Eurotech CPU-161-18 Owner's manual

CPU-161-18

Xeon D COMe CPU Module

USER MANUAL

First edition – June 2017 – B35071E0-MN002-00_UserMan_En_1

Preface

Thank you for choosing the CPU-161-18. Please read this manual before using the CPU-161-18 so that you may

obtain the greatest benefit from using the device.

This manual presents the specifications, functions, and method of use of the CPU-161-18.

Eurotech has made every effort to carefully inspect each product and has taken great care to package and to

ship the product. In the unlikely event of the product’s failure to operate normally due to problems in shipping or

otherwise, the company will repair or replace the product at its own responsibility.

If you have any questions, contact your local Eurotech Sales Office.

Trademarks

All trademarks both marked and unmarked appearing in this document are the property of their respective owners.

This document does not give permission to the implementation of patents or other rights held by Eurotech or third

parties.

Revision history

Revision

Description

Date

1

First release

30 June 2017

CPU-161-18 USER MANUAL  Table of contents  
 

B35071E0-MN002-00_UserMan_En_1 
Table of contents 
Preface ........................................................................................................................................................................ 2 
Trademarks .................................................................................................................................................................. 2 
Revision history ........................................................................................................................................................... 2 
Table of contents .......................................................................................................................................................... 3 
Important User Information ...................................................................................................................................... 5 
1 Safety Notices and Warnings ................................................................................................................................ 5 
2 Life Support Policy ................................................................................................................................................. 7 
3 Warranty ................................................................................................................................................................ 7 
4 RoHS ..................................................................................................................................................................... 7 
5 Technical Assistance ............................................................................................................................................. 7 
6 Conventions ........................................................................................................................................................... 7 
7 Electromagnetic Compatibility ............................................................................................................................... 7 
Overview .................................................................................................................................................................... 9 
Basic Specifications ............................................................................................................................................... 10 
Block Diagram ......................................................................................................................................................... 11 
Board Outline/Schematic Layout .......................................................................................................................... 12 
Processor ................................................................................................................................................................. 13 
1. Processor ............................................................................................................................................................ 13 
2. Cache Memories ................................................................................................................................................ 13 
Memory ..................................................................................................................................................................... 14 
1. Main Memory ...................................................................................................................................................... 14 
2. Boot ROM ........................................................................................................................................................... 14 
3. General Purpose ROM ....................................................................................................................................... 14 
4. EEPROM ............................................................................................................................................................ 14 
COM Express ........................................................................................................................................................... 15 
1. PCI Express (PEG) ............................................................................................................................................. 15 
2. PCI Express ........................................................................................................................................................ 16 
3. LAN ..................................................................................................................................................................... 16 
4. SATA .................................................................................................................................................................. 16 
5. USB3.0 ............................................................................................................................................................... 16 
6. USB2.0 ............................................................................................................................................................... 16 
7. UART .................................................................................................................................................................. 17 
8. LPC ..................................................................................................................................................................... 17 
9. SPI ...................................................................................................................................................................... 17 
10. SMBus (System Management Bus) ................................................................................................................. 17 
11. I
2
C Bus .............................................................................................................................................................. 17 
12. GPIO ................................................................................................................................................................. 17 
12.1.  GPI .......................................................................................................................................................... 17 
12.2.  GPO ........................................................................................................................................................ 18 
13. External BIOS ROM Support ............................................................................................................................ 18 
14. Reset ................................................................................................................................................................ 18 
15. Battery Low Alarm ............................................................................................................................................ 18 
16. Power Button .................................................................................................................................................... 18 

 Table of contents  CPU-161-18 USER MANUAL 
 

B35071E0-MN002-00_UserMan_En_1 
17. Power Good ...................................................................................................................................................... 18 
18. Speaker ............................................................................................................................................................ 18 
FPGA ........................................................................................................................................................................ 19 
1. GPIO Signals between FPGA and MCU ............................................................................................................ 19 
2. LPC Bus Controller ............................................................................................................................................. 19 
3. Address Map....................................................................................................................................................... 20 
3.1.  I
2
C Controller ............................................................................................................................................. 20 
3.2.  LED Control Register ................................................................................................................................ 21 
3.3.  WDT Control Register ............................................................................................................................... 21 
VOLTAGE MONITORING SOFTWARE SPECIFICATIONS ................................................................................................ 23 
1. Description of Operation ................................................................................................................................... 23 
1.1.  Voltage Monitoring Operation ................................................................................................................. 23 
1.2.  Notifying the Bit Error of FPGA Configuration Memory .......................................................................... 23 
2. Address ............................................................................................................................................................. 24 
2.1.  Address List ............................................................................................................................................ 24 
2.2.  Detailed Description of Bit ....................................................................................................................... 25 
Connector and Jumper/LED................................................................................................................................. 32 
1. CPU Module Onboard Component .................................................................................................................. 32 
1.1.  LED1 (General Purpose Status LED) ..................................................................................................... 33 
2. Setting ............................................................................................................................................................... 33 
2.1.  JP2 (CMOS_CLR Setting Pin) ................................................................................................................ 33 
Pin Layout .............................................................................................................................................................. 34 
1. CN1 (COM Express Stacking Connector) ........................................................................................................ 34 
2. CN7 (Multi ISP Connector) ............................................................................................................................... 36 
Address Map .......................................................................................................................................................... 37 
1. IO Space ........................................................................................................................................................... 37 
2. Memory Space ................................................................................................................................................. 38 
3. PCI devices....................................................................................................................................................... 39 
4. SMBus Address Map ........................................................................................................................................ 39 
5. I
2
C Address Map ............................................................................................................................................... 39 
BIOS ........................................................................................................................................................................ 40 
1. Displayed Contents of BIOS Setup Menu ........................................................................................................ 40 
1.1.  BIOS Setup Menu ................................................................................................................................... 41 
1.2.  EDKII Menu ............................................................................................................................................. 42 
1.3.  Boot Manager Menu................................................................................................................................ 72 
1.4.  Boot Maintenance Manager .................................................................................................................... 72 
2. Recording Method For an error Detected During POST .................................................................................. 75 
Heat Sink ................................................................................................................................................................ 77 
Notes ............................................................................................................................................................................ 79 
 
 

CPU-161-18 USER MANUAL Important User Information

5

B35071E0-MN002-00_UserMan_En_1

1. Important User Information

In order to lower the risk of personal injury, electric shock, fire, or equipment damage, users must observe the

following precautions as well as good technical judgment, whenever this product is installed or used.

All reasonable efforts have been made to ensure the accuracy of this document; however, Eurotech assumes

no liability resulting from any error/omission in this document or from the use of the information contained herein.

Eurotech reserves the right to revise this document and to change its contents at any time without obligation to

notify any person of such revision or changes. Reproduction of all or part of this document without Eurotech’s

permission is prohibited.

1.1 Safety Notices and Warnings

The following general safety precautions must be observed during all phases of operation, service, and repair of

this equipment. Failure to comply with these precautions or with specific warnings elsewhere in this manual

violates safety standards of design, manufacture, and intended use of the equipment. Eurotech assumes no

liability for the customer’s failure to comply with these requirements.

The safety precautions listed below represent warnings of certain dangers of which Eurotech is aware. You, as

the user of the product, should follow these warnings and all other safety precautions necessary for the safe

operation of the equipment in your operating environment.

Alerts that can be found throughout this manual

The following alerts are used within this manual and indicate potentially dangerous situations.

Danger, electrical shock hazard:

Information regarding potential electrical shock hazards:

Personal injury or death could occur. Also damage to the system, connected peripheral

devices, or software could occur if the warnings are not carefully followed.

Appropriate safety precautions should always be used, these should meet the

requirements set out for the environment that the equipment will be deployed in.

Warning:

Information regarding potential hazards:

Personal injury or death could occur. Also damage to the system, connected peripheral

devices, or software could occur if the warnings are not carefully followed.

Appropriate safety precautions should always be used, these should meet the

requirements set out for the environment that the equipment will be deployed in.

Information and/or Notes:

These will highlight important features or instructions that should be observed.

Protect the device from vibration and impact

Do not place the product in a location where it can fall or can be subject to vibration or impact because this may

cause device failure.

Do not modify the device

For safety reasons, under no circumstances should you modify the device. Eurotech will not repair products

that have been modified.

Important User Information CPU-161-18 USER MANUAL

6

B35071E0-MN002-00_UserMan_En_1

Protect the product from water and chemicals

Contact between the product and water or chemicals can result in product failure, electrocution, or fire.

Protect the product from foreign material

Make sure that foreign material does not get into the product during use, storage, or transport because this can

result in product failure.

Use precautions in handling to ensure that you are not injured

The sharp projections on this product may cause injury. Take care in handling this product in order to avoid

injury.

Do not disassemble the product

In order to maintain guaranteed product performance, do not disassemble this product under any circumstances.

Keep the product away from radios and TVs

Do not use the product near radios, television sets, or other devices generating strong magnetic or electrical

fields. This could result in failure or malfunction.

Keep the product away from flame, humidity, and direct sunlight

Do not use or store the product in any of the following locations, as this could result in product failure:

 Places where there is fire

 Locations high in humidity or exposed to rain

 Locations exposed to direct sunlight

 Dusty or dirty locations

 Locations containing excessive water or chemical vapors

Install the product in well-ventilated locations

Install the product in well-ventilated locations to efficiently disperse heat generated by the product.

Remove the power plug from the receptacle when not using the product

Turn off the main switch and remove the power plug from the receptacle when not using the product or when

there is the risk of lightning strike.

Use the device within rated parameters

Be sure to use the product within the ratings specified in this manual. Failure to do so may result in malfunction.

Use care when cleaning the product

If the product becomes dirty, wipe it with a dry soft cloth. A thinned neutral cleaner may be used if the product is

particularly dirty. Do not use benzene, thinners, or other solvents under any circumstances.

Ground the product in order to prevent electrocution

Be sure to ground the product by connecting it to a 3-pole AC receptacle or by using an AC receptacle having a

grounding terminal.

Dispose of the product properly

Use appropriate methods for handling industrial wastes when disposing of this product.

Wire the product correctly

Failure to wire the product correctly can result in malfunction or fire. Read this manual and wire the product

correctly.

CPU-161-18 USER MANUAL Important User Information

7

B35071E0-MN002-00_UserMan_En_1

Use antistatic precautions

This product comprises electronic parts that are highly susceptible to static electricity. Static electricity can

cause the product to malfunction. Take care not to touch any of the terminals, connectors, ICs, or other parts

with the hands.

Do not use a malfunctioning product

Stop using the product if you believe it is malfunctioning. Continuing to use a malfunctioning product can cause

the malfunction to spread to other products and can cause short circuits or fire.

1.2 Life Support Policy

Eurotech products are not authorized for use as critical components in life support devices or systems without

the express written approval of Eurotech.

1.3 Warranty

For warranty terms and conditions users should contact their local Eurotech Sales Office.

Refer to the back covers of this manual for full contact details.

1.4 RoHS

This device, including all its components, subassemblies and the consumable materials that are an integral part

of the product, has been manufactured in compliance with the European directive 2011/65/EU known as the

RoHS directive (Restrictions on the use of certain Hazardous Substances). This directive targets the reduction

of certain hazardous substances previously used in electrical and electronic equipment (EEE).

1.5 Technical Assistance

If you have any technical questions, cannot isolate a problem with your device, or have any enquiry about repair

and returns policies, contact your local Eurotech Technical Support Team.

See the back cover for full contact details.

Transportation

When transporting any module or system, for any reason, it should be packed using anti-static material and

placed in a sturdy box with enough packing material to adequately cushion it.

Warning:

Any product returned to Eurotech that is damaged due to inappropriate packaging will not be covered by the

warranty.

1.6 Conventions

The following table describes the conventions for signal names used in this document.

1.7 Electromagnetic Compatibility

This product is intended for industrial assembly only and is not for commercial use. Therefore, this product is not

an apparatus and so does not need to be subject to the EMC Directive.

Convention

Explanation

GND

Digital ground plane

#

Active low signal

+

Positive signal in differential pair

-

Negative signal in differential pair

NC

No connection

RSVD

Use is reserved to Eurotech

CPU-161-18 USER MANUAL Overview

9

B35071E0-MN002-00_UserMan_En_1

2. Overview

CPU-161-18 is a compact module sized COM Express CPU Module, which is equipped with the Intel Xeon

Processor D-1500 family or the Intel Pentium Processor D-1500 family.

Basic Specifications CPU-161-18 USER MANUAL

10

B35071E0-MN002-00_UserMan_En_1

3. Basic Specifications

Table 1 describes the specification list of this product.

CPU-161-18 specification list

Item

Details

CPU

Model

Pentium

D1519

Xeon

D-1529

Xeon

D-1539

Xeon

D-1559

Xeon

D-1527

# of cores

4

8

12

4

TDP

25W

20W

35W

45W

35W

Base frequency

1.5GHz

1.3GHz

1.6GHz

1.5GHz

2.2GHz

Max Turbo

Frequency

2.1GHz

n/a

2.2GHz

2.1GHz

2.7GHz

L1 cache

32kB for data, 32kB for instruction (per core)

L2 cache

256kB for data and instruction (per core)

L3 cache

1.5MB (per core)

Memory

Main Memory

2133MT/s

1600MT/s

2133MT/s

Memory down: DDR4 SDRAM, ECC supported, up to 8GB

DDR4 SO-DIMM socket x1, up to16GB

Boot ROM

SPI-FLASH 16MB

General Purpose

ROM

SPI-FLASH 32MB

EEPROM

64kb

COM Express

SMBus

1 port

I

2

C

1 port

UART

2 ports

LAN(GbE)

1 port

USB 2.0

7 ports

USB 3.0

4 ports

n/a

4 ports

GPIO

GPI：4 bits / GPO：4 bits (GPI1 can be used as a NMI)

PCI Express Gen3

16 lanes

n/a

16 lanes

PCI Express Gen2

8 lanes

16 lanes

8 lanes

LPC

1 port

Serial-ATA 6Gb

4 ports

2 ports

4 ports

SPI

1 port

Other

Following features are supported.

Reset

Thermal Protection

Power button

Power Good

Speaker

Power source

Specification

Power supply

VCC_12V±5%

VCC_5V_SBY±5%

VCC_RTC(2.0~3.3V)

*supplied from the COM Express connector

Current consumption

VCC_12V : Typ 3.89 A (with TDP45W Model)

VCC_5V_SBY : Typ 0.388 A

VCC_RTC (Power OFF) : Typ 2.6 uA

(Power ON) : Typ 0.1 uA

Mechanical

Specification

Standard

PICMG COM.0 COM Express Module base Spec R2.1

Pin-out type

Type6

Form factor

95mm x 95mm (Compact module size)

Weight

110g (excluding the SO-DIMM)

CPU-161-18 USER MANUAL Block Diagram

11

B35071E0-MN002-00_UserMan_En_1

4. Block Diagram

Figure 1 illustrates the block diagram of this product.

Figure 1. Block diagram

PEG

Intel Xeon D

1539

PCIe

SATA

USB3.0

PCIe

LPC

DDR4 2133

SDRAM with ECC

MAX 8GB

DDR4 SO-DIMM

with ECC

MAX 16GB

FPGA

Ethernet

CTRL

SPI

FLASH

(BIOS)

X16

X4

Gen3

Gen2

COM Express

Connector

(Type 6)

PCIe

SATA

USB3.0

LAN(GbE)

I

2

C

LPC

SPI

72

USB2.0

4

PCIe

CPU

PCH

X4

Gen3

X3

USB HUB

USB2.0

X4

USB2.0

X4

UART

X2

5V BUF

X2

8

GPIO(NMI)

GPIO

MCU

SMBUS

MUX

FLASH

(General

Purpose)

PowerSW

RST

PWROK,THERM#

WDT

R

EEP

ROM

Board Outline/Schematic Layout CPU-161-18 USER MANUAL

12

B35071E0-MN002-00_UserMan_En_1

5. Board Outline/Schematic Layout

Figures 2 and 3 illustrate the board outline/schematic layout of the product.

Figure 2. Component side layout

Figure 3. Solder side layout (Top view)

95

15 76 4

4

87

4

4 37 50 4

95

CN1

CN6

JP2

U1

LED1

CN7

CPU-161-18 USER MANUAL Processor

13

B35071E0-MN002-00_UserMan_En_1

6. Processor

6.1. Processor

The following processors can be mounted on this product.

Processor

CPU Model

Number of cores

Core frequency

(base)

Memory

frequency

TDP

D-1519

4

1.5GHz

DDR4-2133

25W

D-1529

4

1.3GHz

DDR4-1600

20W

D-1539

8

1.6GHz

DDR4-2133

35W

D-1559

12

1.5GHz

DDR4-2133

45W

D-1527

4

2.2GHz

DDR4-2133

35W

6.2. Cache Memories

The processor contains the following cache memories.

- L1 Cache

32 kB for data, and 32 kB for instruction (for each core)

- L2 Cache

256 kB shared for data and instruction (for each core)

- L3 Cache

1.5MB (for each core)

Memory CPU-161-18 USER MANUAL

14

B35071E0-MN002-00_UserMan_En_1

7. Memory

The memories in the CPU module are listed as follows.

7.1. Main Memory

The main memory is composed of an on-board DDR4-2133 SDRAM and a DDR4 SO-DIMM socket. The

maximum main memory is 24 GB (max. 8 GB of onboard memory + max. 16 GB of SO-DIMM).

This corresponds to ECC, which can correct a 1 bit error automatically.

7.2. Boot ROM

The BIOS is stored in the SPI-FLASH memory on CPU-161-18. This memory is 16 MB.

CPU-161-18 can also be configured to boot from a BIOS in an SPI-FLASH on the career board.

7.3. General Purpose ROM

There is another SPI-FLASH memory on CPU-161-18. This SPI-FLASH memory can be used as a general-

purpose ROM. This memory is 32 MB.

7.4. EEPROM

An EEPROM is mounted as a storage memory to store an error log of BIOS. The memory is 64 kbit.

CPU-161-18 USER MANUAL COM Express

15

B35071E0-MN002-00_UserMan_En_1

8. COM Express

The CPU module uses the COM Express Type 6 pin-out. This chapter describes each interface.

8.1. PCI Express (PEG)

This interface conforms to the standard of Gen3 (maximum transfer rate: 8GT/s). (*1)

It is composed of 16 lanes.

Table 3 shows the PCI Express (PEG) link configuration. The configuration can be changed from the BIOS

configuration screen.

PCI Express (PEG) Link configuration

COM Express

pin name

PCI Express

lane #

Configuration1

Configuration2

Configuration3

(Default)

PEG15

15

X 4

X 8

X 16

PEG14

14

PEG13

13

PEG12

12

PEG11

11

X 4

PEG10

10

PEG9

9

PEG8

8

PEG7

7

X 4

X 8

PEG6

6

PEG5

5

PEG4

4

PEG3

3

X 4

PEG2

2

PEG1

1

PEG0

0

*1 Xeon D-1529 supports up to 5 GT/s.

COM Express CPU-161-18 USER MANUAL

16

B35071E0-MN002-00_UserMan_En_1

8.2. PCI Express

This interface conforms to the standard of Gen2 (maximum transfer rate: 5 GT/s).

It is composed of 8 lanes.

Table 4 and 5 show the PCI Express link configuration. Changing this configuration requires to modify BIOS

image at low level. Please ask our sales team.

* Xeon D-1529 does not support this interface.

PCI Express Link configuration

COM Express

pin name

PCI Express

lane #

Configuration1

Configuration2

Configuration3

Configuration4

(Default)

PCIE7

7

X 1

X 2

X 4

PCIE6

6

X 1

PCIE5

5

X 1

X 2

PCIE4

4

X 1

PCI Express Link configuration

COM Express

pin name

PCI Express

lane #

Configuration1

(Default)

Configuration2

Configuration3

Configuration4

PCIE3

3

X 1

X 2

X 4

PCIE2

2

X 1

PCIE1

1

X 1

X 2

PCIE0

0

X 1

8.3. LAN

This interface conforms to the standard of 10/100/1000BASE-T.

It is composed of 1 ports.

The Ethernet controller is composed of WG210 of Intel Corporation.

8.4. SATA

This interface conforms to the standard of SATA-600 (maximum transfer rate: 6Gb/s), SATA-300 (maximum

transfer rate: 3Gb/s), and SATA-150 (maximum transfer rate: 1.5Gb/s).

It is composed of 4 ports.

8.5. USB3.0

This interface conforms to the standard of USB3.0 (maximum transfer rate: 5Gb/s).

It is composed of 4 ports.

8.6. USB2.0

This interface conforms to the standard of USB2.0 (maximum transfer rate: 480Mb/s).

It is composed of 7 ports.

CPU-161-18 USER MANUAL COM Express

17

B35071E0-MN002-00_UserMan_En_1

8.7. UART

This interface is composed of 2 ports.

They support up to 115,200 bps.

Though the signal level of this interface is 5 V according to COMe R2.1, 3.3 V signal version is also available.

Please ask our sales team.

8.8. LPC

This interface conforms to the standard of LPC 1.1.

8.9. SPI

This interface is composed of 1 ports.

The BIOS boot can be performed from ROM connected to this port.

8.10. SMBus (System Management Bus)

This interface is composed of 1 ports.

Each signal of SMBus is pulled up to 3.3 V on the CPU module.

8.11. I

2

C Bus

This interface is composed of 1 ports.

Each signal of I

2

C Bus is pulled up to 3.3 V on the CPU module.

The I

2

C bus controller is built in FPGA and accessed via the LPC bus.

8.12. GPIO

8.12.1. GPI

The CPU module supports four general purpose input signals (GPI).

Each GPI signal is connected to the GPIO pin of the processor. Table 6 shows the assignment of the GPI signals.

Moreover, GPI1 can be used as an NMI input.

GPI

COM Express pin name

Pin name of CPU

GPI0

GPIO35

GPI1

GPIO2

GPI2

GPIO3

GPI3

GPIO4

COM Express CPU-161-18 USER MANUAL

18

B35071E0-MN002-00_UserMan_En_1

8.12.2. GPO

The CPU module supports four general purpose output signals (GPO).

Each GPO signal is connected to the GPIO pin of the processor. Table 7 shows the assignment of the GPO

signals.

GPO

COM Express pin name

Pin name of CPU

GPO0

GPIO42

GPO1

GPIO9

GPO2

GPIO15

GPO3

GPIO7

8.13. External BIOS ROM Support

The CPU module supports the BIOS_DIS# [1-0] signal, and the BIOS boot destination can be selected. The

destination can be selected as shown in Table 8 below by processing the BIOS_DIS#[1-0] signals on a carrier

board.

BIOS source settings by BIOS_DIS#[1-0]

BIOS_DIS#[1-0]

BIOS(CS0) Boot Option

11b

SPI-FLASH on CPU-161-18 (Default)

10b

Reserved

01b

SPI-FLASH on a carrier board

00b

SPI-FLASH on CPU-161-18

8.14. Reset

The CPU module supports a SYS_RESET # signal and a CB_RESET # signal.

The CB_RESET # signal is a reset output signal to a carrier board. This reset signal can be used to reset a

device on the carrier board.

The SYS_RESET # signal is a reset button input signal from the carrier board.

8.15. Battery Low Alarm

The CPU module supports a BATLOW # signal.

The BATLOW # signal is an input signal from the carrier board.

8.16. Power Button

The CPU module supports a PWRBTN # signal.

The PWRBTN # signal is an input signal from the carrier board.

8.17. Power Good

The CPU module supports a PWR_OK signal.

The PWR_OK signal is an input signal from a carrier board.

The CPU module checks the assertion of a PWR_OK signal and then turns on the power to onboard devices.

8.18. Speaker

The CPU module supports a SPKR signal of the speaker output.

CPU-161-18 USER MANUAL FPGA

19

B35071E0-MN002-00_UserMan_En_1

9. FPGA

This chapter describes specifications on FPGA of the CPU module. FPGA is MachXO2 family of Lattice.

FPGA provides the following functions.

1) Control of power supply sequence and reset

2) I

2

C bus controller

(*1)

3) WDT function

4) LED control

5) LPC bus controller

*1 The I

2

C bus controller accesses via LPC.

9.1. GPIO Signals between FPGA and MCU

8 GPIO signals are communicated between FPGA and MCU. Table 9 lists signal names for each GPIO signal

and the usage in CPU-161-18.

GPIO signals between FPGA and MCU

Signal name

How to use

Input/output

C8051_GPIO40

(Blank)

Input

C8051_GPIO41

(Blank)

Input

C8051_GPIO42

(Blank)

Input

C8051_GPIO43

MCU_RST_OUT-

Input

C8051_GPIO44

SYS_PWROK

Output

C8051_GPIO45

(Blank)

Input

C8051_GPIO46

(Blank)

Output

C8051_GPIO47

SEDERR

Output

9.2. LPC Bus Controller

FPGA is equipped with the LPC bus controller, which responds to the reading and writing requests from CPU.

FPGA does not request for reading or writing to CPU. Table 10 shows specifications of the LPC bus controller.

Specification of LPC bus controller

Item

Details

Bus clock

33 MHz

Bus width

4 bit width

Used space

I/O space: 280h – 28Fh (16Byte)

Standard

Intel Low Pin Count (LPC) Interface Specification Rev 1.1

Cycle type

I/O Read

I/O Write

SERIRQ

Not used

LPC_DRQ[0: 1]#

Not used

FPGA CPU-161-18 USER MANUAL

20

B35071E0-MN002-00_UserMan_En_1

9.3. Address Map

FPGA uses the addresses of 0x280 – 0x28F in the I/O field. CPU accesses FPGA via the LPC bus. Table 11

describes the register map to FPGA. All registers are configured with an 8 bit width.

FPGA register map

Address

Register name

Use

R/W

0x280

I2C_1_CR

I

2

C controller

R/W

0x281

I2C_1_CMDR

R/W

0x282

I2C_1_BR0

R/W

0x283

I2C_1_BR1

R/W

0x284

I2C_1_TXDR

WO

0x285

I2C_1_SR

RO

0x286

I2C_1_GCDR

RO

0x287

I2C_1_RXDR

RO

0x288

Reserved

－

0x289

Reserved

0x28A

LED_CTL

Control of LED 1

WO

0x28B

WDT_CLR

WDT controller

WO

0x28C

WDT_CTL

R/W

0x28D

Reserved

－

0x28E

Reserved

0x28F

Reserved

9.3.1. I

2

C Controller

The I

2

C controller is the hard IP of Lattice.

The addresses of 0x40 – 0x47 of I

2

C Registers in Table 3 described in Page 9 of the Reference Guide (*1) are

mapped to the addresses of 0x280 – 0x287 in the I/O field of CPU. Table 12 shows the register map of the I

2

C

controller. For the I

2

C access, refer to Figure 6. I

2

C Master Read/Write Example (via WISHBONE) in Page 15 of

the Reference Guide.

I

2

C controller register map

Address

Register name

Register function

R/W

0x280

I2C_1_CR

Control Resistor

R/W

0x281

I2C_1_CMDR

Command Resistor

R/W

0x282

I2C_1_BR0

Clock Pre-scale Resistor

R/W

0x283

I2C_1_BR1

Clock Pre-scale Resistor

R/W

0x284

I2C_1_TXDR

Transmit Resistor

WO

0x285

I2C_1_SR

Status Resistor

RO

0x286

I2C_1_GCDR

General Call Resistor

RO

0x287

I2C_1_RXDR

Receive Data Resistor

RO

0x288

Reserved

－

0x289

Reserved

*1 Using User Flash Memory and Hardened Control Functions in MachXO2 Devices Reference Guide Document number: TN1246 ,

Rev2.3

http: //www.latticesemi.com/view_document?document_id=46300

Page is loading ...

Eurotech CPU-161-18 Owner's manual

Eurotech CPU-161-18 Owner's manual

Related papers

Other documents