Leica Microsystems EM TIC 3X
Leica Microsystems EM TIC 3X is excellent for preparing biological, medical, and industrial samples to investigate the samples under Electron and Light Microscopes. Perfect sample preparation is a prerequisite for perfect microscopy.
This system is an ion beam slope cutter for cross-sectioning and lamella preparation. Highest precision and very thin cross-sections as well as lamellae can be prepared with the Leica EM TIC 3X.
With its unique combination of ion beam etching and mechanical precision cutting, the Leica EM TIC 3X allows for the preparation of samples that were previously impossible to prepare with conventional methods. The system is able to cut through hard and brittle materials without causing any damage to the sample.
Leica Microsystems EM TIC 3X
Leica Microsystems EM TIC 3X is excellent for preparing biological, medical, and industrial samples to investigate the samples under Electron and Light Microscopes. Perfect sample preparation is a prerequisite for perfect microscopy.
This system is an ion beam slope cutter for cross-sectioning and lamella preparation. Highest precision and very thin cross-sections as well as lamellae can be prepared with the Leica EM TIC 3X.
With its unique combination of ion beam etching and mechanical precision cutting, the Leica EM TIC 3X allows for the preparation of samples that were previously impossible to prepare with conventional methods. The system is able to cut through hard and brittle materials without causing any damage to the sample.
Leica Microsystems EM TIC 3X
Leica Microsystems EM TIC 3X is excellent for preparing biological, medical, and industrial samples to investigate the samples under Electron and Light Microscopes. Perfect sample preparation is a prerequisite for perfect microscopy.
This system is an ion beam slope cutter for cross-sectioning and lamella preparation. Highest precision and very thin cross-sections as well as lamellae can be prepared with the Leica EM TIC 3X.
With its unique combination of ion beam etching and mechanical precision cutting, the Leica EM TIC 3X allows for the preparation of samples that were previously impossible to prepare with conventional methods. The system is able to cut through hard and brittle materials without causing any damage to the sample.
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