© 2018 NXP B.V.
FRDM-KW36 Minimum BoM Development
Board User’s Guide
1. Introduction
This guide describes the hardware of KW36 Minimum Bill
of Material development board (reference X-UBluetooth
LEKWZ0-31417). The board is configurable, low-power,
and cost-effective. It is an evaluation and development
board for application prototyping and demonstration of the
KW36A/35A and KW36Z/35Z family of devices.
The KW36 is an ultra-low-power, highly integrated single-
chip device that enables Bluetooth® Low Energy
(Bluetooth LE) or Generic FSK (at 250, 500 and 1000
kbps) for portable, extremely low-power embedded
systems.
The KW36 integrates a radio transceiver operating in
2.36 GHz to 2.48 GHz range supporting a range of GFSK,
an Arm® Cortex®-M0+ CPU, up to 512 KB Flash and up
to 64 KB SRAM. Bluetooth LE Link Layer hardware and
peripherals optimized to meet the requirements of the target
applications.
KW36 device is also available on the FRDM-KW36
Freedom Development Board. For more information about
the FRDM-KW36 Freedom Development Board, see the
1. Introduction ....................................................................... 1
2 Overview and description .................................................. 2
2.1 Overview .................................................................2
2.2 Feature description ..................................................3
3 Functional description........................................................ 5
3.1 Block diagram .........................................................5
3.2 Generic application schematic .................................6
3.3 RF Circuit ................................................................9
3.4 Clocks ......................................................................9
3.5 Power management ................................................ 10
3.6 User Application LEDs .......................................... 15
4 I/O .................................................................................... 16
4.1 I/O pin accessibility ............................................... 16
5 Schematic......................................................................... 18
6 Layout .............................................................................. 19
7 PCB ................................................................................. 20
8 Mounted PCB .................................................................. 20
9 Component positioning .................................................... 21
10 Bill of material ................................................................. 23
Buck mode ............................................................. 23
Bypass mode .......................................................... 25
11 References ....................................................................... 27
12 Revision history ............................................................... 27