Seco SBC-pITX-EHL Owner's manual

ICARUS

Single Board Computer

with Intel® ® Celeron® J / N

Series, Intel® Pentium® J / N Series (formerly Elkhart

Lake) Processors on picoITX form factor

ICARUS

2

Unauthorized use, duplication, or modification by any means without prior consent of SECO S.p.A. is prohibited.

Every effort has been made to ensure the accuracy of this manual. However, SECO S.p.A. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.p.A. reserves the right to change precise specifications without prior notice to supply the best product possible.

For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the

dedicated web form available at www.seco.com (registration required).

Our team is ready to assist.

Revision

Date

Note

Ref

1.0

27th July 2023

First Official Release.

SO

REVISION HISTORY

 
 ICARUS 
ICARUS User Manual - Rev. First Edition: 1.0 - Last Edition: 1.0 - Author: S.O. - Reviewed by M.B. Copyright © 2023 SECO S.p.A.  

INDEX 
   INTRODUCTION ................................................................................................................................................................................. 6 
1 Warranty ........................................................................................................................................................................................................................................ 7 
2 Information and assistance ............................................................................................................................................................................................................. 8 
3 RMA number request ..................................................................................................................................................................................................................... 8 
4 Safety ............................................................................................................................................................................................................................................ 9 
5 Electrostatic discharges ................................................................................................................................................................................................................. 9 
6 RoHS compliance .......................................................................................................................................................................................................................... 9 
7 Safety Police ................................................................................................................................................................................................................................ 10 
8 Terminology and definitions .......................................................................................................................................................................................................... 11 
8.1 Trademark Notice ................................................................................................................................................................................................................ 12 
9 Reference specifications .............................................................................................................................................................................................................. 13 
  OVERVIEW ....................................................................................................................................................................................... 14 
1 Introduction .................................................................................................................................................................................................................................. 15 
2 Technical specifications ............................................................................................................................................................................................................... 16 
3 Electrical specifications ................................................................................................................................................................................................................ 17 
3.1 Power available .................................................................................................................................................................................................................... 17 
3.2 Power consumption ............................................................................................................................................................................................................. 18 
3.3 RTC Battery ......................................................................................................................................................................................................................... 19 
3.4 Power rails naming convention ............................................................................................................................................................................................. 19 
4 Mechanical specifications............................................................................................................................................................................................................. 20 
5 Block diagram .............................................................................................................................................................................................................................. 21 
  CONNECTORS ................................................................................................................................................................................ 22 
1 Introduction .................................................................................................................................................................................................................................. 23 
2 Connectors overview ................................................................................................................................................................................................................... 24 
3 Connectors description ................................................................................................................................................................................................................ 25 
3.1 USB Connectors.................................................................................................................................................................................................................. 25 
3.2 Dual Multimode Display Port Connectors .............................................................................................................................................................................. 25 
3.3 LVDS / eDP Connector ........................................................................................................................................................................................................ 26 
3.4 SATA Connector .................................................................................................................................................................................................................. 27 
3.5 M.2 2230 Socket 1 Key E Connectivity Slot .......................................................................................................................................................................... 28 
3.6 M.2 3042 Socket 2 Key B SSD/WWAN Slot ........................................................................................................................................................................ 29 
3.7 nanoSIM Slot ....................................................................................................................................................................................................................... 30 

 
 ICARUS 
ICARUS User Manual - Rev. First Edition: 1.0 - Last Edition: 1.0 - Author: S.O. - Reviewed by M.B. Copyright © 2023 SECO S.p.A.  

3.8 Gigabit Ethernet connectors ................................................................................................................................................................................................. 30 
3.9 COM Port Header ................................................................................................................................................................................................................ 31 
3.10 FAN connector .................................................................................................................................................................................................................... 31 
3.11 Recovery Switch .................................................................................................................................................................................................................. 31 
3.12 GPIO Header ....................................................................................................................................................................................................................... 32 
3.13 I2C, SPI Header ................................................................................................................................................................................................................... 32 
3.14 CAN Header ........................................................................................................................................................................................................................ 33 
3.15 Audio Header ....................................................................................................................................................................................................................... 33 
3.16 Buttons / LED Header .......................................................................................................................................................................................................... 34 
  BIOS SETUP .................................................................................................................................................................................... 35 
1 Aptio setup Utility ......................................................................................................................................................................................................................... 36 
2 Main setup menu ......................................................................................................................................................................................................................... 37 
2.1 System Date / System Time ................................................................................................................................................................................................. 37 
3 Advanced menu .......................................................................................................................................................................................................................... 38 
3.1 Trusted computing submenu ................................................................................................................................................................................................ 39 
3.2 ACPI Settings submenu ....................................................................................................................................................................................................... 39 
3.3 S5 RTC Wake Settings submenu ......................................................................................................................................................................................... 40 
3.4 CPU Configuration submenu ................................................................................................................................................................................................ 40 
3.5 AMI graphic Output Protocol Policy submenu ........................................................................................................................................................................ 41 
3.6 PCI Subsystems Settings ..................................................................................................................................................................................................... 41 
3.7 Network Stack configuration submenu .................................................................................................................................................................................. 42 
3.8 CSM configuration submenu ................................................................................................................................................................................................ 42 
3.9 NVMe configuration submenu............................................................................................................................................................................................... 43 
3.10 SDIO configuration submenu ................................................................................................................................................................................................ 43 
3.11 USB configuration submenu ................................................................................................................................................................................................. 43 
3.12 Platform Trust technology submenu ...................................................................................................................................................................................... 44 
3.13 Main Thermal Configuration submenu ................................................................................................................................................................................... 44 
3.14 HSUART Transceiver Configuration submenu ....................................................................................................................................................................... 44 
3.15 LVDS Configuration submenu ............................................................................................................................................................................................... 45 
3.16 SMBIOS Information ............................................................................................................................................................................................................. 46 
3.17 Embedded Controller submenu ............................................................................................................................................................................................ 46 
3.18 M.2 peripheral management submenu.................................................................................................................................................................................. 49 
3.19 ACPI Devices Configuration submenu ................................................................................................................................................................................... 50 
4 Chipset menu .............................................................................................................................................................................................................................. 51 

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5

4.4.1 South Bridge submenu ........................................................................................................................................................................................................ 51

4.4.2 Uncore Configuration submenu ............................................................................................................................................................................................ 52

4.4.3 South Cluster Configuration submenu ................................................................................................................................................................................... 53

4.5 Security menu.............................................................................................................................................................................................................................. 57

4.5.1 Secure Boot submenu ......................................................................................................................................................................................................... 57

4.6 Boot menu .................................................................................................................................................................................................................................. 58

4.7 Save & Exit menu ......................................................................................................................................................................................................................... 59

APPENDICES ................................................................................................................................................................................... 60

5.1 Thermal Design ............................................................................................................................................................................................................................ 61

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6

• Warranty

• Information and assistance

• RMA number request

• Safety

• Electrostatic discharges

• RoHS compliance

• Safety Police

• Terminology and definitions

• Reference specifications

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1.1 Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts for 1 year.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.

Items cannot be returned unless previously authorised by the supplier.

The authorisation is released after completing the specific ticketing procedure https://support.seco.com/ (web RMA). The RMA authorisation number must be put

both on the packaging and on the documents shipped with the items, which must include all the accessories in their original packaging, with no signs of damage to,

or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and has must accompany the returned item.

If any of the above-mentioned requirements for RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.

Following a technical analysis, the supplier will verify if all the requirements, for which a warranty service applies, are met. If the warranty cannot be applied, the

Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

SECO offers Engineering Samples for early evaluation and development. Engineering Samples are sold “as-is” with no warranty of any kind, neither explicit nor implied.

Here https://www.seco.com/it/EngineeringSamplesPolicy is defined the framework of SECO and customer responsibilities regarding Engineering Samples.

Warning!

All changes or modifications to the equipment not explicitly approved by SECO S.p.A. could impair the equipment’

s functionality and could void

the warranty.

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8

1.2 Information and assistance

What do I have to do if the product is faulty?

SECO S.p.A. offers the following services:

• SECO website: visit http://www.seco.com to receive the latest information on the product. In most of the cases it is possible to find useful information to

solve the problem.

• SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.

• SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct

solution. E-mail: technical.se[email protected]

Fax (+39) 0575 350210

• Repair center: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

o Returned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.

o Returned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before asking for technical assistance:

• Name and serial number of the product;

• Description of Customer’s peripheral connections;

• Description of Customer’s software (operating system, version, application software, etc.);

• A complete description of the problem;

• The exact words of every kind of error message encountered.

1.3 RMA number request

To request a RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online” and follow the procedure described.

A RMA Number will be sent within 1 working day (only for on-line RMA requests).

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1.4 Safety

The board uses only extremely-low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

1.5 Electrostatic discharges

The board, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all the devices

and/or components on-board.

1.6 RoHS compliance

The board is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other boards.

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid

short circuits due to unwanted contacts with other board components.

If the board has become wet, never connect it to any external power supply unit or battery.

Check carefully that all cables are correctly connected and that they are not damaged.

Whenever handling this product, ground yourself through an anti-static wrist strap. Placement of the board on an anti-static surface is

also highly recommended.

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1.7 Safety Police

In order to meet the safety requirements of EN62368-1:2014 standard for Audio/Video, information and communication technology equipment, this product shall

be: - used inside a fire enclosure made of non-combustible material or V-1 material (the fire enclosure is not necessary if the maximum power supplied to the

module never exceeds 100 W, even in worst-case fault);

- used inside an enclosure (the enclosure is not necessary if the temperature of the parts likely to be touched never exceeds 70 °C);

- installed inside an enclosure compliant with all applicable IEC 62368-1 requirements;

The manufacturer which includes this product in his end-user product shall:

- verify the compliance with B.2 and B.3 clauses of the EN62368-1 standard when the module works in its own final operating condition;

- Prescribe temperature and humidity range for operating, transport and storage conditions;

- Prescribe to perform maintenance on the module only when it is off and has already cooled down;

- Prescribe that the connections from or to the Module have to be compliant to ES1 requirements;

- The module in its enclosure must be evaluated for temperature and airflow considerations;

- Install in a way that prevents the access to the board from children;

- Use along with CPU heatspreader/heatsinks designed according to the thermal and mechanical characteristics.

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1.8 Terminology and definitions

ACPI Advanced Configuration and Power Interface, an open industrial standard for the board’s devices configuration and power management

AHCI Advanced Host Controller Interface, a standard which defines the operation modes of SATA interface

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

BIOS Basic Input / Output System, the Firmware Interface that initializes the board before the OS starts loading

CEC Consumer Electronics Control, an HDMI feature which allows controlling more devices connected together by using only one remote control

DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)

DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock

EHCI Enhanced Host Controller interface, a high-speed controller for USB ports, able to support USB2.0 standard

FFC/FPC Flexible Flat Cable / Flat Panel Cable

GBE Gigabit Ethernet

Gbps Gigabits per second

GND Ground

GPI/O General purpose Input/Output

HD Audio High Definition Audio, most recent standard for hardware codecs developed by Intel® in 2004 for higher audio quality

HDMITM High Definition Multimedia Interface, a digital audio and video interface

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

LPDDR4 Low Power DDR, 4th generation

LVDS Low Voltage Differential Signaling, a standard for transferring data at very high speed using inexpensive twisted pair copper cables, usually used for

video applications

Mbps Megabits per second

MMC/eMMC MultiMedia Card / embedded MMC, a type of memory card, having the same interface as the SD card. The eMMC is the embedded version of the

MMC. They are devices that incorporate the flash memories on a single BGA chip.

N.A. Not Applicable

N.C. Not Connected

OpenCL Open Computing Language, a software library based on C99 programming language, conceived explicitly to realise parallel computing using

Graphics Processing Units (GPU)

OpenGL Open Graphics Library, an Open Source API dedicated to 2D and 3D graphics

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OS Operating System

PCI-e Peripheral Component Interface Express

PSU Power Supply Unit

PWM Pulse Width Modulation

PWR Power

PXE Preboot Execution Environment, a way to perform the boot from the network ignoring local data storage devices and/or the installed OS

SATA Serial Advance Technology Attachment, a differential full duplex serial interface for Hard Disks

SD Secure Digital, a memory card type

SDHC Secure Digital Host Controller

SIM Subscriber Identity Module, a card which stores all data of the owner necessary to allow him accessing to mobile communication networks

SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and

other power supply-related devices

SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed of a master and one or more slaves, individually

enabled through a Chip Select line

TBM To be measured

TMDS Transition-Minimized Differential Signaling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces

UEFI Unified Extensible Firmware Interface, a specification defining the interface between the OS and the board’s firmware. It is meant to replace the

original BIOS interface

UIM User Identity Module, an extension of SIM modules.

USB Universal Serial Bus

V_REF Voltage reference Pin

xHCI eXtensible Host Controller Interface, Host controller for USB 3.0 ports, which can also manage USB 2.0 and USB1.1 ports

1.8.1 Trademark Notice

The terms HDMI, HDMI High-Definition Multimedia Interface, and the HDMI Logo are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.

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1.9 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

ACPI

https://uefi.org/specifications

AHCI

http://www.intel.com/content/www/us/en/io/serial-ata/ahci.html

DDC

http://www.vesa.org

Gigabit Ethernet

https://standards.ieee.org/standard/802_3-2018.html

HD Audio

http://www.intel.com/content/dam/www/public/us/en/documents/product-specifications/high-definition-audio-specification.pdf

HDMI

http://www.hdmi.org/index.aspx

I2C

https://www.nxp.com/docs/en/user-guide/UM10204.pdf

Intel® Front Panel I/O connectivity DG

Intel Technical Library

LVDS

http://www.ti.com/lit/ug/snla187/snla187.pdf

M.2

http://www.pcisig.com/specifications/pciexpress

MMC/eMMC

https://www.jedec.org/committees/jc-64

OpenCL

http://www.khronos.org/opencl

OpenGL

http://www.opengl.org

PCI Express

http://www.pcisig.com/specifications/pciexpress

SATA

https://www.sata-io.org

SD Card Association

https://www.sdcard.org

SM Bus

http://www.smbus.org/specs

TMDS

https://www.cablestogo.com/learning/library/digital-signage/intro-to-tmds

UEFI

http://www.uefi.org

USB 2.0 and USB OTG

https://www.usb.org/sites/default/files/usb_20_20190524.zip

USB 3.0

https://usb.org.10-1-108-210.causewaynow.com/sites/default/files/usb_32_20191024.zip

Intel® Atom Elkhart Lake family

Products formerly Elkhart Lake (intel.com)

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14

• Introduction

• Technical specifications

• Electrical specifications

• Mechanical specifications

• Block diagram

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15

2.1 Introduction

ICARUS is a Single Board Computer in pico-ITX form factor (just 100 x 72mm) based on the Intel® Atom X Series, Intel® Celeron® J/N Series and Intel® Pentium®

J/N Series family of System-on-Chips (SOCs) formerly coded as Elkhart Lake, a series of Dual / Quad Core SOCs with 64-bit instruction set.

These SOCs embed all the features usually obtained by combination of CPU + platform Controller hubs, all in one single IC, which allows, therefore, the system

minimisation and performance optimisation, which is essential for boards with sizes so reduced as for picoITX SBCs, which offers all functionalities of standard PC

boards in just 100x72mm.

This single chip solution includes the memory controller, which gives support for up 32-bit Single-/Dual-/Quad-Channel LPDDR4-3200 Memory.

All SOCs embed an Integrated Intel® Integrated Gen11-LP HD Graphics controller, which offer high graphical performances, with support for 4K HW decoding and

encoding of HEVC(H.265), H.264 and VP8/VP9. It is also possible the HW video decoding of WMV9/VC1. This embedded GPU can drive three independent

displays, by using two DP++ and LVDS, or eDP as factory alternative, interfaces.

Mass Storage capabilities of the board include two external S-ATA Gen3 channels (one available on a standard SATA 7p Male connector, the other on an M.2

Socket 2 Key B Slot and one optional eMMC Drive soldered on board.

Further connectivity features on the board are WWAN M.2 Socket 2 Key B Slot connected to a nanoSIM slot for modems, 2x Gigabit Ethernet connections, one M.2

Socket 1 Key E Slot for WiFi+BT M.2 modules.

The board is available both in commercial and in industrial temperature range.

Please refer to following chapter for a complete list of all peripherals integrated and characteristics.

2.2 Technical specifications

SOC

Intel® Atom x6425RE, Quad Core @1.9GHz, 1.5MB L2 Cache, 12W TDP

Intel® Atom x6414RE, Quad Core @1.5GHz, 1.5MB L2 Cache, 9W TDP

Intel® Atom x6212RE, Dual Core @1.2GHz, 1.5MB L2Cache, 6W TDP

Intel® Atom x6425E, Quad Core @2.0GHz, 1.5MB L2 Cache, 12W TDP

Intel® Atom x6413E, Quad Core @1.5GHz, 1.5MB L2 Cache, 9W TDP

Intel® Atom x6211E, Dual Core @1.3GHz, 1.5MB L2Cache, 6W TDP

Intel® Pentium® N6415, Quad Core @1.2GHz, 1.5MB L2 Cache, 6.5W TDP

Intel® Celeron® N6211, Dual Core @1.2GHz, 1.5MB L2Cache, 6.5W TDP

Intel® Pentium® J6426, Quad Core @2.0GHz, 1.5MB L2Cache, 10W TDP

Intel® Celeron® J6413, Dual Core @1.8GHz, 1.5MB L2Cache, 10W TDP

Memory

32-bit Dual-/Quad-Channel LPDDR4-3200 soldered onboard

Max memory size 16GB

Graphics

Integrated Intel® Gen11-LP HD Graphics controller

Three independent display support

4K HW decoding of HEVC(H.265), H.264 and VP8/VP9, WMV9/VC1

4K HW encoding of HEVC(H.265), H.264 and VP8/VP9

Video Interfaces

Dual DP++ connector

LVDS interface or eDP interface connector

Video Resolution

DP++, support up to 4096x2160 @60Hz

LVDS / eDP, resolution up to 1920x1200 @ 60Hz

Mass Storage

Optional eMMC 5.0 drive on-board

SATA Gen3 7p M connector

SSD M.2 Socket 2 Key B lot, size 2242 / 3042 (excludes WWAN modules)

Networking

2x Gigabit Ethernet connector

WWAN (modem) M.2 Socket 2 Key B 2242 / 3042 slot (excludes SSD interface)

Connectivity M.2 Socket 1 Key E 2230 Slot for WiFi+BTLE modules

USB

USB 3.0 Dual Type-A connector

Internal dual USB 2.0 header

Audio

HD Audio Codec

Line Out + Microphone + S/PDIF Out interfaces on internal header

Serial Ports

2 x RS-232/RS-422/RS-485 Serial ports on internal header

Other Interfaces

nanoSIM slot for M.2 modems

8 x GPI/Os connector

FAN connector

Switch / LED Front Header connector

I2C + INT# + RST# signals for I2C Touch Screen controller on LVDS connector

Optional TPM 2.0 on-board

Power supply voltage: +12VDC ± 5%

Cabled coin cell battery for RTC

Operating temperature **:

0°C ÷ +60°C (Commercial temperature)

-40° ÷ +85°C (Industrial temperature)

Dimensions: 72 x 100 mm (2.83” x 3.93”).

Supported Operating Systems:

Microsoft® Windows® 10 Enterprise (64 bit)

Microsoft® Windows® 10 IoT Core (32- /64-bit)

Linux 64-bit

Yocto (64-bit)

** Measured at any point of SECO standard heatspreader for this product,

during any and all times (including start-up). Actual temperature will widely

depend on application, enclosure and/or environment. Upon customer to

consider application-specific cooling solutions for the final system to keep the

heatspreader temperature in the range indicated. Please also check

paragraph 5.1

2.3 Electrical specifications

The board needs to be supplied only with an external 12VDC ± 5% power supply. All the others voltages necessary for the working of the board and of the connected

peripherals are derived from the main VIN power rail. It is possible to supply the module by using two different power connectors (factory alternatives)

The possible power connector is type Molex Mini-Fit connector, and by factory configuration come in

the horizontal orientation (J1) with p/n 87427-0202 or in the vertical orientation (J2) with p/n 39-28-

1023 or equivalent.

The pin-out is indicated in the table here on the left, and the mating connector is MOLEX p/n 39-01-

2020 or equivalent with crimp terminals series 5556/44476.

2.3.1 Power available

When powering the board with a PSU with characteristics greater or equal to the one described at beginning of previous paragraph, please consider well what is the

typical scenario for using the board (i.e., which peripherals will be connected)

Internal power section is able to supply a maximum of 8A@5V for external devices supplied directly by the module (i.e. USB devices, optionally SSD or SATA disks,

display).

Consider that each USB 2.0 port requires 500mA, and USB 3.0 ports need 0.9A each, so if all 5 USB ports are used, then the 5V power section would be able to

supply further 4.7A (about 24W) to other peripherals, like SATA Disk and/or LVDS display. Anyway, if all this current is needed by external peripherals, a 40W PSU

cannot supply further power for internal circuitry of the board.

Since all the power must be supplied by an external PSU only, please balance well the typical final configuration, considering both the power consumption of the

board itself (in paragraph 2.3.2 are detailed current consumption for possible different SOCs) and the power consumption of external devices.

This way it is possible to calculate preliminarily if a 40W PSU can be sufficient for system needing or if most powerful PSUs are required.

Mini-Fit Power Connector J1 / J2

Signal

1

GND

2

VIN

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18

2.3.2 Power consumption

Using the following setup, and using all possible SOCs offered for the board, the current consumption has been measured on +12VDC VIN power line.

• O.S. Windows 10

• USB mouse and keyboard connected

• DP++ display connected

• Network connection plugged to Gigabit Ethernet Network.

• TPM 2.0 on-board

• Serial port and HDA

• Bios Release 1.09 Rc01.

• FAN at 100%

Independently by the SOC mounted onboard, the following power consumptions are common to all boards:

Battery Backup power consumption: 2.40μA

Suspend State power consumption: 159mA

Soft-Off State power consumption: 154mA

Status

Condifguration

x6425 Atom

(16GB RAM, eMMC 64GB)

x6425RE Atom

(8GB RAM, eMMC 64GB)

J6426 Pentium

(8GB RAM, eMMC 32GB)

N6211 Celeron

(4GB RAM, eMMC 32GB)

Average

Peak

Average

Peak

Average

Peak

Average

Peak

Idle, power saving configuration

0.515 A

0.765 A

0.492 A

0.649 A

0.661 A

0.767 A

0.567 A

0.676 A

OS Boot, power saving configuration

0.865 A

1.131 A

0.887 A

1.220 A

0.905 A

1.246 A

0.761 A

1.296 A

Video reproduction@1080p, power saving configuration

0.668 A

0.939 A

0.702 A

1.145 A

0.823 A

1.180 A

0.770 A

1.136 A

Video reproduction 4K, power saving configuration

0.765 A

1.330 A

0.830 A

1.134 A

0.965 A

1.179 A

1.012 A

1.373 A

Intel TAT 100% workload CPU and GFX, 12W TDP limit

configuration

1.803 A

2.123 A

1.530 A

1.632 A

1.460 A

1.693 A

1.150 A

1.369 A

Intel TAT 100% workload CPU and GFX, no TDP limit

configuration

2.564 A

2.774 A

1.609 A

1.757 A

2.250 A

2.542 A

2.047 A

2.271 A

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2.3.3 RTC Battery

For the occurrences when the module is not powered with an external power supply, on board there is a cabled coin Lithium Battery to supply, with a 3V voltage,

the Real Time Clock embedded inside the SoC.

Battery used is a cabled CR2032-LD Lithium coin-cell battery, with a nominal capacity of 220mAh.

The battery is not rechargeable, and can be connected to the board using dedicated connector CN3 which is a 2-pin

p1.27 mm type MOLEX p/n 53261-0271 or equivalent, with pinout shown in the table on the left.

Mating connector: MOLEX 51021-0200 receptacle with MOLEX 50079-8000 female crimp terminals.

In case of exhaustion, the battery should only be replaced with devices of the same type. Always check the orientation before

inserting and make sure that they are aligned correctly and are not damaged or leaking.

Never allow the batteries to become short-circuited during handling.

Batteries supplied with SBC-D63 are compliant to requirements of European Directive 2006/66/EC regarding batteries and accumulators. When putting out of order

SBC-D63, remove the batteries from the board in order to collect and dispose them according to the requirement of the same European Directive above mentioned.

Even when replacing the batteries, the disposal has to be made according to these requirements.

2.3.4 Power rails naming convention

In all the tables contained in this manual, Power rails are named with the following meaning:

_RUN: Switched voltages, i.e. power rails that are active only when the board is in ACPI’s S0 (Working) state. Examples: +3.3V_RUN, +5V_RUN.

_ALW: Always-on voltages, i.e. power rails that are active both in ACPI’s S0 (Working), S3 (Standby) and S5 (Soft Off) state. Examples: +5V_ALW, +3.3V_ALW.

_U: unswitched ACPI S3 voltages, i.e. power rails that are active both in ACPI’s S0 (Working) and S3 (Standby) state. Examples: +1.5V_U

Other suffixes are used for application specific power rails, which are derived from same voltage value of voltage switched rails, if it is not differently stated (for

example, +5VHDMI is derived from +5V_RUN, and so on).

Battery connector - J3

Signal

1

VRTC

2

GND

CAUTION: handling batteries incorrectly or replacing with not-approved devices may present a risk of fire or explosion.