Dell EMC PowerEdge C6520
Technical Specifications
Part Number: E64S Series
Regulatory Type: E64S001
May 2021
Rev. A00
Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
© 2021 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other
trademarks may be trademarks of their respective owners.
Chapter 1: Technical specifications............................................................................................... 4
Sled dimensions....................................................................................................................................................................4
Sled weight........................................................................................................................................................................... 5
Processor specifications.................................................................................................................................................... 5
PSU specifications.............................................................................................................................................................. 5
Supported operating systems...........................................................................................................................................5
System battery specifications.......................................................................................................................................... 6
Expansion card riser specifications................................................................................................................................. 6
Memory specifications....................................................................................................................................................... 6
Drives......................................................................................................................................................................................7
Storage specifications........................................................................................................................................................ 7
Ports and connectors specifications...............................................................................................................................8
USB port specifications................................................................................................................................................8
Display port specifications...........................................................................................................................................8
NIC port specifications.................................................................................................................................................8
Display port specifications...........................................................................................................................................8
Video specifications............................................................................................................................................................ 8
Environmental specifications............................................................................................................................................ 9
Particulate and gaseous contamination specifications....................................................................................... 10
Thermal restrictions ................................................................................................................................................... 10
Contents
Contents 3
Technical specifications
The technical and environmental specifications of your system are outlined in this section.
Topics:
• Sled dimensions
• Sled weight
• Processor specifications
• PSU specifications
• Supported operating systems
• System battery specifications
• Expansion card riser specifications
• Memory specifications
• Drives
• Storage specifications
• Ports and connectors specifications
• Video specifications
• Environmental specifications
Sled dimensions
Figure 1. Sled dimensions
Table 1. PowerEdge C6520 sled dimensions
X Y Z
174.4 mm (6.86 inches) 40.1 mm (1.58 inches) 570.34 mm (22.45 inches)
1
4 Technical specifications
Sled weight
Table 2. PowerEdge C6520 sled weight
System configuration Maximum weight (with all sleds and drives)
12 x 3.5-inch 45.6 kg (100.53 lb)
24 x 2.5-inch 41.4 kg (91.27 lb)
System with no backplane 35 kg (77.16 lb)
Processor specifications
Table 3. PowerEdge C6520 processor specifications
Supported processor Number of processors supported
3
rd
Generation Intel Xeon Scalable processors with up to 40
cores
two
PSU specifications
The PowerEdge C6520 system supports up to two AC power supply units (PSUs).
Table 4. PSU specifications
PSU Class Heat
dissipation
(maximum)
Frequency Voltage AC Current
High line Low line
100–120 V
2600 W Platinum
Platinum
9750 BTU/hr 50/60 Hz 100 - 240 V
autoranging
2600 W
(220 - 240
V)
1400 W 16 A
2400 W Platinum 9000 BTU/hr 50/60 Hz 100 - 240 V
autoranging
2400 W
(200 - 240
V)
1400 W 16 A
2000 W Platinum 7500 BTU/hr 50/60 Hz 100 - 240 V
autoranging
2000 W
(200 - 240
V)
1000 W 11.5 A
1600 W Platinum 6000 BTU/hr 50/60 Hz 100 - 240 V
autoranging
1600 W
(200 - 240
V)
800 W 10 A
NOTE: This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240
V.
NOTE: Heat dissipation is calculated using the PSU wattage rating.
NOTE: When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system
power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.
Supported operating systems
The PowerEdge C6520 system supports the following operating systems:
● Canonical Ubuntu Server LTS
Technical specifications
5
● Citrix Hypervisor
● Microsoft Windows Server with Hyper-V
● Red Hat Enterprise Linux
● SUSE Linux Enterprise Server
● VMware ESXi/vSAN
● CentOS
● Windows Preinstallation Environment (WinPE) 64-bit drivers
For more information, go to www.dell.com/ossupport.
System battery specifications
The PowerEdge C6520 system supports CR 2032 3.0-V lithium coin cell system battery.
Expansion card riser specifications
The PowerEdge C6520 system supports up to four PCI express (PCIe) Gen 4 expansion cards.
Table 5. Expansion card slots supported on the system board
PCIe slot Risers Riser width PCIe slot height PCIe slot length PCIe slot width
Slot 1 Riser 1a x16 PCIe Low profile Half length x8
Slot 1
Riser 1b with support for
SNAP I/O module
x16 PCIe Low profile Half length x8 + x8
Slot 2 Riser 2b x16 PCIe Low profile Half length x8
NOTE: For information on the expansion card installation guidelines, see the system specific Installation and Service
Manual available at https://www.dell.com/poweredgemanuals
Memory specifications
The PowerEdge C6520 system supports the following memory specifications for optimized operation.
Table 6. Memory specifications
DIMM type DIMM rank
DIMM
capacity
Single processor Dual processors
Minimum
system
capacity
Maximum system
capacity
Minimum
system
capacity
Maximum system
capacity
RDIMM
Single rank 8 GB 8 GB 64 GB 16 GB 128 GB
Dual rank
16 GB 16 GB 128 GB 32 GB 256 GB
32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1 TB
LRDIMM
Quad rank
64 GB 64 GB 512 GB 128 GB 1 TB
128 GB 128 GB 1 TB 256 GB 2 TB
Octa rank 128 GB 128 GB 1 TB 256 GB 2 TB
Table 7. Memory module sockets
Memory module sockets Speed
16, 288-pin 3200 MT/s, 2933 MT/s, 2666 MT/s
6 Technical specifications
Drives
The PowerEdge C6520 system supports:
● 12 x 3.5-inch SAS/SATA (HDD/SSD) drives
● 24 x 2.5-inch SAS/SATA (HDD/SSD) /NVMe drive.
Table 8. Maximum number of supported drive options for the PowerEdge C6520 sled
Maximum number of drives in the
sled
Maximum number of drives assigned per sled
12 x 3.5-inch drive systems Three SAS or SATA drives and SATA SSDs per sled
24 x 2.5-inch Non-NVMe drives
configuration
Six SAS or SATA drives and SATA SSDs per sled
8 x 2.5-inch NVMe drives
configuration (2 NVMe drives per
sled / 8 NVMe drives per chassis)
The NVMe backplane supports either of these configurations:
● Two NVMe drives and four SAS or SATA drives and SATA SSDs per sled
NOTE: NVMe drives are limited to PCIe Gen3 speed.
● Six SAS or SATA drives and SATA SSDs per sled
24 x 2.5-inch NVMe drives
configuration
Six NVMe drives per sled
M.2 SATA drive (optional) The supported capacity of the M.2 SATA card is up to 960 GB
NOTE: The M.2 SATA card can be installed on the M.2 riser or on the BOSS card
Micro-SD card (optional) for boot
(up to 64 GB)
One on Riser 1a
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe
SSD User's Guide at https://www.dell.com/support Browse all Products > Data Center Infrastructure > Storage
Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and
Documents.
Storage specifications
The PowerEdge C6520 sled supports.
Table 9. Storage controller cards for the system
Internal controllers External controllers
● PERC H745
● HBA345
● S150
● H345
● Boot Optimized Storage Subsystem (BOSS-S1): HWRAID
2 x M.2 SSDs
● 12 Gbps SAS Ext. HBA
Table 10. Supported RAID options with M.2 SATA drives
Options Single M.2 SATA drive without RAID Dual M.2 SATA drives with hardware
RAID
Hardware RAID No Yes
RAID Mode N/A RAID 1, RAID 0
Number of drives supported 1 2
Supported CPUs CPU 1 CPU 1
Technical specifications 7
NOTE: RAID options are only supported on BOSS cards which support two M.2 SATA drives.
Ports and connectors specifications
USB port specifications
The PowerEdge C6520 sled supports USB 3.0 on rear of the system.
Display port specifications
The PowerEdge C6520 sled supports 1 x Mini-DisplayPort .
NIC port specifications
The PowerEdge C6520 sled supports one 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN
on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.
Table 11. NIC port specification for the sled
Feature Specifications
LOM card 1 GbE
OCP 3.0 card 1 GbE x 4, 10 GbE x 2, 25 GbE x 2, 25 GbE x 4
Display port specifications
The PowerEdge C6520 sled supports 1 x iDRAC Direct port (Micro-AB USB) that is located on the rear of the system.
Video specifications
The PowerEdge C6520 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 12. Supported front video resolution options for the system
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32
8 Technical specifications
Environmental specifications
NOTE: For additional information about environmental certifications, refer to the Product Environmental Datasheet located
with the Documentation on www.dell.com/support/home.
Table 13. Operational climatic range category A3
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<=
2953 ft)
5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all
times)
8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F)
maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above
900 m (2953 Ft)
Table 14. Shared requirements across all categories
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both
operation and non-operation)
20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15
minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE: * - Per ASHRAE thermal guidelines for tape hardware, these are
not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-104 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Maximum vibration specifications
Table 15. Maximum vibration specifications
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Maximum shock pulse specifications
Table 16. Maximum shock specifications
Maximum shock Specifications
Operating
Six consecutively executed shock pulses 6 G in the positive and negative x, y, z axis for up to 11 ms
(four pulses on each side of the system).
Storage
Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on
each side of the system) of 71 G for up to 2 ms.
Technical specifications 9
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from
particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and
results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions
is the responsibility of the customer.
Table 17. Particulate contamination specifications
Particulate contamination Specifications
Air filtration
Data center air filtration as defined by ISO Class 8 per ISO
14644-1 with a 95% upper confidence limit.
NOTE: This condition applies to data center environments
only. Air filtration requirements do not apply to IT
equipment designed to be used outside a data center, in
environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or
MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-data
center environments.
Corrosive dust
● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data
center environments.
Table 18. Gaseous contamination specifications
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal restrictions
NOTE:
1. Not available: Indicates that the configuration is not offered by Dell EMC.
2. Not supported: Indicates that the configuration is not thermally supported.
NOTE: All components including the DIMMs, communication cards, M.2 SATA, and PERC cards can be supported with
sufficient thermal margin if the ambient temperature is equal to or below the maximum continuous operating temperature
listed in these tables.
NOTE: Some of the system hardware configurations require a lowered upper temperature limit. For more information about
the operating temperature requirement, contact technical support.
NOTE: Some configurations require a lower ambient temperature. For more information, see the following tables.
The following tables list key restrictions on ambient temperature based on which CPU is configured in the system. All inlet
temperatures that are provided below are in continuous degrees centigrade.
10
Technical specifications
Table 19. Maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch
NVMe drive configuration- Air cooled
Processors TDP (W) Cores 6 x drives/
sled
4 x drives/sled 2 x drives/sled 1 x drive/sled No BP
8380 270 40 Not supported Not supported Not supported Not supported Not
supported
8368 270 38 Not supported Not supported Not supported Not supported Not
supported
8368Q 270 38 Not supported Not supported Not supported Not supported Not
supported
8360Y 250 36 Not supported Not supported Not supported Not supported Not
supported
8358 250 32 Not supported Not supported Not supported Not supported Not
supported
8358P 240 32 Not supported Not supported Not supported Not supported 20
6348 235 28 Not supported Not supported Not supported Not supported 20
8352Y 205 32 20 20 25 25 25
8352S 205 32 20 20 25 25 25
6338 205 32 20 20 25 25 25
6330 205 28 20 20 25 25 25
6354 205 18 Not supported 20 20 20 25
6346 205 16 Not supported 20 20 20 25
8352V 195 36 20 20 25 25 25
6338N 185 32 20* 20* 25 25 25
6330N 165 28 25 25* 25* 25* 25*
NOTE:
● Data with * mark means it can have a temperature offset by +5°C, if using extended processor 1 with HSK on this
configuration.
● H745 is not supported with processor TDP > 185 W.
● Additional thermal restrictions are required for PCIE > 25 Watts, 128GB LRDIMM and GPU configuration.
Table 20. Maximum continuous operating temperature for single processor with 2.5-inch direct drive
configuration for processor 1 - Air cooled
Processors TDP (W) Cores 6 x drives/
sled
4 x drives/
sled
2 x drives/ sled 1 x drive/ sled No BP
8380 270 40 20 20 20 20 25
8368 270 38 20 20 25 25 25
8368Q 270 38 Not
supported
Not supported Not supported Not supported Not
supported
8360Y 250 36 20 20 25 25 25
8358 250 32 20 20 25 25 25
8358P 240 32 20 20 25 25 25
6348 235 28 25 25 25 25 30
8351N 225 36 20 20 25 25 25
Technical specifications 11
Table 20. Maximum continuous operating temperature for single processor with 2.5-inch direct drive
configuration for processor 1 - Air cooled (continued)
Processors TDP (W) Cores 6 x drives/
sled
4 x drives/
sled
2 x drives/ sled 1 x drive/ sled No BP
8352Y 205 32 30 30 35 35 35
6314U 205 32 30 30 35 35 35
8352S 205 32 30 30 35 35 35
6338 205 32 30 30 35 35 35
6330 205 28 30 30 35 35 35
6354 205 18 25 25 30 30 30
6346 205 16 25 25 30 30 30
8352V 195 36 30 30 30 30 35
6338N 185 32 35 35 35 35 35
6330N 165 28 35 35 35 35 35
NOTE: Additional thermal restrictions are required for PCIE > 25 Watts, 128GB LRDIMM and GPU configuration.
Table 21. Maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch
NVMe drive configuration- Liquid cooled
Processors TDP (W) Cores 6 x drives/
sled
4 x drives/ sled 2 x drives/
sled
1 x drive/ sled No BP
8380 270 40 35 35 35 35 35
8368 270 38 35 35 35 35 35
8368Q 270 38 35 35 35 35 35
8360Y 250 36 35 35 35 35 35
8358 250 32 35 35 35 35 35
8358P 240 32 35 35 35 35 35
6348 235 28 35 35 35 35 35
8352Y 205 32 35 35 35 35 35
8352S 205 32 35 35 35 35 35
6338 205 32 35 35 35 35 35
6330 205 28 35 35 35 35 35
6354 205 18 35 35 35 35 35
6346 205 16 35 35 35 35 35
8352V 195 36 35 35 35 35 35
6338N 185 32 35 35 35 35 35
6330N 165 28 35 35 35 35 35
NOTE: Additional thermal restrictions are required for PCIE > 25 Watts, 128GB LRDIMM and GPU configuration.
12 Technical specifications
Table 22. Maximum continuous operating temperature for dual processor with 2.5-inch NVMe drive
configuration- Liquid cooled
Processors TDP (W) Cores 6 x drives/
sled
4 x drives/
sled
2 x drives/
sled
1 x drive/ sled
8380 270 40 35 35 35 35
8368 270 38 35 35 35 35
8368Q 270 38 35 35 35 35
8360Y 250 36 35 35 35 35
8358 250 32 35 35 35 35
8358P 240 32 35 35 35 35
6348 235 28 35 35 35 35
8352Y 205 32 35 35 35 35
8352S 205 32 35 35 35 35
6338 205 32 35 35 35 35
6330 205 28 35 35 35 35
6354 205 18 35 35 35 35
6346 205 16 35 35 35 35
8352V 195 36 35 35 35 35
6338N 185 32 35 35 35 35
6330N 165 28 35 35 35 35
NOTE: Additional thermal restrictions are required for PCIE > 25 Watts, 128GB LRDIMM and GPU configuration.
Table 23. Maximum continuous operating temperature for dual processor with 3.5-inch direct drive
configuration- Liquid cooled
Processors TDP (W) Cores 3 x drives/sled 2 x drives/sled 1 x drive/sled
8380 270 40 35 35 35
8368 270 38 35 35 35
8368Q 270 38 35 35 35
8360Y 250 36 35 35 35
8358 250 32 35 35 35
8358P 240 32 35 35 35
6348 235 28 35 35 35
8352Y 205 32 35 35 35
8352S 205 32 35 35 35
6338 205 32 35 35 35
6330 205 28 35 35 35
6354 205 18 35 35 35
6346 205 16 35 35 35
8352V 195 36 35 35 35
6338N 185 32 35 35 35
Technical specifications 13
Table 23. Maximum continuous operating temperature for dual processor with 3.5-inch direct drive
configuration- Liquid cooled (continued)
Processors TDP (W) Cores 3 x drives/sled 2 x drives/sled 1 x drive/sled
6330N 165 28 35 35 35
NOTE: Additional thermal restrictions are required for PCIE > 25 Watts, 128GB LRDIMM and GPU configuration.
ASRAE A3 Configuration Restriction
Table 24. ASRAE A3 Configuration Restriction
Liquid cooled Air Cooled
● NVMe SSD is not supported.
● LRDIMM is not supported.
● PCIe cards greater than 25 W are not supported.
● GPU card is not supported.
● 3.5-inch drive configuration is not supported.
● NVMe SSD is not supported.
● LRDIMM is not supported.
● PCIe cards greater than 25W are not supported.
● GPU card is not supported.
● 3.5-inch drive configuration is not supported.
● For 1P sled, maximum supported CPU TDP is 150 W.
● For 2P sled, maximum supported CPU TDP is 105 W..
14 Technical specifications
/