NXP UM11930 User manual

Brand: NXP

Model: UM11930

Type: User manual

NXP UM11930 is a 14 V battery management system reference design that enables engineers to evaluate and develop battery management systems for electric vehicles. It supports up to 4 channels of pack voltage measurement, redundant current measurement, and temperature sensing for up to 10 channels. The UM11930 also features hardware short circuit protection and software overcurrent protection, making it a safe and reliable solution for battery management applications.

UM11930

RD33772C14VEVM 14 V battery management system

Rev. 1 — 25 September 2023 User manual

Document information

Information Content

Keywords 14VBMS, MC33772C, S32K344, FS26

Abstract The RD33772C14VEVM is a reference design for 14 V battery management systems in electric

vehicle applications. Targeting to meet ASIL C functional safety level requirements.

NXP Semiconductors UM11930

RD33772C14VEVM 14 V battery management system

Rev Date Description

1 20230925 initial version

Revision history

IMPORTANT NOTICE

For engineering development or evaluation purposes only

NXP provides the product under the following conditions:

This evaluation kit or reference design is for use of ENGINEERING DEVELOPMENT OR

EVALUATION PURPOSES ONLY.

It is provided as a sample IC pre-soldered to a printed circuit board to make it easier to access

inputs, outputs, and supply terminals. This evaluation kit or reference design may be used with any

development system or other source of I/O signals by connecting it to the host MCU or computer

board via off-the-shelf cables. Final device in an application will be heavily dependent on proper

printed circuit board layout and heat sinking design as well as attention to supply filtering, transient

suppression, and I/O signal quality.

The product provided may not be complete in terms of required design, marketing, and or

manufacturing related protective considerations, including product safety measures typically found

in the end device incorporating the product. Due to the open construction of the product, it is the

responsibility of the user to take all appropriate precautions for electric discharge. To minimize risks

associated with the customers’ applications, adequate design and operating safeguards must be

provided by the customer to minimize inherent or procedural hazards. For any safety concerns, contact

NXP sales and technical support services.

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1 Introduction

This document is the user guide for the RD33772C14VEVM reference design. This document is intended for

the engineers involved in the evaluation, design, implementation, and validation of a 14 V battery management

system (BMS) in a vehicle. The scope of this document is to provide the user with information to evaluate

the features of the 14 V BMS device. This document covers the hardware connection steps, software and

tools installation and environment configuration for the kit usage. The RD33772C14VEVM allows the user to

connect to a 14 V power supply for voltage sensing, current sensing, temperature sensing and the diagnostic of

contactor status.

2 Finding kit resources and information on the NXP website

The NXP analog product development boards provide an easy-to-use platform for evaluating NXP products.

The boards support a range of analog, mixed-signal, and power solutions. They incorporate monolithic

integrated circuits and system-in-package devices that use proven high-volume technology. NXP products offer

longer battery life, a smaller form factor, reduced component counts, lower cost, and improved performance in

powering state-of-the-art systems.

NXP Semiconductors provides online resources for this user manual and its supported devices on http://

www.nxp.com.

The information page for RD33772C14VEVM user manual is at http://www.nxp.com/RD33772C14VEVM. The

information page provides overview information, technical and functional specifications, ordering information,

documentation, and software. The Getting Started tab provides quick-reference information applicable to using

the RD33772C14VEVM user manual, including the downloadable assets.

2.1 Collaborate in the NXP community

The NXP community is for sharing ideas and tips, ask and answer technical questions, and receive input on just

about any embedded design topic. The NXP community is at http://community.nxp.com.

3 Getting ready

Working with the RD33772C14VEVM requires the kit contents, additional hardware, and a Windows PC

workstation with installed software.

3.1 Kit contents

•Evaluation board in an antistatic bag

•Several cables

•Quick start guide

3.2 Additional hardware

In addition to the kit contents, the following hardware is necessary or beneficial when working with this kit.

•Low-voltage power supply 5 V to 14 V with current limit set initially to 1.5 A

•Current load, 0 A to 500 A

•Controller area network (CAN) card and cable

•Multilink FX debugger cable

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3.3 Minimum system requirements

This reference design requires a Windows PC workstation. The kit requires the following to function properly

with the demo software:

•Windows 10, 8 or 7 compatible PC with a USB port

3.4 Software

Installing software is necessary to work with this reference design. All listed software is available on http://

www.nxp.com/RD33772C14VEVM.

•S32 design studio integrated development environment (IDE) for Arm

4 Getting to know the hardware

4.1 Kit overview

The RD33772C14VEVM is a hardware tool for evaluation and development. It is ideal for rapid prototyping of a

14 V BMS. This board can be used to evaluate the features of the MC33772C device.

4.2 Board features

•Power supply input from 9 V to 18 V

•Up to 10 channels temperature sensing

•Up to 4 channels pack voltage measurement

•Redundant current measurement

•External positive temperature coefficient (PTC) for self-heating function of lithium-ion battery

•Hardware short circuit protection and software (SW) overcurrent protection

•1 channel CAN and 1 channel local interconnect network (LIN) communication with vehicle control unit (VCU)

4.3 Board functions implemented

Functions Description

cell voltageVoltage measurement

up to 4 channels pack voltage

1 channel by MC33772CCurrent measurement

1 channel by MCU

3 channels for cell

1 channel for metal-oxide-semiconductor field-effect transistor (MOSFET)

1 channel for shunt resistor

1 channel for cell balancing

Temperature measurement

3 channels reserved

serial peripheral interface (SPI) (internal)

1 channel LIN (external)

Communication

1 channel CAN (external)

Table 1. Board functions

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RD33772C14VEVM 14 V battery management system

Functions Description

2 parallel MOSFETs

MOSFET diagnostic

Load path

pre-driver

PTC self-heating for battery cell

Table 1. Board functions...continued

4.4 Device features

This reference design features the following NXP products:

Device Description Features

MC33772C 6-channel Li-ion battery

cell controller IC

•5.0 V ≤ VPWR ≤ 30 V operation, 40 V transient

•3 to 6 cells management

•0.8 mV total cell voltage measurement error

•Isolated 2.0 Mbit/s differential communication or 4.0 Mbit/s SPI

•Addressable on initialization

•Synchronized cell voltage and current measurement with coulomb count

•Total stack voltage measurement

•Seven general-purpose input/output (GPIO) or temperature sensor inputs

•5.0 V reference supply output with 5 mA capability

•Automatic over/undervoltage and temperature detection routable to fault pin

•Integrated sleep mode over/undervoltage and temperature monitoring

•Onboard 300 mA passive cell balancing with diagnostics

•Hot plug capable

•Detection of internal and external faults, as open lines, shorts, and leakages

•Designed to support ISO 26262 up to automotive safety integrity level (ASIL) D

safety system

•Fully compatible with the MC33771 for a maximum of 14 cells

•Qualified in compliance with AEC-Q100

Table 2. Device features

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Device Description Features

S32K344 AEC-Q100

qualified 32-bit Arm

Cortex‑M7‑based

MCUs targeted for

general purpose

automotive and

high‑reliability industrial

applications

•Single, multiple, or lockstep Cortex-M7 cores, 120 MHz to 240 MHz + floating

point unit (FPU)

•512 kB to 8 MB flash with error correcting code (ECC)

•Firmware over-the-air (FOTA): A/B firmware swap with zero downtime and

roll‑back support; automatic address translation

•12-bit 1 Msps analog-to-digital converter (ADC), 16-bit enhanced modular

input/output system (eMIOS) timer with logic control unit for motor control

•Low-power Run and Standby modes, fast wake-up, clock, and power gating

•−40 °C to +125 °C AEC-Q100

•Minimum 15-year longevity

•Safety, security, and connectivity

•ISO 26262 up to ASIL B/D

•Fault collection and control unit

•Hardware and software watchdogs, clock/power/temperature monitors

•Safety documentation and SafeAssure community support

•Hardware security engine (HSE) security engine - AES-128/192/256, Rivest,

Shamir, and Adleman public key cryptosystem (RSA), ECC, secure boot, and key

storage; side channel protection; ISO 21434 intended

•Ethernet TSN/AVB (10/100 Mbit/s), I3C, controller area network flexible data rate

(CAN FD), flexible input/output (FlexIO) (SPI/IIC/IIS/SENT protocol), serial audio

interface (SAI), quadruple serial peripheral interface (QSPI)

FS26 safety system basis

chip (SBC) with low

power fit for ASIL D

•Input supply up to 40 V DC

•HV buck, adjustable step down DC-DC converter 3.2 V to 6.35 V (50 mV step),

1.5 A DC

•VCORE, adjustable step down DC-DC converter 0.8 V to 3.3 V (10 mV step),

800 mA to 1500 mA

•Boost controller 5.5 V to 17 V, external switch

•LDO1 and LDO2, configurable 3.3 V or 5.0 V, up to 300 mA DC output current

capability

•Voltage reference (VREF), accurate voltage reference 3.3 V or 5 V, 1 %, 30 mA

DC output current capability

•2 trackers, 10 mV offset, 125 mA DC output current capability

•32 bits SPI [including cyclic redundancy check (CRC)]

•Long duration timer (with dedicated part number)

•Third-generation fail-safe state machine with independent safety monitoring unit

•Target < 25 µA in Low-power mode in LPOFF and < 50 µA in Standby (MCU

powered)

•AMUX: battery, internal safety critical voltages, precise reference voltage and

temperature, GPIOs

•GPIO: wake-up or HS/LS driver

Table 2. Device features...continued

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Device Description Features

TJA1021 LIN2.1/Society

of Automotive

Engineers (SAE) J2602

transceiver

•LIN 2.1/SAE J2602 compliant

•Baud rate up to 20 kBd

•Very low electromagnetic emission (EME)

•High electromagnetic immunity (EMI)

•Passive behavior in unpowered state

•Input levels compatible with 3.3 V and 5 V devices

•Integrated termination resistor for LIN follower applications

•Wake-up source recognition (local or remote)

•K-line compatible

•Very low current consumption in Sleep mode with local and remote wake-up

•High electrostatic discharge (ESD) robustness: ±6 kV according to IEC 61000-4-2

for pins LIN, VBAT, and WAKE_N

•Transmit data (TXD) dominant time-out function

•Bus terminal and battery pin protected against transients in the automotive

environment (ISO 7637)

TJA1145 high speed CAN

transceiver

•ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant

•Data rates up to 5 Mbit/s in the CAN FD fast phase

•Autonomous bus biasing

•Fully compatible with the TJA1145, with improved electromagnetic compatibility

(EMC) performance

•±6 kV ESD protection, according to IEC TS 62228 on pins BAT and WAKE and on

the CAN bus pins

•CAN bus pins short-circuit proof to ±58 V

•Suitable for use in 12 V and 24 V systems

•AEC-Q100 qualified

Table 2. Device features...continued

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4.5 Block diagram

LDO1

S32K344

MCU

(ASIL D)

MC33772

(ASIL C)

I2C

RTC

LDO2

aaa- 051732

LIN

FAULT

TXD

RXD

ADC

FAULT

RESET

SPI1

ADC ADC

IRQ

ADCADC x 5

GND

µC GPIO*2

25 V

PowerMOS Drv x2

PowerMOS x2

TJA1021

(QM)

System

outline Optional PCB

outline

LDO1,

LDO2

VCORE

Vref

SPI2

Standby mon Wakeup

PowerMOS

Drv

FCCU

12 V (K30)

12 V (K15)

Fail safe out

Vehicle CAN

TX/RX TJA1145

(QM)

LDO2

µC NTC

IN OUT+

LSD

(QM) PTC

ADC

GPIO1

GPIO0

µC GPIO*2

µC GPIOx

25 V

VCCM

HW OC/SC

Comp

Gan

Vref

Filter

GPIO2/3/4

ISENSE+/-

GPIO5/6

Filter

Cell 2

Cell 3

Cell 4

Bat pack

6 to 16 V

PTC

12 V (K30)

NTC*3

Filter

Balance R

SWEL34

NTC *3

B-

B+

Filter

SHUNT

GND(K31)

VPWR

CT6

CB4

CB4:3

CT3

CB3

Cell 1

CT2

µC NTC

ADC

SENSE

Csense

LDO1

FailSafe

µC NTC *2

FS26

(ASIL D)

Pre-driver

(QM)

Figure 1. Block diagram

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4.6 Connectors

Figure 2 shows the location of connectors on the board. Table 3, Table 4, and Table 5 list the pinouts for J2, J5,

and J6.

Figure 2. Connectors

Pin Name Description

1 J2_1 VCC

2 J2_2 JTAG_SWDIO/TMS

3 J2_3 GND

4 J2_4 JTAG_SWDCLK/TCK

5 J2_5 GND

6 J2_6 JTAG_SWO/TDO

7 J2_7 KEY

8 J2_8 JTAG_NC/TDI

9 J2_9 GND_Detect

10 J2_10 JTAG_nRESET

Table 3. Joint Test Access Group (JTAG) connector (J2) description

Pin Name Description

1 J5_1 K30_12V_L

2 J5_2 K30_12V_L

3 J5_3 K30_12V_L

4 J5_4 CELL_4

5 J5_5 CELL_3

Table 4. J5 connector description

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Pin Name Description

6 J5_6 CELL_2

7 J5_7 CELL_1

8 J5_8 CELL_0

9 J5_9 GND_KL31_UP

10 J5_10 GND_KL31_UP

11 J5_11 GND_KL31_DOWN

12 J5_12 GND_KL31_DOWN

13 J5_13 BCC_NTCIN_1

14 J5_14 GND

15 J5_15 BCC_NTCIN_2

16 J5_16 GND

17 J5_17 BCC_NTCIN_3

18 J5_18 GND

19 J5_19 MCU_NTCIN_1

20 J5_20 GND

21 J5_21 MCU_NTCIN_2

22 J5_22 GND

23 J5_23 GND_KL31_DOWN

24 J5_24 GND_KL31_DOWN

Table 4. J5 connector description...continued

Pin Name Description

1 J6_1 KL15_WAKE

2 J6_2 LSD_OUT

3 J6_3 SBC_FS0B

4 J6_4 SBC_FS1B

5 J6_5 LIN

6 J6_6 GND

7 J6_7 CAN_H

8 J6_8 CAN_L

Table 5. J6 connector description

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5 Configuring the hardware

Figure 3. Hardware configuration and connection

The RD33772C14VEVM is used in a standalone configuration. There is no connector to add an expansion

board. All required cables are included in the kit.

•For power on the board, need an external 12 V DC power source supply B+ and B−

•Connect the low-voltage connector to J6, the CAN/local interconnect network (LIN) wire communicates with

PC with external CAN/LIN tool

•Connect battery simulation cable to J5 and source from 12 V DC

•Connect the debug tool to J2 for software purpose

6 References

[1] MC33772C product summary page http://www.nxp.com/MC33772C

[2] S32K344 product summary page http://nxp.com/s32k3

[3] FS26 product summary page http://nxp.com/fs26

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7 Legal information

7.1 Definitions

Draft — A draft status on a document indicates that the content is still

under internal review and subject to formal approval, which may result

in modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included in a draft version of a document and shall have no

liability for the consequences of use of such information.

7.2 Disclaimers

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not give

any representations or warranties, expressed or implied, as to the accuracy

or completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation -

lost profits, lost savings, business interruption, costs related to the removal

or replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability

towards customer for the products described herein shall be limited in

accordance with the Terms and conditions of commercial sale of NXP

Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their

applications and products using NXP Semiconductors products, and NXP

Semiconductors accepts no liability for any assistance with applications or

customer product design. It is customer’s sole responsibility to determine

whether the NXP Semiconductors product is suitable and fit for the

customer’s applications and products planned, as well as for the planned

application and use of customer’s third party customer(s). Customers should

provide appropriate design and operating safeguards to minimize the risks

associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default

in the customer’s applications or products, or the application or use by

customer’s third party customer(s). Customer is responsible for doing all

necessary testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications

and the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Evaluation products — This product is provided on an “as is” and “with all

faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates

and their suppliers expressly disclaim all warranties, whether express,

implied or statutory, including but not limited to the implied warranties of non-

infringement, merchantability and fitness for a particular purpose. The entire

risk as to the quality, or arising out of the use or performance, of this product

remains with customer.

In no event shall NXP Semiconductors, its affiliates or their suppliers

be liable to customer for any special, indirect, consequential, punitive

or incidental damages (including without limitation damages for loss of

business, business interruption, loss of use, loss of data or information, and

the like) arising out the use of or inability to use the product, whether or not

based on tort (including negligence), strict liability, breach of contract, breach

of warranty or any other theory, even if advised of the possibility of such

damages.

Notwithstanding any damages that customer might incur for any reason

whatsoever (including without limitation, all damages referenced above and

all direct or general damages), the entire liability of NXP Semiconductors,

its affiliates and their suppliers and customer’s exclusive remedy for all of

the foregoing shall be limited to actual damages incurred by customer based

on reasonable reliance up to the greater of the amount actually paid by

customer for the product or five dollars (US$5.00). The foregoing limitations,

exclusions and disclaimers shall apply to the maximum extent permitted by

applicable law, even if any remedy fails of its essential purpose.

Translations — A non-English (translated) version of a document, including

the legal information in that document, is for reference only. The English

version shall prevail in case of any discrepancy between the translated and

English versions.

Security — Customer understands that all NXP products may be subject to

unidentified vulnerabilities or may support established security standards or

specifications with known limitations. Customer is responsible for the design

and operation of its applications and products throughout their lifecycles

to reduce the effect of these vulnerabilities on customer’s applications

and products. Customer’s responsibility also extends to other open and/or

proprietary technologies supported by NXP products for use in customer’s

applications. NXP accepts no liability for any vulnerability. Customer should

regularly check security updates from NXP and follow up appropriately.

Customer shall select products with security features that best meet rules,

regulations, and standards of the intended application and make the

ultimate design decisions regarding its products and is solely responsible

for compliance with all legal, regulatory, and security related requirements

concerning its products, regardless of any information or support that may be

provided by NXP.

NXP has a Product Security Incident Response Team (PSIRT) (reachable

at [email protected]) that manages the investigation, reporting, and solution

release to security vulnerabilities of NXP products.

Suitability for use in automotive applications (functional safety) —

This NXP product has been qualified for use in automotive applications.

It has been developed in accordance with ISO 26262, and has been

ASIL classified accordingly. If this product is used by customer in the

development of, or for incorporation into, products or services (a) used in

safety critical applications or (b) in which failure could lead to death, personal

injury, or severe physical or environmental damage (such products and

services hereinafter referred to as “Critical Applications”), then customer

makes the ultimate design decisions regarding its products and is solely

responsible for compliance with all legal, regulatory, safety, and security

related requirements concerning its products, regardless of any information

or support that may be provided by NXP. As such, customer assumes all

risk related to use of any products in Critical Applications and NXP and

its suppliers shall not be liable for any such use by customer. Accordingly,

customer will indemnify and hold NXP harmless from any claims, liabilities,

damages and associated costs and expenses (including attorneys’ fees)

that NXP may incur related to customer’s incorporation of any product in a

Critical Application.

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NXP Semiconductors UM11930

RD33772C14VEVM 14 V battery management system

NXP B.V. — NXP B.V. is not an operating company and it does not distribute

or sell products.

7.3 Trademarks

Notice: All referenced brands, product names, service names, and

trademarks are the property of their respective owners.

NXP — wordmark and logo are trademarks of NXP B.V.

AMBA, Arm, Arm7, Arm7TDMI, Arm9, Arm11, Artisan, big.LITTLE,

Cordio, CoreLink, CoreSight, Cortex, DesignStart, DynamIQ, Jazelle,

Keil, Mali, Mbed, Mbed Enabled, NEON, POP, RealView, SecurCore,

Socrates, Thumb, TrustZone, ULINK, ULINK2, ULINK-ME, ULINK-

PLUS, ULINKpro, μVision, Versatile — are trademarks and/or registered

trademarks of Arm Limited (or its subsidiaries or affiliates) in the US and/or

elsewhere. The related technology may be protected by any or all of patents,

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NXP Semiconductors UM11930

RD33772C14VEVM 14 V battery management system

Contents

1 Introduction ......................................................... 3

2 Finding kit resources and information on

the NXP website ..................................................3

2.1 Collaborate in the NXP community ....................3

3 Getting ready .......................................................3

3.1 Kit contents ........................................................3

3.2 Additional hardware ...........................................3

3.3 Minimum system requirements ..........................4

3.4 Software .............................................................4

4 Getting to know the hardware ........................... 4

4.1 Kit overview ....................................................... 4

4.2 Board features ................................................... 4

4.3 Board functions implemented ............................ 4

4.4 Device features ..................................................5

4.5 Block diagram ....................................................8

4.6 Connectors .........................................................9

5 Configuring the hardware ................................ 11

6 References ......................................................... 11

7 Legal information .............................................. 12

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

Date of release: 25 September 2023

Document identifier: UM11930

NXP UM11930 User manual

NXP UM11930 User manual

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