4, R6 to 31 Walsin
R19, R21 to
R30, R33, C5,
C6
(1)
14 Resistor 0402 / 10K / ±5% WR04X103 JTL 0402 R20 1 Walsin
15 Resistor 0603 / 0R / ±5% WR06X000 PTL 0603 R31, R32 2 Walsin
(1)
C5 and C6 are mounted with a 0-Ω resistor by default.
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Layout Guidelines
7 Layout Guidelines
7.1 Board Layout
Figure 7 through Figure 10 show the four layers of the WL1837MODCOM8I EVB.
Figure 7. WL1837MODCOM8I Layer 1 Layout
Figure 8. WL1837MODCOM8I Layer 2 Layout
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Figure 9. WL1837MODCOM8I Layer 3 Layout
Figure 10. WL1837MODCOM8I Layer 4 Layout
Figure 11 and Figure 12 show instances of good layout practices.
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Layout Guidelines
Figure 11. Module Layout Guidelines (Top Layer)
Figure 12. Module Layout Guidelines (Bottom Layer)
Table 4 describes the guidelines corresponding to the reference numbers in Figure 11 and Figure 12.
Table 4. Module Layout Guidelines
Reference Guideline Description
1 Keep the proximity of ground vias close to the pad.
2 Do not run signal traces underneath the module on the layer where the module is mounted.
3 Have a complete ground pour in layer 2 for thermal dissipation.
4 Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation.
5 Increase ground pour in the first layer and have all traces from the first layer on the inner layers, if possible.
6 Signal traces can be run on a third layer under the solid ground layer and the module mounting layer.
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Figure 13 shows the trace design for the PCB. TI recommends using a 50-Ω impedance match on the
trace to the antenna and 50-Ω traces for the PCB layout.
Figure 13. Trace Design for the PCB Layout
Figure 14 shows layer 1 with the trace to the antenna over ground layer 2.
Figure 14. Layer 1 Combined With Layer 2
Figure 15 and Figure 16 show instances of good layout practices for the antenna and RF trace routing.
NOTE: RF traces must be as short as possible. The antenna, RF traces, and modules must be on
the edge of the PCB product. The proximity of the antenna to the enclosure and the
enclosure material must also be considered.
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Figure 15. Top Layer – Antenna and RF Trace Routing Layout Guidelines
Figure 16. Bottom Layer – Antenna and RF Trace Routing Layout Guidelines
Table 5 describes the guidelines corresponding to the reference numbers in Figure 15 and Figure 16.
Table 5. Antenna and RF Trace Routing Layout Guidelines
Reference Guideline Description
The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace
1
starts to radiate.
RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered. RF
2
traces must not have sharp corners.
3 RF traces must have via stitching on the ground plane beside the RF trace on both sides.
4 RF traces must have constant impedance (microstrip transmission line).
For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The
5
ground layer must be solid.
6 There must be no traces or ground under the antenna section.
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Figure 17 shows the MIMO antenna spacing. The distance between ANT1 and ANT2 must be greater
than half the wavelength (62.5 mm at 2.4 GHz).
Figure 17. MIMO Antenna Spacing
Follow these supply routing guidelines:
• For power supply routing, the power trace for V
BAT
must be at least 40-mil wide.
• The 1.8-V trace must be at least 18-mil wide.
• Make V
BAT
traces as wide as possible to ensure reduced inductance and trace resistance.
• If possible, shield V
BAT
traces with ground above, below, and beside the traces.
Follow these digital-signal routing guidelines:
• Route SDIO signal traces (CLK, CMD, D0, D1, D2, and D3) in parallel to each other and as short as
possible (less than 12 cm). In addition, each trace must be the same length. Ensure enough space
between traces (greater than 1.5 times the trace width or ground) to ensure signal quality, especially
for the SDIO_CLK trace. Remember to keep these traces away from the other digital or analog signal
traces. TI recommends adding ground shielding around these buses.
• Digital clock signals (SDIO clock, PCM clock, and so on) are a source of noise. Keep the traces of
these signals as short as possible. Whenever possible, maintain a clearance around these signals.
8 Ordering Information
Part number: WL1837MODCOM8I
Revision History
Changes from Original (November 2014) to A Revision ................................................................................................ Page
• Added WL1807MOD in abstract ........................................................................................................ 1
• Added Warning ............................................................................................................................ 2
• Changed EVB in Figure 1................................................................................................................ 3
• Added input type to pin 99 in Table 1 .................................................................................................. 7
• Added Section 4, Approved Antennas and Maximum Gain Values ................................................................ 8
• Changed EVB reference schematics in Figure 6.................................................................................... 11
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Revision History
• Deleted item 16 (PCB) in Table 3 ..................................................................................................... 12
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Texas Instruments WL1837MODCOM8I WLAN MIMO and BT Module EVB for TI Sitara Platform (Rev. A) User guide

Texas Instruments
Brand
Texas Instruments
Model
WL1837MODCOM8I WLAN MIMO and BT Module EVB for TI Sitara Platform (Rev. A)
Type
User guide
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