Temperature Multi-Input Device
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1 Introduction................................................................................. 5
1.1 Content of this Document ................................................................... 5
1.2 Target Group, Personnel...................................................................... 5
1.3 Symbols Used ...................................................................................... 5
2 Product Specifications............................................................... 7
2.1 Overview and Application ................................................................... 7
2.2 Hazardous Area Installation and Use................................................. 7
2.3 Component Identity ............................................................................. 9
3 Installation and Commissioning ............................................. 11
3.1 Mounting and Dismounting............................................................... 11
3.1.1 Using the Separation Wall................................................................ 13
3.2 Hardware Installation......................................................................... 14
3.2.1 TM-I Cable and Connection Information .......................................... 14
3.2.2 F2 Housing Degree of Protection..................................................... 15
3.2.3 Grounding and Shielding ................................................................ 18
3.2.4 Electrical Connection....................................................................... 19
3.2.5 Fieldbus and Shield Connection ...................................................... 20
3.2.6 Dip Switch Settings.......................................................................... 20
3.3 Firmware Download ........................................................................... 20
4 TM-I Configuration.................................................................... 21
4.1 Introduction ........................................................................................ 21
4.2 Function Block Interaction and Channel Mapping ......................... 21
4.3 Identification, Device ID, PD Tag....................................................... 23
4.4 Parameterization Prerequisites and Procedure .............................. 23
4.5 Sensor Block Configuration.............................................................. 24
4.6 Concentrator Block Configuration ................................................... 26
4.7 AI and MAI Block Configuration ....................................................... 27
5 Operation................................................................................... 28