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Last Updated: May 25, 2023
UP Element i12 Edge
UP Element i12 System Powered by the
Intel® NUC 12 Compute Element
User’s Manual 4th Ed
Preface II
Maker Board System UP Element i12 Edge
Copyright Notice
This document is copyrighted, 2023. All rights are reserved. The original manufacturer
reserves the right to make improvements to the products described in this manual at
any time without notice.
No part of this manual may be reproduced, copied, translated, or transmitted in any
form or by any means without the prior written permission of the original
manufacturer. Information provided in this manual is intended to be accurate and
reliable. However, the original manufacturer assumes no responsibility for its use, or for
any infringements upon the rights of third parties that may result from its use.
The material in this document is for product information only and is subject to change
without notice. While reasonable efforts have been made in the preparation of this
document to assure its accuracy, AAEON assumes no liabilities resulting from errors or
omissions in this document, or from the use of the information contained herein.
AAEON reserves the right to make changes in the product design without notice to its
users.
Preface III
Maker Board System UP Element i12 Edge
Acknowledgement
All other products’ name or trademarks are properties of their respective owners.
⚫ Microsoft Windows® is a registered trademark of Microsoft Corp.
⚫ ITE is a trademark of Integrated Technology Express, Inc.
⚫ IBM, PC/AT, PS/2, and VGA are trademarks of International Business Machines
Corporation
⚫ Intel®, Celeron®, and Iris® are registered trademarks of Intel Corporation.
⚫ Intel Core™ is a trademark of Intel Corporation.
⚫ Linux® is the registered trademark of Linus Torvalds in the U.S. and other
countries.
All other product names or trademarks are properties of their respective owners.
Ownership is not implied nor claimed by the publisher of this document for any
product or product names not herein listed.
Preface IV
Maker Board System UP Element i12 Edge
Packing List
Before setting up your product, please make sure the following items have been
shipped:
Item
Quantity
⚫ UP Element i12 Edge
1
⚫ Screw Bag for VESA
1
⚫ Wi-Fi Antenna
2
⚫ Plug & Push Terminal Block
2
If any of these items are missing or damaged, please contact your distributor or sales
representative immediately.
Preface V
Maker Board System UP Element i12 Edge
About this Document
This User’s Manual contains all the essential information, such as detailed descriptions
and explanations on the product’s hardware and software features (if any), its
specifications, dimensions, jumper/connector settings/definitions, and driver installation
instructions (if any), to facilitate users in setting up their product.
Users may refer to the product page at AAEON.com for the latest version of this
document.
Preface VI
Maker Board System UP Element i12 Edge
Safety Precautions
Please read the following safety instructions carefully. It is advised that you keep this
manual for future references
1. All cautions and warnings on the device should be noted.
2. Make sure the power source matches the power rating of the device.
3. Position the power cord so that people cannot step on it. Do not place anything
over the power cord.
4. Always completely disconnect the power before working on the system’s
hardware.
5. No connections should be made when the system is powered as a sudden rush
of power may damage sensitive electronic components.
6. If the device is not to be used for a long time, disconnect it from the power
supply to avoid damage by transient over-voltage.
7. Always disconnect this device from any AC supply before cleaning.
8. While cleaning, use a damp cloth instead of liquid or spray detergents.
9. Make sure the device is installed near a power outlet and is easily accessible.
10. Keep this device away from humidity.
11. Place the device on a solid surface during installation to prevent falls
12. Do not cover the openings on the device to ensure optimal heat dissipation.
13. Watch out for high temperatures when the system is running.
14. Do not touch the heat sink or heat spreader when the system is running
15. Never pour any liquid into the openings. This could cause fire or electric shock.
16. As most electronic components are sensitive to static electrical charge, be sure to
ground yourself to prevent static charge when installing the internal components.
Use a grounding wrist strap and contain all electronic components in any
static-shielded containers.
Preface VII
Maker Board System UP Element i12 Edge
17. If any of the following situations arises, please the contact our service personnel:
i. Damaged power cord or plug
ii. Liquid intrusion to the device
iii. Exposure to moisture
iv. Device is not working as expected or in a manner as described in
this manual
v. The device is dropped or damaged
vi. Any obvious signs of damage displayed on the device
18. DO NOT LEAVE THIS DEVICE IN AN UNCONTROLLED ENVIRONMENT WHERE
THE STORAGE TEMPERATURE IS BELOW -20° C (-4°F) OR ABOVE 60°C (140°F)
TO PREVENT DAMAGE.
Preface VIII
Maker Board System UP Element i12 Edge
FCC Statement
This device complies with Part 15 FCC Rules. Operation is
subject to the following two conditions: (1) this device may not
cause harmful interference, and (2) this device must accept any
interference received including interference that may cause
undesired operation.
Caution:
There is a danger of explosion if the battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by the manufacturer. Dispose of used batteries
according to the manufacturer’s instructions and your local government’s recycling or
disposal directives.
Attention:
Il y a un risque d’explosion si la batterie est remplacée de façon incorrecte.
Ne la remplacer qu’avec le même modèle ou équivalent recommandé par le constructeur.
Recycler les batteries usées en accord avec les instructions du fabricant et les directives
gouvernementales de recyclage.
Preface IX
Maker Board System UP Element i12 Edge
China RoHS Requirements (CN)
产品中有毒有害物质或元素名称及含量
AAEON System QO4-381 Rev.A0
部件名称
有毒有害物质或元素
铅
(Pb)
汞
(Hg)
镉
(Cd)
六价铬
(Cr(VI))
多溴联苯
(PBB)
多溴二苯
醚(PBDE)
印刷电路板
及其电子组件
×
○
○
○
○
○
外部信号
连接器及线材
×
○
○
○
○
○
外壳
○
○
○
○
○
○
中央处理器
与内存
×
○
○
○
○
○
硬盘
×
○
○
○
○
○
液晶模块
×
○
○
○
○
○
光驱
×
○
○
○
○
○
触控模块
×
○
○
○
○
○
电源
×
○
○
○
○
○
电池
×
○
○
○
○
○
本表格依据 SJ/T 11364 的规定编制。
○
：表示该有毒有害物质在该部件所有均质材料中的含量均在
GB/T 26572标准规定的限量要求以下。
×：表示该有害物质的某一均质材料超出了GB/T 26572的限量要求，然而该
部件
仍符合欧盟指令2011/65/EU 的规范。
备注：
一、此产品所标示之环保使用期限，系指在一般正常使用状况下。
二、上述部件物质中央处理器、内存、硬盘、光驱、电源为选购品。
三、上述部件物质液晶模块、触控模块仅一体机产品适用。
Preface X
Maker Board System UP Element i12 Edge
China RoHS Requirement (EN)
Hazardous and Toxic Materials List
AAEON System QO4-381 Rev.A0
Component
Name
Hazardous or Toxic Materials or Elements
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
Chromium
(Cr(VI))
Polybrominat
ed biphenyls
(PBBs)
Polybrominat
ed diphenyl
ethers
(PBDEs)
PCB and
Components
X
O
O
O
O
O
Wires &
Connectors for
Ext.Connections
X
O
O
O
O
O
Chassis
O
O
O
O
O
O
CPU & RAM
X
O
O
O
O
O
HDD Drive
X
O
O
O
O
O
LCD Module
X
O
O
O
O
O
Optical Drive
X
O
O
O
O
O
Touch Control
Module
X
O
O
O
O
O
PSU
X
O
O
O
O
O
Battery
X
O
O
O
O
O
This form is prepared in compliance with the provisions of SJ/T 11364.
O: The level of toxic or hazardous materials present in this component and its parts is
below the limit specified by GB/T 26572.
X: The level of toxic of hazardous materials present in the component exceed the
limits specified by GB/T 26572, but is still in compliance with EU Directive 2011/65/EU
(RoHS 2).
Notes:
1. The Environment Friendly Use Period indicated by labelling on this product is
applicable only to use under normal conditions.
2. Individual components including the CPU, RAM/memory, HDD, optical drive, and
PSU are optional.
3. LCD Module and Touch Control Module only applies to certain products which
feature these components.
Preface XI
Maker Board System UP Element i12 Edge
Table of Contents
Chapter 1 - Product Specifications.......................................................................................... 1
1.1 Specifications ............................................................................................................ 2
1.2 Block Diagram .......................................................................................................... 5
Chapter 2 – Hardware Information ....................................................................................... 6
2.1 Dimensions ............................................................................................................... 7
2.2 I/O Location .............................................................................................................. 8
2.3 List of Connectors .................................................................................................... 9
2.3.1 Power Button (1) .......................................................................................... 10
2.3.2 LAN 2 Ethernet Port (Intel® I225-IT) & USB 3.2 Gen 2 (2) ................. 10
2.3.3 LAN 1 Ethernet Port (Intel® I219-LM) & USB 3.2 Gen 2 (3) .............. 10
2.3.4 LAN 3 Ethernet Port (Realtek RTL8111H) (4) .......................................... 11
2.3.5 USB 2.0 (1/2) (5) ........................................................................................... 11
2.3.6 USB Type-C 3.0 (6) ..................................................................................... 12
2.3.7 DP 1.4 & HDMI 2.0 (7) ................................................................................ 12
2.3.8 COM 1/2 (Pin Header) (8) ......................................................................... 13
2.3.9 GPIO (9) ........................................................................................................14
2.3.10 Mic-In/Line-Out (10) ................................................................................... 15
2.3.11 DC Jack (11) ................................................................................................... 15
2.3.12 Reset Button (12) ......................................................................................... 15
2.4 List of Internal Slots ................................................................................................ 16
2.4.1. M.2 2280 M-Key.......................................................................................... 17
2.4.2 M.2 3052 B-Key ........................................................................................... 17
Chapter 3 – Operating System and Certification ............................................................... 18
3.1. Operating System ................................................................................................... 19
3.1.1. OS Version Support .................................................................................... 19
3.1.2. Certification Specification ......................................................................... 19
Preface XII
Maker Board System UP Element i12 Edge
Appendix A – Cables and Connectors ................................................................................ 20
A.1 Cables and Connectors ......................................................................................... 21
Appendix B – M.2 2280 Installation ..................................................................................... 22
B.1 M.2 2280 Device Installation ............................................................................... 23
Maker Board System UP Element i12 Edge
Chapter 1
Chapter 1 - Product Specifications
Chapter 1 – Product Specifications 2
Maker Board System UP Element i12 Edge
1.1 Specifications
System
CPU
12th Generation Intel® Core™/Intel® Celeron®
Processor 7000 Series SoC:
Intel® Core™ i7-1255U
Intel® Core™ i5-1235U
Intel® Core™ i3-1215U
Intel® Celeron® Processor 7305
Memory
Onboard LPDDR5, 4GB/8GB/16GB/32GB
Graphics
Intel® Iris® Xe Graphics
Storage
Optional with M.2 2280 M-Key x 2
Ethernet
Intel® I225-IT x 1 (2.5GbE)
Intel® I219-LM GbE x 1
Realtek RTL8111H GbE x 1
Wi-Fi/BT
Intel® AX211 Wi-Fi 6E (802.11ax)
Expansion Slot
M.2 3052 B-Key x 1 (with Nano SIM Slot)
M.2 2280 M-Key x 2 (PCIe 3.0 [x2])
Security
TPM 2.0/Watchdog timer
OS Support
Microsoft® Windows 10
Linux: Ubuntu 22.04 LTS
Chapter 1 – Product Specifications 3
Maker Board System UP Element i12 Edge
I/O
USB
USB 3.2 Gen 2 (Type-A) x 2
USB 2.0 (Type-A) x 2
USB 3.2 Gen 2 (Type-C) x 1, supports DP 1.4
Display
HDMI 2.0b x 1
DP 1.4 x 1
Ethernet
RJ-45 x 3 for GbE/2.5GbE LAN (Supports PXE function)
COM
RS-232/422/485 x 2 (Pin Header type, RS-422/485
supports 9600 baud rate)
Audio
Mic-In x 1/Line-Out x 1
GPIO
Isolation GPIO x 8 in/8 out (Pin Header Type)
Power Supply
Power Requirement
9V ~ 36V
Power Supply Type
Ø2.5 Lockable connector
Power Consumption
Intel® Core™ i7-1255U, LPDDR5 5200MHz 32GB,
4.47A @12V (Typical)
Intel® Core™ i7-1255U, LPDDR5 5200MHz 32GB, 9.6A
@12V (Maximum)
Mechanical
Mounting
Wallmount, 75mm x 75mm VESA mount
Dimensions
5.9” x 4.9” x 1.8” (152mm x 125mm x 48mm)
Gross Weight
3.31 lb. (1.5 Kg)
Net Weight
2.21 lb. (1 Kg)
Chapter 1 – Product Specifications 4
Maker Board System UP Element i12 Edge
Environmental
Operating Temperature
With Heatsink: 32°F ~ 140°F (0°C ~ 60°) with air flow
0.5m/s
Storage Temperature
-40°F ~ 140°F (-40°C ~ 60°C)
Operating Humidity
0% ~ 90% relative humidity, non-condensing
Certification
CE/FCC Class A, RED, RoHS Compliant, REACH
Shock: MIL-STD-202G Method 213B, Table 213-I
Condition A
Vibration: IEC 60068-2-6: 1G, 5-500Hz, 3 axes
IEC 60068-2-64: Operating 5Grms, 5-500 Hz, 3 axes
Chapter 1 – Product Specifications 5
Maker Board System UP Element i12 Edge
1.2 Block Diagram
Maker Board System UP Element i12 Edge
Chapter 2
Chapter 2 – Hardware Information
Chapter 2 – Hardware Information 7
Maker Board System UP Element i12 Edge
2.1 Dimensions
Chapter 2 – Hardware Information 8
Maker Board System UP Element i12 Edge
2.2 I/O Location
/